PROGRAM AT A GLANCE Monday, 14 September, 2015
|
|
|
- Ira Johnston
- 7 years ago
- Views:
Transcription
1 Monday, 14 September, 2015 Tutorials Monday September 14, TUTORIALS Start End Room "Villach" Room "Salzburg" Room "Linz" Room "Innsbruck" Start End 10:50 11:00 Intro by the Chair: Oliver Häberlen 10:50 11:00 11:00 12:30 GaN Switched Mode Power Supplies: System Solutions and Challenges for Power 11:00 12:30 12:30 13:00 12:30 13:00 13:00 13:10 Intro by the Chair: Roland Thewes Lunch Intro by the Chair: Max Lemme 13:00 13:10 13:10 13:30 13:10 13:30 13:30 13:40 Intro by the Chair: Marc Tiebout Introduction to 3D Time- of- Flight Image 13:30 14:00 13:40 14:40 Modeling of physical effects in bipolar Thin Channel Silicon Transistors Sensors transistors for mm- wave circuits 14:00 14:30 14:40 15:00 Coffee break Design of Law- Phase Noise Bipolar Voltage- 14:30 15:00 15:00 15:40 Controlled Oscillators 15:00 15:30 Tunnel FETs Circuit Architectures for Capacitance- to- Digital Conversion 15:30 16:30 16:00 16:30 Phased Array Design for 5G- mmwave in 16:30 17:00 BiCMOS 16:30 17:00 17:00 18:00 THz Design in BiCMOS 18:00 18:15 Wrap- up Wrap- up Wrap- up 18:15 18:30 Implantable Medical GaN GaN power switching transistors: Survey on device concepts and technology GaN Epitaxy The Material Challenge: Hetero- epitaxial Growth of GaN on Silicon Wafers GaN Reliability Dispersion effects, failure modes and mechanisms of GaN- on- Si HEMTs for power electronics applications Compound Semiconductor 2D Channel Graphene FET Models for Circuit Design 17:00 18:00 18:00 18:30 18:30 18:45 Wrap- up :45
2 Tuesday, 15 September, 2015 Room "Graz" Room "Vienna" Room "Klagenfurt" Room "Salzburg" Room "Linz" Room "Innsbruck" 08:40 09:00 Opening (Room Graz) 08:40 09:00 09:00 10:20 Joint Plenary Lectures (Room Graz): J. Dickmann, Daimler AG P. Leteinturier, Infineon Technologies 09:00 10:20 10:20 10:40 10:20 10:40 10:40 11:20 Joint Plenary Lecture (Room Graz): W. Sansen, KU Leuven 10:40 11:20 PANEL: European Microelectronics Leading in Automotive? (Room Graz) 11:20 12:20 J. Dickmann, Daimler AG V. Graeger, NXP K. Laney, ams AG P. Leteinturier, Infineon Technologies 11:20 12:20 L. Malier, STMicroelectronics W. Sansen, KU Leuven W. Schelter, AVL Software and Functions GmbH 12:20 13:20 Lunch 12:20 13:20 13:20 14:00 17:40 18:00 ESSCIRC Plenary (Room Graz): B. Nikolic, Berkeley Filters and Optical Links X- Band and Beyond Tuesday, September 15, G: Next Generation Wireless Beyond 4G Compact Models 16:00 17:40 Digital Circuits and VCOs and Frequency Wireline and Optical Emerging & Systems Generators Technologies I Technology, Design and Characterization of Wide Bandgap Power Focus Session FDSOI (Part 1) ESSDERC Plenary (R. Klagenfurt): S. Takagi, Tokyo University Nonvolatile Memory Technologies Innovative Approaches for Opto and Power 15:20 15:40 15:40 16:20 Young Professionals Mentoring and Career Coaching Event (Room Vienna) 19:00 21:00 Welcome reception (Nikola Tesla Hall) 19:00 21:00 16:20 18:00
3 Wednesday, 16 September, 2015 Wednesday, September 16, 2015 Room "Graz" Room "Vienna" Room "Klagenfurt" Room "Salzburg" Room "Linz" Room "Innsbruck" 08:40 10:00 Joint Plenary Lectures (Room Graz): J. Hansryd, Ericsson Research G. Baccarani, University of Bologna 08:40 10:00 10:00 10:20 Awards 10:00 10:20 10:20 10:50 10:20 10:50 10:50 12:10 RF Circuits Power Management Focus Session (Room Klagenfurt): Modeling for the Future and its Design Interpretation MEMS & Sensors FDSOI (Part 2) 10:50 12:10 12:10 13:20 Lunch 12:10 13:20 Sigma- Delta Modulators Energy Harvesting Focus Session (Room Klagenfurt): Sensors and Smart Systems 2D Yield and Manufacturing 15:20 15:40 15:20 15:40 15:40 16:20 ESSCIRC Plenary (Room Graz): M. Steyaert, KU Leuven ESSDERC Plenary (R. Klagenfurt): G. Duesberg, Trinity College Dublin 15:40 16:20 16:20 17:40 Analog RF Receivers 17:40 18:00 Nyquist ADC Emerging & Technologies II Sensor Systems Reliability and Variability 16:20 18: TPC Meeting ESSCIRC by invitation only 2016 TPC Meeting ESSDERC by invitation only 19:40 22:00 Gala Dinner 19:40 22:00
