Dynamic Details Inc. Advanced PWB Substrates Enabling Technologies. Enabli ng Technol ogi es. Tom Buck. To m Buck

Transcription

1 Advanced PWB Substrates Enabling Technologies Enabli ng By Tom Buck T-Buck Dynamic Details Inc Dynamic Details Inc.

2 Advanced PWB Substrates Enabling Technologies Enabli ng By Tom Buck T-Buck Dynamic Details Inc Dynamic Details Inc.

3 Enabling PWB Process Technologies Overview Technology Drivers Advanced Materials Characterized FR-4 Driving Factors For Advanced PWB Technology Hybrid Constructions Laser Direct Imaging High Aspect Ratio Copper Plating Laser Drilling Planar Via Technologies T-Buck Dynamic Details Inc

5 Advanced Printed Circuit Technologies Enabli ng Chip scale packaging and ever increasing signal speeds are testing the limits of conventional PWB fabrication technologies. Bridging the gap to push forward will require an array of of enabling technologies! Enabling technologies for advanced PWB s Advanced low loss laminate systems Mixed dielectric structures Laser Direct Imaging (LDI) High aspect ratio Cu plating (Pulse Plating) Laser drilling Planar Cu filled Microvia s Stacked Microvia s Advanced PWB structures T-Buck Dynamic Details Inc

6 High Density Interconnect Markets 56% Cellular/Wireless 18% Telecom 10% Silicon Packaging 10% High End Computer 3% Industrial 2% Personal Computer 1% Medical T-Buck Dynamic Details Inc

7 Trends in electrical performance and density BGAPitch 0.4 mm 0.5 mm 0.8mm 1.0mm 0.5mm SMT 1.27mm BGA 100 I/O to 1000 I/O 100 I/O to 1500 I/O 100 I/O to 2500 I/O Increasing Density Portable products. Significant density increases due to miniatiurization. More pitch reduction than I/O increases. RF electrical requirements are slowly becoming more complex but still limited to small portion of PCB design. <100 MHz Digital Rf/wireless < 1 GHz Digital 2 to10 GHz Digital T-Buck Dynamic Details Inc Increasing electrical performance requirements.

8 BGA Pitch.5 mm.8mm Trends in electrical performance and density 100 I/O to 1000 I/O 100 I/O to 1500 I/O 100 I/O to 2500 I/O Network/Telecom/High-End Computing. Significant density increases with rapidly decreasing BGA pitch and increasing I/O driven by a rapid increase in digital speed and a constant multiplying of 2004 functionality. Density and speed requirements can be in conflict. 1.0mm.5mm SMT 1.27mm BGA Increasing Density 1998 <100 MHz Digital Rf/wireless < 1 GHz Digital 2 to10 GHz Digital T-Buck Dynamic Details Inc Increasing electrical performance requirements.

9 Electrical Considerations: High Density PWB s Enabli ng Performance Driven Board Design Controlled impedance required Differential signaling required Edge Coupled Lined Broad Side Coupled Solid AC Return Path Low Attenuation Low loss dielectric Mixed dielectrics Higher layer counts required Board thickness? High Density Connectors Controlled Impedance Differential Signaling Minimize Crosstalk High Signal to Ground Ratio 0.6 Gbit/s 1.2 Gbit/s 2.5 Gbit/s Gbit/s Design Challenge High Data Rates FR-4 Epoxy Glass Low Loss Epoxies T-Buck Dynamic Details Inc Gbit/s RF Materials/Mixed

10 Th e E l ectr ical P ath Is Now A 3 DProblem! High Speed Electrical Path L power Circuit Board Backplane Circuit Board L power A L pin L con L con L pin B L gnd C con C pin C con C pin L gnd Circuit Card A B Internal Planes T-Buck Dynamic Details Inc to Backplane

11 Impact Of Current Trends On PWB Technology Enabli ng Conflicting Design Requirements Increasing Signal Speeds & Frequency Increasing I/O Density & Reduced I/O Pitch Increased line width to reduce copper loss Minimum length routing Matched length routing Well characterized FR-4 and or low loss dielectrics materials Differential signaling between adjacent pins Via parameters must be characterized BGA escape driving up layer count Line widths driven down to 50 mm to 75 mm to allow escape Increasing layer counts driving up substrate thickness & Via length Smaller via diameters required for escape Dramatic increase in Cu plating aspect ratio Solder Mask registration becoming an issue with chip scale geometries T-Buck Dynamic Details Inc

12 Factors Driving Circuit Density & Cost Factors that will determine the break point between Conventional through hole and advanced structures: Large scale use of 1.0mm BGA packages Minimum component pitch (Chip scale < 0.8 mm) Localized density Single device with extremely high I/O (escape limited) Local use of Chip Scale components High density double sided designs Surface Power and ground Minimum drilled hole and line/space rules Electrical constraints Controlled length for timing Line width to minimize copper loss The bottom line; via density is driving layer count! T-Buck Dynamic Details Inc

13 MLB Layer Count vs Component Pin Density Start of Exponential layer growth Number of Layers Total Layers Signal Layers Pins Per Square Inch T-Buck Dynamic Details Inc

14 Multilayer Signal Routing Efficiency Enabli ng 1.0 mm BGA Signal Layer (42 x 42 array) 5 mil line and 5 mil space yields a channel density of 100 in./in.^2 outside the array Channel density within array 25 in.in.^2 Global X,Y routing efficiency greatly reduced by large arrays Solution: Minimize through holes T-Buck Dynamic Details Inc

15 Array Package Trends I/O s Up Pitch Down Solder Column 1.0 mm 130 I/O 0.5 mm BGA Approx. package size 7.5 mm x 7.5mm (0.3 x 0.3 ) 2577 I/O 1.0 mm Ceramic Column Grid Array (CCGA) Approx. package size 52mm x 52 mm (2.04 x 2.04 ) 0.5 mm Packaging Trends T-Buck Dynamic Details Inc

