New Materials for Flex- and Rigid/Flex-Circuitry From Sun Chemical. Productronica Munich Nov Quality - Service - Innovation

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1 New Materials for Flex- and Rigid/Flex-Circuitry From Sun Chemical Productronica Munich Nov 2009 Quality - Service - Innovation 1

2 New Material for Flex- and Rigid/Flex Circuitry Content: Our Vision Common situation using Coverlay Foils SunFlex SD versus foils, processing and cost How to use SunFlex SD Results Summary 6

3 New Material for Flex- and Rigid/Flex Circuitry Our vision of a product with future to help our customers to be more competitive Screen Coverlay SunFlex SD 7

4 SunFlex SD Coverlay for Circuits Our vision: Substitution of Coverlayfoils Why, what would be the benefit? What is common with Coverlay foils in real life? 8

5 Common with foil technology Foils are supplied in rolls or sheets never exactly matching pcb format or cut to size at a cost Waste of material and need to discharge rest of foils plus protection foil Each single flex layer has to be covered individually with coverlay and pressed Depending on layercount this means several long lasting and energy consuming press cycles Used either full area (high material cost) or on selected areas (high man power cost), always connected in a seperate press step to the laminate. High process cost, high energy cost, depending on layer count long process times, 3 press cycles = longer than 1 shift! 9

6 Difficile and time consuming partial coverlay To cut (laser e.g.) coverlay pieces To remove protection sheet To place and fix coverlay One panel can take several hours, a number of panels may need several days How much easier is screen printing with stencil! And more precise! 10

7 Common with foil technology Foils are supplied with adhesives, either epoxy or acrylic type. Adhesives tend to give smear in drilling Special desmear processes Plasma are needed before plating Adhesives absorbe humidity Dimensional instabilites z-axis Dilemma: Use of Coverlay full area means: Drilling through adhesive need for desmear High material cost, about /m² Use of Coverlay selected areas means: High man power cost, slow process, reduced accuracy, >0,8mm manual positioning Foils are instable because of manual mounting and several press cycles Tolerances for correction factors difficult to calculate prior to production, hence often unsatisfying yields 11

8 Common with foil technology Technical problems with machining, drilling, routing, smear, dust Not easy logistics as many different types of material need to be purchased and stored different film thicknesses e.g. Production and CAM need to know many different material properties and behaviours in processing 12

9 SunFlex SD Coverlay versus foils Our vision: Substitution of Coverlayfoils Why, what would be the benefit? What is common with Coverlay foils in real life? 13

10 Difficile and time consuming partial coverlay To cut (laser e.g.) coverlay pieces To remove protection sheet To place and fix coverlay One panel can take several hours, a number of panels may need several days How much easier is screen printing with stencil! And more precise! 14

11 Using Coverlay foil means many process steps Foil with Teflon Separator Press coverlay Layup Build in Teflon Cut to size Prepreg and Teflon Cut to size coverlay Remove protection foil Register and mount coverlay To measureflexlayer, find correction factors for dimensional instability for foil coverlayer 15

12 Using SunFlex SD means less process steps SunFlex SD with Teflon Separator Layup package Build in Teflon Cut to size Prepreg and Teflon To print and predry each flex layer Only one press cycle for the whole layup. 16

13 Use of Coverlay foil Presscycle B Cu Layer 1 outerlayer Fr 4-Core Cu Layer 2 Innerlayer 2 x NoFlow Prepreg Presscycle A { Presscycle A Coverlayfoil Adhesive / Acryl / Epoxi Cu Flexlayer 3 Kapton Core Cu Flexlayer 4 Adhesive / Acryl / Epoxi Coverlayfoil 2 x NoFlow Prepreg Cu Layer 5 Innerlayer Fr 4 Core Cu Layer 6 Outerlayer 17

14 Useof SunFlexSD Cu Lage 1 Aussenlage Fr 4-Kern Cu Lage 2 Innenlage 2 x NoFlow Prepreg SunFlex SD Cu Flexlage 3 Kapton Träger Cu Flexlage 4 SunFlex SD SunFlex SD printed and dryed 2 x NoFlow Prepreg Cu Lage 5 Innenlage Fr 4 Kern Cu Lage 6 Aussenlage Complete layup needs only 1 press cycle 18

