Package Information Datasheet for Mature Altera Devices

Transcription

1 Packag Information Datasht for Matur Altra Dvics DS-PKG-16.8 This datasht provids packag and thrmal rsistanc information for matur Altra dvics. Packag information includs th ordring cod rfrnc, packag acronym, ladfram matrial, lad finish (plating), JEDEC outlin rfrnc, lad coplanarity, wight, moistur snsitivity lvl, and othr spcial information. Th thrmal rsistanc information includs dvic pin count, packag nam, and rsistanc valus. This datasht includs th following sctions: Dvic and Packag Cross Rfrnc on pag 1 Thrmal Rsistanc on pag 23 Packag Outlins on pag 44 f f f For mor packag and thrmal rsistanc information about Altra dvics that ar not listd in this datasht, rfr to th Packag and Thrmal Rsistanc pag of th Altra wbsit. For information about trays, tubs, and dry packs, rfr to AN 71: Guidlins for Handling J-Lad, QFP, and BGA Dvics. RoHS-compliant dvics ar compatibl with ladd-rflow tmpraturs. For mor information, rfr to Altra s RoHS-Compliant Dvics litratur pag. Dvic and Packag Cross Rfrnc Tabl 2 through Tabl 22 lists th dvic, packag typ, and numbr of pins for ach Altra dvic listd in this datasht. Altra dvics listd in this datasht ar availabl in th following packags: Ball-Grid Array (BGA) Cramic Pin-Grid Array (PGA) FinLin BGA (FBGA) Hybrid FinLin BGA (HBGA) Plastic Dual In-Lin Packag (PDIP) Plastic Enhancd Quad Flat Pack (EQFP) Plastic J-Lad Chip Carrir (PLCC) Plastic Quad Flat Pack (PQFP) Powr Quad Flat Pack (RQFP) Thin Quad Flat Pack (TQFP) Ultra FinLin BGA (UBGA) Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

2 2 Packag Information Datasht for Matur Altra Dvics Dvic and Packag Cross Rfrnc Tabl 1 lists th Altra dvics and th associatd tabl locations. Tabl 1. Matur Altra Dvic and Packag Cross Rfrnc Altra Dvic Tabl locations Arria sris FPGAs Arria GX Dvics: Tabl 2 on pag 3 Stratix Stratix II Dvics: Tabl 3 on pag 3 sris FPGAs Stratix Dvics: Tabl 4 on pag 5 Cyclon Cyclon II Dvics: Tabl 5 on pag 7 sris FPGAs Cyclon Dvics: Tabl 6 on pag 8 MAX 9000 Dvics: Tabl 7 on pag 8 MAX sris CPLDs MAX 7000 Dvics: Tabl 8 on pag 9 MAX 3000A Dvics: Tabl 9 on pag 10 HardCopy II Dvics: Tabl 10 on pag 11 HardCopy sris ASICs HardCopy Dvics: Tabl 11 on pag 11 HardCopy APEX Dvics: Tabl 12 on pag 12 APEX II Dvics: Tabl 13 on pag 13 APEX 20KE Dvics: Tabl 14 on pag 13 APEX sris FPGAs APEX 20KC Dvics: Tabl 15 on pag 15 APEX 20K Dvics: Tabl 16 on pag 15 ACEX 1K FPGAs ACEX 1K Dvics: Tabl 17 on pag 16 Mrcury FPGAs Mrcury Dvics: Tabl 18 on pag 17 FLEX 10KA Dvics: Tabl 19 on pag 17 FLEX sris FPGAs FLEX 10KS Dvics: Tabl 20 on pag 18 FLEX 10KE Dvics: Tabl 21 on pag 18 Excalibur FPGAs Excalibur Dvics: Tabl 22 on pag 21 Configuration dvics Configuration Dvics: Tabl 23 on pag 22 Enhancd configuration dvics Enhancd Configuration Dvics: Tabl 24 on pag 22 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

3 Packag Information Datasht for Matur Altra Dvics 3 Dvic and Packag Cross Rfrnc Arria GX Dvics Tabl 2 lists th dvic nam, packag typ, and numbr of pins for th Arria GX dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Stratix II Dvics Tabl 2. Arria GX Dvics Dvic Packag Pins EP1AGX20 EP1AGX35 EP1AGX50 EP1AGX60 EP1AGX90 Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl- Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Channl Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Channl Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Tabl 3 lists th dvic nam, packag typ, and numbr of pins for th Stratix II dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Tabl 3. Stratix II Dvics (Part 1 of 2) Dvic Packag Pins EP2S15 Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option 4 Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

4 4 Packag Information Datasht for Matur Altra Dvics Dvic and Packag Cross Rfrnc Tabl 3. Stratix II Dvics (Part 2 of 2) Dvic Packag Pins EP2S30 EP2S60 EP2S90 EP2S130 EP2S180 EP2SGX30 EP2SGX60 EP2SGX90 EP2SGX130 Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, option Channl Lid: HBGA, Flip Chip 484 Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Channl Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

5 Packag Information Datasht for Matur Altra Dvics 5 Dvic and Packag Cross Rfrnc Stratix Dvics Tabl 4 lists th dvic nam, packag typ, and numbr of pins for th Stratix dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Tabl 4. Stratix Dvics (Part 1 of 2) Dvic Packag Pins EP1SGX10 EP1SGX25 EP1SGX40 EP1S10 EP1S20 EP1S25 EP1S30 Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option BGA, Wir Bond 672 FBGA, Wir Bond, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option BGA, Wir Bond 672 FBGA, Wir Bond, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option BGA, Wir Bond 672 FBGA, Wir Bond, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: BGA, Flip Chip, Option 1 Singl-Pic Lid: BGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

6 6 Packag Information Datasht for Matur Altra Dvics Dvic and Packag Cross Rfrnc Tabl 4. Stratix Dvics (Part 2 of 2) Dvic Packag Pins EP1S40 EP1S60 EP1S80 Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: BGA, Flip Chip, Option 1 Singl-Pic Lid: BGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: BGA, Flip Chip, Option 1 Singl-Pic Lid: BGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: BGA, Flip Chip, Option 1 Singl-Pic Lid: BGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option 1 Singl-Pic Lid: FBGA, Flip Chip, Option Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

7 Packag Information Datasht for Matur Altra Dvics 7 Dvic and Packag Cross Rfrnc Cyclon II Dvics Tabl 5 lists th dvic nam, packag typ, and numbr of pins for th Cyclon II dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Tabl 5. Cyclon II Dvics Dvic Packag Pins TQFP, Wir Bond 144 EP2C5 PQFP, Wir Bond 208 FBGA, Wir Bond, Option 2, Thin 256 TQFP, Wir Bond 144 EP2C8 PQFP, Wir Bond 208 FBGA, Wir Bond, Option 2, Thin 256 EP2C8A FBGA, Wir Bond, Option 2, Thin 256 EP2C15A FBGA, Wir Bond, Option 2, Thin 256 FBGA, Wir Bond, A: PQFP, Wir Bond 240 EP2C20 FBGA, Wir Bond, Option 2, Thin 256 FBGA, Wir Bond, A: EP2C20A FBGA, Wir Bond, Option 2, Thin 256 FBGA, Wir Bond, A: FBGA, Wir Bond, A: EP2C35 UBGA, Wir Bond 484 FBGA, Wir Bond, A: FBGA, Wir Bond, A: EP2C50 UBGA, Wir Bond 484 FBGA, Wir Bond, A: EP2C70 FBGA, Wir Bond, A: FBGA, Wir Bond, A: Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

8 8 Packag Information Datasht for Matur Altra Dvics Dvic and Packag Cross Rfrnc Cyclon Dvics Tabl 6 lists th dvic nam, packag typ, and numbr of pins for th Cyclon dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. MAX 9000 Dvics MAX 7000 Dvics Tabl 6. Cyclon Dvics Dvic Packag Pins EP1C3 EP1C4 EP1C6 EP1C12 EP1C20 TQFP, Wir Bond 100 TQFP, Wir Bond 144 FBGA, Wir Bond, Option FBGA, Wir Bond 400 TQFP, Wir Bond 144 PQFP, Wir Bond 240 FBGA, Wir Bond, Option PQFP, Wir Bond 240 FBGA, Wir Bond, Option FBGA, Wir Bond, Option FBGA, Wir Bond, Option FBGA, Wir Bond 400 Tabl 7 lists th dvic nam, packag typ, and numbr of pins for th MAX 9000 dvic family. Tabl 7. MAX 9000 Dvics Dvic Packag Pins EPM9320 BGA, Wir Bond 356 EPM9320A BGA, Wir Bond 356 EPM9560 BGA, Wir Bond 356 Tabl 8 lists th dvic nam, packag typ, and numbr of pins for th MAX 7000 dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

9 Packag Information Datasht for Matur Altra Dvics 9 Dvic and Packag Cross Rfrnc Tabl 8. MAX 7000 Dvics (Part 1 of 2) Dvic Packag Pins PLCC, Wir Bond 44 EPM7032B TQFP, Wir Bond 44 UBGA, Wir Bond 49 TQFP, Wir Bond 44 EPM7064B UBGA, Wir Bond 49 FBGA, Wir Bond, Option TQFP, Wir Bond 100 UBGA, Wir Bond 49 TQFP, Wir Bond 100 EPM7128B FBGA, Wir Bond, Option TQFP, Wir Bond 144 UBGA, Wir Bond 169 FBGA, Wir Bond, Option TQFP, Wir Bond 100 TQFP, Wir Bond 144 EPM7256B UBGA, Wir Bond 169 PQFP, Wir Bond 208 FBGA, Wir Bond, Option TQFP, Wir Bond 144 UBGA, Wir Bond 169 EPM7512B PQFP, Wir Bond 208 FBGA, Wir Bond, Option BGA, Wir Bond, Option EPM7032AE PLCC, Wir Bond 44 TQFP, Wir Bond 44 PLCC, Wir Bond 44 UBGA, Wir Bond 49 EPM7064AE FBGA, Wir Bond, Option TQFP, Wir Bond 44 TQFP, Wir Bond 100 FBGA, Wir Bond, Option PLCC, Wir Bond 84 FBGA, Wir Bond, Option EPM7128AE TQFP, Wir Bond 100 TQFP, Wir Bond 144 UBGA, Wir Bond 169 FBGA, Wir Bond, Option Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

10 10 Packag Information Datasht for Matur Altra Dvics Dvic and Packag Cross Rfrnc Tabl 8. MAX 7000 Dvics (Part 2 of 2) Dvic Packag Pins TQFP, Wir Bond 100 FBGA, Wir Bond, Option EPM7256AE TQFP, Wir Bond 144 PQFP, Wir Bond 208 FBGA, Wir Bond, Option TQFP, Wir Bond 144 EPM7512AE PQFP, Wir Bond 208 BGA, Wir Bond, Option FBGA, Wir Bond, Option EPM7032A PLCC, Wir Bond 44 TQFP, Wir Bond 44 PLCC, Wir Bond 84 TQFP, Wir Bond 100 EPM7128A FBGA, Wir Bond 100 TQFP, Wir Bond 144 FBGA, Wir Bond, Option TQFP, Wir Bond 100 EPM7256A TQFP, Wir Bond 144 PQFP, Wir Bond 208 FBGA, Wir Bond, Option EPM7192E PGA, Wir Bond 160 PQFP, Wir Bond 160 MAX 3000A Dvics Tabl 8 lists th dvic nam, packag typ, and numbr of pins for th MAX 3000A dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Tabl 9. MAX 3000A Dvics (Part 1 of 2) Dvic Packag Pins EPM3032A PLCC, Wir Bond 44 TQFP, Wir Bond 44 TQFP, Wir Bond 44 EPM3064A PLCC, Wir Bond 44 TQFP, Wir Bond 100 EPM3128A TQFP, Wir Bond 100 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

11 Packag Information Datasht for Matur Altra Dvics 11 Dvic and Packag Cross Rfrnc Tabl 9. MAX 3000A Dvics (Part 2 of 2) Dvic Packag Pins EPM3256A TQFP, Wir Bond 144 PQFP, Wir Bond 208 EPM3512A PQFP, Wir Bond 208 FBGA, Wir Bond, Option HardCopy II Dvics Tabl 10 lists th dvic nam, packag typ, and numbr of pins for th HardCopy II dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Tabl 10. HardCopy II Dvics Dvic Packag Pins HC210 FBGA, Wir Bond, A: HC220 Singl-Pic Lid: FBGA, Flip Chip, Option Singl-Pic Lid: FBGA, Flip Chip, Option HC230 Singl-Pic Lid: FBGA, Flip Chip, Option HC240 Singl-Pic Lid: FBGA, Flip Chip, Option Singl-Pic Lid: FBGA, Flip Chip, Option HardCopy Dvics Tabl 11 lists th dvic nam, packag typ, and numbr of pins for th HardCopy dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Tabl 11. HardCopy Dvics Dvic Packag Pins HC1S25 FBGA, Wir Bond, A: BGA, Wir Bond 672 HC1S30 Dual-Pic Lid: FBGA, Flip Chip, Option HC1S40 Dual-Pic Lid: FBGA, Flip Chip, Option HC1S60 Dual-Pic Lid: FBGA, Flip Chip, Option HC1S80 Dual-Pic Lid: FBGA, Flip Chip, Option Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

