The Alphabet soup of IPC Specifications. 340 Raleigh Street Holly Springs, NC 27540

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1 The Alphabet soup of IPC Specifications 340 Raleigh Street Holly Springs, NC (919)

2 About the IPC IPC-the electronics industry standard Founded in 1957 as the Institute of Printed Circuits Lobbying, research, standards developement Relevant/current training for electronics companies that make them more competitive in the global market Portable certification that is a marketable skill for the individual Replacing most military spec s

3 The first IPC meeting-1957

4 PCB Assembly Specifications: IPC-7711/7721B IPC-A- 610E IPC/WHMA-A-620B IPC-J-STD-001E IPC-A-600H All are available in a CIS and a CIT level All differentiate class 1, 2, 3 and Space

5 IPC 7711/7721 Rework and Repair of PCB s Operator course modularized Lead Free Criteria included 90% hands-on component removal, replacement and laminate repair

6 7711/7721 Modules 1-Common procedures 2-Wire splicing 3-TH rework 4-SMT chip and MELF soldering & removal 5-SOT & SOIC soldering & removal 6-PLCC & QFP soldering & removal (0.020 ) 7-PCB repair (TH & SMT surface) 8-Conformal coat repair 9-PCB repair(internal)

7 Procedures of IPC-7711B Removal Procedure 3.3.1, Chip Component Removal - Bifurcated Tip Procedure 3.3.2, Chip Component Removal - Tweezer Method 3.3.3, Chip Component Removal - Procedure Hot Air Method

8 3.3.1 Chip Component Removal Bifurcated Tip Figure 1: Apply Flux Figure 2: Tin Tips Figure 3: Position Tip Figure 4: Melt All Joints Figure 5: Lift Component

9 EQUIPMENT REQUIRED Soldering system Chip removal tip Soldering handpiece OPTIONAL EQUIPMENT Tweezers Controllable preheater MATERIALS Flux-cored solder Flux Cleaner Product Class: R,F,W,C Skill Level: Intermediate Level of Conformance: High

10 Product Class: R,F,W,C Skill Level: Intermediate Level of Conformance: High PROCEDURE 1. Remove conformal coating (if any) and clean work area of any contamination, oxides or residues. 2. Install the chip removal tip into the soldering handpiece. 3. Start with tip temperature of approximately 315 C and change as necessary. 4. Apply flux to all lead/land areas. (See Figure 1.) 5. Remove old solder from tip and thermal shock with a damp sponge. 6. Apply solder to inside of tip forming a crown. (See Figure 2.) 7. Lower tip over component until tip contacts solder joints. (See Figure 3.) 8. Confirm solder melt and lift component from PWB. (See Figures 4 & 5.) (Surface tension of the tip should lift the component from the board. If this does not occur, use of tweezers to lift the component is optional.)

11 Product Class: R,F,W,C Skill Level: Intermediate Level of Conformance: High Procedure Continued: NOTE: Chip components may have adhesive between the body and the board. If adhesive is used, it may be necessary to slightly turn the component to allow the component to be removed from the board. This must only be accomplished after complete solder melt to prevent damage. 9. Release component from tip by wiping on a heat resistant surface. 10. Re-tin tip with solder. 11. Prepare lands for component replacement.

12 SMT drag solder video

13

14 IPC 610 Workmanship standards and inspection criterion Accept / Reject criteria for all 3 classes No hands-on, all soft skills Operator (CIS) modularized Includes lead free criteria

15 610 Modules 1-Common procedures 2-Documents and handling 3-Hardware installation 4-Soldering 5-Terminal connections 6-PTH 7-SMT 8-Component damage and PCB assemblies 9-Solderless wire wrap

16 CHIP COMPONENTS END JOINT WIDTH Note Pass for 1&2owest side of the solder fillet. Note Pass for 3side of the solder fillet. 50% Figure 75%50% Figure 8-19 Acceptable Acceptable - Class 1, 2 Class , IPC, Bannockburn, IL All rights reserved. For use only in IPC Training Programs leading to Official IPC Certification

17 CHIP COMPONENTS END JOINT WIDTH Figure , IPC, Bannockburn, IL All rights reserved. For use only in IPC Training Programs leading to Official IPC Certification

18 CHIP COMPONENTS SIDE JOINT LENGTH Note 3. Wetting is evident. Figure 8-23 Target Class 1, 2, , IPC, Bannockburn, IL All rights reserved. For use only in IPC Training Programs leading to Official IPC Certification

19 CHIP COMPONENTS MINIMUM FILLET HEIGHT Note 3. Wetting is evident. Note 6. Designs with via in pad may preclude meeting these criteria. Solder acceptance criteria should be defined between the user and the manufacturer. Figure 8-26 Acceptable Class 1, 2, , IPC, Bannockburn, IL All rights reserved. For use only in IPC Training Programs leading to Official IPC Certification