15 Use of Coverlayfoils 4 Layer Rigid Flex Circuit with flex area on outers Coverlay 1 x Fr 4 Core Soldermask Prepreg 4 Layer Rigid Flex Circuit with 1 flexible Innerlayer ( double sided symmetric ) Coverlay 2 x Fr 4 Core Fr 4 Core. 6 Layer Rigid Flex Circuit with 2 flexible Innerlayer ( double sided symmetric ) Coverlay 4 x Fr 4 Core Fr 4 Core 19

16 Replacement of coverlay foil with SunFlex SD 4 Layer Rigid Flex Circuit with flex area on outers SunFlex SD printed selected area Fr 4 Core One press cycle saved 4 Layer Rigid Flex Circuit with 1 flexible Innerlayer ( double sided symmetric ) SunFlex SD printed full area 2x Fr 4 Core One press cycle saved Fr 4 Core 6 Layer Rigid Flex Circuit with 2 flexible Innerlayer ( double sided symmetric ) SunFlex SD printed full area 4 x Fr 4 Core Two press cycles saved Fr 4 Core 20

17 Cost savings through use of Sun Flex SD screen printed coverlay It is plain to see that screen printed coverlay can save significant cost in production of rigid-flex circuits Either in savings of material and material related cost (logistics, waste for full area use of coverlay Or in savings of man power and time for use of selected area coverlay. Next slides will demonstrate this in real numbers, calculated using real machine cost, personal cost and production times 21

18 Cost and time comparison for single layer Materialkostenanteil Personalkostenanteil Duchlaufzeiten in min vollflächig Partiell Gedruckt Coverlay Coverlay Polyimid Production cost 1 Flexlayer double sided Cu, 30 panels = 10m² 22

19 Comparison cost and time for 3 flex layers Hk bei 3 Flexlagen Materialkostenanteil Personalkostenanteil Duchlaufzeiten in min Kosten in , t in m in vollflächig Partiell Gedruckt Coverlay Coverlay Polyimid 0 23

20 How to use SunFlex SD Now that we have seen that there are benefits of SunFlex SD how can that product be processed in a real environment? Production Process Screen Printing Drying/Baking Pressing Drilling Plating Routing-Cutting 24

21 Screen printing SunFlex SD 1. Can be used under standard screen printing conditions, Vacuum print table recommended Rheology like soldermask, nothing special mixed pot life 24h 25

22 Screen printing SunFlex SD 2-component Polyamideimide-System, chemically stabilised, shelf life of 18 monthes, mixed pot life C Mixing of resist and hardener 100 :15 parts, no special instructions, supplied ready to use, no thinning. Preclean to common conditions Water based stencils and screen fillers can be used, tapes should be tested, Al coated tapes are suitable. Print rheology like soldermask 43/100 screens give about 10µm dry film thickness, multiple prints with intermediate predry possible to adjust to copper hights. No special exhausts needed, no complaints from operators 26

23 Drying SunFlex SD 2. Drying, Handling ( 80 to 120 C 15 min ) bake (150 C 60 min) Convection air batch oven or conveyorised, wide process window -Double coating with intermediate drying for higher film thicknesses No layer seperation, no bubbles 27

24 Drilling and plating SunFlex SD Source: Andus ELECTRONIC GmbH 28

25 Press conditions for SunFlex SD Standard press cycles ( total cycle 3 h max 185 C 35 bar, e.g.) with Teflon seperation sheet. All demonstrators were produced using common press cycles After Press 29

26 Drilling and plating SunFlex SD Mechanical drilling with no special parameters or laser drilling with YAG laser 30

27 Drilling and plating SunFlex SD Source: Andus ELECTRONIC GmbH 31

28 Drilling and plating SunFlex SD No smear formation No Plasma desmear needed Source: ILFA Feinstleitertechnik 32

29 SunFlex SD and final finishes Final finishes HASL ( leadfree) chem. Sn, ENIG (various tested) All finishes passed with no delamination, no lift 33

30 Machinability of SunFlex SD Mechanical processes precise routing contours, no threads, no separation 34

31 Cosmetic of SunFlex SD Appearence comparable to foils SunFlex SD Coverlay foil 35

32 Processing of SunFlex SD Cooperation partners have produced real panels using SunFlex SD Demonstrators can be seen on show, B2, 374 Results of test phase re processing 1. Use of standard screen printing OK 2. Drying, Handling, final bake OK 3. Press as standard OK 4. Drilling, Plating, no smear formation OK 5. Final finishes OK 6. Machinability, seperation from PTFE OK 7.Cosmetic: Colour meets foil colour OK 36

