Investigation of Components Attachment onto Low Temperature Flex Circuit

Save this PDF as:
 WORD  PNG  TXT  JPG

Size: px
Start display at page:

Download "Investigation of Components Attachment onto Low Temperature Flex Circuit"

Transcription

1 Investigation of Components Attachment onto Low Temperature Flex Circuit July 2013 Q. Chu, N. Ghalib, H. Ly

2 Agenda Introduction to MIRA Initiative MIRA Manufacturing Platforms Areas of Development Multiphase Development Overview Phase 1 and Phase 2 Low Temp Flex Circuit Assembly Development Phase 3 Alternative Attachment Method Investigation Next Steps

3 Introduction to MIRA Initiative Miniaturization Leveraging Manufacturing Platforms for Innovation Integration Ruggedization Automation 3

4 Miniaturization enabling improved performance in less volume. MIRA Manufacturing Platforms Integration providing greater diversity of enhanced functionality. Ruggedization delivering unparalleled in field reliability. Automation assembling complex components efficiently and safely. 4

5 Bumped Die Flexible Substrates Standard Polyimide Substrates Low Temp Flex (Polyester) Substrates Stretchable Substrate Components Standard Profile Components Thin Profile Components Thin Die (Passive Components) Thin Die (Active Components) Areas of Development Wire Bonded Std 305 SAC Attached Materials Adhesives Thermal Cure Moisture Cure UV/Thermal Cure Solder Alloys Low Temperatures Std LF Temperatures Low Cost Method of Attachments Convection Oven (Reflow/Batch) Alternative Method A Alternative Method B Alternative Method C Alternative Method D Rework Capability Reworkability Alternative Method E 5

6 Multiphase Development Overview Phase 1 Phase 2 Phase 3 Phase 4 Phase 5 Phase 6 Phase 7 Adhesive Materials Identification and Selection Material and Initial Process Characterization w/ Passive Components (i.e. Resistors) Investigate Alternative Attachment Process Adhesive Material Re assessment (Custom Blend?) Process Optimization w/ Passive Components Material and Process Characterization w/ Active Comp. (i.e. Thin Die CSP, Flip Chip, etc.) Reliability Testing Completed In Process 6

7 Phase 1 and Phase 2 - Low Temp Flex Circuit Assembly Development Proprietary and Confidential 7

8 Low Temp Flex Circuit Assembly Development Objective Characterize assembly process for attaching components onto low temp flex circuit

9 Development Process Flow Adhesive Selection Paper Qual of Electrically Conductive Adhesives (ECA) Down Select of ECAs Prescreen DOE Selection to 1 ECA Assembly Process Development (ECA) Application LED Placement ECA Cure (DOE) Post Cure Functional Test Glop Top Application Post Cure Functional Test

10 Material Considerations Flex Circuit Test Board Dimensions: x 5.68 x Surface Finish: Ag ink Material: PET (Polyester) Components Top and Side Firing LEDs Flex Circuit mounted on SMT Pallet Electrically Conductive Adhesives ECA A ECA B ECA C ECA D

11 Criteria Selection of Electrically Conductive Adhesive Low curing temperature Fast curing time Single part Screen printable Low resistivity Four adhesives were considered for prescreen evaluation One was selected based on adhesion and lowest cure properties for process characterization on flex circuit 11

12 Rubber Squeegee as recommended by vendor resulted in unacceptable print deposits Squeegee scoops material from apertures during print Lessons Learned: Screen Printing Conductive Epoxy Metal squeegee blade resulted in more desired print volume Adhesive stencil life was found to be 4 hrs or less Higher frequency of stencil underwipe needed (after 2 pass)

13 Lessons Learned: Part Placement/Cure No self alignment properties Where you placed is where it will end up being after cure Placement force is critical Over driving the part down minimized lap joint (reduced mechanical strength) Two stage cure needed to not distort flex with selected adhesive Cure temp used was lower than vendor s recommendations to minimize distortion of flex circuit