12 12 Packag Information Datasht for Matur Altra Dvics Dvic and Packag Cross Rfrnc HardCopy APEX Dvics Tabl 12 lists th dvic nam, packag typ, and numbr of pins for th HardCopy APEX dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Tabl 12. HardCopy APEX Dvics Dvic Packag Pins HC20K400 BGA, Wir Bond, Option HC20K600 BGA, Wir Bond, Option Dual-Pic Lid: FBGA, Flip Chip, Option Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

13 Packag Information Datasht for Matur Altra Dvics 13 Dvic and Packag Cross Rfrnc APEX II Dvics Tabl 13 lists th dvic nam, packag typ, and numbr of pins for th APEX II dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. APEX 20KE Dvics Tabl 13. APEX II Dvics Dvic Packag Pins EP2A15 EP2A25 EP2A40 EP2A70 Dual-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: BGA, Flip Chip 724 Channl Lid: FBGA, Flip Chip, Option Dual-Pic Lid: BGA, Flip Chip 724 Dual-Pic Lid: FBGA, Flip Chip, Option Channl Lid: FBGA, Flip Chip, Option Dual-Pic Lid: BGA, Flip Chip 724 Dual-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: BGA, Flip Chip 724 Dual-Pic Lid: FBGA, Flip Chip, Option Tabl 14 lists th dvic nam, packag typ, and numbr of pins for th APEX 20KE dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Tabl 14. APEX 20KE Dvics (Part 1 of 2) Dvic Packag Pins FBGA, Wir Bond 144 EP20K30E TQFP, Wir Bond 144 PQFP, Wir Bond 208 FBGA, Wir Bond, Option FBGA, Wir Bond 144 TQFP, Wir Bond 144 EP20K60E PQFP, Wir Bond 208 PQFP, Wir Bond 240 FBGA, Wir Bond, Option BGA, Wir Bond 356 Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

14 14 Packag Information Datasht for Matur Altra Dvics Dvic and Packag Cross Rfrnc Tabl 14. APEX 20KE Dvics (Part 2 of 2) Dvic Packag Pins FBGA, Wir Bond 144 TQFP, Wir Bond 144 EP20K100E PQFP, Wir Bond 208 PQFP, Wir Bond 240 FBGA, Wir Bond, Option BGA, Wir Bond 356 TQFP, Wir Bond 144 PQFP, Wir Bond 208 EP20K160E PQFP, Wir Bond 240 BGA, Wir Bond 356 FBGA, Wir Bond, Option PQFP, Wir Bond 208 PQFP, Wir Bond 240 EP20K200E BGA, Wir Bond 356 FBGA, Wir Bond, Option BGA, Wir Bond, Option FBGA, Wir Bond, Option PQFP, Wir Bond 240 EP20K300E BGA, Wir Bond, Option FBGA, Wir Bond, Option EP20K400E BGA, Wir Bond, Option FBGA, Flip Chip, Option BGA, Wir Bond, Option EP20K600E FBGA, Flip Chip, Option FBGA, Flip Chip, Option BGA, Flip Chip 652 EP20K1000E FBGA, Flip Chip, Option FBGA, Flip Chip, Option EP20K1500E BGA, Flip Chip 652 FBGA, Flip Chip, Option Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

15 Packag Information Datasht for Matur Altra Dvics 15 Dvic and Packag Cross Rfrnc APEX 20KC Dvics Tabl 15 lists th dvic nam, packag typ, and numbr of pins for th APEX 20KC dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. APEX 20K Dvics Tabl 15. APEX 20KC Dvics Dvic Packag Pins EP20K200C EP20K400C EP20K600C EP20K1000C PQFP, Wir Bond 208 PQFP, Wir Bond 240 BGA, Wir Bond 356 FBGA, Wir Bond, Option BGA, Wir Bond, Option FBGA, Flip Chip, Option BGA, Wir Bond, Option FBGA, Flip Chip, Option FBGA, Flip Chip, Option BGA, Flip Chip 652 FBGA, Flip Chip, Option FBGA, Flip Chip, Option Tabl 16 lists th dvic nam, packag typ, and numbr of pins for th APEX 20K dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Tabl 16. APEX 20K Dvics (Part 1 of 2) Dvic Packag Pins TQFP, Wir Bond 144 PQFP, Wir Bond 208 EP20K100 PQFP, Wir Bond 240 FBGA, Wir Bond, Option BGA, Wir Bond 356 EP20K160 PQFP, Wir Bond 240 TQFP, Wir Bond 144 Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

16 16 Packag Information Datasht for Matur Altra Dvics Dvic and Packag Cross Rfrnc ACEX 1K Dvics Tabl 16. APEX 20K Dvics (Part 2 of 2) Dvic Packag Pins PQFP, Wir Bond 208 EP20K200 PQFP, Wir Bond 240 BGA, Wir Bond 356 FBGA, Wir Bond, Option EP20K300 FBGA, Wir Bond, Option BGA, Wir Bond, Option EP20K400 PGA, Wir Bond 655 FBGA, Flip Chip, Option Tabl 17 lists th dvic nam, packag typ, and numbr of pins for th ACE 1K dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Tabl 17. ACEX 1K Dvics Dvic Packag Pins TQFP, Wir Bond 100 EP1K10 TQFP, Wir Bond 144 PQFP, Wir Bond 208 FBGA, Wir Bond, Option TQFP, Wir Bond 144 EP1K30 PQFP, Wir Bond 208 FBGA, Wir Bond, Option TQFP, Wir Bond 144 EP1K50 PQFP, Wir Bond 208 FBGA, Wir Bond, Option FBGA, Wir Bond, Option PQFP, Wir Bond 208 EP1K100 FBGA, Wir Bond, Option FBGA, Wir Bond, Option Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

17 Packag Information Datasht for Matur Altra Dvics 17 Dvic and Packag Cross Rfrnc Mrcury Dvics Tabl 18 lists th dvic nam, packag typ, and numbr of pins for th Mrcury dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. FLEX 10KA Dvics Tabl 18. Mrcury Dvics Dvic Packag Pins EP1M120 Dual-Pic Lid: FBGA, Flip Chip, Option EP1M350 Dual-Pic Lid: FBGA, Flip Chip, Option Tabl 19 lists th dvic nam, packag typ, and numbr of pins for th FLEX 10KA dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Tabl 19. FLEX 10KA Dvics Dvic Packag Pins TQFP, Wir Bond 100 EPF10K10A TQFP, Wir Bond 144 PQFP, Wir Bond 208 FBGA, Wir Bond, Option TQFP, Wir Bond 144 PQFP, Wir Bond 208 EPF10K30A PQFP, Wir Bond 240 FBGA, Wir Bond, Option BGA, Wir Bond 356 FBGA, Wir Bond, Option RQFP, Wir Bond 240 EPF10K100A BGA, Wir Bond 356 FBGA, Wir Bond, Option BGA, Wir Bond 600 EPF10K250A PGA, Wir Bond 599 BGA, Wir Bond 600 Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

18 18 Packag Information Datasht for Matur Altra Dvics Dvic and Packag Cross Rfrnc FLEX 10KS Dvics Tabl 20 lists th dvic nam, packag typ, and numbr of pins for th FLEX 10KS dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. FLEX 10KE Dvics Tabl 20. FLEX 10KS Dvics Dvic Packag Pins EPF10K50S EPF10K200S TQFP, Wir Bond 144 PQFP, Wir Bond 208 PQFP, Wir Bond 240 FBGA, Wir Bond, Option BGA, Wir Bond 356 FBGA, Wir Bond, Option RQFP, Wir Bond 240 BGA, Wir Bond 356 FBGA, Wir Bond, Option BGA, Wir Bond 600 FBGA, Wir Bond, Option Tabl 21 lists th dvic nam, packag typ, and numbr of pins for th FLEX 10KE dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Tabl 21. FLEX 10KE Dvics (Part 1 of 3) Dvic Packag Pins TQFP, Wir Bond 144 EPF10K30E PQFP, Wir Bond 208 FBGA, Wir Bond, Option FBGA, Wir Bond, Option TQFP, Wir Bond 144 PQFP, Wir Bond 208 EPF10K50E PQFP, Wir Bond 240 FBGA, Wir Bond, Option BGA, Wir Bond 356 FBGA, Wir Bond, Option Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

19 Packag Information Datasht for Matur Altra Dvics 19 Dvic and Packag Cross Rfrnc Tabl 21. FLEX 10KE Dvics (Part 2 of 3) Dvic Packag Pins PQFP, Wir Bond 208 PQFP, Wir Bond 240 EPF10K100E FBGA, Wir Bond, Option BGA, Wir Bond 356 FBGA, Wir Bond, Option PQFP, Wir Bond 240 BGA, Wir Bond 356 EPF10K130E FBGA, Wir Bond, Option BGA, Wir Bond 600 FBGA, Wir Bond, Option PGA, Wir Bond 599 EPF10K200E BGA, Wir Bond 600 FBGA, Wir Bond, Option PLCC, Wir Bond 84 EPF10K10 TQFP, Wir Bond 144 PQFP, Wir Bond 208 TQFP, Wir Bond 144 EPF10K20 RQFP, Wir Bond 208 RQFP, Wir Bond 240 RQFP, Wir Bond 208 EPF10K30 RQFP, Wir Bond 240 BGA, Wir Bond 356 EPF10K40 RQFP, Wir Bond 208 RQFP, Wir Bond 240 RQFP, Wir Bond 240 EPF10K50 BGA, Wir Bond 356 PGA, Wir Bond 403 RQFP, Wir Bond 240 EPF10K50V PQFP, Wir Bond 240 BGA, Wir Bond 356 FBGA, Wir Bond 484 EPF10K70 RQFP, Wir Bond 240 PGA, Wir Bond 503 EPF10K100 PGA, Wir Bond 503 EPF10K130V PGA, Wir Bond 599 BGA, Wir Bond 600 TQFP, Wir Bond 100 EPF6010A TQFP, Wir Bond 144 PQFP, Wir Bond 208 Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

20 20 Packag Information Datasht for Matur Altra Dvics Dvic and Packag Cross Rfrnc Tabl 21. FLEX 10KE Dvics (Part 2 of 3) Dvic Packag Pins PQFP, Wir Bond 208 PQFP, Wir Bond 240 EPF10K100E FBGA, Wir Bond, Option BGA, Wir Bond 356 FBGA, Wir Bond, Option PQFP, Wir Bond 240 BGA, Wir Bond 356 EPF10K130E FBGA, Wir Bond, Option BGA, Wir Bond 600 FBGA, Wir Bond, Option PGA, Wir Bond 599 EPF10K200E BGA, Wir Bond 600 FBGA, Wir Bond, Option PLCC, Wir Bond 84 EPF10K10 TQFP, Wir Bond 144 PQFP, Wir Bond 208 TQFP, Wir Bond 144 EPF10K20 RQFP, Wir Bond 208 RQFP, Wir Bond 240 RQFP, Wir Bond 208 EPF10K30 RQFP, Wir Bond 240 BGA, Wir Bond 356 EPF10K40 RQFP, Wir Bond 208 RQFP, Wir Bond 240 RQFP, Wir Bond 240 EPF10K50 BGA, Wir Bond 356 PGA, Wir Bond 403 RQFP, Wir Bond 240 EPF10K50V PQFP, Wir Bond 240 BGA, Wir Bond 356 FBGA, Wir Bond 484 EPF10K70 RQFP, Wir Bond 240 PGA, Wir Bond 503 EPF10K100 PGA, Wir Bond 503 EPF10K130V PGA, Wir Bond 599 BGA, Wir Bond 600 TQFP, Wir Bond 100 EPF6010A TQFP, Wir Bond 144 PQFP, Wir Bond 208 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

21 Packag Information Datasht for Matur Altra Dvics 21 Dvic and Packag Cross Rfrnc Excalibur Dvics Tabl 21. FLEX 10KE Dvics (Part 3 of 3) Dvic Packag Pins EPF6016 EPF6016A EPF6024A EPF8282A EPF8452A TQFP, Wir Bond 144 PQFP, Wir Bond 208 PQFP, Wir Bond 240 BGA, Wir Bond, Option TQFP, Wir Bond 100 FBGA, Wir Bond 100 TQFP, Wir Bond 144 PQFP, Wir Bond 208 FBGA, Wir Bond, Option TQFP, Wir Bond 144 PQFP, Wir Bond 208 PQFP, Wir Bond 240 BGA, Wir Bond, Option FBGA, Wir Bond, Option PLCC, Wir Bond 84 TQFP, Wir Bond 100 TQFP, Wir Bond 100 PQFP, Wir Bond 160 Tabl 22 lists th dvic nam, packag typ, and numbr of pins for th Excalibur dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Tabl 22. Excalibur Dvics Dvic Packag Pins EPXA1 FBGA, Wir Bond, Option Dual-Pic Lid: FBGA, Flip Chip, Option EPXA4 Dual-Pic Lid: FBGA, Flip Chip, Option Dual-Pic Lid: FBGA, Flip Chip, Option EPXA10 Dual-Pic Lid: FBGA, Flip Chip, Option Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