4 Thursday, 17 September, 2015 Room "Graz" Room "Vienna" Room "Klagenfurt" Room "Salzburg" Room "Linz" Room "Innsbruck" Room "Villach" Joint Plenary Lectures (Room Graz): 08:40 10:00 08:40 10:00 B. Stadlober, JOANNEUM RESEARCH P. Boudre, Soitec 10:00 10:20 Preview ESSCIRC/ESSDERC 2016 (Room Graz) 09:00 10:20 10:20 10:50 10:20 10:50 10:50 12:10 Memory Circuits RF Transmitters Thursday, September 17, 2015 Optical Sensors and Readout Modeling of Important Issues for Main Stream Silicon Advanced CMOS Device and Technology Resistive RAM Invited Session: Sensors and MEMS Applications 10:50 11:50 11:50 12:10 12:10 13:20 Lunch 12:10 13:20 13:20 14:00 ESSCIRC Plenary (R. Graz): Y. Deval, Univ. of Bordeaux ESSDERC Plenary (Room Klagenfurt): T. Ernst, CEA- Leti 13:20 14:00 PLLs and Timing Circuits BioMedical and Sensor Circuits Invited Session (R. Klagenfurt): Advanced Biomedical Characterization of Advanced Advanced Numerical Modeling of Alternative Material 16:00 16:20 Joint Plenary Lecture (Room Graz): W. van Puymbroeck, DG CONNECT 16:00 16:20 16:20 17:40 Closing Session: Synchronous Advancement of Hardware and Software Added Value for Europe? (Room Graz) Jointly organized by ESSCIRC/ESSDERC and the stakeholders of ECSEL 16:20 17:40 19:00 21:00 Guided City Tour through Graz 19:00 21:00
5 Friday, 18 September, 2015 Workshops Friday September 18, WORKSHOPS Start End Room 1 Room 2 Room 3 Room 4 Room 5 Room 6 Start End 08:30 08:45 DC- DC Converter 08:30 08:45 08:45 11:00 Chair: Christoph 08:30 10:30 Sandner 11:00 11:30 11:30 12:00 12:00 12:30 12:30 13:00 13:00 13:45 13:45 14:00 14:00 16:00 10:30 11:00 14:00 15:30 15:30 16:00 16:00 16:30 16:00 16:30 16:30 17:30 MOS- AK: Enabling Compact Modeling R&D Exchange Chair: Wladek Grabinski Lunch MOS- AK: Enabling Compact Modeling R&D Exchange Chair: Wladek Grabinski RFID Technologies Exploiting 2D and 3D Printing and Packaging Chair: Jasmin Grosinger RFID Technologies Exploiting 2D and 3D Printing and Packaging Chair: Jasmin Grosinger Lunch From Atom To Transistor Predictive Simulation of Emerging Chair: Zlatan Stanojević From Atom To Transistor Predictive Simulation of Emerging Chair: Zlatan Stanojević Variation- Aware Design for RF Engineers Chair: Stephan Weber Variation- Aware Design for RF Engineers Chair: Stephan Weber Electromagnetic Compatibility of Integrated Circuits Chair: Bernd Deutschmann Electromagnetic Compatibility of Integrated Circuits Chair: Bernd Deutschmann DC- DC Converter Chair: Christoph Sandner 11:00 13:00 13:00 14:00 16:30 17:30
CONFERENCE SESSIONS MATRIX - MONDAY
CONFERENCE SESSIONS MATRIX - MONDAY 7 05 GaN Devices 11 Graphene & III-V Devices 8 04 OPENING SESSION 06 Millimetre-Wave Low Noise Amplifiers 12 Millimetre-Wave Transceiver 9 07 Millimetre-Wave and THz
High-Frequency Integrated Circuits
High-Frequency Integrated Circuits SORIN VOINIGESCU University of Toronto CAMBRIDGE UNIVERSITY PRESS CONTENTS Preface, page xiii Introduction l 1.1 High-frequency circuits in wireless, fiber-optic, and
Concevoir et produire des semiconducteurs en Europe: une Utopie? Let s have a look
Concevoir et produire des semiconducteurs en Europe: une Utopie? Let s have a look Gérard MATHERON MIDIS MINATEC 24 avril 2009 1 Advanced Wafer Manufacturing Challenges Advanced Wafer Manufacturing Challenges
ANALOG & DIGITAL ELECTRONICS
ANALOG & DIGITAL ELECTRONICS Course Instructor: Course No: PH-218 3-1-0-8 Dr. A.P. Vajpeyi E-mail: apvajpeyi@iitg.ernet.in Room No: #305 Department of Physics, Indian Institute of Technology Guwahati,
A Career that Revolutionises & Improves Lives
OPTION GROUP B ELECTRONIC ENGINEERING presented by K Radha Krishnan Associate Professor, EEE 25 February 2015 1 A Career that Revolutionises & Improves Lives Scientists investigate that which already is,
Make the Future Visible. Career Opportunities at Infineon Technologies. www.infineon.com/careers
Make the Future Visible Career Opportunities at Infineon Technologies www.infineon.com/careers Did you know that semiconductors are the key to successful e-mobility? Did you know that you can find our
Making a PhD @ the Department of Electrical Engineering (ESAT)
Making a PhD @ the Department of Electrical Engineering (ESAT) Agenda 19h00: information session about PhD program o research @ ESAT o application procedures 19h30: testimonials from current PhD students
INF4420 Introduction
INF4420 Introduction Spring 2012 Jørgen Andreas Michaelsen (jorgenam@ifi.uio.no) Outline Practical information about the course. Context (placing what we will learn in a larger context) Outline of the
NATIONAL SUN YAT-SEN UNIVERSITY
NATIONAL SUN YAT-SEN UNIVERSITY Department of Electrical Engineering (Master s Degree, Doctoral Program Course, International Master's Program in Electric Power Engineering) Course Structure Course Structures