14 Lessons Learned: Handling Handling without the use of back support/pallets caused joints to crack at various interfaces Adhesive to lead terminal Within bulk adhesive Adhesive to pad Printed Ag ink pad to PET flex

15 Lessons Learned: Reworking of Failed LED s Manual rework yielded positive results Achieved by dispensing adhesive over failed joints and then cure Draw back: Long cure time was needed

16 Summary of Observations Print Metal squeegee blade recommended Placement Misplaced parts remained misplaced after cure no self alignment Cure Current available off the shelf adhesive required longer cure time than stated due to Flex circuit deformation/degradation Handling Adhesive/Film assembly was sensitive to normal handling of flex circuit Rework Manual rework was possible, however, long cure time was required

17 Phase 3 Alternative Attachment Method Investigation Proprietary and Confidential 17

18 Objective Investigate alternative solder attachment methods using a low temp substrate 18

19 Baseline Lesson learned from Phase 1 and 2 applied to plastic substrate test board using ECA material Assembly Results Electrically Conductive Adhesive (ECA) Good attachments observed Drawback: long cure time 19

20 Alternative Attachment Method A Inconsistent solder joints were observed post soldering process after multiple DOEs performed Only worked on NiAu surface finish Process not considered viable for mass production 20

21 Alternative Attachment Method B Initial soldering of LF SAC 305 solder onto low temp plastic encouraging Surface temp of substrate during soldering reached 85C during solder attach Attachment of array packaging is still a challenge with method 21

22 Summary of Observations Repeatable results of components attached using ECA on Low temp plastic test board Alternative Method A was not successful and poses many challenges for mass assembly adoption Alternative Method B was found to be a via approach standard leadframe components but not for array packaging

23 Next Steps Phase 1 Phase 2 Phase 3 Phase 4 Phase 5 Phase 6 Phase 7 Adhesive Materials Identification and Selection Material and Initial Process Characterization w/ Passive Components (i.e. Resistors) Investigate Alternative Attachment Process Adhesive Material Re assessment (Custom Blend?) Process Optimization w/ Passive Components Material and Process Characterization w/ Active Comp. (i.e. Thin Die CSP, Flip Chip, etc.) Reliability Testing Completed Complete Eval of 3 Additional Methods Initial discussion with key vendor for special blend - <80C/<5min cure temp/time On hold Flex Test Board Designed/Fabbed 23

24 Thank You

Good Boards = Results

Good Boards = Results Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.

More information

Molded. By July. A chip scale. and Omega. Guidelines. layer on the silicon chip. of mold. aluminum or. Bottom view. Rev. 1.

Molded. By July. A chip scale. and Omega. Guidelines. layer on the silicon chip. of mold. aluminum or. Bottom view.  Rev. 1. Application Note PAC-006 By J. Lu, Y. Ding, S. Liu, J. Gong, C. Yue July 2012 Molded Chip Scale Package Assembly Guidelines Introduction to Molded Chip Scale Package A chip scale package (CSP) has direct

More information

A High Thermal Conductive Solderable Adhesive

A High Thermal Conductive Solderable Adhesive A High Thermal Conductive Solderable Adhesive YINCAE Advanced Materials, LLC WHITE PAPER January 2016 2014 YINCAE Advanced Materials, LLC - All Rights Reserved. YINCAE Advanced Materials, LLC, 19 Walker

More information

Flip Chip Package Qualification of RF-IC Packages

Flip Chip Package Qualification of RF-IC Packages Flip Chip Package Qualification of RF-IC Packages Mumtaz Y. Bora Peregrine Semiconductor San Diego, Ca. 92121 mbora@psemi.com Abstract Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages

More information

PCB Land Design and Surface Mount for DFN2x5 Punched Package

PCB Land Design and Surface Mount for DFN2x5 Punched Package Document No. DSMT-0002 Rev. 1 Page: 1/1 PCB Land Design and Surface Mount for DFN2x5 Punched Package Introduction DFN package is a plastic encapsulated package with a copper lead frame substrate. It offers

