STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF

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1 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Trench gate field-stop IGBT, H series 600 V, 5 A high speed Datasheet - production data Features High speed switching Tight parameters distribution Safe paralleling Low thermal resistance Short-circuit rated Ultrafast soft recovery antiparallel diode Applications Motor control UPS, PFC Figure 1. Internal schematic diagram Description G (1) C (2, TAB) These devices are IGBTs developed using an advanced proprietary trench gate and field-stop structure. The devices are part of the H series of IGBTs, which represent an optimum compromise between conduction and switching losses to maximize the efficiency of high switching frequency converters. Moreover, a slightly positive V CE(sat) temperature coefficient and very tight parameter distribution result in safer paralleling operation. E (3) Table 1. Device summary Order codes Marking Packages Packing STGB5H60DF GB5H60DF D²PAK Tape and reel STGD5H60DF GD5H60DF DPAK Tape and reel STGF5H60DF GF5H60DF TO-220FP Tube STGP5H60DF GP5H60DF TO-220 Tube May 2015 DocID Rev 3 1/30 This is information on a product in full production.

2 Contents STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Contents 1 Electrical ratings Electrical characteristics Electrical characteristics (curves) Test circuits Package information D²PAK package information DPAK package information D²PAK and DPAK packing information TO-220FP package information TO-220 package information Revision history /30 DocID Rev 3

3 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Electrical ratings 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter D²PAK TO-220 DPAK TO- 220FP Unit V CES Collector-emitter voltage (V GE =0) 600 V Continuous collector current at T C =25 C (1) I C A Continuous collector current at T C = 100 C 5 5 (1) I CP (2) Pulsed collector current (1) A V GE Gate-emitter voltage ±20 V I F Continuous forward current at T C =100 C 5 5 (1) Continuous forward current T C =25 C (1) A (2) I FP Pulsed forward current (1) A Insulation withstand voltage (RMS) from all V ISO three leads to external heat sink 2500 V (t = 1 s, T C =25 C) P TOT Total dissipation at T C =25 C W T STG Storage temperature range - 55 to 150 T J Operating junction temperature - 55 to 175 C 1. Limited by maximum junction temperature. 2. Pulse width limited by maximum junction temperature. Table 3. Thermal data Symbol Parameter D²PAK TO-220 DPAK TO- 220FP Unit R thjc Thermal resistance junction-case IGBT R thjc Thermal resistance junction-case diode R thja Thermal resistance junction-ambient C/W DocID Rev 3 3/30 30

4 Electrical characteristics STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF 2 Electrical characteristics T J = 25 C unless otherwise specified. Table 4. Static Symbol Parameter Test conditions Min. Typ. Max. Unit V (BR)CES Collector-emitter breakdown voltage (V GE = 0) I C = 2 ma 600 V V GE = 15 V, I C = 5 A V CE(sat) Collector-emitter saturation voltage V GE = 15 V, I C = 5 A T J = 125 C V GE = 15 V, I C = 5 A T J = 175 C V GE(th) Gate threshold voltage V CE = V GE, I C = 250 µa V I CES Collector cut-off current (V GE = 0) V CE = 600 V 25 µa I GES Gate-emitter leakage current (V CE = 0) V GE = ± 20 V ±250 na V Table 5. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit C ies Input capacitance pf C oes Output capacitance V CE = 25 V, f = 1 MHz, pf C res V GE = 0 Reverse transfer capacitance pf Q g Total gate charge nc Q ge Gate-emitter charge V CC = 480 V, I C = 5 A, V GE = 15 V nc Q gc Gate-collector charge nc 4/30 DocID Rev 3