22 22 Packag Information Datasht for Matur Altra Dvics Dvic and Packag Cross Rfrnc Configuration Dvics Tabl 23 lists th dvic nam, packag typ, and numbr of pins for th Configuration dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Tabl 23. Configuration Dvics Enhancd Configuration Dvics Dvic Packag Pins EPC1 EPC2 EPC1064 EPC1213 EPC1441 PDIP, Wir Bond 8 PLCC, Wir Bond 20 PLCC, Wir Bond 20 TQFP, Wir Bond 32 PDIP, Wir Bond 8 PLCC, Wir Bond 20 PDIP, Wir Bond 8 PLCC, Wir Bond 20 PDIP, Wir Bond 8 PLCC, Wir Bond 20 TQFP, Wir Bond 32 Tabl 24 lists th dvic nam, packag typ, and numbr of pins for th Enhancd configuration dvic family. 1 Th packag typ ntris with Option # rfr to instancs whr multipl packag options xist for a givn packag typ and pin count. Th option numbr idntifis th spcific typ usd by th corrsponding dvic dnsity. Tabl 24. Enhancd Configuration Dvics Dvic Packag Pins EPC4 PQFP, Wir Bond 100 EPC8 PQFP, Wir Bond 100 EPC16 UBGA, Wir Bond 88 PQFP, Wir Bond 100 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

23 Packag Information Datasht for Matur Altra Dvics 23 Thrmal Rsistanc Thrmal Rsistanc Altra follows JEDEC JESD51 sris standards to provid thrmal rsistancs. Th purpos of th JESD51 standards is to compar th thrmal prformanc of various packags undr standardizd tst conditions. Whil standardizd thrmal rsistancs can hlp compar th rlativ thrmal prformanc of diffrnt packags, thy cannot apply dirctly to th many spcific applications bcaus JESD51 tst conditions may not match a spcific application. Svral factors affct th thrmal prformanc of a dvic in a usr s application. Ths includ powr dissipation in th componnt; airflow vlocity, dirction and turbulnc lvl; powr in adjacnt componnts; two-sidd vs. on-sidd activ componnt mounting; printd circuit board (PCB) orintation & construction; and adjacnt boards and thir powr dissipation. It may b ncssary to tst or modl spcific applications. This tsting and modling of a componnt usr s spcific applications is th usr s rsponsibility. Tabl 26throughTabl 43provid JA (junction-to-ambintthrmalrsistanc)and JC (junction-to-cas thrmal rsistanc) valus for th Altra dvic familis. Altra rsrvs th right to mak changs to thrmal rsistancs without notic in th futur. Tabl 25 lists th matur Altra dvics and th associatd tabl locations. Tabl 25. Thrmal Rsistanc Altra Dvic Tabl Location Arria sris FPGAs Arria GX Dvics: Tabl 26 on pag 24 Stratix II Dvics: Tabl 27 on pag 25 Stratix sris FPGAs Stratix Dvics: Tabl 28 on pag 26 Cyclon II Dvics: Tabl 29 on pag 27 Cyclon sris FPGAs Cyclon Dvics: Tabl 30 on pag 28 MAX 9000 Dvics: Tabl 31 on pag 29 MAX sris CPLDs MAX 7000 Dvics: Tabl 32 on pag 30 MAX 3000A Dvics: Tabl 33 on pag 33 HardCopy II Dvics: Tabl 34 on pag 34 HardCopy sris ASICs HardCopy Dvics: Tabl 35 on pag 34 APEX II Dvics: Tabl 36 on pag 35 APEX sris FPGAs APEX 20K: Tabl 37 on pag 36 ACEX 1K FPGAs ACEX 1K Dvics: Tabl 38 on pag 38 Mrcury FPGAs Mrcury Dvics: Tabl 39 on pag 39 FLEX 10K Dvics: Tabl 40 on pag 39 FLEX sris FPGAs FLEX 8000 Dvics: Tabl 41 on pag 41 FLEX 6000 Dvics: Tabl 42 on pag 42 Excalibur FPGAs Excalibur Dvics: Tabl 43 on pag 43 Altra is transitioning to an industry-standard coppr lid for its thrmally nhancd BGA and thrmally nhancd Flip Chip FBGA packag offrings. f For mor information, rfr to Procss Chang Notic PCN0214. Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

24 24 Packag Information Datasht for Matur Altra Dvics Thrmal Rsistanc This chang affcts th APEX 20KE, APEX 20KC, APEX II, Mrcury, and Excalibur dvic familis. Thrfor, two thrmal rsistanc spcifications ar providd for dvics affctd by this chang. Th oldr packags ar idntifid as using th aluminum silicon carbid (AlSiC) lid, whil th nwr packags ar idntifid as using th coppr (Cu) lid. Thrmally nhancd BGA and thrmally nhancd Flip Chip FBGA packags offrd in th nwr Altra familis, including Stratix and Stratix GX, wr introducd using an industry-standard Cu lid. Thrfor, ths dvic spcifications includ only a singl thrmal rsistanc spcification. 1 Contact Altra if you nd typical +/ valus of A dimnsions for thrmal analysis. Th max numbrs ar providd for physical layout. Arria Sris Dvics Thrmal Rsistanc Tabl 26 provids thrmal rsistanc valus for Arria sris dvics. Arria GX Dvics Tabl 26 lists th thrmal rsistanc of Arria GX dvics. Tabl 26. Thrmal Rsistanc of Arria GX Dvics Dvic Packag Pin Count JA ( C/W) Still Air 100 ft./min. 200 ft./min. JA ( C/W) 400 ft./min. JC ( C/W) JB ( C/W) EP1AGX20 FBGA FBGA EP1AGX35 FBGA FBGA FBGA EP1AGX50 FBGA FBGA FBGA EP1AGX60 FBGA FBGA EP1AGX90 FBGA Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

25 Packag Information Datasht for Matur Altra Dvics 25 Thrmal Rsistanc Stratix Sris Dvics Thrmal Rsistanc Tabl 27 to Tabl 28 provid thrmal rsistanc valus for Stratix sris dvics. Stratix II Dvics Tabl 27 lists th thrmal rsistanc of Stratix II dvics. Tabl 27. Thrmal Rsistanc of Stratix II Dvics (Part 1 of 2) Dvic EP2S15 EP2S30 EP2S60 EP2S90 EP2S130 EP2S180 EP2SGX30 EP2SGX60 Packag FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip HBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. JB ( C/W) Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

26 26 Packag Information Datasht for Matur Altra Dvics Thrmal Rsistanc Tabl 27. Thrmal Rsistanc of Stratix II Dvics (Part 2 of 2) Dvic EP2SGX90 EP2SGX130 Packag FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. JB ( C/W) Stratix Dvics Tabl 28 lists th thrmal rsistanc of Stratix dvics. Tabl 28. Thrmal Rsistanc of Stratix Dvics (Part 1 of 2) Dvic EP1SGX10C EP1SGX10D EP1SGX25C EP1SGX25D EP1SGX25D EP1SGX25F EP1SGX40D EP1SGX40G EP1S10 EP1S20 EP1S25 Packag FBGA, Flip Chip FBGA, Flip Chip Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip BGA FBGA FBGA, Flip Chip FBGA, Flip Chip BGA FBGA FBGA, Flip Chip BGA FBGA FBGA, Flip Chip FBGA, Flip Chip Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

27 Packag Information Datasht for Matur Altra Dvics 27 Thrmal Rsistanc Tabl 28. Thrmal Rsistanc of Stratix Dvics (Part 2 of 2) Dvic Packag Pin Count JC ( C/W) EP1S30 EP1S40 EP1S60 EP1S80 FBGA, Flip Chip BGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip BGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip BGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip BGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip Cyclon Sris Dvics Thrmal Rsistanc Tabl 29 to Tabl 30 provid thrmal rsistanc valus for Cyclon sris dvics. Cyclon II Dvics Still Air 100 ft./min. Tabl 29 lists th thrmal rsistanc of Cyclon II dvics. Tabl 29. Thrmal Rsistanc of Cyclon II Dvics (Part 1 of 2) Dvic Packag Pin Count JC ( C/W) EP2C5 TQFP, Wir Bond PQFP, Wir Bond FBGA, Wir Bond 200 ft./min. 400 ft./min Still Air 100 ft./min. 200 ft./min. 400 ft./min Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

28 28 Packag Information Datasht for Matur Altra Dvics Thrmal Rsistanc Tabl 29. Thrmal Rsistanc of Cyclon II Dvics (Part 2 of 2) Dvic Packag Pin Count JC ( C/W) EP2C8 EP2C15 EP2C20 EP2C35 EP2C50 EP2C70 TQFP, Wir Bond PQFP, Wir Bond FBGA, Wir Bond FBGA, Wir Bond FBGA, Wir Bond PQFP, Wir Bond FBGA, Wir Bond FBGA, Wir Bond FBGA, Wir Bond UBGA, Wir Bond FBGA, Wir Bond FBGA, Wir Bond UBGA, Wir Bond FBGA, Wir Bond FBGA, Wir Bond FBGA, Wir Bond Cyclon Dvics Tabl 30 lists th thrmal rsistanc of Cyclon dvics. Tabl 30. Thrmal Rsistanc of Cyclon Dvics (Part 1 of 2) Still Air 100 ft./min. 200 ft./min. 400 ft./min. Dvic EP1C3 EP1C6 Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. TQFP TQFP TQFP PQFP FBGA Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

29 Packag Information Datasht for Matur Altra Dvics 29 Thrmal Rsistanc Tabl 30. Thrmal Rsistanc of Cyclon Dvics (Part 2 of 2) Dvic EP1C12 EP1C20 Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. PQFP FBGA FBGA FBGA FBGA MAX Sris Dvics Thrmal Rsistanc Tabl 31 through Tabl 33 provid thrmal rsistanc valus for MAX sris dvics. MAX 9000 Dvics Tabl 31 lists th thrmal rsistanc of MAX 9000 dvics. Tabl 31. Thrmal Rsistanc of MAX 9000 Dvics Dvic EPM9320 EPM9320A EPM9400 EPM9480 EPM9560 EPM9560A Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. PLCC RQFP PGA BGA PLCC RQFP BGA PLCC RQFP RQFP RQFP RQFP RQFP RQFP BGA RQFP RQFP BGA Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

30 30 Packag Information Datasht for Matur Altra Dvics Thrmal Rsistanc MAX 7000 Dvics Tabl 32 lists th thrmal rsistanc of MAX 7000 dvics. Tabl 32. Thrmal Rsistanc of MAX 7000 Dvics (Part 1 of 3) Dvic EPM7032 EPM7032B EPM7032S EPM7032V EPM7032AE EPM7064S EPM7064 EPM7064AE EPM7064B EPM7096 EPM7128A Packag PLCC Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min PQFP TQFP PLCC TQFP UBGA PLCC TQFP PLCC TQFP PLCC TQFP PLCC TQFP PLCC TQFP PLCC TQFP PLCC PQFP PLCC TQFP UBGA TQFP FBGA PLCC PLCC PLCC TQFP FBGA TQFP FBGA Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

31 Packag Information Datasht for Matur Altra Dvics 31 Thrmal Rsistanc Tabl 32. Thrmal Rsistanc of MAX 7000 Dvics (Part 2 of 3) Dvic EPM7128B Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. UBGA TQFP FBGA TQFP UBGA FBGA PLCC EPM7128E PQFP PQFP PLCC EPM7128S TQFP PQFP PQFP PLCC TQFP FBGA EPM7128AE TQFP UBGA FBGA PLCC EPM7160E PQFP PQFP PLCC EPM7160S TQFP PQFP EPM7192S PQFP EPM7192E PGA PQFP TQFP EPM7256A TQFP PQFP FBGA TQFP TQFP EPM7256B UBGA PQFP FBGA Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

32 32 Packag Information Datasht for Matur Altra Dvics Thrmal Rsistanc Tabl 32. Thrmal Rsistanc of MAX 7000 Dvics (Part 3 of 3) Dvic EPM7256E EPM7256S EPM7256AE EPM7512AE EPM7512B Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. PGA PQFP RQFP PQFP RQFP FBGA TQFP TQFP PQFP FBGA TQFP PQFP BGA FBGA TQFP UBGA PQFP BGA FBGA Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