More information

Bob Willis leadfreesoldering.com

Bob Willis leadfreesoldering.com Assembly of Flexible Circuits with Lead-Free Solder Alloy Bob Willis leadfreesoldering.com Introduction to Lead-Free Assembly Video Clips Component www.bobwillis.co.uk/lead/videos/components.rm Printed

More information

AND8493/D. How to Store, Reflow and Solder ON Semiconductor Hybrids APPLICATION NOTE

AND8493/D. How to Store, Reflow and Solder ON Semiconductor Hybrids APPLICATION NOTE How to Store, Reflow and Solder ON Semiconductor Hybrids APPLICATION NOTE Reflow Introduction Storage and Shelf Life Devices are classified according to their Moisture Sensitivity Level (MSL). There are

More information

3D printed Electronics From Idea to Reality

3D printed Electronics From Idea to Reality 3D printed Electronics From Idea to Reality 2 Outline Introduction Background TNO From 2D printing to 3D manufacturing Different Techniques How are most electronics being build today? How can AM be used

More information

What is surface mount?

What is surface mount? A way of attaching electronic components to a printed circuit board The solder joint forms the mechanical and electrical connection What is surface mount? Bonding of the solder joint is to the surface

More information

Flex Circuit Design and Manufacture.

Flex Circuit Design and Manufacture. Flex Circuit Design and Manufacture. Hawarden Industrial Park, Manor Lane, Deeside, Flintshire, CH5 3QZ Tel 01244 520510 Fax 01244 520721 Sales@merlincircuit.co.uk www.merlincircuit.co.uk Flex Circuit

More information

Stencil Design Guidelines for Electronics Assembly Technologies Student professional contest The 22nd Edition, Brasov, 24th-27th April 2013

Stencil Design Guidelines for Electronics Assembly Technologies Student professional contest The 22nd Edition, Brasov, 24th-27th April 2013 Stencil Design Guidelines for Electronics Assembly Technologies Student professional contest The 22nd Edition, Brasov, 24th-27th April 2013 BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS DEPARTMENT OF

More information

PCB Quality Inspection. Student Manual

PCB Quality Inspection. Student Manual PCB Quality Inspection Student Manual Unit 2: Inspection Overview Section 2.1: Purpose of Inspection What Is The Purpose of Inspection? There are 2 reasons why Inspection is performed: o To verify the

More information

Power Converter Module Package Process Specification for EN5310, EN5330, and EN5360 Converter Modules

Power Converter Module Package Process Specification for EN5310, EN5330, and EN5360 Converter Modules Power Converter Module Package Process Specification for EN5310, EN5330, and EN5360 Converter Modules Introduction This applications note addresses the following topics: PCB Design Recommendations: o Pad

More information

Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M

Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M Miniaturizing Flexible Circuits for use in Medical Electronics Nate Kreutter 3M Drivers for Medical Miniaturization Market Drivers for Increased use of Medical Electronics Aging Population Early Detection

More information

1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.

1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda. .Introduction If the automobile had followed the same development cycle as the computer, a Rolls- Royce would today cost $00, get one million miles to the gallon and explode once a year Most of slides

More information

01005 Assembly Process, Materials and Tooling. Denis Barbini, Ph.D. Universal Instruments Corporation Advanced Process Lab

01005 Assembly Process, Materials and Tooling. Denis Barbini, Ph.D. Universal Instruments Corporation Advanced Process Lab 01005 Assembly Process, Materials and Tooling Denis Barbini, Ph.D. Universal Instruments Corporation Advanced Process Lab Introduction Introduction to the 01005 History and market information Availability

More information

PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices

PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices Introduction There is an industry-wide trend towards using the smallest package possible for a given pin count. This is driven primarily

More information

Edition 2012-032 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon Technologies AG All Rights Reserved.