33 Example of a demonstrator layup As a first real panel to test SunFlex SD Andus decided to use a standard symmetric 6 layer with one flex core. SunFlex SD to replace the standard coverlay foil. SunFlex SD Flex core, Cu-layer 3 and 4 SunFlex SD 37

34 Performance of SunFlex SD SunFlex SD can save cost SunFlex SD can be used with standard practices and standard equipment, no investment needed. How does SunFlex SD perform in tests? 38

35 Description of SunFlex SD SunFlex SD is a chemically stabilised 2-component Polyamideimide product that complies with RoHS and WEEE directive SunFlex SD complies with the European Directive 2003/11/EC regarding the presence of the metals Pb (Lead/Lead compounds), Hexavalent Chromium, Cd, Hg and Poly Brominated Flame Retardants. SunFlex SD conforms to Regulation (EC) No. 1907/2006 (REACH), Annex II- Europe SunFlex SD has a shelf life of 18 monthes. No problems for worldwide supply. Physical Properties Of SunFlex SD Adhesive Resist and Hardener Pack Code Viscosity (Pas.) S.G. Flash Point Non volatile content CBSN >70 C (158 F) 42.1% CCSN >70 C (158 F) 72.5% *Viscosity measured at 25 C (77 F). Please note viscosity can vary greatly depending on ink temperature, volume of ink tested, type of viscometer used and the test method. Volatile Organic Content (VOC) g./L. 39

36 Test results Trace Laboratories, Oct. 09 Tested as soldermask V-0 rating Trace Laboratories are certified UL-Agency. 40

37 Electrical properties of Sun Flex SD cured film 41

38 Cycletest -40 / +125 C, 1000 cycles Source: ILFA Feinstleitertechnik SunFlex SD No delamination after solder test 260 C 42

39 The flex test according to IPC TM650 43

40 Flex test results Panel No.. 10 bends 5000 bends bends bends (run over night) Results from lab test for selection of suitable versions 1. Flextests walktest r= 3mm > Zycles 1 massive parallel to tracks IPC TM massive cracks 90 to tracks 4 0 a few cracks 90 to tracks 5 some cracks very fine cracks over copper tracks 44

41 Further remarkable tested material properties Absorption of humidity IPC-TM-650, ,01 0,02% The absence of acrylic or epoxy adhesives provides much better dimensional stability, avoids smear, higher yields If predried at min. 120 C there is no flow of resin, SunFlex SD behaves like a Noflo Prepreg. If used without separation sheet and dried below 185 C SunFlex SD has function of adhesive. Successful bonding to Al foil. On peel test laminate is torn apart SunFlex can be Laser ablated to achieve highest registration accuracy and solderable pads on outer layers. SunFlex SD was tested for performance of Solder Mask and passed, provides high temperature stability and registration accuracy of Laser Ablation. 45

42 Sun Flex SD as Adhesive Processing Drying tests at different temperatures proved no flow characteristic from 120 C onwards. Possible replacement for common adhesives with extremely low humidity absorption, no smear effects Very thin constructions possible Results Source: Design for Excellence 4.3, Mektek 46

43 Summary A new material family has been invented with very high temperature resistance and high level final properties, very low humidity absorption, easy processing and great potential of cost savings and quality increasing in the area of Flex- and Rigid-Flex circuitry. The product is stable with shelf life of 18 monthes and is RoHS and WEEE Directive Compliant. Further applications of this material are under test with cooperation partners under NDAs. The material can be adopted to other application methods such as Dispensing or Roller Coating or the like offering a wide field of usability 47

44 Thanks We would like to thank our cooperation partners for their contribution and help with testing and producing test vehicles as well as real panels and the demonstrators for this Productronica and for sharing their high expertise with us. Many Thanks to ILFA Feinstleitertechnik GmbH, Andus ELECTRONIC GmbH, AT&S AG CONTAG GmbH 48

45 Many thanks for your kind attention Vielen Dank /Many thanks Let s move it! 49

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