20 12.3 High Voltage - Insulation Figure Figure Defect Class 1, 2, 3 Acceptable Class 1, 2, 3

21 High Voltage Terminals Wires/Leads Figure 12-4 Defect Class 1, 2, 3 Sharp edges. Incomplete coverage, icicles

22 Review Questions 1. A high voltage terminal with no evidence of sharp edges, solder points, icicles, inclusions or wire strands is, A. Target Class 1,2,3 B. Acceptable Class 1,Process Indicator 2, 3 C. Defect Class 1,2,3 D. Process Indicator Class 1, Defect Class 2, 3 A, Page 12-2, Clause

23 IPC/WHMA-A-620A Requirements and Acceptance for Cable and Wire Harness Assemblies

24 620 Modules 1-Policies and procedures 2-Crimp terminations 3-Soldered terminations 4-Connectorization 5-Splices 6-Marking & labeling 7-Coaxial and twinaxial cable assemblies 8-Solderless wire wrap

25 8.2.1 Crimped Splices - Barrel (Please use poll to answer) Target - Class 1,2,3 Wire insulation is flush against end of barrel splice (A). Bare wire ends are flush with barrel splice, bellmouth is evident (B). Crimp is centered and properly formed to retain wires (C). Barrel splice is not cracked.

26 8.2.1 Crimped Splices - Barrel Acceptable - Class 1,2,3 Wire insulation gap is within two wire diameters (A). Bare wire end is less than flush, but is visible and included in crimp indentation (B). Crimp slightly offset but properly formed, bellmouth is evident (C). Barrel splice is not cracked. Does not violate minimum electrical clearance.

27 IPC J-STD-001 Process Control-Materials, Methods and Verification Criteria 80% book 20% hands-on Soldering thru hole, SMT, terminals and wires-very general CIS Modularized Refers to J

28 J-Standard supporting Documents 002-Solderability requirements-terminals 003-Solderability requirements-pcb s 004-Requirements for soldering flux 005-Requirements for solder paste 006-Requirements for solder alloys 020-MSD classifications

29 J Standard Modules 1-Common procedures 2-Wires and terminals 3-PTH 4-SMT 5-Inspection 6-Space addendum

30 Table 7-7 Flat, Ribbon, L, and Gull Wing Leads Feature Maximum Side Overhang Dim. Class 1 Class 2 Class 3 A 50% (W) or 0.5 mm [0.02 in], whichever is less; Note 1 25% (W) or 0.5 mm [0.02 in], whichever is less; Note 1 Note 1. Does not violate minimum electrical clearance. Figure 7-7

31 Table 7-7 Flat, Ribbon, L, and Gull Wing Leads Feature Minimum End Joint Width Dim. Class 1 Class 2 Class 3 C 50%(W) 75%(W) Figure 7-7

32 Gull Wing Installation Figure 1: Position Component Figure 2: Tack Lead Figure 3: Flux Leads Figure 4: Fill Tip Figure 5: Solder Component M5-18

33

34 IPC-600 Acceptability of printed boards

35 600 modules 1-Policies and procedures 2-Externally observable characteristics 3-Internally observable characteristics 4-Miscellaneous and cleanliness 5-Question and answer period 6-Exam and exam review

36 2.3.1 Measling A 1, 2, 3 Microsectioning not required as this is an externally observable requirement

37 2.3.2 Crazing T A 1, 2, 3 N Microsectioning not required as this is an externally observable requirement

38 2.3.4 Foreign Inclusions T A 1, 2, 3 N

39 1.3 Example Delamination Some attributes have both externally observable and internally observable requirements. M1-39

40 Pop quiz: This laminate imperfection meets which class requirements? A. Class 1, only B. Classes 1 and 2 C. Classes 1, 2 and 3 D. None of the above Answer: D Ref: Delamination/Blisters R2-40

41 Question 2: The plated hole condition is acceptable for which class(es) of product? A. Class 1 B. Classes 1 and 2 C. Class 2 D. Classes 2 and 3 Answer: A Ref: External Annular Ring Supported Holes R2-41

42 All spec s are related J standard

43 Other IPC documents DRM s The seven sins of soldering J-0033-handling of MSD s CH-65B-cleaning PCB s 7525-Stencil design guidelines 7095-BGA s T-50-Terms and definitions Many other documents, industry reports etc.

44 Why Invest in Training? Industry recognized certification to show your dedication to quality Increase throughput and reliability May be required (mil, med, auto, ISO) Employee retention Increase first pass yield Decrease defects Enhance your bottom line

45 Key Resources

TRAINING SERVICES. Training Courses Curriculum Development Highly Skilled Staff. Training Courses Curriculum Development Highly Skilled

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