16 Increasing I/O Density Decreasing BGA Pitch Enabli ng 1.27 mm 1.27 mm BGA package Localized via density 62/cm 2 (400/in. 2 ) XeTel 6.45 x Increase in via density 0.50 mm 0.50 mm BGA package Localized via density 400/cm 2 (2580/in. 2 ) XeTel T-Buck Dynamic Details Inc

17 Circuit Density vs BGA Pitch (Mechanical Drill) Decreasing Channel Density Technology Shift Increasing $ 1.27 mm 1.0 mm 0.8 mm 0.5 mm Drill dia. Pad dia. Line width Space Hole density Channel 12 mils 25 mils 5 mils 5 mils 400/in. 40 in./in.^2 10 mils 20 mils 3.5 mils 625/in. 50 in./in.^2 8 mils 20 mils 3.5 mils 1008/in. 31 in./in.^2 6 mils 16 mils N/A 2580/in. Escape Only! T-Buck Dynamic Details Inc

18 PWB Technology Requirements Well characterized FR-4 materials Blind and Buried via s 125 mm or less What s Needed? Advanced low loss dielectric materials Copper Geometry 50 mm line & Space High aspect ratio copper plating 16:1 or higher T-Buck Dynamic Details Inc

20 Advanced Low Loss Dielectric Laminates Enabli ng Material Composition Tg Dielectric Constant Loss Tangent Generic FR-4 Laminates Families Tetafunctional (FR-4) Epoxy/Woven:E-glass 135 C 1 MHz 1 GHz 1 MHz 1 GHz Multifunctional (FR-4) Epoxy/Woven:E-glass 150 C High Grade Multifunctional Epoxy/Woven:E-glass 175 C Special Purpose FR-4 Laminates 1 MHz 2.5 GHz 1 MHz 2.5 GHz Low CTE FR-4 (N4000-7) Epoxy/Woven: E-Glass 155 C GHz 10 GHz 1 GHz 10 GHz CAF Resistant FR-4 (N ) (Lead Free Compatible) Epoxy/Woven: E-Glass 190 C Mhz 2 GHz 1 Mhz 2 GHz CAF Resistant FR-4 (IS410) (Lead Free Compatible) Epoxy/Woven: E-Glass 190 C T-Buck Dynamic Details Inc

21 Advanced Low Loss Dielectric Laminates Material Composition Tg Dielectric Constant Loss Tangent High Performance Laminates 1 MHz 1 GHz 1 MHz 10 GHz Nelco (N7000-1) Polyimide/Woven:E-glass 260 C Isola (P95) Polyimide/Woven:E-glass Arlon (85N) Polyimide/Woven:E-glass Nelco (N4500-6T) Epoxy/NonWoven:Aramid 180 C Nelco (N8000) Cyanate Ester/Woven:E-glass 240 C ISOLA (G200) BT/Woven:E-glass 185 C Nelco (N5000) BT/Woven:E-glass 185 C Nelco (N ) Black BT/Woven:E-glass 205 C MGC (832) Black BT/Woven:E-glass 205 C Mitsui Chemical (BN300) BT/Woven:E-glass 300 C T-Buck Dynamic Details Inc

22 Advanced Low Loss Dielectric Laminates Enabli ng Material Composition Tg Dielectric Constant Loss Tangent High Performance Epoxy 1 MHz 10 GHz 1 MHz 10 GHz GE GETEK Epoxy-PPO/Woven:E-glass 180 C Nelco N Epoxy/Woven:E-glass 200 C Nelco N SI Epoxy/Woven:Glass * 200 C Isola FR-408 Epoxy/Woven:E-glass 180 C Isola IS620 Epoxy/Woven E-Glass 210 C High Frequency Laminates 10 GHz 10 GHz Rogers 4003 Hydrocarbon/Ceramic/Woven:Glass 280 C Rogers 4350 Hydrocarbon/Ceramic/Woven:Glass 280 C Rogers 4403 (Prepreg) 4000 Series Resin/1080 style Glass 280 C Arlon 25N) Ceramic Filled PTFE/Woven:Glass Arlon 25FR Ceramic Filled PTFE/Woven:Glass T-Buck Dynamic Details Inc

23 Advanced Low Loss Dielectric Laminates Material Composition Tg Dielectric Constant Loss Tangent High Frequency Laminates 10 GHz 10 GHz Isola GIGAVER APPE/Woven Glass 210 C Taconics TLE-95 PTFE/Woven:Glass Taconics TLX PTFE/Woven:E-glass Taconics HT 1.5 Bonding Film W.L.Gore Speed Board N Expanded PTFE/Epoxy Resin W.L.Gore Speed Board C Expanded PTFE/Cyanate Ester T-Buck Dynamic Details Inc

24 Advanced Low Loss Dielectric Laminates Material Composition Dielectric Constant Loss Tangent Microwave Laminates 10 GHz 10 GHz Rogers RO3003 PTFE/Ceramic Rogers RO3006 PTFE/Ceramic Rogers RO3010 PTFE/Ceramic Rogers RT/duroid 5870 PTFE/Glass Microfiber Rogers RT/duroid 5880 PTFE/Glass Microfiber Rogers TMM 3 Hydrocarbon/Ceramic Rogers TMM 4 Hydrocarbon/Ceramic Rogers TMM 6 Hydrocarbon/Ceramic Rogers TMM 10 Hydrocarbon/Ceramic Rogers 3001 (Bonding Film) Thermoplastic T-Buck Dynamic Details Inc