organismos internacionales
Semiconductores de potencia de gap ancho en organismos internacionales Philippe Godignon & Power devices and Systems Group Systems Integration Department Centro Nacional de Microelectrónica, CNM CNM-CSIC,
WIPO Summer Schools on Intellectual Property
E SUMMER SCHOOL WIPO/ACAD//14/INF.1 ORIGINAL: ENGLISH DATE: JANUARY 2014 WIPO Summer Schools on Intellectual Property organized by the World Intellectual Property Organization (WIPO) in cooperation with
TowerJazz High Performance SiGe BiCMOS processes
TowerJazz High Performance SiGe BiCMOS processes 2 Comprehensive Technology Portfolio 0.50 µm 0.35 µm 0.25 µm 0.18/0.16/0.152 µm 0.13 0.13µm BiCMOS, SiGe SiGe SiGe SiGe Power/BCD BCD BCD Power/BCD Image
Substrate maturity and readiness in large volume to support mass adoption of ULP FDSOI platforms. SOI Consortium Conference Tokyo 2016
Substrate maturity and readiness in large volume to support mass adoption of ULP FDSOI platforms Christophe Maleville Substrate readiness 3 lenses view SOI Consortium C1 - Restricted Conference Tokyo 2016
Leti Introduction and Overview
Leti Introduction and Overview Leti Day in Tokyo, October 3rd 2012 Laurent Malier 2012 Leti 2012 1 CEA The CEA at a glance Commissariat à l Énergie Atomique et aux Énergies Alternatives is one of the largest
GaAs Switch ICs for Cellular Phone Antenna Impedance Matching
GaAs Switch ICs for Cellular Phone Antenna Impedance Matching IWATA Naotaka, FUJITA Masanori Abstract Recently cellular phones have been advancing toward multi-band and multi-mode phones and many of them
ELECTRICAL ENGINEERING
EE ELECTRICAL ENGINEERING See beginning of Section H for abbreviations, course numbers and coding. The * denotes labs which are held on alternate weeks. A minimum grade of C is required for all prerequisite
Build your own solution with UMS
FOUNDRY SERVICES Build your own solution with UMS Your innovative partner for high performance, high yield MMIC solutions 2015-2016 www.ums-gaas.com FOUNDRY SERVICES UMS has developed a proven family of
Smart Systems for Healthcare and Energy Efficiency
Smart Systems for Healthcare and Energy Efficiency EPOSS Annual Forum 8 th October 2010 Salvo Coffa Group VP, R&D General Manager Industrial & Multisegment Sector STMicroelectronics 1 Smart Systems Main
Digital Integrated Circuit (IC) Layout and Design
Digital Integrated Circuit (IC) Layout and Design! EE 134 Winter 05 " Lecture Tu & Thurs. 9:40 11am ENGR2 142 " 2 Lab sections M 2:10pm 5pm ENGR2 128 F 11:10am 2pm ENGR2 128 " NO LAB THIS WEEK " FIRST
Nanotechnologies for the Integrated Circuits
Nanotechnologies for the Integrated Circuits September 23, 2015 Dr. Bertrand Cambou Professor of Practice NAU, Cybersecurity School of Informatics, Computing, and Cyber-Systems Agenda The Market Silicon
ELECTRICAL AND COMPUTER ENGINEERING By Joan Omoruyi, Engineering Librarian, Northeastern University
ELECTRICAL AND COMPUTER ENGINEERING By Joan Omoruyi, Engineering Librarian, Northeastern University. Soon after physicists began to understand electricity, the electrical engineering profession was born
SECOND YEAR. Major Subject 3 Thesis (EE 300) 3 Thesis (EE 300) 3 TOTAL 3 TOTAL 6. MASTER OF ENGINEERING IN ELECTRICAL ENGINEERING (MEng EE) FIRST YEAR
MASTER OF SCIENCE IN ELECTRICAL ENGINEERING (MS EE) FIRST YEAR Elective 3 Elective 3 Elective 3 Seminar Course (EE 296) 1 TOTAL 12 TOTAL 10 SECOND YEAR Major Subject 3 Thesis (EE 300) 3 Thesis (EE 300)
How To Learn To Understand And Understand The Physics Of Chemistry
What will I learn as an Electrical Engineering student? Department of Electrical and Computer Engineering Tufts School of Engineering Trying to decide on a major? Most college course descriptions are full
Making a PhD @ the Department of Electrical Engineering (ESAT)
Making a PhD @ the Department of Electrical Engineering (ESAT) Agenda 19h00: information session about PhD program o research @ ESAT o application procedures 19h40: testimonials from current PhD students
1.1 Silicon on Insulator a brief Introduction
Table of Contents Preface Acknowledgements Chapter 1: Overview 1.1 Silicon on Insulator a brief Introduction 1.2 Circuits and SOI 1.3 Technology and SOI Chapter 2: SOI Materials 2.1 Silicon on Heteroepitaxial
Department of Electrical and Computer Engineering Ben-Gurion University of the Negev. LAB 1 - Introduction to USRP