Edition 2012-032 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon Technologies AG All Rights Reserved. Recommendations for Printed Circuit Board Assembly of Infineon Laminate Packages Additional Information DS1 2012-03 Edition 2012-032 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon

More information

FLASHSOLDERING - A NEW PROCESS FOR REFLOW SOLDERING INSULATED MAGNET WIRE TO ELECTRONIC CONTACTS

FLASHSOLDERING - A NEW PROCESS FOR REFLOW SOLDERING INSULATED MAGNET WIRE TO ELECTRONIC CONTACTS FLASHSOLDERING - A NEW PROCESS FOR REFLOW SOLDERING INSULATED MAGNET WIRE TO ELECTRONIC CONTACTS David W. Steinmeier microjoining Solutions & Mike Becker Teka Interconnection Systems Abstract: Flashing

More information

Analysis of Factors that Affect Yield in SMT Assembly. 1.0 Introduction

Analysis of Factors that Affect Yield in SMT Assembly. 1.0 Introduction Analysis of Factors that Affect Yield in SMT Assembly Edward Kamen, Alex Goldstein, Orapin Asarangchai, Georgia Institute of Technology Allan Fraser, Kyle Klatka, GenRad, Inc. Joe Belmonte, Speedline/MPM

More information

Electronic Board Assembly

Electronic Board Assembly Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering THR soldering THT soldering -

More information

DFX - DFM for Flexible PCBs Jeremy Rygate

DFX - DFM for Flexible PCBs Jeremy Rygate DFX - DFM for Flexible PCBs Jeremy Rygate 1 Jeremy Rygate 30 years experience with Front End in the Electronics industry and PCB manufacturing. Experience in advanced PCBs, particularly Flex, Flex-rigid

More information

Enpirion Application Note General Enpirion Product QFN Package Soldering Guideline

Enpirion Application Note General Enpirion Product QFN Package Soldering Guideline Enpirion Application Note General Enpirion Product QFN Package Soldering Guideline 1.0 - Introduction Altera ENPIRION power converter packages are designed with a plastic leadframe package technology that

More information

Specializing in Open Cavity Packages & Complete IC Assembly Services ISO 9001:2008 Certified and ITAR Registered

Specializing in Open Cavity Packages & Complete IC Assembly Services ISO 9001:2008 Certified and ITAR Registered TowerJazz Global Symposium Specializing in Open Cavity Packages & Complete IC Assembly Services and TowerJazz Global Symposium Quik-Pak a division of Delphon Industries 2011 Gold Sponsor and TowerJazz

More information

Reballing Rework Bright New Future

Reballing Rework Bright New Future Reballing Rework Bright New Future Components are continuing to evolve. One of those evolutions is the Ball Grid Array or BGA. Add in the advent of the RoHS and WEEE directives and rework of the BGA is

More information

Thermal Conductive Materials and LED Cooling

Thermal Conductive Materials and LED Cooling Thermal Conductive Materials and LED Cooling Agenda Overview Effects of Thermal Degradation Impact of Higher Voltages Impact on Relative Flux Thermal Interface Materials Considerations of Thermal Materials/Adhesives

More information

3D Electroform Stencils for Two Level PCB

3D Electroform Stencils for Two Level PCB 3D Electroform Stencils for Two Level PCB Rachel Miller-Short, VP Global Sales Photo Stencil Bill Coleman Photo Stencil Dudi Amir Intel Joe Perault Parmi Abstract The requirements for two-level PCB with

More information

Alenica Technologies Symposium& Expo July Thermal Spot Curing of Adhesives with Photonic Energy Ruben Burga

Alenica Technologies Symposium& Expo July Thermal Spot Curing of Adhesives with Photonic Energy Ruben Burga Alenica Technologies Symposium& Expo July 2011 Thermal Spot Curing of Adhesives with Photonic Energy Ruben Burga IRphotonics Inc. Montreal CONFIDENTIAL & PROPRIETARY IRphotonics provides Mid IR Fibers