25 Advanced Low Loss Dielectric Laminates Material Composition Tg Dielectric Constant Loss Tangent Special Purpose Micro-Via Dielectric Material 1 MHz 1 GHz 1 MHz 10 GHz Nelco T Epoxy/Resin Coated Foil 180 C Polyclad PCL-CF-400 Epoxy/Resin Coated Foil 165 C Thermont Random Aramid Fiber 180 C Nelco 1080 LD Prepreg Uniform Weave 1080 (N Resin) 175 C Nelco 106 LD Prepreg Uniform Weave 106 (N Resin) 175 C Gore Microlam 610 Expanded PTFE/ Resin 2.9 GHz 2.9 GHz Gore Microlam 630 Expanded PTFE/ Resin 10 GHz 10 GHz T-Buck Dynamic Details Inc

26 UK Directive Green Materials Definition of RoHS: The Restriction of Hazardous Substances in Electrical and Electronic Equipment (RoHS) Who does it affect? Manufacturers, sellers, distributors and recyclers of electrical and electronic equipment containing lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers. From 1 July 2006 new electrical and electronic equipment will not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers. T-Buck Dynamic Details Inc

27 Material Lead (Pb) Green Materials Definition of RoHS Compliance for Materials Cadmium (cd) Mercury (Hg) Hexavalent Chromium (Hex-Cr) Polybrominated Biphenyls (PBB fire retardant) Polybrominated Diphenyl Ethers (PBDE- fire retardant) Allowable Amount by weight 0.1% by weight <0.01% by weight 0.1% by weight <0.1% by weight 0.1% by weight 0.1% by weight T-Buck Dynamic Details Inc

28 Green Materials (DSC) (1 GHz) Material Resin System Tg εr Loss tan Nelco coming soon Halogen-Free Epoxy 180 C?? Isola DE 156 Duraver Halogen-Free Epoxy 160 C Polyclad HF-541 Halogen-Free Epoxy 145 C Polyclad HF-571 Halogen-Free Epoxy 165 C Hitachi MCL-BE-67G Halogen-Free FR4 200 C DMA Matsushita R-1566 Halogen-Free FR4 145 C *MGC CCL-EL-150 Halogen-Free FR4 155 C Arlon 65GT Epoxy/Thermount Rogers RO4003C Hydrocarbon/Ceramic >280 C *Mitsubishi Gas Chemical T-Buck Dynamic Details Inc

29 Lead Free Materials (DSC) (1 GHz) Material Resin System Tg Dk Df Isola IS 410 High Performance Epoxy 180 C Nelco N Multifunctional 175 C Hitachi MCL-BE-67G Halogen-Free FR4 200 C DMA Nelco N Enhanced Epoxy 190 C (10 GHz) UL V0 IPC 4101A/29 Lead-Free Assembly Passes 288 degrees C Robust Thermal Stability T-Buck Dynamic Details Inc

30 Lead Free Solder Profile Higher temperature & dwell time exceed current FR-4 process limits Materials with higher Tg, Low Z axis CTE and improved T-288 resistance will be required Solder Re-Flow Profile T-Buck Dynamic Details Inc

32 Di el ectr i c Prop erties of FR-4 Laminate Factors that influence dielectric constant and loss tangent: Signal frequency Temperature Moisture content Glass composition Ratio of epoxy resin to glass in the construction T-Buck Dynamic Details Inc

33 Dielectric Properties of FR-4 Laminate 5 Dielectric constant with respect to frequency Epoxy resin content 40% 50% Signal frequency in MHz T-Buck Dynamic Details Inc Source: D. Heywood, Controlled Impedance PCB s from FR4 Material, Isola Werke UK LTD report

34 Dielectric Properties of FR-4 Laminate 5 Dielectric Constant with respect 1 MHz % 50% % Epoxy resin content T-Buck Dynamic Details Inc Source: D. Heywood, Controlled Impedance PCB s from FR4 Material, Isola Werke UK LTD report

35 Di el ectr i c Prop erties of FR-4 Laminate Df Dissipation Factor with respect to 1.0 GHz FR-4 N C 40C 60C 80C Temperature T-Buck Dynamic Details Inc Data Source: Park-Nelco

36 Dielectric Properties of FR-4 Laminate Dielectric constant with respect to frequency & moisture content Dielectric Constant Frequency in GHz 0.05% MC 0.45% MC 0.75% MC T-Buck Dynamic Details Inc FR % epoxy resin Data Source: Isola

37 Dielectric Constant of FR-4 Laminate Considerations: Standard FR4 epoxy-glass laminates can maintain a dielectric constant tolerance of less than +/- 0.2 based on a specific laminate construction and resin content Standard tolerance on prepreg resin content is +/- 1.5% as supplied by vendors, +/- 1.0% can be attained for critical applications (special order) Resin content in prepreg varies for each style of prepreg Prepreg resin content is reduced in high pressure lamination do to flow in the melt phase T-Buck Dynamic Details Inc

38 Epoxy-Glass Laminate Construction Copper Foil Woven glass fabric High dielectric constant (e r ~ 6) Epoxy resin Low dielectric constant (e r ~ 3.5) PWB Cross-Section Dielectric constant of the composite laminate is a function of the resin/glass ratio T-Buck Dynamic Details Inc Composite laminates can have many different resin/glass constructions Photo Courtesy of Park Nelco

39 Epoxy-Glass Laminate Construction Standard glass fabrics used in the construction of Prepreg & Laminate Glass Count Warp Count Warp Yarn Yarn Fill Glass Thickness ECD-900 1/0 ECD-900 1/ ECD-450 1/0 ECD-450 1/ ECD-450 1/0 ECD-450 1/ ECE-225 1/0 ECD-450 1/ ECE-225 1/0 ECE-225 1/ ECDE-300 1/0 ECDE-300 1/ ECG-150 1/0 ECG-150 1/ ECG-75 1/0 ECG-75 1/ T-Buck Dynamic Details Inc

