MB SIM Technology Co., Ltd. Electrics / Electronics Training Competencies

Transcription

1 MB SIM Technology Co., Ltd. Electrics / Electronics Training Competencies 1

2 INDEX Company Overview Core Competences Electronics Solutions Consulting Services Training Competencies Training Concepts Reference Training Courses Cooperation Partners Contact Partner 2

3 COMPANY OVERVIEW Positioning Joint Venture Shareholders Business Activities Business Location Employees A subsidiary of the global MBtech Group and a leading provider for engineering and consulting services locally in China 75 % MB-technology GmbH 25 % SIMIT Shanghai Institute Of Microsystems And Information Technology Dedicated and market oriented engineering services for electronic solutions and consulting along the entire value creation chain with local resources Combination with MB Tech services for supporting localization & adaption of JVs and foreign company subsidaries in China Low cost engineering and offshoring services to customers worldwide Shanghai, P.R. China 40 local engineers plus global MBtech Group network of consulting & engineering experts History : Joint Research Laboratory for Electronic Packaging 01/ /2005: Joint Venture between DaimlerChrysler and SIMIT 09/2006: Foundation of MB SIM Technology Co., Ltd. 3

4 CORE COMPETENCIES Electronics solutions Local core competencies Consulting services 1 Systems engineering 2 Software engineering 3 Test engineering MB SIM Tech Service Offering 1 Technology & Innovation Consulting 2 Process Consulting 3 Translation 4 Validation & compliance 4 Training & Qualification Vehicle engineering With global MBtech support Powertrain solutions 4

5 ELECTRONICS SOLUTIONS 1 Systems engineering 2 Software engineering MB SIM Tech electronics solutions 3 Test engineering 4 Validation & compliance 5

6 CONSULTING SERVICES 1 Technology & process consulting 2 Qualification & training MB SIM Tech consulting 3 Technology survey 4 Technical documentation translation 6

7 TRAINING COMPETENCIES Electronics Technology Test & Failure Analysis Quality Series Production Series Supply Chain Technology development on electronics manufacturing Flip Chip technology on electronics manufacturing Failure analysis on electronics packaging Reliability tests and qualification Moisture sensitivity and relevant issues Quality system and standard training (ISO/IEC17025, TS16949, ISO9001, ISO14001) TS16949 tools (PPAP,APQP,FMEA SPC,MSA) Lean manufacture 5S implementation Visual management Total productive (TPM) Procurement management Supply chain management Supplier selection and qualification Lead free technology on electrics manufacturing ESD protection technology Soldering & solder joint failure analysis CSAM and its applications X-ray imaging and its application QC tools and 8D Total quality management 6 Sigma DOE and QFD Production plan and material control Continue improvement (Kaizen) Project management Supplier quality management Inventory and warehouse management Fundamentals of SEM/EDX Quality cost analysis 7

8 TRAINING CONCEPTS We offer training services with different models fitting to customer needs Public Seminar: Expertise communication and improvement Course model Standard single training: Only one topic course provided Combined training: Training course combines two or more topics Customized training: The training course is customized to meet the customers needs Venue Choice On customer site training: A package service for customers Public training: Participate personally in appointed training rooms 8

9 TT1: Introduction to Technology Development on Electronics Manufacturing Objectives of course Understand the history and development of electronics manufacturing Understand the history and development of electronics packaging Target participants Engineers and technicians in the field of chip design, electronic packaging, & assembly, system development and manufacture. Duration 4 hours - The history and development of electronic productions - Development of Integrated Circuit Technology - Development of RF devices, MEMS and other devices for special application - Introduction of electronic packaging - The functions of electronic packaging - Categories of electronic packaging - Examples of common electronic packages - The development trends of electronic packaging - Packaging development of IC devices - Packaging development of passive components - Development of PCBs 9

10 TT2: Lead Free Technology on Electronics Manufacturing Objectives of course Understand the background of lead-free Master the basic knowledge of lead-free technology Target participants Engineers and technicians in the field of chip design, electronic packaging, & assembly, system development and manufacture. Duration 4 hours - Background of lead-free technology - The harm of Pb to human health - Legislation about lead-free - Current situation of lead-free technology - Introduction of lead-free technology - Definition of lead-free - Main materials for lead-free soldering - Schedule of lead-free implementation - Challenges during lead-free process - Solderability problem of lead-free materials - Reliability of lead-free solder joints 10

