Webinar HDI Microvia Technology Cost Aspects
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1 Webinar HDI Microvia Technology Cost Aspects HDI - Cost Aspects Seite 1 1 July, 2014
2 Agenda - Webinar HDI Microvia Technology Cost Aspects Reasons for the use of HDI technology Printed circuit board (PCB) size Number of layers Stack-up and complexity Other important cost influences Design rules Drilling costs Microvia filling Stefan Keller Product Manager HDI - Cost Aspects Seite 2 1 July, 2014
3 HDI Microvia Technology why? 1. Complexity of the components in particular BGA pitches 0.65 mm and less require HDI Pitch 0,8 mm / PTH Via Pad Ø 0.50 mm Microvia Design Rules: > HDI Design Guide and HDI webinars HDI - Cost Aspects Seite 3 1 July, 2014
4 HDI Microvia Technology why? 2. Reliability / Aspect Ratio ASR 6:1 8:1 (PCB thickness / Ø ) Minimum drill tool diameter 0.30 mm / 0.25 mm Final customer reliability requirements? IPC class 2 or IPC class 3 Cl µm >> Often the better solution: HDI microvia instead of PTH Microvia 0.30 mm pad size / 0.10 mm Ø HDI - Cost Aspects Seite 4 1 July, 2014
5 HDI Microvia Technology why? Produkte 3. Miniaturisation Market requirements size of the device + PCB size Other examples: - embedded computer - medical technology - industrial cameras Other approaches / cost pressure: double sided assembly on the whole surface functional separation of top and bottom side Smaller or one PCB instead of two HDI - Cost Aspects Seite 5 1 July, 2014
6 HDI Microvia Technology why? Produkte Survey: Why do you use HDI Technology? Multiple answers possible Routing Fine Pitch BGAs Higher reliability Miniaturisation in general Other reasons HDI - Cost Aspects Seite 6 1 July, 2014
7 HDI Microvia Technology but: Produkte HDI - Cost Aspects Seite 7 1 July, 2014
8 Buried Via HDI Cost Aspect PCB Size Produkte PCB size size of the device > could be essential for a successful product! Number of layers / stack-up Semi (FR4)- flex Printed resistors on innerlayers Microvia Avoidance of PTH vias! HDI Technology Microvias + Buried Vias HDI - Cost Aspects Seite 8 1 July, 2014
9 HDI Cost Aspect PCB Size QFP 0.40 mm pitch Pad- 300 µm solder pad 200 µm max. 230 µm 0,400 mm pitch HDI - Cost Aspects Seite 9 1 July, 2014
10 HDI Cost Aspect Number of Layers Produkte BGA pitch 0.80 mm 20 x 20 = 400 pins Design Study How many signal layers are needed? o o With PTH vias (only plated through hole vias) With Microvias (HDI) HDI - Cost Aspects Seite 10 1 July, 2014
11 HDI Cost Aspect Number of Layers Produkte BGA Pitch 0.80 mm 20 x 20 = 400 Pins Design Study PTH Microvia How many signal layers are needed? How many signal layers are needed? HDI - Cost Aspects Seite 11 1 July, 2014
12 HDI Cost Aspect Stack-up If the PCB size is fixed: Recommendation: stack-up only as complex as necessary - Number of layers - Number of lamiations / pressing processes / manufacturing processes HDI - Cost Aspects Seite 12 1 July, 2014
13 Costs HDI Cost Aspect Complexity HDI % 100 % Single pressing 100 % % Laser drilling layer 1 to % Inner layer microvias (staggered) sequential pressings % Buried vias mech. drilled 1 + 6b % Additional inner layer microvias 2 + 4(6b) sequential pressings 175 % 2 + 4b Complexity HDI - Cost Aspects Seite 13 1 July, 2014
14 Costs HDI Cost Aspect Complexity HDI % What are the costs for a 8-layer multilayer without microvias? 2 sequential 100 % % ML08 Single pressing 100 % % Laser drilling layer 1 to % Inner layer microvias (staggered) pressings % Buried vias mech. drilled 1 + 6b % Additional inner layer microvias 2 + 4(6b) Complexity HDI - Cost Aspects Seite 14 1 July, 2014
15 HDI Cost Aspects Stack-up and Complexity HDI08_ ML eurocard 100 x 160 mm / 200 boards 1000 boards: HDI - Cost Aspects Seite 15 1 July, 2014
16 HDI Cost Aspect Technology Microvias stacked Microvias 0,40 mm BGA pitch staggered Filling? HDI - Cost Aspects Seite 16 1 July, 2014
17 HDI Cost Aspect Design Rules HDI - Cost Aspects Seite 17 1 July, 2014
18 HDI Cost Aspect Design Rules BGA pitch 0.80 mm 90 µm track width often uncritical Fine line structures 75 µm usually only for 0.50 mm pitch BGAs absolutely necessary HDI - Cost Aspects Seite 18 1 July, 2014
19 HDI Cost Aspect Design Rules 0.50 mm pitch BGA 0,650 mm pitch clearance solder mask 50 / 62,5 µm track width 100 µm BGA pad 350 µm 75 µm fine line structures in any case on the inner layers outer layers: different options HDI - Cost Aspects Seite 19 1 July, 2014
20 Costs HDI Cost Aspect Drilling Costs Ø 200 µm (1 / drill bit) Endurance: 1000 holes Frequency: 3 / s Ø 200 µm Ø 300 µm Ø 300 µm (0,60 / drill bit) Endurance: 2000 holes Frequency: max. 8 / s fix costs laser drilling (Acquisition) fix costs mechanical drilling Number of Holes Microvia: Ø 125 µm (0,0 / Microvia) Frequency: / s HDI - Cost Aspects Seite 20 1 July, 2014
21 HDI Cost Aspect Microvia Filling IPC-7095C: max. 22% of the image diameter The appearance of voids depends on: Flux, solder paste Temperature profil.. Extra charge!! Filling? Customer / EMS have to decide for themselves which variant could be used! HDI - Cost Aspects Seite 21 1 July, 2014
22 HDI other Cost Aspects High speed / signal integrity HDI Technology instead of expensive high frequency material Version 1: PTH Version 2: Microvia / Buried Via open ended antennas Made in Germany Technical advice and support, Product Management, local sales representatives and engineering Design Conferences Workshops Design Rules DFM Impedance calculations Stack-ups Metallurgic analyses HDI - Cost Aspects Seite 22 1 July, 2014
23 HDI Cost Aspects Summary Components Total complexity Reliability requirements Determine which PCB Technology should be utilised PCB size Build-up Drilling costs Design Rules Are the determining cost factors and they could be decisively influenced by HDI technology The relationships should be considered Miniaturisation is really possible only with HDI technology HDI - Cost Aspects Seite 23 1 July, 2014
24 HDI Cost Aspects Produkte HDI - Cost Aspects Seite 24 1 July, 2014
25 Knowing the relationships - is a secret of success! We are looking forward to good cooperation! Stefan Keller Product Manager stefan.keller@we-online.de HDI - Cost Aspects Seite 25 1 July, 2014
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