5 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Electrical characteristics Table 6. Switching characteristics (inductive load) Symbol Parameter Test conditions Min. Typ. Max. Unit t d(on) Turn-on delay time ns t r Current rise time V CE = 400 V, I C = 5 A, R G = 47 Ω, V GE = 15 V ns (di/dt)on Turn-on current slope A/µs t d(on) Turn-on delay time V CE = 400 V, I C = 5 A, ns t r Current rise time R G = 47 Ω, V GE = 15 V ns (di/dt)on Turn-on current slope T J = 175 C A/µs t r(voff) Off voltage rise time ns t d(off) Turn-off delay time V CE = 400 V, I C = 5 A, R G = 47 Ω, V GE = 15 V ns t f Current fall time ns t r(voff) Off voltage rise time V CE = 400 V, I C = 5 A, ns t d(off) Turn-off delay time R G = 47 Ω, V GE = 15 V ns t f Current fall time T J = 175 C ns t sc Short-circuit withstand time V CC 360 V, V GE = 15 V, R G = 47 Ω µs Table 7. Switching energy (inductive load) Symbol Parameter Test conditions Min. Typ. Max. Unit Eon (1) Turn-on switching losses µj (2) V CE = 400 V, I C = 5 A, E off Turn-off switching losses R G = 47 Ω, V GE = 15 V µj E ts Total switching losses µj Eon (1) Turn-on switching losses V CE = 400 V, I C = 5 A, µj (2) E off Turn-off switching losses R G = 47 Ω, V GE = 15 V µj E ts Total switching losses T J = 175 C µj 1. Energy losses include reverse recovery of the diode. 2. Turn-off losses include also the tail of the collector current. DocID Rev 3 5/30 30

6 Electrical characteristics STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Table 8. Collector-emitter diode Symbol Parameter Test conditions Min. Typ. Max. Unit V F Forward on-voltage I F = 5 A I F = 5 A, T J = 175 C V t rr Reverse recovery time ns Q rr Reverse recovery charge V CC = 400 V; I F = 5 A; di F /dt = 100 A / µs nc I rrm Reverse recovery current A t rr Reverse recovery time V CC = 400 V; I F = 5 A; ns Q rr Reverse recovery charge di F /dt = 100 A / µs nc I rrm Reverse recovery current T J = 175 C A 6/30 DocID Rev 3

7 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Electrical characteristics 2.1 Electrical characteristics (curves) Figure 2. Power dissipation vs. case temperature for D 2 PAK and TO-220 Figure 3. Collector current vs. case temperature for D 2 PAK and TO-220 Figure 4. Power dissipation vs. case temperature for DPAK Figure 5. Collector current vs. case temperature for DPAK DocID Rev 3 7/30 30

8 Electrical characteristics STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Figure 6. Power dissipation vs. case temperature for TO-220FP Figure 7. Collector current vs. case temperature for TO-220FP Figure 8. Output characteristics (T J = 25 C) Figure 9. Output characteristics (T J = 175 C) Figure 10. V CE(sat) vs. junction temperature Figure 11. V CE(sat) vs. collector current 8/30 DocID Rev 3

9 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Electrical characteristics Figure 12. Collector current vs. switching frequency for D 2 PAK, DPAK and TO-220 Figure 13. Collector current vs. switching frequency for TO-220FP Figure 14. Forward bias safe operating area for D 2 PAK, DPAK and TO-220 Figure 15. Forward bias safe operating area for TO-220FP Figure 16. Transfer characteristics Figure 17. Diode V F vs. forward current DocID Rev 3 9/30 30

10 Electrical characteristics STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Figure 18. Normalized V GE(th) vs junction temperature Figure 19. Normalized V (BR)CES vs. junction temperature Figure 20. Capacitance variation Figure 21. Gate charge vs. gate-emitter voltage Figure 22. Switching loss vs collector current Figure 23. Switching loss vs gate resistance 10/30 DocID Rev 3

11 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Electrical characteristics Figure 24. Switching loss vs temperature Figure 25. Switching loss vs collector-emitter voltage Figure 26. Short circuit time and current vs V GE Figure 27. Switching times vs. collector current Figure 28. Switching times vs. gate resistance Figure 29. Reverse recovery current vs. diode current slope DocID Rev 3 11/30 30

12 Electrical characteristics STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Figure 30. Reverse recovery time vs. diode current slope Figure 31. Reverse recovery charge vs. diode current slope Figure 32. Reverse recovery energy vs. diode current slope 12/30 DocID Rev 3

13 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Electrical characteristics Figure 33. Thermal impedance for D 2 PAK, DPAK and TO-220 IGBT Figure 34. Thermal impedance for D 2 PAK, DPAK and TO-220 diode DocID Rev 3 13/30 30