11 TT3: Flip Chip Technology on Electronics Manufacturing Objectives of course Target participants Duration Understand the characteristics of flip chip Master the basic knowledge of flip chip technology Engineers and technicians in the field of chip design, electronic packaging, & assembly, system development and manufacture. 4 hours - Introduction of flip chip technology - Origin of flip chip technology - Advantage and application of flip chip technology - Basic process of flip chip technology -Bumping process - Main flip chip techniques - Under filling process - Reliability of flip chip - Influence of materials and processes on lifetime of flip chip devices - Typical failure modes of flip chip devices 11

12 TT3: ESD Protection Technology on Electronics Manufacturing Objectives of course Target participants Duration Understand the characteristics of ESD Set up ESD system and reduce the damage Production engineers Electronic engineers Quality engineer and relative engineers 6 hours - Introduction ESD theory - ESD technology and skills - ESD protection system and management -ESD standard 12

13 QFA1: Failure Analysis on Electronics Packaging Objectives of course Comprehensive understanding of failure analysis electronics packaging Target participants Engineers engaged in quality, reliability and failure analysis from component/board assembling companies and system manufacturers. Duration 4 hours - Definition and classification of failures/ Why do electronic products fail? - The objectives of failure analysis/ Understand the importance of failure analysis - Philosophical approach of failure analysis/ Technique approach of failure analysis - Common misunderstandings and mis-practice/ Failure analysis flow charts 13

14 QFA2: Reliability Tests and Qualification of Plastic Packaged ICs Objectives of course Understanding basic concept of reliability test Understanding common qualification test procedure of plastic packaged IC Target participants Engineers engaged in quality, reliability and failure analysis from component/board assembling companies and system manufacturers. Duration 4 hours - Basic concept of reliability and reliability test - Difference between reliability screening and reliability test - Common accelerated models in reliability test - Common test methods in qualification of plastic packaged IC 14

15 QFA3: Moisture Sensitivity and Relevant Issues Objectives of course Understanding moisture effects on plastic device reliability Understanding how to judge the MSL of plastic devices Target participants Engineers engaged in quality, reliability and failure analysis from component/board assembling companies and system manufacturers. Duration 4 hours - Problem caused by moisture penetration - Popcorn phenomena and root cause - Understanding Moisture relevant Standards - How to judge the root cause of failure relevant to moisture - Practical guideline for moisture sensitive devices 15

16 QFA4: Soldering & Solder Joint Failure Analysis Objectives of course Understand common techniques for solder joint failure analysis and their limitations Target participants Engineers engaged in quality, reliability and failure analysis from component/board assembling companies and system manufacturers. Duration 4 hours - Common solder joint failure modes and investigation techniques; x-ray, dye penetration, cross-sectioning, SEM/EDX. - Black pad failure, gold brittleness failure, ternary alloy failure etc. 16

17 TM1: CSAM and its Applications in Electronics Manufacturing Objectives of course Target participants Duration To understand CSAM, its applications in electronics manufacturing, its strength and limitations. Engineers engaged in quality, reliability, process and failure analysis from component/board assembling companies and system manufacturers. 4 hours - Introduction of CSAM fundamentals - Its applications in electronics manufacturing (with many examples) 17

18 TM2: X-ray Imaging and its Application in Electronics Manufacturing Objectives of course Target participants Duration Understand soft x-ray imaging, its strength, limitations. Understand its typical application in electronics manufacturing. Engineers engaged in quality, reliability, process and failure analysis from component/board assembling companies and system manufacturers. 4 hours - Principle of soft X-ray imaging - Typical applications of soft x-ray imaging in electronics manufacturing 18

19 TM3: Fundamentals of SEM/EDX and its Applications in Electronics Packaging Objectives of course To know the fundamentals of SEM/EDX To know the application of SEM/EDX as a failure analysis method in electronics packaging Target participants SEM/EDX manipulator, Failure analysis Engineer and other relevant staff Duration 4 hours -Interaction between incident electrons and specimen -- Fundaments of SEM/EDX - Examples showing the applications of SEM/EDX 19

20 COOPERATION PARTNERS MBtech Group Team board member: Packaging Branch of China Semiconductor Association Shanghai SMT, Electronics Manufacturing Association, YangZi Triangle SMT Expert Group Material and Equipment Suppliers: Seho, Sonoscan, Feinfocus, Kester, Nisene (B&G), UIC, Rhesca Training Organization: German Chamber of Commerce AHK 20

21 CONTACT PARTNER Guogeng Xiao Senior Associate Quality Management MB SIM Technology Co., Ltd. Bldg. 8, 865 Changning Road Shanghai , P.R. China Tel: Fax: Further information: 21