Department of Electrical and Computer Engineering Ben-Gurion University of the Negev LAB 1 - Introduction to USRP - 1-1 Introduction In this lab you will use software reconfigurable RF hardware from National
Spike-Based Sensing and Processing: What are spikes good for? John G. Harris Electrical and Computer Engineering Dept
Spike-Based Sensing and Processing: What are spikes good for? John G. Harris Electrical and Computer Engineering Dept ONR NEURO-SILICON WORKSHOP, AUG 1-2, 2006 Take Home Messages Introduce integrate-and-fire
An Introduction to High-Frequency Circuits and Signal Integrity
An Introduction to High-Frequency Circuits and Signal Integrity 1 Outline The electromagnetic spectrum Review of market and technology trends Semiconductors industry Computers industry Communication industry
UTBB-FDSOI 28nm : RF Ultra Low Power technology for IoT
UTBB-FDSOI 28nm : RF Ultra Low Power technology for IoT International Forum on FDSOI IC Design B. Martineau www.cea.fr Cliquez pour modifier le style du Outline titre Introduction UTBB-FDSOI 28nm for RF
RF Network Analyzer Basics
RF Network Analyzer Basics A tutorial, information and overview about the basics of the RF Network Analyzer. What is a Network Analyzer and how to use them, to include the Scalar Network Analyzer (SNA),
Syllabus. For the trade of. Cable tv operator. Under Apprenticeship Training Scheme In the Informal Sector. Designed in 2002. Government of India
Syllabus For the trade of Cable tv operator Under Apprenticeship Training Scheme In the Informal Sector Designed in 2002 Government of India Ministry of Labour (D.G.E.&T.) CENTRAL STAFF TRAINING AND RESEARCH
76-77 GHz RF Transmitter Front-end for W-band Radar Applications
Freescale Semiconductor Data Sheet Summary for MC33 7-77 GHz RF Transmitter Front-end for W-band Radar Applications The MR2001 is a scalable three package solution for automotive radar modules. The chipset
Advanced VLSI Design CMOS Processing Technology
Isolation of transistors, i.e., their source and drains, from other transistors is needed to reduce electrical interactions between them. For technologies
1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.
.Introduction If the automobile had followed the same development cycle as the computer, a Rolls- Royce would today cost $00, get one million miles to the gallon and explode once a year Most of slides
How to Design and Build a Building Network
Logo azienda/università BC1 Le tecnologie Elettroniche e Informatiche al servizio della gestione energetica Enrico Sangiorgi Workshop Diapositiva 1 BC1 inserire i propri riferimenti Nome e Cognome relatore
Electrical and Computer Engineering (ECE)
Department of Electrical and Computer Engineering Contact Information College of Engineering and Applied Sciences B-236 Parkview Campus 1903 West Michigan, Kalamazoo, MI 49008 Phone: 269 276 3150 Fax:
DESIGN OF MIXED SIGNAL CIRCUITS AND SYSTEMS FOR WIRELESS APPLICATIONS
DESIGN OF MIXED SIGNAL CIRCUITS AND SYSTEMS FOR WIRELESS APPLICATIONS Vladimir LANTSOV Computer Engineering Department, Vladimir State University, Gorky Street, 87, 600026, VLADIMIR, Russia, phone: +7
Serial port interface for microcontroller embedded into integrated power meter
Serial port interface for microcontroller embedded into integrated power meter Mr. Borisav Jovanović, Prof. dr. Predrag Petković, Prof. dr. Milunka Damnjanović, Faculty of Electronic Engineering Nis, Serbia
MsC in Advanced Electronics Systems Engineering
MsC in Advanced Electronics Systems Engineering 1 2 General overview Location: Dijon, University of Burgundy, France Tuition Fees : 475 / year Course Language: English Course duration: 1 year Level: Second
VCO Phase noise. Characterizing Phase Noise
VCO Phase noise Characterizing Phase Noise The term phase noise is widely used for describing short term random frequency fluctuations of a signal. Frequency stability is a measure of the degree to which
Coherent sub-thz transmission systems in Silicon technologies: design challenges for frequency synthesis
Coherent sub-thz transmission systems in Silicon technologies: design challenges for frequency synthesis Alexandre Siligaris www.cea.fr Cliquez pour modifier le style du Outline titre Introduction-context
CONTENTS. Preface. 1.1.2. Energy bands of a crystal (intuitive approach)
CONTENTS Preface. Energy Band Theory.. Electron in a crystal... Two examples of electron behavior... Free electron...2. The particle-in-a-box approach..2. Energy bands of a crystal (intuitive approach)..3.