14 Electrical characteristics STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Figure 35. Thermal impedance for TO-220FP IGBT Figure 36. Thermal impedance for TO-220FP diode 14/30 DocID Rev 3

15 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Test circuits 3 Test circuits Figure 37. Test circuit for inductive load switching Figure 38. Gate charge test circuit Figure 39. Switching waveform Figure 40. Diode reverse recovery waveform DocID Rev 3 15/30 30

16 Package information STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. 4.1 D²PAK package information Figure 41. D²PAK (TO-263) package outline 16/30 DocID Rev 3

17 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Package information Table 9. D²PAK (TO-263) package mechanical data Dim. mm Min. Typ. Max. A A b b c c D D D E E E e 2.54 e H J L L L R 0.4 V2 0 8 DocID Rev 3 17/30 30

18 Package information STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Figure 42. D²PAK recommended footprint (a) a. All dimension are in millimeters 18/30 DocID Rev 3

19 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Package information 4.2 DPAK package information Figure 43. DPAK (TO-252) type A2 package outline DocID Rev 3 19/30 30

20 Package information STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Table 10. DPAK (TO-252) type A2 package mechanical data Dim. mm Min. Typ. Max. A A A b b c c D D E E e e H L L L L R 0.20 V /30 DocID Rev 3

21 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Package information Figure 44. DPAK (TO-252) recommended footprint (b) b. All dimensions are in millimeters DocID Rev 3 21/30 30

22 Package information STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF 4.3 D²PAK and DPAK packing information Figure 45. D²PAK and DPAK tape outline 10 pitches cumulative tolerance on tape +/- 0.2 mm T Top cover tape P0 D P2 E K0 B0 F W A0 P1 D1 User direction of feed R User direction of feed Bending radius AM08852v2 22/30 DocID Rev 3

23 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Package information REEL DIMENSIONS Figure 46. D²PAK and DPAK reel outline T 40 mm min. access hole at slot location B A D C N G measured at hub Full radius Tape slot in core for tape start 25 mm min. width AM08851v2 Table 11. D²PAK tape and reel mechanical data Tape Reel Dim. mm mm Dim. Min. Max. Min. Max. A A 330 B B 1.5 D C D D 20.2 E G F N 100 K T 30.4 P P Base qty 1000 P Bulk qty 1000 R 50 T W DocID Rev 3 23/30 30

24 Package information STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Table 12. DPAK (TO-252) tape and reel mechanical data Tape Reel Dim. mm mm Dim. Min. Max. Min. Max. A A 330 B B 1.5 B C D D 20.2 D1 1.5 G E N 50 F T 22.4 K P Base qty P Bulk qty P R 40 T W /30 DocID Rev 3

25 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Package information 4.4 TO-220FP package information Figure 47. TO-220FP package outline _Rev_K_B DocID Rev 3 25/30 30

26 Package information STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Table 13. TO-220FP package mechanical data Dim. mm Min. Typ. Max. A B D E F F F G G H L2 16 L L L L L Dia /30 DocID Rev 3

27 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Package information 4.5 TO-220 package information Figure 48. TO-220 type A package outline DocID Rev 3 27/30 30

28 Package information STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Table 14. TO-220 type A package mechanical data Dim. mm Min. Typ. Max. A b b c D D E e e F H J L L L L ØP Q /30 DocID Rev 3

29 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF Revision history 5 Revision history Table 15. Document revision history Date Revision Changes 28-Nov Initial release. 23-Feb May Updated Section 2: Electrical characteristics and Section 4: Package information. Minor text changes. Text and formatting changes throughout document In Section 1: Electrical ratings: - updated Table 2 and Table 3 In Section 2: Electrical characteristics: - updated Table 4, Table 5, Table 6, Table 7 and Table 8 Added Section 2.1: Electrical characteristics (curves) Updated Section 4.2: DPAK package information Document status promoted from preliminary data to production data DocID Rev 3 29/30 30

30 STGB5H60DF, STGD5H60DF, STGF5H60DF, STGP5H60DF IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document STMicroelectronics All rights reserved 30/30 DocID Rev 3

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