More information

Neal O Hara. Business Development Manager

Neal O Hara. Business Development Manager Neal O Hara Business Development Manager PCS OFFERING User Interface Flex Circuit Solutions Sensor Systems Multilayer Copper Flex Circuits LED Lighting 2 VERTICAL INTEGRATION FPC Connector Picoflex on

More information

RJR Polymers Reliability Qualification Report RQFN55-24-A and RQFN44-12-A

RJR Polymers Reliability Qualification Report RQFN55-24-A and RQFN44-12-A Reliability Qualification Report RQFN55-24-A and RQFN44-12-A Package Qualification September 14, 2011 RJR Polymers Reliability Qualification Report RQFN55-24-A and RQFN44-12-A Table of Contents Purpose.3

More information

Workshop on SMT Stencils. Sakthivel Padmanapan

Workshop on SMT Stencils. Sakthivel Padmanapan Workshop on SMT Stencils Sakthivel Padmanapan 1 SMTA Chennai 30th May 2014 What is STENCIL? 2 SMTA Chennai 30th May 2014 In general, the stencil is a simple tool to make repetitive impression. Is being

More information

Ball Grid Array (BGA) Technology

Ball Grid Array (BGA) Technology Chapter E: BGA Ball Grid Array (BGA) Technology The information presented in this chapter has been collected from a number of sources describing BGA activities, both nationally at IVF and reported elsewhere

More information

DirectFET TM - A Proprietary New Source Mounted Power Package for Board Mounted Power

DirectFET TM - A Proprietary New Source Mounted Power Package for Board Mounted Power TM - A Proprietary New Source Mounted Power Package for Board Mounted Power by Andrew Sawle, Martin Standing, Tim Sammon & Arthur Woodworth nternational Rectifier, Oxted, Surrey. England Abstract This

More information

Integrated Circuit Packaging and Thermal Design

Integrated Circuit Packaging and Thermal Design Lezioni di Tecnologie e Materiali per l Elettronica Integrated Circuit Packaging and Thermal Design Danilo Manstretta microlab.unipv.it danilo.manstretta@unipv.it Introduction to IC Technologies Packaging

More information

Solder Reflow Guide for Surface Mount Devices

Solder Reflow Guide for Surface Mount Devices June 2015 Introduction Technical Note TN1076 This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is

More information

Preface xiii Introduction xv 1 Planning for surface mount design General electronic products 3 Dedicated service electronic products 3 High-reliability electronic products 4 Defining the environmental

More information

BGA - Ball Grid Array Inspection Workshop. Bob Willis leadfreesoldering.com

BGA - Ball Grid Array Inspection Workshop. Bob Willis leadfreesoldering.com BGA - Ball Grid Array Inspection Workshop Bob Willis leadfreesoldering.com Mixed Technology Assembly Processes Adhesive Dispensing Component Placement Adhesive Curing Turn Boar Over Conventional Insertion

More information

AND8464/D. Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages APPLICATION NOTE

AND8464/D. Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages APPLICATION NOTE Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages Prepared by: Denise Thienpont, Steve St. Germain ON Semiconductor APPLICATION NOTE Introduction ON Semiconductor has introduced an expanded

More information

A guide to the BGA Package 1. What is it? 2. Why have they caught on? 3. Are they difficult to place by machine? 4. Is it possible to place them by hand? 5. How do you know if a BGA has fully soldered

More information

PCB design for reliability on power components

PCB design for reliability on power components Milano, 28-29 Maggio 2013 Centro Congressi Milanofiori Electronics Day Automotive Roberto Tiziani Powertrain Technologies Manager Magneti Marelli PCB design for reliability on power components Organizzato

More information

CARTS USA 2011 Presentation

CARTS USA 2011 Presentation CARTS USA 2011, Jacksonville, FL, March 28-31, 2011 CARTS USA 2011 Presentation Power Efficiency Improvement for Low Ohm Current Sense Resistor Akhlaq Rahman, Fred Olinger, Mike Howieson Thin Film Technology