Simplifying System Design Using the CS4350 PLL DAC
Simplifying System Design Using the CS4350 PLL 1. INTRODUCTION Typical Digital to Analog Converters (s) require a high-speed Master Clock to clock their digital filters and modulators, as well as some
Curriculum and Concept Module Development in RF Engineering
Introduction Curriculum and Concept Module Development in RF Engineering The increasing number of applications students see that require wireless and other tetherless network solutions has resulted in
Delivering Dependable Performance... A Spectrum of Radar Solutions
We work with you M/A-COM Technology Solutions is an industry leader in the design, development, and manufacture of radio frequency (RF), microwave and millimeter wave semiconductors, components and technologies.
What will I learn as an Electrical Engineering student?
What will I learn as an Electrical Engineering student? Department of Electrical and Computer Engineering Tu5s School of Engineering Trying to decide on a major? Most college course descrip>ons are full
PRESS RELEASE FRAUNHOFER INSTITUTE FOR INTEGRATED CIRCUITS IIS DESIGN AUTOMATION DIVISION EAS. PRESSE RELEASE June 2, 2014 Page 1 5
PRESS RELEASE June 2, 2014 Page 1 5 European Project VERDI provides Universal Verification Methodology (UVM) in SystemC to Accellera Systems Initiative as new industry standard proposal UVM-SystemC language
VON BRAUN LABS. Issue #1 WE PROVIDE COMPLETE SOLUTIONS ULTRA LOW POWER STATE MACHINE SOLUTIONS VON BRAUN LABS. State Machine Technology
VON BRAUN LABS WE PROVIDE COMPLETE SOLUTIONS WWW.VONBRAUNLABS.COM Issue #1 VON BRAUN LABS WE PROVIDE COMPLETE SOLUTIONS ULTRA LOW POWER STATE MACHINE SOLUTIONS State Machine Technology IoT Solutions Learn
Global Semiconductor & Electronics Forum 9-11 March 2016, Shanghai, China. Connecting leaders for an IoT world
Global Semiconductor & Electronics Forum 9-11 March 2016, Shanghai, China Connecting leaders for an IoT world Welcome and registration Wednesday 9 th March 2016 16:00 18:30 Event Registration 18:30 21:00
'Possibilities and Limitations in Software Defined Radio Design.
'Possibilities and Limitations in Software Defined Radio Design. or Die Eierlegende Wollmilchsau Peter E. Chadwick Chairman, ETSI ERM_TG30, co-ordinated by ETSI ERM_RM Software Defined Radio or the answer
Design and Test of Fast Laser Driver Circuits
Design and Test of Fast Laser Driver Circuits Since the invention of the laser by Theodore H Maiman 50 years ago, lasers have found widespread applications in various technological fields, such as telecommunications,
On the convergences between More Moore, More Than Moore and Beyond CMOS
On the convergences between More Moore, More Than Moore and Beyond CMOS Workshop organizers : Francis BALESTRA & Raphael CLERC IMEP, Grenoble, FRANCE Thank you to A. Godoy and colleagues for the help organizing
Meeting TeTech. Version: 1.8, 15-July-2013, Author: Wim Telkamp, language: English
Meeting TeTech, English version TeTech M.H. Trompstraat 6 3601 HT Maarssen The Netherlands Tel: + 31 (0) 346 284004 Fax: + 31 (0) 346 283691 Email: info@tetech.nl Web: www.tetech.nl CoC: 30169033 VAT:
Hocheffiziente, modulare Stromversorgung für mobile und stationäre Anwendungen. Dr. Oliver Lang Sonnenrepublik GmbH www.sonnenrepublik.