40 Epoxy-Glass Laminate Construction Glass Style: 106 Plain Weave Count: 56x56 (ends/in) Thickness: Glass Style: 1080 Plain Weave Count: 60x47 (ends/in) Thickness: T-Buck Dynamic Details Inc NOTE: The plain weave yarn consists of yarns interlaced in an alternating fashion one over and one under every yarn. Source: Isola

41 Epoxy-Glass Laminate Construction Enabli ng Glass Style: 2113 Plain Weave Count: 60x56 (ends/in) Thickness: Glass Style: 2116 Plain Weave Count: 60x58 (ends/in) Thickness: T-Buck Dynamic Details Inc Source: Isola

42 Epoxy-G lass L ami nate Construction Glass Style: 1652 Plain Weave Count: 52x52 (ends/in) Thickness: Glass Style: 7628 Plain Weave Count: 44x32 (ends/in) Thickness: (in) T-Buck Dynamic Details Inc Source: Isola

43 Epoxy Glass Laminate Properties N Dielectric properties based on construction & frequency (N4000-6) Dielectric Constant Thickness Tolerance Construction RC% 1MHz Tol. 1GHz Tol. 2.5 GHz Tol. 10 GHz Tol x x x x 106 1x x x 106 1x x x x x 106 1x x x x x x x x x x x x x x x x x x x x x x T-Buck Dynamic Details Inc Data Source: Park Nelco

44 Data Source: Park Nelco T-Buck Dynamic Details Inc Epoxy G l ass L ami nate Properties N Dielectric properties based on construction & frequency (N ) Dielectric Constant Thickness Tolerance Construction RC% 1MHz Tol. 1GHz Tol. 2.5 GHz Tol. 10 GHz Tol x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x 106 1x x x x x x x x x x x x x

45 Epoxy Glass Laminate Properties N SI Low loss epoxy resin system & low loss/dielectric constant SI glass Dielectric Constant Thickness Tolerance Construction RC% 1MHz Tol. 1GHz Tol. 2.5 GHz Tol. 10 GHz Tol x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x T-Buck Dynamic Details Inc Data Source: Park Nelco

46 Controlled Material Stack-up T-Buck Dynamic Details Inc

48 Advanced Low Loss Dielectric Laminates Relative Laminate Cost Per Square Foot vs Loss Tangent Based on Laminate T-Buck Dynamic Details Inc Source: R ogers

49 Mixed Dielectric Substrates Mixed dielectric constructions reduce cost by only using more expensive low loss materials where needed FR-4 Epoxy-Glass Sub-Cores provide structural support when using PTFE based laminates Layer 1 Layer 2 Low loss Dielectric (4350, 3003 ect.) FR-4 Prepreg Layer 3 Layer 4 Layer 5 Layer 6 FR-4 Substrate (4 Layer) T-Buck Dynamic Details Inc Typical mixed dielectric construction with low loss cap layer

50 Mixed Dielectric Circuit Constructions Enabli ng Mixed Dielectric: Rogers 4350/FR-4 Cross-Section Roger 4350 FR-4 T-Buck Dynamic Details Inc

51 Mixed Dielectric Circuit Constructions Cross-Section Mixed Dielectric: Rogers 4350/Rogers TMM 6 Roger Thick Rogers TMM Thick T-Buck Dynamic Details Inc

52 Conduction Cooled Circuit Constructions PWB Thermal Path Considerations: Conduction cooling allows heat to be removed through the PWB Conduction cooling with integral core constructions provide thermal paths in one or more of the following ways: Provide heat spreading through the core using the PWB as a radiating surface Using thermal via s a conducting path can be established from components to the core Heat can be conducted to the edge of the card and be removed by exposing the core and connecting to an external heat sink T-Buck Dynamic Details Inc Thermal vias can be used to establish a thermal connection from the core to surface edge rails and connect to an external heat sink

53 Signal via through Cu core Conduction Cooled Circuit Constructions Blind via Thermal via Drilled Through Hole Ceramic filled dielectric Copper Core Thermal path Copper core constructions: Copper conductivity 385 W/m*K Copper core CTE 17 ppm/c Epoxy laminate conductivity 0.3 W/m*K Surface edge rails T-Buck Dynamic Details Inc

54 Signal via through Cu core Conduction Cooled Circuit Constructions Blind via Thermal via Component Cavity Drilled Through Hole Copper Core Thermal path Ceramic filled dielectric Copper core constructions: Copper conductivity 385 W/m*K Copper core CTE 17 ppm/c Epoxy laminate conductivity 0.3 W/m*K Surface edge rails T-Buck Dynamic Details Inc

55 Signal via through Cu core Conduction Cooled Circuit Constructions Blind via Drilled Through Hole Ceramic filled dielectric Copper Core Thermal path Copper core constructions: Copper conductivity 385 W/m*K Copper core CTE 17 ppm/c Epoxy laminate conductivity 0.3 W/m*K Exposed core Edge rails T-Buck Dynamic Details Inc

56 T-Buck Dynamic Details Inc ½ oz Signal Plane ½ oz Signal ½ oz Plane Plane Signal ½ oz Plane Signal ½ oz Plane ½ oz Signal ½ oz Signal Plane ½ oz Signal ½ oz Plane Plane Signal ½ oz Plane Signal ½ oz Plane ½ oz Signal Conduction Cooled Circuit Constructions Material N Thermal Via.004 Ref..005 Ref..005 Ref..005 Ref..005 Ref..005 Ref..005 Ref..005 Ref..004 Ref..005 Ref. Copper Core Ref..004 Ref..005 Ref..005 Ref..005 Ref..005 Ref..005 Ref..005 Ref..005 Ref..004 Ref. Solder mask Layer 1 50 ohms Layer 2 Layer 3 50 ohms Layer 4 Layer 5 Layer 6 50 ohms Layer 7 Layer 8 50 ohms Layer 9 Layer 10 Layer 11 Layer 12 Layer ohms Layer 14 Layer 15 Layer ohms Layer 17 Layer ohms Layer 19 Layer ohms Solder mask Isolated signal via Upper sub Core clearance drill Dielectric filler Lower sub