33 Packag Information Datasht for Matur Altra Dvics 33 Thrmal Rsistanc MAX 3000A Dvics Tabl 33 lists th thrmal rsistanc of MAX 3000A dvics. Tabl 33. Thrmal Rsistanc of MAX 3000A Dvics Dvic EPM3032A EPM3064A Packag Pin Count JC ( C/W) HardCopy Sris Dvics Thrmal Rsistanc Still Air 100 ft./min. 200 ft./min. 400 ft./min. TQFP PLCC TQFP PLCC TQFP EPM3128A TQFP EPM3256A TQFP PQFP EPM3512A PQFP FBGA Tabl 34 to Tabl 35 provid thrmal rsistanc valus for HardCopy sris dvics. Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

34 34 Packag Information Datasht for Matur Altra Dvics Thrmal Rsistanc HardCopy II Dvics Tabl 34 lists th thrmal rsistanc of HardCopy II dvics. Tabl 34. Thrmal Rsistanc of HardCopy II Dvics Dvic Packag Pin Count JC ( C/W) HC210 HC220 HC230 HC240 FBGA, Wir Bond FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip HardCopy Dvics Still Air 100 ft./min. 200 ft./min. Tabl 35 lists th thrmal rsistanc of HardCopy dvics. Tabl 35. Thrmal Rsistanc of HardCopy Dvics Dvic Packag 400 ft./min. JB ( C/W) Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. HC20K400 BGA, Flip Chip HC20K600 FBGA, Flip Chip HC1S25 FBGA, Wir Bond BGA, Wir Bond HC1S30 FBGA, Flip Chip HC1S40 FBGA, Flip Chip HC1S60 FBGA, Flip Chip HC1S80 FBGA, Flip Chip Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

35 Packag Information Datasht for Matur Altra Dvics 35 Thrmal Rsistanc APEX Sris Dvics Thrmal Rsistanc Tabl 36 to Tabl 37 list thrmal rsistanc valus for APEX sris dvics. APEX II Dvics Tabl 36 lists th thrmal rsistanc of APEX II dvics. Tabl 36. Thrmal Rsistanc of APEX II Dvics Dvic EP2A15 EP2A25 EP2A40 EP2A70 Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. FBGA, Flip Chip (Cu lid) FBGA, Flip Chip (AlSiC lid) BGA, Flip Chip (Cu lid) BGA, Flip Chip (AlSiC lid) FBGA (Cu lid) FBGA, Flip Chip (AlSiC lid) BGA, Flip Chip (Cu lid) BGA, Flip Chip (AlSiC lid) FBGA, Flip Chip (Cu lid) FBGA, Flip Chip (AlSiC lid) FBGA, Flip Chip (Cu lid) FBGA, Flip Chip (AlSiC lid) BGA, Flip Chip (Cu lid) BGA, Flip Chip (AlSiC lid) FBGA, Flip Chip (Cu lid) FBGA, Flip Chip (AlSiC lid) BGA, Flip Chip (Cu lid) BGA, Flip Chip (AlSiC lid) FBGA, Flip Chip (Cu lid) FBGA, Flip Chip (AlSiC lid) Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

36 36 Packag Information Datasht for Matur Altra Dvics Thrmal Rsistanc APEX 20K Dvics Tabl 37 lists th thrmal rsistanc of APEX 20KE, 20KC, and 20K dvics. Tabl 37. Thrmal Rsistanc of APEX 20KE, 20KC, and 20K Dvics (Part 1 of 3) Dvic EP20K30E EP20K60E EP20K100 EP20K100E EP20K160E EP20K200 EP20K200E Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. TQFP PQFP FBGA FBGA TQFP FBGA PQFP PQFP FBGA BGA TQFP PQFP PQFP FBGA BGA TQFP FBGA PQFP PQFP FBGA BGA TQFP PQFP PQFP BGA FBGA PQFP PQFP BGA FBGA PQFP PQFP BGA FBGA BGA FBGA Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

37 Packag Information Datasht for Matur Altra Dvics 37 Thrmal Rsistanc Tabl 37. Thrmal Rsistanc of APEX 20KE, 20KC, and 20K Dvics (Part 2 of 3) Dvic EP20K200C EP20K300E EP20K400 EP20K400E EP20K400C EP20K600E EP20K600C EP20K1000E EP20K1000C Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. PQFP PQFP BGA FBGA PQFP BGA FBGA BGA PGA FBGA FBGA w/ fin (1) BGA FBGA (Cu lid) FBGA (AlSiC lid) FBGA w/ fin (1) BGA FBGA (Cu lid) FBGA (AlSiC lid) FBGA w/ fin (1) FBGA (Cu lid) ,020 FBGA (AlSiC lid) FBGA w/ fin (1) 1, BGA (Cu lid) BGA (AlSiC lid) FBGA w/ fin (1) FBGA (Cu lid) FBGA (AlSiC lid) FBGA w/ fin (1) FBGA (Cu lid) ,020 FBGA (AlSiC lid) FBGA w/ fin (1) 1, Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

38 38 Packag Information Datasht for Matur Altra Dvics Thrmal Rsistanc Tabl 37. Thrmal Rsistanc of APEX 20KE, 20KC, and 20K Dvics (Part 3 of 3) Dvic EP20K1500E Not to Tabl 37: Packag Pin Count BGA (Cu lid) BGA (AlSiC lid) FBGA FBGA w/ fin (1) FBGA (Cu lid) ,020 FBGA (AlSiC lid) FBGA w/ fin (1) 1, (1) fin is an xtra hat sink that customrs can add to th dvic. Svral vndors mak hat sinks, and thy all hav diffrnt sizs. Altra prformd th thrmal calculations in Tabl 37 using th following fin spcifications: width: 0.25 mm; hight: 7.0 mm; pitch: 1.5 mm; bas thicknss: 0.5 mm. ACEX 1K Dvics Thrmal Rsistanc JC ( C/W) Still Air 100 ft./min. 200 ft./min. Tabl 38 provids thrmal rsistanc valus for ACEX 1K dvics. Tabl 38. Thrmal Rsistanc of ACEX 1K Dvics 400 ft./min. Dvic EP1K10 EP1K30 EP1K50 EP1K100 Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. TQFP TQFP PQFP FBGA TQFP PQFP FBGA TQFP PQFP FBGA FBGA PQFP FBGA FBGA Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

39 Packag Information Datasht for Matur Altra Dvics 39 Thrmal Rsistanc Mrcury Dvics Thrmal Rsistanc Tabl 39 provids thrmal rsistanc valus for Mrcury dvics. Tabl 39. Thrmal Rsistanc of Mrcury Dvics Dvic EP1M120 EP1M350 Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. FBGA (Cu lid) FBGA (AlSiC lid) FBGA (Cu lid) FBGA (AlSiC lid) FLEX Sris Dvics Thrmal Rsistanc Tabl 40 through Tabl 42 provid thrmal rsistanc valus for FLEX sris dvics. FLEX 10K Dvics Tabl 40 lists th thrmal rsistanc of FLEX 10K dvics. Tabl 40. Thrmal Rsistanc of FLEX 10K Dvics (Part 1 of 3) Dvic EPF10K10 EPF10K10A EPF10K20 EPF10K30 EPF10K30A EPF10K30E Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. PLCC TQFP PQFP TQFP TQFP PQFP FBGA TQFP RQFP RQFP RQFP RQFP BGA TQFP PQFP PQFP FBGA BGA FBGA TQFP PQFP FBGA FBGA Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

40 40 Packag Information Datasht for Matur Altra Dvics Thrmal Rsistanc Tabl 40. Thrmal Rsistanc of FLEX 10K Dvics (Part 2 of 3) Dvic EPF10K40 EPF10K50 EPF10K50V EPF10K50E EPF10K50S EPF10K70 EPF10K100 EPF10K100A EPF10K100E EPF10K130V Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. RQFP RQFP RQFP BGA PGA PGA (1) PQFP RQFP BGA FBGA TQFP PQFP PQFP FBGA FBGA TQFP PQFP PQFP FBGA BGA FBGA RQFP PGA PGA PGA (1) PGA (2) 2.0 RQFP BGA FBGA BGA PQFP PQFP FBGA BGA FBGA PGA BGA Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

41 Packag Information Datasht for Matur Altra Dvics 41 Thrmal Rsistanc Tabl 40. Thrmal Rsistanc of FLEX 10K Dvics (Part 3 of 3) Dvic EPF10K130E EPF10K200E EPF10K200S EPF10K250A Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. PQFP BGA FBGA BGA FBGA PGA BGA FBGA RQFP BGA FBGA BGA FBGA PGA BGA Nots to Tabl 40: (1) With attachd pin-fin hat sink. (2) With attachd motor-drivn fan hat sink. FLEX 8000 Dvics Tabl 41 lists th thrmal rsistanc of FLEX 8000 dvics. Tabl 41. Thrmal Rsistanc of FLEX 8000 Dvics (Part 1 of 2) Dvic EPF8282A EPF8452A EPF8636A Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. PLCC TQFP PLCC TQFP PQFP PLCC PQFP PGA PQFP RQFP Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

42 42 Packag Information Datasht for Matur Altra Dvics Thrmal Rsistanc Tabl 41. Thrmal Rsistanc of FLEX 8000 Dvics (Part 2 of 2) Dvic EPF8820A EPF81188A EPF81500A Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. TQFP PQFP PQFP RQFP BGA PQFP PGA PQFP RQFP PQFP RQFP PGA FLEX 6000 Dvics Tabl 42 lists th thrmal rsistanc of FLEX 6000 dvics. Tabl 42. Thrmal Rsistanc of FLEX 6000 Dvics Dvic Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. EPF6010A TQFP TQFP TQFP EPF6016 PQFP PQFP BGA TQFP FBGA EPF6016A TQFP PQFP FBGA TQFP PQFP EPF6024A PQFP BGA FBGA Excalibur Dvics Thrmal Rsistanc Tabl 43 provids thrmal rsistanc valus for Excalibur dvics. Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

43 Packag Information Datasht for Matur Altra Dvics 43 Thrmal Rsistanc Tabl 43. Thrmal Rsistanc of Excalibur Embddd Procssor Solutions Dvic EPXA1 EPXA4 EPXA10 Packag Pin Count JC ( C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. FBGA FBGA, Flip Chip (Cu lid) FBGA, Flip Chip (AlSiC lid) FBGA, Flip Chip (Cu lid) FBGA, Flip Chip (AlSiC lid) FBGA, Flip Chip (Cu lid) 1, FBGA, Flip Chip (AlSiC lid) 1, FBGA, Flip Chip (Cu lid) 1, FBGA, Flip Chip (AlSiC lid) 1, Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

44 44 Packag Information Datasht for Matur Altra Dvics Packag Outlins Packag Outlins Th packag outlins on th following pags ar listd in ordr of ascnding pin count. Altra packag outlins mt th rquirmnts of JEDEC Publication No All lidlss flip chip and wir bond packags ar non-vntd packags. All othr flip chip packags ar vntd packags. Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

45 Packag Information Datasht for Matur Altra Dvics 45 8-Pin Plastic Dual In-Lin Packag (PDIP) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in inchs. Pin 1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Ladfram Matrial Lad Finish (Plating) JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification P PDIP Coppr Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn MS-001 Variation: BA NA 0.6 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Inchs Symbol Min. Nom. Max. A A A TYP D E E L b c BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

46 46 Packag Information Datasht for Matur Altra Dvics Packag Outlin Pin 8 D Pin 1 ID E1 E c Pin 4 Pin 1 A A2 b L A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

47 Packag Information Datasht for Matur Altra Dvics Pin Plastic J-Lad Chip Carrir (PLCC) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in inchs. Pin 1 is gnrally indicatd by an indntation in th plastic body, in Pin 1's proximity, on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Ladfram Matrial Lad Finish (Plating) JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification L PLCC Coppr Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn MS-018 Variation: AA inchs (0.10mm) 0.8 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Inchs Symbol Min. Nom. Max. A A A TYP D D D E E E b c TYP TYP Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

48 48 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

49 Packag Information Datasht for Matur Altra Dvics Pin Plastic Thin Quad Flat Pack (TQFP) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin 1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Ladfram Matrial Lad Finish (Plating) JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification T TQFP Coppr Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn MS-026 Variation: ABA inchs (0.1mm) 0.2 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 1.20 A A D 9.00 BSC D BSC E 9.00 BSC E BSC L L REF S 0.20 b c BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

50 50 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

51 Packag Information Datasht for Matur Altra Dvics Pin Plastic J-Lad Chip Carrir (PLCC) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in inchs. Pin 1 is gnrally indicatd by an indntation in th plastic body, in Pin 1 s proximity, on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc L Packag Acronym PLCC Ladfram Matrial Coppr Lad Finish (Plating) Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn JEDEC Outlin Rfrnc MS-018 Variation: AC Lad Coplanarity inchs (0.10 mm) Wight 2.6 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Inchs Symbol Min. Nom. Max. A A A TYP D D D E E E b c TYP TYP Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