Hocheffiziente, modulare Stromversorgung für mobile und stationäre Anwendungen Dr. Oliver Lang Sonnenrepublik GmbH www.sonnenrepublik.de 1 Startup Dec 2012 in Berlin, Germany Solar systems with total modularity
«A 32-bit DSP Ultra Low Power accelerator»
«A 32-bit DSP Ultra Low Power accelerator» E. Beigné edith.beigne@cea.fr CEA LETI MINATEC, Grenoble, France www.cea.fr Low power SOC challenges : Energy Efficiency Fine-Grain AVFS solutions FDSOI technology
LLRF. Digital RF Stabilization System
LLRF Digital RF Stabilization System Many instruments. Many people. Working together. Stability means knowing your machine has innovative solutions. For users, stability means a machine achieving its full
A 1-GSPS CMOS Flash A/D Converter for System-on-Chip Applications
A -GSPS CMOS Flash A/D Converter for System-on-Chip Applications Jincheol Yoo, Kyusun Choi, and Ali Tangel Department of Computer Science & Department of Computer & Engineering Communications Engineering
NVM memory: A Critical Design Consideration for IoT Applications
NVM memory: A Critical Design Consideration for IoT Applications Jim Lipman Sidense Corp. Introduction The Internet of Things (IoT), sometimes called the Internet of Everything (IoE), refers to an evolving
SLC vs. MLC: An Analysis of Flash Memory
SLC vs. MLC: An Analysis of Flash Memory Examining the Quality of Memory: Understanding the Differences between Flash Grades Table of Contents Abstract... 3 Introduction... 4 Flash Memory Explained...
INTRODUCTION TO COMMUNICATION SYSTEMS AND TRANSMISSION MEDIA
COMM.ENG INTRODUCTION TO COMMUNICATION SYSTEMS AND TRANSMISSION MEDIA 9/6/2014 LECTURES 1 Objectives To give a background on Communication system components and channels (media) A distinction between analogue
EECC694 - Shaaban. Transmission Channel
The Physical Layer: Data Transmission Basics Encode data as energy at the data (information) source and transmit the encoded energy using transmitter hardware: Possible Energy Forms: Electrical, light,
Soitec. Eric Guiot, Manager R&D Soitec. 7 mars 2011 JSIam 2011
Soitec Eric Guiot, Manager R&D Soitec 1 Agenda Soitec: company presentation Applications and market PhDs at Soitec 2 Mission Statement Supply innovative materials and technologies for the electronics and
Automatic Impedance Matching for 13.56 MHz NFC Antennas
Automatic Impedance Matching for 13.56 MHz NFC Antennas Michael Roland 1, Harald Witschnig 2, Erich Merlin 2, Christian Saminger 1 1 Upper Austria University of Applied Sciences, Hagenberg, Austria 2 NXP
Challenges of the Internet of Things for Sensor and Actuator Applications
Challenges of the Internet of Things for Sensor and Actuator Applications Thomas Gessner, Torsten Thieme SEMICON Moscow 2015 Smart Systems Integration Session June 17 th, 2015 Source: Journal Internet
Intel Labs at ISSCC 2012. Copyright Intel Corporation 2012
Intel Labs at ISSCC 2012 Copyright Intel Corporation 2012 Intel Labs ISSCC 2012 Highlights 1. Efficient Computing Research: Making the most of every milliwatt to make computing greener and more scalable
Solid State Electronics and Photonics Electrical and Computer Engineering The Ohio State University
Solid State Electronics and Photonics Electrical and Computer Engineering The Ohio State University An Overview for Prospective Students http://www.ece.osu.edu/ssep SSEP Area: Who Are We? First Row Betty
DECEMBER 2015 PTAB Public Hearing Schedule
IPR 2015-00021 Tuesday, December 01, 2015 9:00 AM A ALEXANDRIA, VA 2013-003491 12422863 Tuesday, December 01, 2015 9:00 AM (MST) 14-133 DENVER, CO 2013-003763 11839384 Tuesday, December 01, 2015 9:00 AM
How To Make A Power Amplifier For A Mobile Phone
A PA for Mobile Terminals Supporting 9 Bands from 7 MHz to 2. GHz Multi-band PA Variable MN A PA for Mobile Terminals Supporting 9 Bands from 7 MHz to 2. GHz Commercially available mobile terminals currently
TLI4946. Datasheet TLI4946K, TLI4946-2K, TLI4946-2L. Sense and Control. May 2009
May 2009 TLI4946 High Precision Hall Effect Latches for Industrial and Consumer Applications TLI4946K, TLI4946-2K, TLI4946-2L Datasheet Rev. 1.0 Sense and Control Edition 2009-05-04 Published by Infineon
DEVELOPMENT OF DEVICES AND METHODS FOR PHASE AND AC LINEARITY MEASUREMENTS IN DIGITIZERS
DEVELOPMENT OF DEVICES AND METHODS FOR PHASE AND AC LINEARITY MEASUREMENTS IN DIGITIZERS U. Pogliano, B. Trinchera, G.C. Bosco and D. Serazio INRIM Istituto Nazionale di Ricerca Metrologica Torino (Italia)
