Flex-rigid: Base materials and their characteristics
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1 Flex-rigid: Base materials and their characteristics Webinar February, 7th 2017 Speaker: Andreas Schilpp
2 Introduction: Integration of Module Interconnects Benefits through Flex-Rigid Technology Reliability dynamic bending Signal integrity Miniaturisation page 2
3 agenda 1 Ingredients for a Flex-Rigid PCB 2 3 Standard Flex-rigid Stack-ups Material characteristics and their effect on applications page 3
4 Terms and Abbreviations Bondply B2B: Board-to-Board CAF: Conductive Anodic Filament Cu: Copper CL: Coverlay FPC: Flexible Prited Circuit IPC: Organisation "Association Connecting Electronics Industries PI: Polyimide TPI: Thermoplastic PI (Adhesive) ZIF: Zero Insertion Force page 4
5 samples you will get here! flexible foil Polyimide, copper 2 sides copper resp. ENIG surface flexible soldermask rigid FR4 (stiffener) 3M transfer adhesive page 5
6 samples you will get here! flexible foil Polyimide, copper 1 side rigid FR4, FR4 prepreg copper resp. ENIG surface flexible soldermask standard soldermask page 6
7 samples you will get here! flexible foil Polyimide, copper 2 sides rigid FR4, FR4 prepreg copper resp. ENIG surface Polyimide coverlay standard soldermask page 7
8 samples you will get here! flexible foil Polyimide, copper 2 sides rigid FR4, FR4 prepreg copper resp. ENIG surface flexible soldermask / Polyimide coverlay standard soldermask page 8
9 flexible foils, copper-clad flexible foils with adhesive flexible adhesive foils rigid cores, copper-clad rigid prepregs (adhesive compound) specialty: LowFlow prepreg copper foils copper plating (barrels and plated layers) solder surface (on copper) soldermask Standard (almost green) flexibel ink for legend strain relief out of elastomer page 9
10 Production of flexible base materials (1) Polyimide, single sided copper clad base material adhesiveless, Casting PI varnish Heater 2-FCCL S/S Cu Polyimide foil thickness: (12,5µm) / 25µm / 50µm Standard / 75µm / 100µm / (.) Copper foil thickness: (5µm / 7µm / 9µm) / 12µm / 18µm / 35µm / 70µm page 10
11 Production of flexible base materials (2) Polyimide, double sided copper clad base material adhesiveless (TPI) Lamination Cu PI TPI TPI PI Cu Cu 2-FCCL D/S TPI film Cu Polyimide foil thickness: (12,5µm) / 25µm / 50µm Standard / 75µm / 100µm / (.) Copper foil thickness: (5µm / 7µm / 9µm) / 12µm / 18µm / 35µm / 70µm page 11
12 Production of flexible base materials (3) Polyimide, double sided copper clad base material adhesiveless: Sputter methode (we do not use this kind of material) Polyimide foil thickness: (12,5µm) / 25µm / 50µm Standard / 75µm / 100µm / (.) Primer Copper foil thickness: (5µm / 7µm / 9µm) / 12µm / 18µm page 12
13 Production of flexible base materials (4) Polyimide, single sided copper clad base material with adhesive Copper PI Film Adhesive Heater 3L Cu Adhesive PI Polyimide foil thickness: (12,5µm) / 25µm / 50µm Standard / 75µm / 100µm / (.) Adhesive thickness: typical 13µm / 20µm / 25µm Acrylc glue (since 1970 s) or Epoxy Copper foil thickness: (5µm / 7µm / 9µm) / 12µm / 18µm / 35µm / 70µm Paper instead of copper foil Coverlay (Polyimide + adhesive on one side) Paper instead of copper foil and Polyimide pure adhesive foil (i.e. LF0100) page 13
14 Production of flexible base materials (5) Polyimide, double sided copper clad base material with adhesive Copper PI Adhesive Cu Heater Cu Adhesive PI Adhesive Cu Polyimide foil thickness: (12,5µm) / 25µm / 50µm Standard / 75µm / 100µm / (.) Adhesive thickness: typical 13µm / 20µm / 25µm Acrylc glue (since 1970 s) or Epoxy Copper foil thickness: (5µm / 7µm / 9µm) / 12µm / 18µm / 35µm / 70µm Paper instead of copper foil Bondply (Polyimide with adhesive on both sides) page14
15 Rigid Base material (1) Spezification according IPC-4101 Ingredients: resin: Epoxy, Polyimid, hardener fillers carrier: paper or glas copper foil page 15
16 Rigid Base material (2) woven glass as carrier worp and weft direction spread glass constructions specification: IPC-4412 Quellen: NanYa page16
17 Copper foils Thickness derived from surface weight oz/ft² 1 oz/ft² = 305g/m² = 35µm Dicke Copper quality acc. IPC-4562 electro plated (ED) rolled copper RA-Quality new: rolled copper HA-Quality rough treatment side facing the base meterial page17
18 Rigid Base material (3) vertical impregnation system Source: VDE/BDI3711, Blatt page18
19 Rigid Base material (4) 1. impregnation 2. prepreg cutting, copper foil lay-up 3. copper lamination 4. final cutting Source: Isola page19
20 agenda 1 Ingredients for a Flex-Rigid PCB 2 3 Standard Flex-rigid Stack-ups Material characteristics and their effect on applications page 20
21 Standard stack-ups Flex-rigid Modifications: flex inside / outside thickness of flexible material Polyimide adhesiveless / with adhesive quality rigid base material copper quality and thickness flexible soldermask or coverlay coverlay partially / full size total thickness of pcb solder surface page 21
22 Standard stack-ups Flex-rigid (2) page 22
23 Standard stack-ups Flex-rigid (3) Base materials rigid: FR4 Tg 150 C, halogen free, filled- standard thicknesses flex: Polyimide Tg >> 200 C, adhesiveless typical 25µm / 50µm thick( up to 150µm) standard solder mask, flexible solder mask, Polyimide coverlay Stack-up plans example: µvia capable page 23
24 agenda 1 Ingredients for a Flex-Rigid PCB 2 3 Standard Flex-rigid Stack-ups Material characteristics and their effect on applications page 24
25 Material characteristics and their effect on applications (1) resin system dielectric properties ration resin : carrier dielectric properties resin + hardener + fillers: temperature stability ( PI) soldering performance, application thermal expansion behavior CTE thermal conductivity Sources: ZVEI, GMM page 25
26 Material characteristics and their effect on applications(2) adhesive general weak point in a compound thermal expansion in z-axis capability for UL listing impact on tracking index CTI solder mask Coverlay dielectric strength abrasion resistance buckling resistance Source: Dr. Seidel, Siemens pagee 26
27 Material characteristics and their effect on applications (3) copper treatment adhesion on base material fine line capability suitable for high frequencies copper quality robustness in dynamical bending and buckling carrier dimensional stability registration annular ring glass matrix: HR characteristics, CAF Source: Isola page 27
28 Summary there is an incredible variety in materials used for flex and flex-rigid technology and in their combinations standardisation is important to meet quality and cost targets knowledge about material characteristics and processes is mandatory specification of materials and stack-ups has to be fixed in an early phase of a project based on the specification of the entire project ( mission profile ) Please contact us as soon as possible! page 28
29 Thank you for your attention The webinar was presented by
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