52 52 Packag Information Datasht for Matur Altra Dvics Packag Outlin D D1 Pin 1 Pin 44 Pin 7 Pin 1 ID E2 E E1 Pin 17 c A A2 b D2 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

53 Packag Information Datasht for Matur Altra Dvics Pin Plastic Thin Quad Flat Pack (TQFP) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin 1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Ladfram Matrial Lad Finish (Plating) JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification T TQFP Coppr Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn MS-026 Variation: ACB inchs (0.1mm) 0.3 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 1.20 A A D BSC D BSC E BSC E BSC L L REF S 0.20 b c BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

54 54 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

55 Packag Information Datasht for Matur Altra Dvics Pin Ultra FinLin Ball-Grid Array (UBGA) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Substrat Matrial Soldr Ball Composition JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification U UBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAB inchs (0.12mm) 0.2 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 1.55 A A A TYP D 7.00 BSC E 7.00 BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

56 56 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

57 Packag Information Datasht for Matur Altra Dvics Pin Plastic Enhancd Quad Flat Pack (EQFP) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Ladfram Matrial Lad Finish (plating) JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification E EQFP Coppr Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn MS-026 Variation: ABD-HD inch (0.08 mm) 0.15 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 1.20 A A D 9.00 BSC D BSC D E E BSC 7.00 BSC E L L REF S 0.20 b c BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

58 58 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW Pin 64 Pin 64 Pin 1 Pin 1 Pin 1 ID Pin 16 Pin 16 S Dtail A Dtail A Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

59 Packag Information Datasht for Matur Altra Dvics Pin Plastic J-Lad Chip Carrir (PLCC) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in inchs. Pin 1 is gnrally indicatd by an indntation in th plastic body, in Pin 1's proximity, on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Ladfram Matrial Lad Finish (Plating) JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification L PLCC Coppr Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn MS-018 Variation: AF inchs (0.10mm) 7.9 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Inchs Symbol Min. Nom. Max. A A A TYP D D D E E E b c TYP TYP Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

60 60 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

61 Packag Information Datasht for Matur Altra Dvics Pin Ultra FinLin Ball-Grid Array (UBGA) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Substrat Matrial Soldr Ball Composition JEDEC Outlin Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification U UBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MO inchs (0.12 mm) 0.4 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 1.40 A A A REF D BSC E 8.00 BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

62 62 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr A Pin A1 ID B C D E E F G H b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

63 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 1 Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on th packag surfac. 1 This POD is applicabl to F100 packags of all products xcpt MAX II, which is assmbld in Option 2 packag outlins. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Substrat Matrial Soldr ball composition JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification F FBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: AAC inchs (0.20mm) 0.6 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 1.70 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

64 64 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

65 Packag Information Datasht for Matur Altra Dvics Pin Plastic Quad Flat Pack (PQFP) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin 1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on th packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Ladfram Matrial Lad Finish (Plating) JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification Q PQFP Coppr Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn MS-022 Variation: GC inchs (0.10mm) 1.9 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.40 A A D BSC D BSC E BSC E BSC L L REF S 0.20 b c BSC 0 7 Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

66 66 Packag Information Datasht for Matur Altra Dvics Packag Outlin Pin 100 D D1 Pin 1 Pin 1 ID E E1 Pin 30 A A2 S Dtail A A1 Dtail A C Gag Plan b S L1 L 0.25mm Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

67 Packag Information Datasht for Matur Altra Dvics Pin Plastic Thin Quad Flat Pack (TQFP) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin 1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Ladfram Matrial Lad Finish (Plating) JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification T TQFP Coppr Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn MS-026 Variation: AED inchs (0.08mm) 0.6 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 1.20 A A D BSC D BSC E BSC E BSC L L REF S 0.20 b c BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

68 68 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

69 Packag Information Datasht for Matur Altra Dvics Pin Plastic Enhancd Quad Flat Pack (EQFP) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin 1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Ladfram Matrial Lad Finish (Plating) JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification E EQFP Coppr Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn MS-026 Variation: BFB inchs (0.08mm) 1.1 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 1.60 A A D BSC D BSC D E BSC E BSC E L L REF S 0.20 b c BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

70 70 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

71 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Substrat Matrial Soldr Ball Composition JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification F FBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: AAD inchs (0.20mm) 0.8 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 2.20 A A A REF D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

72 72 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

73 Packag Information Datasht for Matur Altra Dvics Pin Plastic Thin Quad Flat Pack (TQFP) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin 1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Ladfram Matrial Lad Finish (Plating) JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification T TQFP Coppr Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn MS-026 Variation: BFB inchs (0.08mm) 1.1 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 1.60 A A D BSC D BSC E BSC E BSC L L REF S 0.20 b c BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

74 74 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

75 Packag Information Datasht for Matur Altra Dvics Pin Cramic Pin-Grid Array (PGA) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in inchs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc G Packag Acronym PGA Ladfram Matrial Alloy 42 Lad Finish Gold Ovr Nickl Plat JEDEC Outlin Rfrnc MO-067 Variation: AG Lad Coplanarity N/A Wight 19.9 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Inchs Symbol Min. Nom. Max. A A TYP A D E L TYP b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

76 76 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

77 Packag Information Datasht for Matur Altra Dvics Pin Plastic Quad Flat Pack (PQFP) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin 1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Ladfram Matrial Lad Finish (Plating) JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification Q PQFP Coppr Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn MS-022 Variation: DD inchs (0.10mm) 6.2 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 4.10 A A D BSC D BSC E BSC E BSC L L REF S 0.20 b c BSC 0 7 Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

78 78 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

79 Packag Information Datasht for Matur Altra Dvics Pin Ultra FinLin Ball-Grid Array (UBGA) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Substrat Matrial Soldr Ball Composition JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification U UBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAF inchs (0.12mm) 0.6 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 1.70 A A A TYP D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

80 80 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

81 Packag Information Datasht for Matur Altra Dvics Pin Plastic Quad Flat Pack (PQFP) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin 1 may b indicatd by an ID dot in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Lad Matrial Lad Finish (Plating) JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification Q PQFP Coppr Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn MS-029 Variation: FA inchs (0.08 mm) 6.3 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 4.10 A A D BSC D BSC E BSC E BSC L L REF S 0.20 b c BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

82 82 Packag Information Datasht for Matur Altra Dvics Packag Outlin Pin 208 D D1 Pin 1 Pin 1 ID E E1 Pin 52 A A2 S Dtail A A1 Dtail A C Gag Plan b S L 0.25mm L1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

83 Packag Information Datasht for Matur Altra Dvics Pin Powr Quad Flat Pack (RQFP) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin 1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc R Packag Acronym RQFP Ladfram Matrial Coppr Lad Finish (Plating) Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn JEDEC Outlin Rfrnc MS-029 Variation: FA-1 Lad Coplanarity inchs (0.08mm) Wight 11.0 g (Typ.) or 6.4 g (Typ.) (1) Moistur Snsitivity Lvl Printd on moistur barrir bag Not: (1) Th lightr wight is du to th chang in hat slug matrial usd (from nickl-platd coppr to anodizd aluminum). Rfr to PCN1002. Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 4.10 A A D BSC D BSC E BSC E BSC L L REF S 0.20 b c BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

84 84 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

85 Packag Information Datasht for Matur Altra Dvics Pin Plastic Quad Flat Pack (PQFP) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin 1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Ladfram Matrial Lad Finish (Plating) JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification Q PQFP Coppr Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn MS-029 Variation: GA inchs (0.08mm) 8.0 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 4.10 A A D BSC D BSC E BSC E BSC L L REF S 0.20 b c BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

86 86 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

87 Packag Information Datasht for Matur Altra Dvics Pin Powr Quad Flat Pack (RQFP) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin 1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc R Packag Acronym RQFP Ladfram Matrial Coppr Lad Finish (Plating) Rgular: 85Sn:15Pb (Typ.) Pb-fr: Matt Sn JEDEC Outlin Rfrnc MS-029 Variation: GA Lad Coplanarity inchs (0.08mm) Wight 15.4 g (Typ.) or 8.5 g (Typ.) (1) Moistur Snsitivity Lvl Printd on moistur barrir bag Not: (1) Th lightr wight is du to th chang in hat slug matrial usd (from nickl-platd coppr to anodizd aluminum). Rfr to PCN1002. Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 4.10 A A D BSC D BSC E BSC E BSC L L REF S 0.20 b c BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

88 88 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

89 Packag Information Datasht for Matur Altra Dvics Pin Ball-Grid Array (BGA), Option 1 Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Substrat Matrial Soldr Ball Composition JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification B BGA BT or tap Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAL inchs (0.20 mm) 4.8 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 1.70 A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

90 90 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E A C E G J L N R U W B D F H K M P T V Y b A A2 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

91 Packag Information Datasht for Matur Altra Dvics Pin Plastic Ball-Grid Array (BGA), Option 2 Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc B Packag Acronym BGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: BAL-2 Lad Coplanarity inchs (0.20 mm) Wight 2.2 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 2.60 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

92 92 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW D BOTTOM VIEW Pin A1 Cornr Pin A1 ID E A B C D E F G H J K L M N P R T U V W Y b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

93 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 1 Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. 1 This POD is applicabl to F256 packags of all products listd in this datasht xcpt Cyclon II, which ar assmbld in Option 2 packag outlins. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAF-1 Lad Coplanarity inchs (0.20 mm) Wight 1.5 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 2.20 A A A REF D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

94 94 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

95 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 2 Thin Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on th packag surfac. 1 This POD is applicabl to F256 packags of th Cyclon II dvics only. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MO-192 Variation: DAF-1 Lad Coplanarity inchs (0.20 mm) Wight 1.5 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 1.55 A A REF A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

96 96 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

97 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA) Wir Bond Option 1 All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Substrat Matrial Soldr Ball Composition JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification F FBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAG inchs (0.20mm) 1.4 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 2.20 A A A REF D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

98 98 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

99 Packag Information Datasht for Matur Altra Dvics Pin Ball-Grid Array (BGA) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Substrat Matrial Soldr Ball Composition JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification B BGA BT or tap Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAR inchs (0.20mm) 7.7 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 1.70 A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

100 100 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

101 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Substrat Matrial Soldr Ball Composition JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification F FBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAH inchs (0.20mm) 2.3 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 2.20 A A A REF D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

102 102 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

103 Packag Information Datasht for Matur Altra Dvics Pin Cramic Pin-Grid Array (PGA) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in inchs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc G Packag Acronym PGA Ladfram Matrial Alloy 42 Lad Finish Gold Ovr Nickl Plat JEDEC Outlin Rfrnc MO-128 Variation: AL Lad Coplanarity N/A Wight 47.7 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Inchs Symbol Min. Nom. Max. A A TYP A D E L TYP b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

104 104 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

105 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on th packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Substrat Matrial Soldr Ball Composition JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification F FBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAJ inchs (0.20 mm) 6.8 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

106 106 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

107 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip Channl Lid All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on th packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Substrat Matrial Soldr Ball Composition JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification F FBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MO-034 Variation: AAJ inchs (0.20 mm) 6.8 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

108 108 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

109 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 2 Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAJ-1 Lad Coplanarity inchs (0.20 mm) Wight 2.6 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 2.60 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

110 110 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

111 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 4 Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAJ-1 Lad Coplanarity inchs (0.20 mm) Wight 5.3 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC D BSC E BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

112 112 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

113 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA) Wir Bond A:2.40 All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAJ-1 Lad Coplanarity inchs (0.20 mm) Wight 2.3 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

114 114 Packag Information Datasht for Matur Altra Dvics Packag Outlin A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

115 Packag Information Datasht for Matur Altra Dvics Pin Hybrid FinLin Ball-Grid Array (HBGA) Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Substrat Matrial Soldr Ball Composition JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification H HBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAL inchs (0.20mm) 11.3 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

116 116 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

117 Packag Information Datasht for Matur Altra Dvics Pin Ultra FinLin Ball-Grid Array (UBGA) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Substrat Matrial Soldr Ball Composition JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification U UBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAP inchs (0.12mm) 1.6 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 2.20 A A A TYP D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

118 118 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

119 Packag Information Datasht for Matur Altra Dvics Pin Cramic Pin-Grid Array (PGA) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in inchs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc G Packag Acronym PGA Ladfram Matrial Alloy 42 Lad Finish Gold Ovr Nickl Plat JEDEC Outlin Rfrnc MO-128 Variation: AN Lad Coplanarity N/A Wight 59.0 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Inchs Symbol Min. Nom. Max. A A TYP A D E L TYP b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

120 120 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E 1 2 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP AR AT AU AV AW AY BA BB BC b 1 2 A A2 A1 L Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

121 Packag Information Datasht for Matur Altra Dvics Pin Cramic Pin-Grid Array (PGA) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in inchs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc G Packag Acronym PGA Ladfram Matrial Alloy 42 Lad Finish Gold ovr Nickl Plat JEDEC Outlin Rfrnc MO-128 Variation: AP Lad Coplanarity N/A Wight 69.0 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Inchs Symbol Min. Nom. Max. A A TYP A D E L TYP b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