57 Conduction Cooled Circuit Constructions Thermal Mechanical Properties of Core Materials Raw Material Thermal Conductivity (W/m*K) CTE (ppm/c) Density (g/cm3) Tensile Modulus (msi) Dielectric Constant (er) ST ST ST ST ST In Development FR Polyimide Copper N/A Aluminum N/A CIC N/A Stabl cor values represents data of raw fibers T-Buck Dynamic Details Inc Data Source: Thermal Works

58 Low CTE High Conductivity StablCor TM Laminate Standard weave pitch based carbon fiber fabric High thermal conductivity Negative coefficient of thermal expansion Extremely high modulus of elasticity to Copper foil Copper foil CTE 1.15 Design Considerations: Carbon fiber fabric is electrically conductive Both copper planes must be treated as the same potential Split planes are made by mechanically routing resulting in loss of thermal path Laminate must be pre-drilled to provide electrical clearance Optimum designs, dielectric thickness should not exceed from the top of core CTE will be based on volume metric ratio of StableCor and Copper/Dielectric materials T-Buck Dynamic Details Inc

59 Signal via through Cu core Low CTE Conduction Cooled Circuit Constructions Blind via Thermal via StablCor Constructions: StablCor conductivity W/m*K StablCor CTE 1.15 ppm/c Epoxy laminate conductivity 0.3 W/m*K Surface edge rails T-Buck Dynamic Details Inc

60 Low CTE Conduction Cooled Circuit Constructions Flip Chip applications Solder ball Die CTE 2.5 ppm/c PTH StablCor Substrate CTE 2 to 8 ppm/c T-Buck Dynamic Details Inc StablCor Constructions: StablCor conductivity W/m*K StablCor CTE 1.15 ppm/c Epoxy laminate conductivity 0.3 W/m*K

61 *>124.9 F Low CTE Conduction Cooled Circuit Constructions Standard FR Gbit memory StablCor 1 Gbit memory *<68.0 F T-Buck Dynamic Details Inc Graphic Source: Thermal Works

62 Signal via through Cu core Low CTE Conduction Cooled Circuit Constructions Solder joint Cera mi c package CTE 6.3 ppm/c Thermal via StablCor Constructions: StablCor conductivity W/m*K StablCor CTE 1.15 ppm/c Epoxy laminate conductivity 0.3 W/m*K Surface edge rails T-Buck Dynamic Details Inc

64 Conventional Photo Printing Process Laser plot Mylar photo tools T-Buck Dynamic Details Inc Expose circuit image using Mylar photo tools

65 Conventional Photo Printing Process Enabli ng Mylar Resist Copper C-Stage Photo Tool Exposed resist UV light source UV light source Unexposed resist Engineering Considerations Alignment of upper and lower tools Alignment of tools to substrate Scaling of photo tools Geometric compensation Temperature stability of tools while photo printing T-Buck Dynamic Details Inc

66 Conventional Photo Printing Process Minimum photo tool (minimum space) Resist Top width Base Width Etch Back T-Buck Dynamic Details Inc The minimum photo tool opening is limited by the ability to fully remove un-exposed resist in the narrow gap between traces

67 Laser Direct Imaging (LDI) Enabli ng Elimination of Photo Tools No Film/Artwork Movement Quick Turn Made Easy Run product as soon as Engineering releases data to the floor Reduction in Defect Count. Direct Write = No Film related defects No issues related to loss of vacuum Orbotech DP-100 T-Buck Dynamic Details Inc Scanning Optics

68 Laser Direct Imaging (LDI) Improved Resolution System Resolution 4000 dpi System Capability: 50µm/50µm (.002 /.002 ) Line & Space Improved Registration CCD Camera System & Target Fiducials Through Holes Drilled 24 Hole Pattern of Laser Drilled Microvia System capability Positional Accuracy +/-25µm LDI Solder Mask Beta testing is in progress on Taiyo LDI SM T-Buck Dynamic Details Inc

69 Dynami c Det ail s, Inc. Laser Direct Imaging (LDI) Enabli ng Using CCD Cameras and Mechanical or Laser Drilled Fiducials it is possible to get perfect registration every time. T-Buck Dynamic Details Inc

70 Laser Direct Imaging (LDI) Using Laser Imaging it is possible to achieve finer resolution without the impact to yield that is experienced in contact printing using Photo Tools. Printing Defects Using a Photo Tool Improved Image Quality with LDI T-Buck Dynamic Details Inc mil Track and Gap in Manufacture

71 Laser Direct Imaging (LDI) Vertical Horizontal 50µm/50µm (.002 /.002 ) T-Buck Dynamic Details Inc Shipley LD 730 Photo Resist

72 Laser Direct Imaging (LDI) Better Registration by Automation Using the DP-100 Registration Features and Data Scaling Option it is possible to register a 4 mil pad to a 2 mil via without Break Out in production using a 20 x 16 manufacturing panel T-Buck Dynamic Details Inc

73 Laser Direct Imaging (LDI) Precise Inner Layer Registration 24 Layer PCB Cross-Section T-Buck Dynamic Details Inc

74 Laser Direct Imaging (LDI) Solder Mask Enabli ng Laser Direct Imaged Solder Mask Adaptively tooled Improved Registration +/ vs +/ Standard LPI Solder Mask +/ Laser Defined Solder Mask +/ T-Buck Dynamic Details Inc

76 High Aspect Ratio Pulse Plating High Aspect Ratio Copper Plating Equipment Complex Waveform (WST) Pulse Process Mixed Frequency WST - Max effect on mixed feature on boards - Wide operating window Chemistry MACuSPEC from MacDermid T-Buck Dynamic Details Inc