More information

Application Note: TPH3206LD and TPH3206LS Lead Free 2 nd Level Soldering Recommendations for Vapor Phase Reflow. 1. Package Description

Application Note: TPH3206LD and TPH3206LS Lead Free 2 nd Level Soldering Recommendations for Vapor Phase Reflow. 1. Package Description Application Note: TPH3206LD and TPH3206LS Lead Free 2 nd Level Soldering Recommendations for Vapor Phase Reflow 1. Package Description Trasphorm s PQFN (Power Quad Flatpack No Lead) package incorporates

More information

Soldering Process Considerations for Land Grid Array Modules

Soldering Process Considerations for Land Grid Array Modules Soldering Process Considerations for Land Grid Array Modules The reflow process is dependant on many parameters; this application note is presented as a guide to soldering LGA modules. Manufacturers are

More information

High Volume Assembly & Test Solutions To Meet The Rapidly Growing MEMS Market. Enabling a Microelectronic World

High Volume Assembly & Test Solutions To Meet The Rapidly Growing MEMS Market. Enabling a Microelectronic World High Volume Assembly & Test Solutions To Meet The Rapidly Growing MEMS Market Enabling a Microelectronic World MEMS & IC Package Comparison MEMS Package Relative Growth MEMS package market is now growing

More information

3M Electrically Conductive Adhesive Transfer Tape 9703

3M Electrically Conductive Adhesive Transfer Tape 9703 Technical Data April 2011 M Electrically Conductive Adhesive Transfer Tape 970 Product Description M Electrically Conductive Adhesive Transfer Tape 970 is a pressure sensitive adhesive (PSA) transfer tape

More information

GUIDELINES FOR PRINTED CIRCUIT BOARD ASSEMBLY (PCBA) OF UTAC GROUP S GRID ARRAY PACKAGE (GQFN) AND ITS BOARD LEVEL RELIABILITY

GUIDELINES FOR PRINTED CIRCUIT BOARD ASSEMBLY (PCBA) OF UTAC GROUP S GRID ARRAY PACKAGE (GQFN) AND ITS BOARD LEVEL RELIABILITY GUIDELINES FOR PRINTED CIRCUIT BOARD ASSEMBLY (PCBA) OF UTAC GROUP S GRID ARRAY PACKAGE (GQFN) AND ITS BOARD LEVEL RELIABILITY Kyaw Ko Lwin*, Daniel Ting Lee Teh, Carolyn Epino Tubillo, Jun Dimaano, Ang

More information

CASE STUDY: SCREEN PRINTING SOLUTIONS FOR SMALL DIE & PRECISION ALIGNMENT CHALLENGES

CASE STUDY: SCREEN PRINTING SOLUTIONS FOR SMALL DIE & PRECISION ALIGNMENT CHALLENGES CASE STUDY: SCREEN PRINTING SOLUTIONS FOR SMALL DIE & PRECISION ALIGNMENT CHALLENGES By William E. Coleman Ph.D., Photo Stencil and Travis Tanner, Plexus Manufacturing Solutions When you have a gold Kovar

More information

PCB inspection is more important today than ever before!

PCB inspection is more important today than ever before! PCB inspection is more important today than ever before! Industry experts continue to stress the need to inspect hidden solder joints! Figure 1. The BGA package has not been placed into the paste deposit.