122 122 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

123 Packag Information Datasht for Matur Altra Dvics Pin Ball-Grid Array (BGA) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Substrat Matrial Soldr Ball Composition JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification B BGA BT or tap Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAW inchs (0.20mm) 12.0 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 2.00 A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

124 124 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E b A B C D E F G H J L K M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP AR A A2 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

125 Packag Information Datasht for Matur Altra Dvics Pin Ball-Grid Array (BGA), Option 1 Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc B Packag Acronym BGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: BAW-1 Lad Coplanarity inchs (0.20 mm) Wight 23.8 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

126 126 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW Pin A1 ID D E Pin A1 Cornr A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP AR b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

127 Packag Information Datasht for Matur Altra Dvics Pin Plastic Ball-Grid Array (BGA), Option 2 Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc B Packag Acronym BGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: BAW-1 Lad Coplanarity inchs (0.20 mm) Wight 15.9 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.20 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

128 128 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E A C E G J L N R U W B D F H K M P V T Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP AR b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

129 Packag Information Datasht for Matur Altra Dvics Pin Plastic Ball-Grid Array (BGA), Option 3 Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Ordring Cod Rfrnc Packag Acronym Substrat Matrial Soldr Ball Composition JEDEC Outlin Rfrnc Lad Coplanarity Wight Moistur Snsitivity Lvl Spcification B BGA BT or tap Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAW inchs (0.20 mm) 15.1 g (Typ.) Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 2.00 A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

130 130 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP AR b A A2 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

131 Packag Information Datasht for Matur Altra Dvics Pin Cramic Pin-Grid Array (PGA) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in inchs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc G Packag Acronym PGA Ladfram Matrial Alloy 42 Lad Finish Gold ovr Nickl Plat JEDEC Outlin Rfrnc MO-128 Variation: AP Lad Coplanarity N/A Wight 74.9 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Inchs Symbol Min. Nom. Max. A A TYP A D E L TYP b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

132 132 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

133 Packag Information Datasht for Matur Altra Dvics Pin Plastic Ball-Grid Array (BGA) Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc B Packag Acronym BGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: BAR-2 Lad Coplanarity inchs (0.20 mm) Wight 5.8 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 2.60 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

134 134 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

135 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAL-1 Lad Coplanarity inchs (0.20 mm) Wight 9.5 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

136 136 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

137 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 2 Wir Bond All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAL-1 Lad Coplanarity inchs (0.20 mm) Wight 3.8 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 2.60 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

138 138 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

139 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 4 Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAL-1 Lad Coplanarity inchs (0.20 mm) Wight 7.1 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC D BSC E BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

140 140 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

141 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA) Wir Bond A:2.40 All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAL-1 Lad Coplanarity inchs (0.20 mm) Wight 3.0 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

142 142 Packag Information Datasht for Matur Altra Dvics Packag Outlin b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

143 Packag Information Datasht for Matur Altra Dvics Pin Ball-Grid Array (BGA) Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc B Packag Acronym BGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: BAR-1 Lad Coplanarity inchs (0.20 mm) Wight 13.6 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

144 144 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

145 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAM-1 Lad Coplanarity inchs (0.20 mm) Wight 10.7 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

146 146 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

147 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip Channl Lid All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MO-034 Variation: AAM-1 Lad Coplanarity inchs (0.20 mm) Wight 9.5 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

148 148 Packag Information Datasht for Matur Altra Dvics Packag Outlin TOP VIEW BOTTOM VIEW D Pin A1 Cornr Pin A1 ID E b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

149 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 3 Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAM-1 Lad Coplanarity inchs (0.20 mm) Wight 8.2 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC D BSC E BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

150 150 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

151 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA) Wir Bond A:2.40 All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAN-1 Lad Coplanarity inchs (0.20 mm) Wight 3.9 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

152 152 Packag Information Datasht for Matur Altra Dvics Packag Outlin D E b A A2 A3 A1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

153 Packag Information Datasht for Matur Altra Dvics Pin Ball-Grid Array (BGA), Option 1 Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc B Packag Acronym BGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: BAU-1 Lad Coplanarity inchs (0.20 mm) Wight 19.6 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

154 154 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

155 Packag Information Datasht for Matur Altra Dvics Pin Ball-Grid Array (BGA), Option 2 Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc B Packag Acronym BGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: BAU-1 Lad Coplanarity inchs (0.20 mm) Wight 17.0 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC D BSC E BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

156 156 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

157 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAP-1 Lad Coplanarity inchs (0.20 mm) Wight 13.8 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

158 158 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

159 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 2 Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAP-1 Lad Coplanarity inchs (0.20 mm) Wight 10.8 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC D BSC E BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

160 160 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

161 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAR-1 Lad Coplanarity inchs (0.20 mm) Wight 15.5 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

162 162 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

163 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 2 Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAR-1 Lad Coplanarity inchs (0.20 mm) Wight 12.4 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC D BSC E BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

164 164 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

165 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAU-1 Lad Coplanarity inchs (0.20 mm) Wight 18.9 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

166 166 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

167 Packag Information Datasht for Matur Altra Dvics Pin FinLin Ball-Grid Array (FBGA), Option 2 Flip Chip All dimnsions and tolrancs conform to ASME Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an ID dot, or a spcial fatur, in its proximity on packag surfac. Packag Information Dscription Spcification Ordring Cod Rfrnc F Packag Acronym FBGA Substrat Matrial BT Soldr Ball Composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JEDEC Outlin Rfrnc MS-034 Variation: AAU-1 Lad Coplanarity inchs (0.20 mm) Wight 15.9 g (Typ.) Moistur Snsitivity Lvl Printd on moistur barrir bag Packag Outlin Dimnsion Tabl Millimtrs Symbol Min. Nom. Max. A 3.50 A A A D BSC D BSC E BSC E BSC b BSC Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

168 168 Packag Information Datasht for Matur Altra Dvics Packag Outlin Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

169 Packag Information Datasht for Matur Altra Dvics Additional Information i Additional Information Rvision History This sction contains rvision history and contact information. Tabl 60 lists th rvision history for this documnt. Tabl 60. Documnt Rvision History (1) (Part 1 of 13) Dat and Documnt Vrsion Changs Mad Dcmbr 2011 Addd 896-Pin FinLin Ball-Grid Array (FBGA) Wir Bond A:2.40, 484-Pin FinLin Ball-Grid Array (FBGA) Wir Bond A:2.40, and 672-Pin FinLin Ball-Grid Array (FBGA) Wir Bond A:2.40. Summary of Changs Updatd for vrsion 16.8 Novmbr 2011 Addd Tabl 9 on pag 10. Updatd for vrsion 16.7 August 2011 Rmovd HardCopy III, HardCopy IV, MAX V, MAX II, Classic, and Updatd for vrsion 16.6 EPCS dvics packag listing and thrmal rsistanc valus. July 2011 Rmovd Arria II, Stratix V, Stratix IV, Stratix III, Cyclon IV, and Cyclon III dvics packag listing and thrmal rsistanc valus. Updatd for vrsion 16.5 Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

170 ii Packag Information Datasht for Matur Altra Dvics Additional Information Tabl 60. Documnt Rvision History (1) (Part 2 of 13) Dat and Documnt Vrsion Changs Mad Jun 2011 Updatd packag diagram in 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Dual-Pic Lid (EP3SL150) and 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Dual-Pic Lid (EP3SE110) Addd Tabl 30 and Tabl 58. Updatd th A and A2 dimnsion valus in 780-Pin FinLin Ball- Grid Array (FBGA) Flip Chip Channl Lid (EP4SGX230) and 780- Pin FinLin Ball-Grid Array (FBGA) Flip Chip Channl Lid (EP4SE230). Updatd th D1 and E1 dimnsion valus in 1152-Pin FinLin Ball- Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4SGX290) and 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4SGX360). Updatd Tabl 13. Updatd th b, A, and A2 dimnsion valus in 256-Pin Ultra FinLin Ball-Grid Array (UBGA) Wir Bond Thin (EP3C10), 256-Pin Ultra FinLin Ball-Grid Array (UBGA) Wir Bond Thin (EP3C16) and 256-Pin Ultra FinLin Ball-Grid Array (UBGA) Wir Bond Thin (EP3C25). Updatd information in Packag Outlins. Addd nw packag diagram for 1152-Pin FinLin Ball-Grid Array (HBGA) Flip Chip Dual-Pic Lid (EP3SL340), and 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Channl Lid (EP4SGX180). Addd nw 1760-pin packags for 5SGXB5 and 5SGXB6 dvics: 1760-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid A:3.40 to rplac th 1932-pin packags for 5SGXB5 and 5SGXB6 dvics. Updatd cross rfrnc for 5SGXB5 and 5SGXB pin packag diagram in Tabl 3. Updatd tabl Tabl 33. Summary of Changs Updatd for vrsion 16.4 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

171 Packag Information Datasht for Matur Altra Dvics Additional Information iii Tabl 60. Documnt Rvision History (1) (Part 3 of 13) Dat and Documnt Vrsion Changs Mad Dcmbr 2010 Updatd documnt titl and mtadata. Updatd Tabl 43 with nw thrmal rsistanc valu for EP3C16 (U484 Wir Bond packag) and EP3C40 (U484 Wir Bond and F780 Wir Bond packags). Updatd not 3 in Tabl 9. Updatd Tabl 19 and Tabl 53 to rmov dual-pic lid options for HardCopy II dvics. Addd Arria II GZ dvic packag listing in Tabl 2 and Arria II GZ thrmal rsistanc in Tabl 35. Addd Stratix V dvic packag listing in Tabl 4 and Stratix V thrmal rsistanc in Tabl 37. Addd MAX V dvic packag listing in Tabl 13 and MAX V thrmal rsistanc in Tabl 46. Addd nw Cyclon IV dvic packag in Tabl 9 and thrmal rsistanc valus in Tabl 42. Updatd lad coplanarity and A3 dimnsion valus in 358-Pin Ultra FinLin Ball-Grid Array (UBGA) Flip Chip, 358-Pin Ultra FinLin Ball-Grid Array (UBGA) Flip Chip Lidlss (EP2AGX45), and 358- Pin Ultra FinLin Ball-Grid Array (UBGA) Flip Chip Lidlss (EP2AGX65). Addd nw packag diagram for 1932-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4SGX360), 324-Pin FinLin Ball-Grid Array (FBGA) Wir Bond (EPM2210), and 324- Pin FinLin Ball-Grid Array (FBGA) Wir Bond (EPM2210G). Summary of Changs Updatd for vrsion 16.3 Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

172 iv Packag Information Datasht for Matur Altra Dvics Additional Information Tabl 60. Documnt Rvision History (1) (Part 4 of 13) Dat and Documnt Vrsion Changs Mad Sptmbr 2010 Updatd JEDEC Outlin Rfrnc for 144-Pin Plastic Enhancd Quad Flat Pack (EQFP) Wir Bond (EP3C10), 144-Pin Plastic Enhancd Quad Flat Pack (EQFP) Wir Bond (EP3C16), and 144-Pin Plastic Enhancd Quad Flat Pack (EQFP) Wir Bond (EP3C25). Updatd dimnsion valu for Arria II GX dvics: 572-Pin FinLin Ball-Grid Array (FBGA) Lidlss Flip Chip (EP2AGX95), 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (EP2AGX95), 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (EP2AGX95), 572-Pin FinLin Ball-Grid Array (FBGA) Lidlss Flip Chip (EP2AGX65), 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (EP2AGX65), 572-Pin FinLin Ball-Grid Array (FBGA) Lidlss Flip Chip (EP2AGX45), 780-Pin FinLin Ball- Grid Array (FBGA) Flip Chip Lidlss (EP2AGX45), 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (EP2AGX260), 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (EP2AGX260), 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (EP2AGX190), 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (EP2AGX190), 1152-Pin FinLin Ball- Grid Array (FBGA) Flip Chip Lidlss (EP2AGX125), 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (EP2AGX125), and 572-Pin FinLin Ball-Grid Array (FBGA) Lidlss Flip Chip (EP2AGX125). Updatd dimnsion valu for HardCopy dvics: 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4E35), 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4E35), 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC335), 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC335), 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC325), 484-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4E25), 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4E25), 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4GX15), 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4GX25), 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4GX25), 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4GX35), and 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4GX35). Rvisd th unit wight info for: 484-Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip, 484-Pin FinLin Ball-Grid Array (FBGA), Option 4 Flip Chip, 572-Pin FinLin Ball-Grid Array (FBGA) Option 1, Flip Chip, 572-Pin FinLin Ball-Grid Array (FBGA) Option 2, Flip Chip, 672-Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip, 672-Pin FinLin Ball-Grid Array (FBGA), Option 4 Flip Chip, 780-Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip, 780-Pin FinLin Ball-Grid Array (FBGA), Option 3 Flip Chip, 780-Pin FinLin Ball-Grid Array (FBGA), Option 4 Flip Chip 1020-Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip, and 1020-Pin FinLin Ball-Grid Array (FBGA), Option 2 Flip Chip. Summary of Changs Updatd for vrsion 16.2 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