77 Enabli ng Co nventional Copper Electroplating Typical Plating Capabilities Description Aspect ratio Via/Hole Diameter Dielectric/ Board Thickness Microvia 0.5:1 100 µm (.004 ) 50 µm (.002 ) PTH 8:1 200 µm (.008 ) 1.75 mm (.062 ) PTH 10: µm (.0135 ) 3.4 mm (.135 ) T-Buck Dynamic Details Inc

78 High Aspect Ratio Pulse Plating Pulse Plating Capabilities Description Aspect ratio Advanced Emerging 1 Via/Hole Diameter Dielectric/ Board Thickness Microvia 0.6:1 1: µm (.004 ) 100 µm (.004 ) PTH 11:1 14:1 200 µm (.008 ) 2.8 mm (.112 ) PTH 14:1 16: µm (.0135 ) 5.4 mm (.216 ) Notes: T-Buck Dynamic Details Inc Capabilities have been pr oven! C ons ult DDI engineering 2- R eq uires spe cial ele ctr oless pr ocess and may n ot work on all applicati ons

79 High Aspect Ratio Pulse Plating Aspect Ratio = 14:1 Thickness 2.8mm (.112 ) Drill dia. 200 µm (.008 ) Controlled depth mechanical drilling T-Buck Dynamic Details Inc

80 High Aspect Ratio Pulse Plating Aspect Ratio = 16:1 Thickness = 5.4mm (.216 ) Drill dia. = µm (.0135 ) 36 Layer MLB T-Buck Dynamic Details Inc

81 High Aspect Ratio Pulse Plating Laser drilled microvia s Aspect Ratio 0.5:1 T-Buck Dynamic Details Inc

83 Laser Drilling Technology & Microvias Enabli ng What is considered a Microvia? Generally microvia s are considered to be blind holes that terminate to a lower layer without the need to generate a sublamination Hole diameters range from 3 to 8 mils and are typically in the 4 to 6 mil range Hole depth is limited by copper plating aspect ratio, typically 0.5: to 0.6:1 however higher aspect ratios have been achieved Most common method for hole formation is laser drilling with YAG lasers Microvia s terminate to the underlying pad without penetrating the copper T-Buck Dynamic Details Inc

84 Laser Drilling Technology Common High Density Via Structures Through hole 1:3 µvia 1:2 µvia 1:3 Stacked plate fill µvia 2 Layer HDI buildup HDI Dielectric 4 Layer MLB core T-Buck Dynamic Details Inc :2 2:3 Staircase µvia Buried via HDI Substrate 1:2 Plate fill µvia

85 0.8 mm µ BGA Laser Drilling Technology Conventional MLB vs HDI Conventional MLB Substrate 0.8 mm HDI Substrate Mechanical drilled via s offset from attachment pad Laser drilled via in pad (Solder mask defined attachment pad layer # 1) Solder mask defined pad Signal routing on layer # 2 T-Buck Dynamic Details Inc

86 Laser Drilling Technology 0.5 mm Microvias in SMT Pads Laser Drilled Microvias Via location does not impact assembly due to it s extremely small volume T-Buck Dynamic Details Inc

87 Laser Drilling Technology Common Laser Drilling Techniques ND:YAG (Ultra-Violet) Capable of drilling copper, all re-enforcing materials and all laminate resin systems. 25 to 50 micron beam forms holes by spiraling of trepaning the beam C0 2 (Infrared) Capable of drilling most re-enforcing materials and laminate resin systems. Not effective for drilling copper (copper is reflective in the infrared spectrum) Forms holes by pulsing a larger high energy beam ESI ND:YAG Drilling System Combination ND:YAG CO 2 forms holes by removing copper with the ND:YAG laser and the dielectric and re-enforcing material with the CO 2 laser T-Buck Dynamic Details Inc

88 Laser Drilling Technology Typical laser drilled Microvia geometry Termination or Capture Pad Laser drilled Microvia Layer 1 to Laser drilled Microvia Layer 1 to T-Buck Dynamic Details Inc Note: Typical aspect ratio on laser drilled holes is 0.5:1 to 0.7:1 max

89 Laser Drilling Technology Enabli ng Factors Impacting Laser Drilling Time & Cost Copper foil thickness Dielectric thickness Hole diameter Dielectric composition Non-reinforced resin (RCC) Non-woven reinforcement (Thermont ) Woven (106, 1080 glass) System Optimization = increases velocity and power T-Buck Dynamic Details Inc

90 Laser Drilling Technology Typical ND:YAG Laser Drilling Speeds Cu Thick. Via Dia. Drilling Speed Holes/sec. 9 µm 100 µm µm 150 µm µm 200 µm T-Buck Dynamic Details Inc Epoxy/glass prepreg Epoxy Resin Coated Copper (50 µm) Random Aramid fiber (50 µm Thermont ) Laser drillable prepreg (1080 LD Prepreg)

91 Routing Channel Density vs. Via Structure Standard through hole technology: Channel density limited by via density, geometry and pitch Blind & Buried via s: Channel density enhanced Still geometry limited Limited Z axis connectivity Once you leave through hole designs the goal is to find the via combination that maximizes routing channel density at the lowest cost Microvias: Channel density enhanced through smaller geometry Limited Z axis connectivity SMV: Channel density enhanced through smaller geometry Unlimited Z axis connectivity T-Buck Dynamic Details Inc

92 Routing Channel Density vs. Via Structure Mechanically Drilled Blind Prepreg Drilled Through Hole Core Prepreg Sub Lam. Prepreg Bon d layer between upper and lower s ub Prepreg Core Sub Lam. Prepreg T-Buck Dynamic Details Inc Increased channel density on lower sub lamination Standard PTH geometry apply, reduced aspect ratio on sub drill Anti-pad diameter must account for tolerance buildup in multiple laminating cycles