L innovazione tecnologica dell industria italiana verso la visione europea del prossimo futuro
L innovazione tecnologica dell industria italiana verso la visione europea del prossimo futuro Mercoledì 2 Aprile 2014 Antonio D Errico, Francesco Testa, Roberto Sabella, Ericsson Silicon Photonics Opportunities
AC/DC Power Supply Reference Design. Advanced SMPS Applications using the dspic DSC SMPS Family
AC/DC Power Supply Reference Design Advanced SMPS Applications using the dspic DSC SMPS Family dspic30f SMPS Family Excellent for Digital Power Conversion Internal hi-res PWM Internal high speed ADC Internal
A bachelor of science degree in electrical engineering with a cumulative undergraduate GPA of at least 3.0 on a 4.0 scale
What is the University of Florida EDGE Program? EDGE enables engineering professional, military members, and students worldwide to participate in courses, certificates, and degree programs from the UF
Implementation of Short Reach (SR) and Very Short Reach (VSR) data links using POET DOES (Digital Opto- electronic Switch)
Implementation of Short Reach (SR) and Very Short Reach (VSR) data links using POET DOES (Digital Opto- electronic Switch) Summary POET s implementation of monolithic opto- electronic devices enables the
The I2C Bus. NXP Semiconductors: UM10204 I2C-bus specification and user manual. 14.10.2010 HAW - Arduino 1
The I2C Bus Introduction The I2C-bus is a de facto world standard that is now implemented in over 1000 different ICs manufactured by more than 50 companies. Additionally, the versatile I2C-bus is used
Case Study Competition 2013. Be an engineer of the future! Innovating cars using the latest instrumentation!
Case Study Competition 2013 Be an engineer of the future! Innovating cars using the latest instrumentation! The scenario You are engineers working on a project team that is tasked with the development
WIPO-USA Summer School on Designs and the Interface with Intellectual Property Rights (IPRs) (Patents, Trademarks, and Copyright)
E SUMMER SCHOOL WIPO/ACAD//15/INF.1 ORIGINAL: ENGLISH DATE: MAY 2015 WIPO-USA Summer School on Designs and the Interface with Intellectual Property Rights (IPRs) (Patents, Trademarks, and Copyright) organized
Application Note, Rev.1.0, September 2008 TLE8366. Application Information. Automotive Power
Application Note, Rev.1.0, September 2008 TLE8366 Automotive Power Table of Contents 1 Abstract...3 2 Introduction...3 3 Dimensioning the Output and Input Filter...4 3.1 Theory...4 3.2 Output Filter Capacitor(s)
1ED Compact A new high performance, cost efficient, high voltage gate driver IC family
1ED Compact A new high performance, cost efficient, high voltage gate driver IC family Heiko Rettinger, Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany, heiko.rettinger@infineon.com
Developments in 900 MHz wireless connectivity systems. Guido Dolmans Holst Centre / Imec-NL
Developments in 900 MHz wireless connectivity systems Guido Dolmans Holst Centre / Imec-NL 3 HOLST CENTRE PROJECTS SUB-GHZ NUTSHELL 900 MHz UHF RFID European project Pasteur for sensor-enhanced RFID for
STMicroelectronics. Deep Sub-Micron Processes 130nm, 65 nm, 40nm, 28nm CMOS, 28nm FDSOI. SOI Processes 130nm, 65nm. SiGe 130nm
STMicroelectronics Deep Sub-Micron Processes 130nm, 65 nm, 40nm, 28nm CMOS, 28nm FDSOI SOI Processes 130nm, 65nm SiGe 130nm CMP Process Portfolio from ST Moore s Law 130nm CMOS : HCMOS9GP More than Moore
SiGe:C BiCMOS Technologies for RF Automotive Application
SiGe:C BiCMOS Technologies for RF Automotive Application Gerhard Fischer, Srdjan Glisic, Bernd Heinemann, Dieter Knoll, Wolfgang Winkler IHP Im Technologiepark 25 15236 Frankfurt (Oder) Germany Outline
a leap ahead in analog
EMV Contactless Payment Systems based on AS3911 Overview and System Simulations Giuliano Manzi, PhD Mannheim, May 23 25, 2012 CST EUROPEAN USER CONFERENCE 2012 a leap ahead in analog OUTLINE AS3911 OVERVIEW
AMS Verification at SoC Level: A practical approach for using VAMS vs SPICE views
AMS Verification at SoC Level: A practical approach for using VAMS vs SPICE views Nitin Pant, Gautham Harinarayan, Manmohan Rana Accellera Systems Initiative 1 Agenda Need for SoC AMS Verification Mixed
Note monitors controlled by analog signals CRT monitors are controlled by analog voltage. i. e. the level of analog signal delivered through the
DVI Interface The outline: The reasons for digital interface of a monitor the transfer from VGA to DVI. DVI v. analog interface. The principles of LCD control through DVI interface. The link between DVI