173 Packag Information Datasht for Matur Altra Dvics Additional Information v Tabl 60. Documnt Rvision History (1) (Part 5 of 13) Dat and Documnt Vrsion Changs Mad Rvisd th unit wight info for: 1152-Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip, 1152-Pin FinLin Ball-Grid Array (FBGA), Option 2 Flip Chip, 1152-Pin FinLin Ball-Grid Array (FBGA), Option 3 Flip Chip, 1508-Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip, 1508-Pin FinLin Ball-Grid Array (FBGA), Option 2 Flip Chip, 1517-Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip, 1517-Pin FinLin Ball-Grid Array (FBGA), Option 2 Flip Chip, 1760-Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip, 1760-Pin FinLin Ball-Grid Array (FBGA), Option 2 Flip Chip, 1932-Pin FinLin Ball-Grid Array (FBGA), Option 1 Flip Chip, 1932-Pin FinLin Ball-Grid Array (FBGA), Option 2 Flip Chip, 484-Pin Hybrid FinLin Ball-Grid Array (HBGA) Flip Chip, 780-Pin Hybrid FinLin Ball-Grid Array (HBGA) Flip Chip, 1517-Pin Hybrid FinLin Ball-Grid Array (HBGA), Option 1 Flip Chip, 1517-Pin Hybrid FinLin Ball-Grid Array (HBGA), Option 2 Flip Chip, 1152-Pin Hybrid FinLin Ball- Grid Array (HBGA), Option 1 Flip Chip, 1152-Pin Hybrid FinLin Ball-Grid Array (HBGA), Option 2 Flip Chip, 1152-Pin Hybrid FinLin Ball-Grid Array (HBGA), Option 3 Flip Chip, and 1152-Pin Hybrid FinLin Ball-Grid Array (HBGA), Option 4 Flip Chip. Addd packag diagram: 144-Pin Plastic Enhancd Quad Flat Pack (EQFP) Wir Bond (EP3C10), 148-Pin Quad Flat No-Lad Packag (QFN) Wir Bond, 780-Pin FinLin Ball-Grid Array (FBGA), Option 4 Flip Chip, 1152-Pin FinLin Ball-Grid Array (FBGA), Option 3 Flip Chip, and 572-Pin FinLin Ball-Grid Array (FBGA) Option 2, Flip Chip. Addd packag diagram for Stratix IV dvics: 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4SGX290), 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4SGX110), 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4SGX110), 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Channl Lid (EP4SGX180), 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4SGX180), 1932-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4SGX290), 780-Pin Hybrid FinLin Ball-Grid Array (HBGA) Flip Chip Channl Lid (EP4SGX360), 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4SGX360), 1760-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4SGX360), 1517-Pin Hybrid FinLin Ball-Grid Array (HBGA) Flip Chip Dual-Pic Lid (EP4SE530), 1517-Pin Hybrid FinLin Ball-Grid Array (HBGA) Flip Chip Singl-Pic Lid (EP4SE530), 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Channl Lid (EP4SE230), and 1152-Pin Hybrid Ball-Grid Array (HBGA) Flip Chip Singl-Pic Lid (EP4SE530). Summary of Changs Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

174 vi Packag Information Datasht for Matur Altra Dvics Additional Information Tabl 60. Documnt Rvision History (1) (Part 6 of 13) Dat and Documnt Vrsion Changs Mad Addd packag diagram for Stratix III dvics: 780-Pin FinLin Ball- Grid Array (FBGA) Flip Chip Dual-Pic Lid (EP3SL150), 780- Pin Hybrid FinLin Ball-Grid Array (HBGA) Flip Chip Dual-Pic Lid (EP3SL200), 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Dual-Pic Lid (EP3SE110), 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Dual-Pic Lid (EP3SE110), 780-Pin Hybrid FinLin Ball-Grid Array (HBGA) Flip Chip Dual-Pic Lid (EP3SE260), 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Channl Lid (EP3SE260), and 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Dual-Pic Lid (EP3SE260). Addd packag diagram for Cyclon IV dvics: 780-Pin FinLin Ball-Grid Array (FBGA) Wir Bond OMPAC (EP4CE115). Addd packag diagram for Cyclon III dvics : 780-Pin FinLin Ball-Grid Array (FBGA) Wir Bond OMPAC (EP3C120), 144-Pin Plastic Enhancd Quad Flat Pack (EQFP) Wir Bond (EP3C16), 256-Pin Ultra FinLin Ball-Grid Array (UBGA) Wir Bond Thin (EP3C10), 780-Pin FinLin Ball-Grid Array (FBGA) Wir Bond OMPAC (EP3C55), 144-Pin Plastic Enhancd Quad Flat Pack (EQFP) Wir Bond (EP3C25), 256-Pin FinLin Ball- Grid Array (FBGA) Wir Bond Thin (EP3C10), 780-Pin FinLin Ball-Grid Array (FBGA) Wir Bond OMPAC (EP3C80), 484-Pin FinLin Ball-Grid Array (FBGA) Wir Bond OMPAC (EP3C120), 256-Pin FinLin Ball-Grid Array (FBGA) Wir Bond Thin (EP3C16), 256-Pin FinLin Ball-Grid Array (FBGA) Wir Bond Thin (EP3C25), 324-Pin FinLin Ball-Grid Array (FBGA) Wir Bond (EP3C25), 324-Pin FinLin Ball-Grid Array (FBGA) Wir Bond (EP3C40), 484-Pin FinLin Ball-Grid Array (FBGA) Wir Bond OMPAC (EP3C16), 484-Pin FinLin Ball-Grid Array (FBGA) Wir Bond OMPAC (EP3C40), 484-Pin FinLin Ball- Grid Array (FBGA) Wir Bond OMPAC (EP3C55), 484-Pin FinLin Ball-Grid Array (FBGA) Wir Bond OMPAC (EP3C80), 484-Pin Ultra FinLin Ball-Grid Array (UBGA) Wir Bond (EP3CLS100), 256-Pin Ultra FinLin Ball-Grid Array (UBGA) Wir Bond Thin (EP3C16), 484-Pin Ultra FinLin Ball-Grid Array (UBGA) Wir Bond (EP3C16), 256-Pin Ultra FinLin Ball-Grid Array (UBGA) Wir Bond Thin (EP3C25), 484-Pin Ultra FinLin Ball-Grid Array (UBGA) Wir Bond (EP3C55), and 484-Pin Ultra FinLin Ball-Grid Array (UBGA) Wir Bond (EP3C80). Addd packag diagram for MAX II dvics: 100-Pin FinLin Ball- Grid Array (FBGA) Wir Bond Thin (EPM240), 100-Pin FinLin Ball-Grid Array (FBGA) Wir Bond Thin (EPM570). Updatd A3 dimnsion for 572-Pin FinLin Ball-Grid Array (FBGA) Lidlss Flip Chip (EP2AGX45), 572-Pin FinLin Ball- Grid Array (FBGA) Lidlss Flip Chip (EP2AGX65), 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (EP2AGX45), and 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (EP2AGX65). Summary of Changs Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

175 Packag Information Datasht for Matur Altra Dvics Additional Information vii Tabl 60. Documnt Rvision History (1) (Part 7 of 13) Dat and Documnt Vrsion Changs Mad Addd packag diagram for HardCopy III dvics: 484-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (HC325) and 484-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC325). Updatd D1/E1 valus in 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4S40G2), 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4S100G2), 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4SGX180), 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4SGX230), 484-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4E25), 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4E25), and 1020-Pin FinLin Ball-Grid Array (FBGA), Option 2 Flip Chip. Updatd Tabl 7. Updatd Tabl 10 footnot. Updatd thrmal rsistanc valus of EP3CLS70, EP3CLS100, EP3CLS150, and EP3CLS200 dvics F484 pin packag in Tabl 42. Updatd packag diagram in 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4SGX360) Updatd th nots in 256-Pin FinLin Ball-Grid Array (FBGA), Option 1 Wir Bond and 256-Pin FinLin Ball-Grid Array (FBGA), Option 2 Thin Wir Bond to includ Cyclon IV dvics. Updatd EP4SE230 dvic packag to Channl Lid from Dual-Pic Lid in Tabl 4. Updatd packag diagram in 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Dual-Pic Lid (EP4SGX180). Updatd EP1AGX50 and EP1AGX60 F484 pin packag dscription from dual-pic lid to channl lid in Tabl 3. Updatd EP4SGX180 and EP4SGX230 dvic packag dscription in Tabl 4. Addd not 1 to Tabl 6. Dltd HC315WF484 from Tabl 18. Addd additional information to 148-Pin Quad Flat No-Lad Packag (QFN) Wir Bond (EP4CGX15) and 148-Pin Quad Flat No-Lad Packag (QFN) Wir Bond Summary of Changs Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

176 viii Packag Information Datasht for Matur Altra Dvics Additional Information Tabl 60. Documnt Rvision History (1) (Part 8 of 13) Dat and Documnt Vrsion April 2010 Addd Tabl 1 and Tabl 38 Updatd Tabl 2 through Tabl 37 Updatd valus in Tabl 49, Tabl 50, Tabl 58 Changs Mad Rmovd 148-pin Quad Flat No-Lad Packag (QFN) Wir Bond, 484-Pin FBGA, Flip Chip, Dual-Pic Lid (EP2S15), 484-Pin FBGA, Flip Chip, Singl-Pic Lid (EP2S15), 672-Pin FBGA, Flip Chip, Dual- Pic Lid (EP2S15), 672-Pin FBGA, Flip Chip, Singl-Pic Lid (EP2S15) packag outlins. Corrctd titl in 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (HC4E35) Addd 148-Pin Quad Flat No-Lad Packag (QFN) Wir Bond (EP4CGX15) Addd 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl- Pic Lid (EP4S40G2), 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4S100G2), 1517-Pin Hybrid FinLin Ball-Grid Array (HBGA) Flip Chip Singl-Pic Lid (EP4S40G5), and 1932-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl- Pic Lid (EP4S100G4) Addd 1152-Pin Hybrid Ball-Grid Array (HBGA) Flip Chip Singl- Pic Lid (EP4SE820), 1517-Pin Hybrid Ball-Grid Array (HBGA) Flip Chip Singl-Pic Lid (EP4SE820), and 1760-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4SE820) Addd 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl- Pic Lid (EP4SGX180) and 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Dual-Pic Lid (EP4SGX180) Addd 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Dual- Pic Lid (EP4SGX230) Addd 484-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4E25), 484-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (HC4E25), and 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4E25) Addd 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4GX15), and 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (HC4GX15) Addd 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4GX25), 780-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (HC4GX25), 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4GX25), and 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (HC4GX25) Summary of Changs Updatd for vrsion 16.1 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

177 Packag Information Datasht for Matur Altra Dvics Additional Information ix Tabl 60. Documnt Rvision History (1) (Part 9 of 13) Dat and Documnt Vrsion Changs Mad Addd 1152-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (HC4GX35), 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Lidlss (HC4GX35), and 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (HC4GX35) Updatd 1517-Pin FinLin Ball-Grid Array (FBGA) Flip Chip Singl-Pic Lid (EP4SGX230) Corrctd titl for 324-Pin FinLin Ball-Grid Array (FBGA) Wir Bond Option 1 from 324-Pin FinLin Ball-Grid Array (FBGA) Corrctd titl for 1517-Pin Hybrid FinLin Ball-Grid Array (HBGA) Flip Chip Singl-Pic Lid (EP4SE820) from 1517-Pin Hybrid FinLin Ball-Grid Array (HBGA) Flip Chip Singl-Pic Lid (EP4SGX820) Corrctd wight in 324-Pin FBGA Data Sht Addd thrmal rsistanc disclaimr at th bginning of th Thrmal Rsistanc sction Movd EPC1, EPC2, EPC1441 ntris from Tabl 27 to Tabl 37 Dcmbr 2009 Addd nots for prliminary thrmal information (Tabl 36, Tabl 37, Tabl 46, and Tabl 47) Summary of Changs Updatd for vrsion 16.0 Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