93 Routing Channel Density vs. Via Structure Enabli ng Core Mechanically Drilled Blind Sub Prepreg Bond layer Drilled Through Hole Prepreg Core Mechanically Drilled Buried Vias Sub Lam. Prepreg Prepreg Bond layer Core Mechanically Drilled Blind Sub Increased channel density on sub lamination Standard PTH geometry apply, reduced aspect ratio on sub drill Anti-pad diameter must account for tolerance buildup in multiple laminating cycles T-Buck Dynamic Details Inc No Z axis connectivity between adjacent sub-laminations

94 Routing Channel Density vs. Via Structure Laser drilled via Mechanical drilled hole Prepreg Core Prepreg Core Prepreg Core Prepreg Increased channel density on layer 1 and 2 from reduced geometry Increased channel density on layers n-1 to n resulting from a blind hole Standard PTH geometry apply to mechanical drilled holes Dielectric thickness layer 1:2 limited by plating aspect ratio (0.5:1 to 0.6:1) T-Buck Dynamic Details Inc

95 3 Track routing layer 2 Microvia Through Hole Combo 1.0 mm Ball pad 12 mil capture pad 2 Track routing layer 1 Laser drilled hole High density Routing layer 30 mil anti-pad 2 Track routing Between PTH pads Plated through hole 10 mil drill, 20 mil pad T-Buck Dynamic Details Inc

96 Microvia: 0.8 mm BGA Signal Routing Microvia in pad used to enhance escape on high density BGA s Prepreg Core Prepreg Core Prepreg Core Prepreg HDI Structure 0.8 mm BGA T-Buck Dynamic Details Inc

97 Ball pad Microvia Through Hole Combo 0.8 mm Two track routing Layer mm 10 mil drill 20 mil pad 1 mm pitch High density Routing layer One track routing Layer 1 3 mil max. No limit! T-Buck Dynamic Details Inc

98 Laser Drilling Technology 1.0 mm BGA Microvia in pad Two track signal routing on surface Interstitial Microvia T-Buck Dynamic Details Inc Thermount Dielectric

99 Laser Drilling Technology Enabli ng 39 x mm BGA 1.0 mm Layer 1 Signal Routing T-Buck Dynamic Details Inc

100 µvia & Buried & PTH 1.0 mm Pitch (Full Offset) Ball pad Laser drilled hole Buried via (2:N-1) PTH 10 mil drill 20 mil pad 30 mil anti-pad 12 mil capture pad 3 mil Max No limit! T-Buck Dynamic Details Inc

101 µvia & Buried & PTH Via s 1.0 mm (Min Offset) Ball pad Laser drilled hole Buried via (2:N-1) One track Route Between Capture pad and buried via 12 mil capture pad 30 mil anti-pad PTH 10 mil drill, 20 mil pad T-Buck Dynamic Details Inc

102 Laser Drilling Technology 0.8 mm BGA Via in pad Offset via Interstitial Microvias Layer 1 to 2 T-Buck Dynamic Details Inc

103 Microvia Through Hole & Buried Combo 0.8 mm Buried via 8 mil drill 18 mil pad 0.8 mm 10 mil drill 20 mil pad 1 mm pitch Ball pad One track between PTH s One track routing Layer 2 on 45 degree 3 mil max. No limit! T-Buck Dynamic Details Inc

104 Microvia Applications For Power and Ground Ground Via RF Ground Plane Analog & RF Side Digital Side Microvia Ground Connections T-Buck Dynamic Details Inc

105 Microvia Through Hole & Buried Combo 0.8 mm Buried via 8 mil drill 18 mil pad 0.8 mm Plane Connection 10 mil drill 20 mil pad 1 mm pitch Ball pad No Via One track between PTH s One track routing 3 mil max. No limit! T-Buck Dynamic Details Inc

106 Microvia Stair Case & Buried Combo 0.8 mm Buried via 10 mil drill 20 mil pad 0.8 mm Ball pad 10 mil drill 20 mil pad 1 mm pitch One track between PTH s One track routing Between Stair Case 3 mil max. 3 mil max. T-Buck Dynamic Details Inc

107 Microvia Stair Case & Buried Combo 0.8 mm Buried via 10 mil drill 20 mil pad 0.8 mm Plane Connection 10 mil drill 20 mil pad 1 mm pitch Plane Layer two One track between PTH s Stair-Case Connection through a plane layer 3 mil max. 3 mil max. T-Buck Dynamic Details Inc

108 Laser Drilling Technology Enabli ng Laser drilled via s Mechanically drilled via 0.8 mm BGA 0.8 mm BGA T-Buck Dynamic Details Inc Tin/Lead Surface Finish

109 Using Microvia s For Power & Ground Enabli ng Signal Via Power Via Layer 1& 8 Ground Flood Internal escape pad within power layer 1.0 mm BGA Copper Ground Flood under LPI Solder mask T-Buck Dynamic Details Inc

110 Microvia Geometry (Surface Power And Ground) Signal Pad Ground Pad Power Pad Layer 1 Layer 2 Microvia layer 1: Side View T-Buck Dynamic Details Inc

111 Using Microvia s For Power & Ground Layer 1: Ground Layer 2: Power g s s g s p s p Layer 3: Signal Layer 4: Ground Thr ough h oles eli minated by Mi cr ovia P&G conne cti ons Antipads f or b uried P TH Signal conne cti ons T-Buck Dynamic Details Inc

112 Increased Density: Microvia s Replace PTH P&G 5 channels at 5/5 line/space or 6 channels at 4/4.5 lines/space Microvia s used on External power and ground layers eliminate through holes and double the effective pitch mils 12 mils 24 mils T-Buck Dynamic Details Inc