Thermal Antenna for Passive THz Security Screening System and Current- Mode Active-Feedback Readout Circuit for Thermal Sensor
Department of Electrical Engineering Thermal Antenna for Passive THz Security Screening System and Current- Mode Active-Feedback Readout Circuit for Thermal Sensor 1. Background Alon Rotman and Roy Nicolet
Design and Construction of Variable DC Source for Laboratory Using Solar Energy
International Journal of Electronics and Computer Science Engineering 228 Available Online at www.ijecse.org ISSN- 2277-1956 Design and Construction of Variable DC Source for Laboratory Using Solar Energy
Technical Description. Transistor D.C. Chopper Controller Type GS 24 S
Technical Description Transistor D.C. Chopper Controller Type GS 24 S Table of contents 1. Getting started guide 2. General information 2.1. Characteristics 2.2. Accessories 3. Information about the Machine
Product Datasheet P1110 915 MHz RF Powerharvester Receiver
DESCRIPTION The Powercast P1110 Powerharvester receiver is an RF energy harvesting device that converts RF to DC. Housed in a compact SMD package, the P1110 receiver provides RF energy harvesting and power
OMNIYIG. .5 TO 2 GHz, 1 TO 4 GHz, 6 to 18 GHz Thin Film YIG-TUNED OSCILLATORS OUTLINE DIMESIONS MOUNTING SURFACE GND +15V + TUNE - HTR HTR
. TO Hz, 1 TO Hz, to 1 Hz Thin Film YITUNED OSCILLATORS Highly Reliable StateoftheArt ThinFilm Technology s. to 1 Hz oscillators employ thinfilm technology, coupled with aas FET transistors, and were designed
M.S Ramaiah School of Advanced Studies - Bangalore. On completion of this session, the delegate will understand and be able to appriciate:
Transmission Control Lecture delivered by: Prof. Ashok C.Meti MSRSAS-Bangalore 1 Session Objectives On completion of this session, the delegate will understand and be able to appriciate: Rl Role of electronic
Automation System TROVIS 6400 TROVIS 6493 Compact Controller
Automation System TROVIS 6400 TROVIS 6493 Compact Controller For panel mounting (front frame 48 x 96 mm/1.89 x 3.78 inch) Application Digital controller to automate industrial and process plants for general
Enhanced In-house Voice Communication over Power- Line Network
International Journal of Scientific and Research Publications, Volume 3, Issue 7, July 2013 1 Enhanced In-house Voice Communication over Power- Line Network Asif Hassan Senior Lecturer, Dept. of ECE, HMSIT,
MARKET ANALYSIS AND KEY TRENDS FROM FD SOI PERSPECTIVE (SEPTEMBER 22, 2014)
MARKET ANALYSIS AND KEY TRENDS FROM FD SOI PERSPECTIVE (SEPTEMBER 22, 2014) INTERNATIONAL BUSINESS STRATEGIES, INC. 632 Industrial Way Los Gatos CA 95030 USA 408 395 9585 408 395 5389 (fax) www.ibs-inc.net
mm-wave System-On-Chip & System-in-Package Design for 122 GHz Radar Sensors
mm-wave System-On-Chip & System-in-Package Design for 122 GHz Radar Sensors 12th International Symposium on RF MEMS and RF Microsystems Athens, Greece J. C. Scheytt 1, Y. Sun 1, S. Beer 2, T. Zwick 2,
P D 215 1.25 Operating Junction Temperature T J 200 C Storage Temperature Range T stg 65 to +150 C
SEMICONDUCTOR TECHNICAL DATA Order this document by /D The RF Line The is designed for output stages in band IV and V TV transmitter amplifiers. It incorporates high value emitter ballast resistors, gold
Material Requirements For 3D IC and Packaging Presented by: W. R. Bottoms
Material Requirements For 3D IC and Packaging Presented by: W. R. Bottoms Frontiers of Characterization and Metrology for Nanoelectronics Hilton Dresden April 14-16, 2015 Industry Needs Are Changing Moore
Location-Aware and Safer Cards: Enhancing RFID Security and Privacy
Location-Aware and Safer Cards: Enhancing RFID Security and Privacy 1 K.Anudeep, 2 Mrs. T.V.Anantha Lakshmi 1 Student, 2 Assistant Professor ECE Department, SRM University, Kattankulathur-603203 1 anudeepnike@gmail.com,
Technical Datasheet Scalar Network Analyzer Model 8003-10 MHz to 40 GHz
Technical Datasheet Scalar Network Analyzer Model 8003-10 MHz to 40 GHz The Giga-tronics Model 8003 Precision Scalar Network Analyzer combines a 90 db wide dynamic range with the accuracy and linearity
The Heartbeat behind Portable Medical Devices: Ultra-Low-Power Mixed-Signal Microcontrollers
The Heartbeat behind Portable Medical Devices: Ultra-Low-Power Mixed-Signal Microcontrollers The proliferation of sophisticated yet affordable personal medical devices is transforming the health care industry,