More information

Thermal Management for Low Cost Consumer Products

Thermal Management for Low Cost Consumer Products Thermal Management for Low Cost Consumer Products TI Fellow Manager: Advanced Package Modeling and Characterization Texas Instruments rvin@ti.com Outline The challenges Stacked die, Package-on-Package,

More information

Assembly of LPCC Packages AN-0001

Assembly of LPCC Packages AN-0001 Assembly of LPCC Packages AN-0001 Surface Mount Assembly and Handling of ANADIGICS LPCC Packages 1.0 Overview ANADIGICS power amplifiers are typically packaged in a Leadless Plastic Chip Carrier (LPCC)

More information

Technical Note Assembly instructions of Dual Flat Lead Package (DFL)

Technical Note Assembly instructions of Dual Flat Lead Package (DFL) Technical Note Assembly instructions of Dual Flat Lead Package (DFL) TABLE OF CONTENTS 1 Objective... 2 2 Dual Flat Lead Package (DFL)... 2 3 DFL Package Outline and Dimensions... 3 4 Tape and reel specifications...

More information

A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages

A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages Bernd K Appelt Director WW Business Development April 24, 2012 Table of Content Definitions Wafer Level

More information

FLEXIBLE CIRCUITS MANUFACTURING

FLEXIBLE CIRCUITS MANUFACTURING IPC-DVD-37 FLEXIBLE CIRCUITS MANUFACTURING Below is a copy of the narration for DVD-37. The contents of this script were developed by a review group of industry experts and were based on the best available

More information

ASSEMBLY INSTRUCTIONS FOR SCC2000 SERIES

ASSEMBLY INSTRUCTIONS FOR SCC2000 SERIES 1 (16) ASSEMBLY INSTRUCTIONS FOR SCC2000 SERIES Technical Note 96 2 (16) Table of Contents 1 Objective... 3 2 Murata's 24-lead Dual In-line Package (DIL-24)... 3 3 DIL-24 Package Outline and Dimensions...

More information

Chip-on-board Technology

Chip-on-board Technology Hybrid Technology The trend in electronics is to continue to integrate more and more functions and numbers of components into a single, smaller assembly. Hybrid circuit technology is a key method of increasing

More information

DVD-51C Adhesive Application For Surface Mount

DVD-51C Adhesive Application For Surface Mount DVD-51C Adhesive Application For Surface Mount Below is a copy of the narration for DVD-51C. The contents for this script were developed by a review group of industry experts and were based on the best

More information

Customer Service Note Lead Frame Package User Guidelines

Customer Service Note Lead Frame Package User Guidelines Customer Service Note Lead Frame Package User Guidelines CSN30: Lead Frame Package User Guidelines Introduction Introduction When size constraints allow, the larger-pitched lead-frame-based package design

More information

AN-5082 Power56 Wave-Soldering Board Assembly Considerations

AN-5082 Power56 Wave-Soldering Board Assembly Considerations www.fairchildsemi.com AN-5082 Power56 Wave-Soldering Board Assembly Considerations Introduction PQFN packages are commonly mounted on board through reflow process. The board mounting guidelines through

More information

Lecture 23 MEMS Packaging. Department of Mechanical Engineering

Lecture 23 MEMS Packaging. Department of Mechanical Engineering Lecture 23 MEMS Packaging MEMS Packaging A simplified process flow for MEMS Packaging MEMS Packaging Key Design and Packaging consideration Wafer or wafer-stack thickness Wafer Dicing concerns Thermal

More information

Introduction to the Plastic Ball Grid Array (PBGA)

Introduction to the Plastic Ball Grid Array (PBGA) Introduction to the Plastic Ball Grid Array (PBGA) Q1, 2008 Terry Burnette Dec. 15, 2005 Presentation Outline PBGA Introduction and Package Description PC Board Design for PBGA PBGA Assembly PBGA Solder

More information

ELEC 6740 Electronics Manufacturing Chapter 7: Design for Manufacturability, Testing & Repair

ELEC 6740 Electronics Manufacturing Chapter 7: Design for Manufacturability, Testing & Repair ELEC 6740 Electronics Manufacturing Chapter 7: Design for Manufacturability, Testing & Repair R. Wayne Johnson Auburn University johnson@eng.auburn. @eng.auburn.eduedu Outline! DFM Organizational Structure!