114 Laser Drilling Technology Via In Pad Enabli ng Potential Assembly Issues With Via In Pad: Microvias vias in pad from layer 1 to 2 must have minimum volume after plating to prevent and or minimize solder voiding due to trapped volatiles Even with minimum microvia volume an optimized solder profile is often necessary Microvia diameters for connecting layer 1 to 3 or greater are in all cased too large for via in pad Potential joint reliability issue with large ceramic devices with via in pad when no escape pattern is used Dog Bone due to large CTE mismatch to the organic substrate T-Buck Dynamic Details Inc

115 Enabli ng Laser Drilling Technology Via In Pad Ideal Solder Joint BGA Pad Solder Ball PWB Land Pad Microvia Capture pad T-Buck Dynamic Details Inc Chip Scale BGA Package with Microvia in Pad

116 Laser Drilling Technology Via In Pad IC Package X-Ray of BGA site Solder ball PCB Substrate Solder void within a solder ball at via in pad location T-Buck Dynamic Details Inc

117 Laser Drilling Technology Via In Pad Unacceptable Via In Pad Solder Joints BG A Pa ckage Pad PW BS ubstrate T-Buck Dynamic Details Inc

118 Enabli ng DDI Planar Via Technologies Technology Drivers For Planar Via-In-Pad: Eliminate potential solder voiding in Via-In-Pad applications Address Via-In-Pad applications for multilayer HDI structures (i.e. 1:3, 1:4? connections) while maintaining low aspect ratio plating High capacitance low inductance HDI power structures Via-In-Pad capability with RF laminates greater than thick Effective use of embedded resistors on HDI layers Process Technologies PTH Conductive fill and Cu plate PTH Non-Conductive fill and plate Planar Cu fill microvia Planar Cu fill Stacked MicroVia SMV T-Buck Dynamic Details Inc

119 VIA Fill For Plated Through Holes Via Filling Process Mechanical Drilling Copper Plating Screen via fill Planarize Dupont CB100 Conductive via fill (sliver filler) Taiyo TR7901 Conductive via fill (silver filler) Methode 1210 Conductive via fill (silver filler) Secondary Copper Plate T-Buck Dynamic Details Inc

120 Conductive Via Fill For PTH Small v oiding typ. Surface copper foil Cond uctive Via fill Copper plated hole barrel Conductive Via fill Cross-section with conductive via fill (Taiyo TR7901 Silver filled) Surface view (X,Y) after via filling and before Cu plating T-Buck Dynamic Details Inc

121 Conductive Via Fill For PTH Cross-Section Electroplated surface View of surface Component land pad CB-100 Conductive via fill T-Buck Dynamic Details Inc

122 DDI Stacked Microvia s SMV Stacked Microvia s Attributes: Provides a solid copper fill eliminating potential solder voiding Improved assembly for Chip Scale components Improves routing density for Fine Pitch BGAs (0.65 mm & 0.5 mm) Allows routing out on multiple layers with Pad diameters Maximize copper on plane layers Lower inductance when compared to staircase and offset via s T-Buck Dynamic Details Inc

123 Laser Drilled Via s: Plated Cu Fill Enabli ng Laser drilled via s with Cu plate fill Surface pad Copper Fill Layer 2 capture pad laser drilled via with Cu plate fill diameter surface pad T-Buck Dynamic Details Inc

124 Laser Drilled Via s: Plated Cu Fill Enabli ng BGA Land pads with planar copper surface & Immersion Nickel Gold Planar Surface for 0.8 mm BGA T-Buck Dynamic Details Inc

125 Applications For Planar Cu filled Via s : 0.4 mm Flip C hip Application Microvia Technology with Planar Cu Fill.002 trace & space Laser Direct Image (LDI).004 Laser drill Plate Fill 0.5:1 aspect ratio L1 =.008 Pad L2 & 5 =.010 Pad Solder mask ¼ oz ¼ oz 1 oz 1 oz ¼ oz ¼ oz Signal Signal Pwr Gnd Signal Signal.002 Ref. FR4.006 Ref. FR Ref. FR Ref. FR Ref. FR4 Layer 1 Layer 2 Layer 3 Layer 4 Layer 5 Layer pad.008 drill Solder mask T-Buck Dynamic Details Inc Finish Thickness =.036 +/-.003 Material N Tg 210 C Solder mask clearance for Flip Chip Area.001/side Utilize Laser Direct Image (LDI) Solder mask

126 0.5mm SMV Geometry (Offset Buried Via) 1:2 Microvia Full offset Dog Bone Layer 1 Layer 2 Layer 3 Layer 4 1:3 SMV Connecting layer 1 to the Dog Bone on layer 3 and mechanically drilled hole to layer 4 Stripline layer 10 mil Hole T-Buck Dynamic Details Inc Side View

127 Applications For Planar Cu filled Via s Enabli ng 1-8-1: Offset laser drilled via over conductive filled buried via s.001 Soldermask ½ oz ½ oz ½ oz ½ oz ½ oz ½ oz ½ oz ½ oz ½ oz ½ oz Signal Gnd Signal Signal Gnd Pwr Signal Gnd Signal Gnd.003 Ref. Thermount.006 Ref. N Ref. N Ref. N Ref. N Ref. N Ref. N Ref. N Ref. Thermount Layer 1 Layer 2 Layer 3 Layer 4 Layer 5 Layer 6 Layer 7 Layer 8 Layer 9 Layer Soldermask Layer 2-9 = Buried Vias pad & drill Conductive Via Fill Layer 1-2 & 9 10 Microvias L1 & 10 = pad laser drill Layer 1-10 through Vias pad &.010 drill T-Buck Dynamic Details Inc Layer 1 & 2-9 & 10 3/8 oz copper if trace and space <0.004

128 SMV Geometry (Minimum Offset) Enabli ng 0.5mm Anti-Pad BGA Land Pad Layer 1 Layer 2 Layer 3 Layer 4 4 mil SMV, 10 mil pad 10 mil hole 20 mil pad 1.0mm T-Buck Dynamic Details Inc