178 x Packag Information Datasht for Matur Altra Dvics Additional Information Tabl 60. Documnt Rvision History (1) (Part 10 of 13) Dat and Documnt Vrsion Novmbr 2009 Addd Cyclon IV information Changs Mad Addd nots to 1152-Pin HBGA Option 3 Data Sht Corrctd drawings for 358-Pin UBGA Lidlss (EP2AGX45), 358-Pin UBGA Lidlss (EP2AGX65), and 1152-Pin FBGA Lidlss (EP2AGX95) Data Shts Addd 148-Pin QFN, 169-Pin FBGA, and 324-Pin FBGA Option 2 Data Shts Addd 1517-Pin Lidlss (HC4E35) and 1517-Pin Singl-Pic Lid (HC4E35) Data Shts Addd 780-pin FBGA Channl Lid (EP4SGX230), 780-Pin HBGA Channl Lid (EP4SGX 360), 1152-Pin FBGA Channl Lid (EP4SGX230), 1152-Pin FBGA Channl Lid (EP4SGX360), 1152-Pin FBGA Dual-Pic Lid (EP4SGX230), 1152-Pin FBGA Singl-Pic Lid (EP4SGX230), 1152-Pin FBGA Singl-Pic Lid (EP4SGX360), 1152-Pin HBGA Singl-Pic Lid (EP4SGX530), 1152-Pin HBGA Singl-Pic Lid (EP4SGX820), 1517-Pin FBGA Dual-Pic Lid (EP4SGX230), 1517-Pin FBGA Singl-Pic Lid (EP4SGX230), 1517-Pin FBGA Singl-Pic Lid (EP4SGX360), 1517-Pin HBGA Dual-Pic Lid (EP4SGX530), 1517-Pin HBGA Singl-Pic Lid (EP4SGX530), 1517-Pin HBGA Singl-Pic Lid (EP4S40G2 and EP4S100G2), 1517-Pin HBGA Singl-Pic Lid (EP4S100G5), 1517-Pin HBGA Singl-Pic Lid (EP4SGX820), 1760-Pin FBGA Dual-Pic Lid (EP4SGX530), 1760-Pin FBGA Singl-Pic Lid (EP4SGX360), 1760-Pin FBGA Singl-Pic Lid (EP4SGX820), 1932-Pin FBGA Dual-Pic Lid (EP4SGX530), 1932-Pin FBGA Singl-Pic Lid (EP4SGX530), 1932-Pin FBGA Singl-Pic Lid (EP4S100G2) Data Shts Addd 484-Pin FBGA Dual-Pic Lid (EP2S15), 484-Pin FBGA Singl-Pic Lid (EP2S15), 672-Pin FBGA Dual-Pic Lid (EP2S15), 672-Pin FBGA Singl-Pic Lid (EP2S15), 164-Pin MBGA (EP3C16), and 484-Pin UBGA (EP3C40) Data Shts Summary of Changs Updatd for vrsion 15.9 Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

179 Packag Information Datasht for Matur Altra Dvics Additional Information xi Tabl 60. Documnt Rvision History (1) (Part 11 of 13) Dat and Documnt Vrsion Changs Mad Octobr 2009 Addd 1152-Pin HBGA Option 3, 1152-Pin HBGA Option 4, 1517-Pin HBGA Option 2, 1760-Pin FBGA Option 2, and 1932-Pin FBGA Option 2 Data Shts Addd 358-Pin UBGA Lidlss (EP2AGX45), 358-Pin UBGA Lidlss (EP2AGX65), 572-Pin FBGA Lidlss (EP2AGX45), 572-Pin FBGA Lidlss (EP2AGX65), 572-Pin FBGA Lidlss (EP2AGX95), 572-Pin FBGA Lidlss (EP2AGX125), 780-Pin FBGA Lidlss (EP2AGX45), 780-Pin FBGA Lidlss (EP2AGX65), 780-Pin FBGA Lidlss (EP2AGX95), 780-Pin FBGA Lidlss (EP2AGX125), 780-Pin FBGA Lidlss (EP2AGX190), 780-Pin FBGA Lidlss (EP2AGX260), 1152-Pin FBGA Lidlss (EP2AGX95), 1152-Pin FBGA Lidlss (EP2AGX125), 1152-Pin FBGA Lidlss (EP2AGX190), and 1152-Pin FBGA Lidlss (EP2AGX260) Data Shts Addd 780-Pin FBGA Lidlss (HC325), 780-Pin FBGA Singl- Pic Lid (HC325), 1152-Pin FBGA Lidlss (HC335), 1152-Pin FBGA Singl-Pic Lid (HC335), 1152-Pin FBGA Lidlss (HC4E35), 1152-Pin FBGA Singl-Pic Lid (HC4E35), 1517-Pin FBGA Lidlss (HC335), and 1517-Pin FBGA Singl-Pic Lid (HC335) Data Shts Rmovd EP2AGX20 and EP2AGX30 ntris from Tabl 2 and Tabl 39 Addd EP4SE820 ntris to Tabl 41 Addd Stratix IV GT dvics to Tabl 4; addd option rfrncs Updatd thrmal rsistanc valus in Tabl 39 Jun 2009 Mad thr corrctions to Stratix III thrmal rsistanc tabl Addd Cyclon III LS information Addd Stratix IV GT thrmal rsistanc valus Addd and/or HardCopy III and IV cross-rfrnc and thrmal rsistanc tabls Updatd HardCopy III and IV part numbrs Addd Cyclon III M164 packag information Addd 484-Pin FBGA Option 4, 672-Pin FBGA Option 4, 1020-Pin FBGA Option 2, 1508-Pin FBGA Option 2, and 1517-Pin Option 2 FBGA Data Shts Rvisd 1508-Pin FBGA Option 1, 1020-Pin FBGA Option 1, 1517-Pin FBGA Option 1, 572-Pin FBGA, and 1152-Pin FBGA Option 2 Data Shts Addd 956-Pin BGA Option 2 Data Sht March 2009 Corrctd b Nom. valu in 358-Pin UBGA Data Sht Corrctd A Max. valu and rplacd packag drawing in 780-Pin FBGA - Option 3 Data Sht Corrctd A Max. valu in 256-Pin UBGA Data Sht Modifid thrmal rsistanc valus for EP3SL200 dvic in Stratix III thrmal rsistanc tabl Summary of Changs Updatd for vrsion 15.8 Updatd for vrsion 15.7 Updatd for vrsion 15.6 Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

180 xii Packag Information Datasht for Matur Altra Dvics Additional Information Tabl 60. Documnt Rvision History (1) (Part 12 of 13) Dat and Documnt Vrsion March 2009 Fixd thta symbols in svral data sht Dimnsion Tabls Changs Mad Updatd dimnsions in 256-Pin UBGA Data Sht Summary of Changs Updatd for vrsion 15.5 Addd 358-Pin UBGA Data Sht, 572-Pin, 780-Pin Option 3, and 1152-Pin Option 2 FBGA Data Shts Addd Arria II GX thrmal rsistanc tabl Addd Arria II GX dvic and packag cross-rfrnc tabl Addd EP3SL50, EP3SE80, and EP3SL110 dvics to Stratix III thrmal rsistanc tabl Addd EP4SGX70, EP4SGX180, and EP4SGX290 dvics and updatd Stratix IV GX thrmal rsistanc tabl Addd HardCopy III and HardCopy IV thrmal rsistanc tabl Miscllanous formatting changs Dcmbr 2008 Changd dimnsion A Max. valu in 1932-Pin FBGA Data Sht Updatd for vrsion 15.4 Novmbr 2008 Movd Rvision History to th nd and addd How to Contact Altra Updatd for vrsion 15.3 sction Addd subhadings in Thrmal Rsistanc sction Convrtd to 8-1/2 x 11 pag siz Changd Maximum Lad Coplanarity to Lad Coplanarity and addd (Typ.) to wights for all packags Addd EP2C15 information to Cyclon II tabls Sptmbr 2008 Addd thrmal rsistanc valus for Stratix IV Updatd for vrsion 15.2 Addd nw 1152-Pin HBGA Option 2 (42.5 MM SQ.) Data Sht Addd nw 1517-Pin HBGA (42.5 MM SQ.) Data Sht Addd thta-jb thrmal rsistanc valus for Stratix II Addd HardCopy II thrmal rsistanc valus Rvisd wights for 256-Pin BGA Option 2, 652-Pin BGA Option 2, 652-Pin BGA Option 3, 208-Pin RQFP, 240-Pin RQFP, and 304-Pin RQFP Data Shts Addd nots to 1152-Pin FBGA, 1517-Pin FBGA, 1760-Pin FBGA; changd dimnsion A thicknss and A2 thicknss in 1932-Pin FBGA Data Sht May 2008 Addd 1932-Pin FBGA Data Sht Updatd for vrsion 15.1 Addd Dvic and Packag Cross Rfrnc tabl for Stratix IV April 2008 Rvisd Maximum Lad Coplanarity valus for 1517-Pin FBGA and Updatd for vrsion Pin FBGA Data Shts Addd thr ntris to Tabl 3 Corrctd minor typos in Tabl 4 and Tabl 10 Corrctd HC210W packag in Tabl 12 Many tabls updatd for formatting consistncy Packag Information Datasht for Matur Altra Dvics Dcmbr 2011 Altra Corporation

181 Packag Information Datasht for Matur Altra Dvics Additional Information xiii Tabl 60. Documnt Rvision History (1) (Part 13 of 13) Dat and Documnt Vrsion Fbruary 2008 Addd 164-Pin MBGA information in Tabl 8 Addd HardCopy II dvic information in Tabl 12 Updatd Stratix III thrmal rsistanc valus in Tabl 22 Addd 164-Pin MBGA Data Sht Corrctd 8-Pin SOIC Data Sht (changd B to b in Packag Outlin Dimnsion Tabl) Corrctd 68-Pin MBGA Data Sht (changd Inchs to Millimtrs in Packag Outlin Dimnsion Tabl) Octobr 2007 Rmovd not from 100-Pin PQFP Option 1 Data Sht Rmovd 100-Pin PQFP Option 2 Data Sht Updatd 88-Pin UBGA, 144-Pin EQFP, 256-Pin FBGA Option 1, 256- Pin FBGA Option 2, 256-Pin UBGA, 1517-Pin FBGA, and 1760-Pin FBGA Data Shts Addd 780-Pin HBGA and 1152-Pin HBGA Data Shts May 2007 v14.7 Addd Arria GX information Addd Cyclon III tabls Rvisd D2 and E2 dimnsions for 144-Pin EQFP Rvisd 100-Pin MBGA - Wir Bond and 256-Pin MBGA - Wir Bond Addd 780-Pin FBGA option 2 - Wir Bond, 256-Pin UBGA - Wir Bond, 68-Pin MBGA - Wir Bond, and 144-Pin MBGA - Wir Bond Fbruary 2007 v14.6 Dcmbr 2006 v14.5 Changs Mad Updatd 144-Pin Plastic Thin Quad Flat Pack (TQFP) Data Sht to corrct titl and ordring cod rfrnc Addd rvision history Tabl 2 was addd for Stratix III Dvic and Packag Cross-Rfrnc Tabls 16, 17, and 18 wr addd for Stratix III Thrmal Rsistanc information 1517-Pin FinLin Ball-Grid Array (FBGA) - Flip Chip data sht was addd 1760-Pin FinLin Ball-Grid Array (FBGA) - Flip Chip data sht was addd "Wir Bond" and "Flip Chip" was addd to titl of ach data sht, as appropriat "BGA" was splld out as "Ball-Grid Array" in all titls Som packag outlin drawings wr rformattd Wights wr updatd for many packags Not to Tabl 60: (1) Formal rvision history for this documnt bgan with vrsion Summary of Changs Updatd for vrsion 14.9 Updatd for vrsion 14.8 Changs and additions as dscribd in Changs Mad sction Rvisd on data sht (144-Pin Plastic Thin Quad Flat Pack (TQFP) Data Sht), addd rvision history Addd Tabls for Stratix III, updatd othr data shts Dcmbr 2011 Altra Corporation Packag Information Datasht for Matur Altra Dvics

182 Additional Information How to Contact Altra For th most up-to-dat information about Altra products, s th following tabl. Contact (Not 1) Contact Mthod Addrss Tchnical support Wbsit Tchnical training Wbsit [email protected] Altra litratur srvics [email protected] Non-tchnical support (Gnral) [email protected] (Softwar Licnsing) [email protected] Not: (1) You can also contact your local Altra sals offic or sals rprsntativ. 101 Innovation Driv San Jos, CA Tchnical Support Copyright Dcmbr Altra Corporation. All rights rsrvd. Altra, Th Programmabl Solutions Company, th stylizd Altra logo, spcific dvic dsignations, and all othr words and logos that ar idntifid as tradmarks and/or srvic marks ar, unlss notd othrwis, th tradmarks and srvic marks of Altra Corporation in th U.S. and othr countris. All othr product or srvic nams ar th proprty of thir rspctiv holdrs. Altra products ar protctd undr numrous U.S. and forign patnts and pnding applications, maskwork rights, and copyrights. Altra warrants prformanc of its smiconductor products to currnt spcifications in accordanc with Altra's standard warranty, but rsrvs th right to mak changs to any products and srvics at any tim without notic. Altra assums no rsponsibility or liability arising out of th application or us of any information, product, or srvic dscribd hrin xcpt as xprssly agrd to in writing by Altra Corporation. Altra customrs ar advisd to obtain th latst vrsion of dvic spcifications bfor rlying on any publishd information and bfor placing ordrs for products or srvics.