More information

Circuit Technology Crossovers Where PCBs and Printed Electronics Meet

Circuit Technology Crossovers Where PCBs and Printed Electronics Meet As originally published in the IPC APEX EXPO Conference Proceedings. Circuit Technology Crossovers Where PCBs and Printed Electronics Meet Chris Hunrath, Insulectro, Lake Forest, CA, USA chunrath@insulectro.com

More information

Chapter 14. Printed Circuit Board

Chapter 14. Printed Circuit Board Chapter 14 Printed Circuit Board A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, or traces, etched from copper

More information

FLEXIBLE CIRCUIT DIELECTRIC BASE MATERIAL OPTIONS

FLEXIBLE CIRCUIT DIELECTRIC BASE MATERIAL OPTIONS FLEXIBLE CIRCUIT DIELECTRIC BASE MATERIAL OPTIONS Flexible circuits are used in a multitude of applications, ranging from the lowest end consumer products to the highest end military and commercial systems.

More information

The Don ts of Better Flexible Circuit Design and Manufacture By Mark Finstad Friday, 01 June 2007

The Don ts of Better Flexible Circuit Design and Manufacture By Mark Finstad Friday, 01 June 2007 The Don ts of Better Flexible Circuit Design and Manufacture By Mark Finstad Friday, 01 June 2007 Successful designs are soon forgotten but failures are remembered for years. Steering clear of these twelve

More information

Printed Circuits. Danilo Manstretta. microlab.unipv.it/ danilo.manstretta@unipv.it. AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica

Printed Circuits. Danilo Manstretta. microlab.unipv.it/ danilo.manstretta@unipv.it. AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica Lezioni di Tecnologie e Materiali per l Elettronica Printed Circuits Danilo Manstretta microlab.unipv.it/ danilo.manstretta@unipv.it Printed Circuits Printed Circuits Materials Technological steps Production

More information

Power Dissipation Considerations in High Precision Vishay Sfernice Thin Film Chips Resistors and Arrays (P, PRA etc.) (High Temperature Applications)

Power Dissipation Considerations in High Precision Vishay Sfernice Thin Film Chips Resistors and Arrays (P, PRA etc.) (High Temperature Applications) VISHAY SFERNICE Resistive Products Application Note ABSTRACT On our thin film chips resistors and arrays the main path for the heat, more than 90 %, is conduction through the body of the component, the

More information

Thermal Stress analysis of Electronic component in Plastic Moulding Process

Thermal Stress analysis of Electronic component in Plastic Moulding Process Available online atwww.scholarsresearchlibrary.com Archives of Applied Science Research, 2015, 7 (5):54-63 (http://scholarsresearchlibrary.com/archive.html) ISSN 0975-508X CODEN (USA) AASRC9 Thermal Stress

More information

Accelerated Thermal Cycling and Failure Mechanisms For BGA and CSP Assemblies

Accelerated Thermal Cycling and Failure Mechanisms For BGA and CSP Assemblies Accelerated Thermal Cycling and Failure Mechanisms For BGA and CSP Assemblies Reza Ghaffarian, Ph.D. Jet Propulsion Laboratory California Institute of Technology Pasadena, California 818-354-2059 reza.ghaffarian@jpl.nasa.gov

More information

Fraunhofer ISIT, Itzehoe 14. Juni 2005. Fraunhofer Institut Siliziumtechnologie (ISIT)

Fraunhofer ISIT, Itzehoe 14. Juni 2005. Fraunhofer Institut Siliziumtechnologie (ISIT) Research and Development centre for Microelectronics and Microsystems Applied Research, Development and Production for Industry ISIT applies an ISO 9001:2000 certified quality management system. Certificate

More information

Measuring of the Temperature Profile during the Reflow Solder Process Application Note

Measuring of the Temperature Profile during the Reflow Solder Process Application Note Measuring of the Temperature Profile during the Reflow Solder Process Application Note Abstract With reference to the application note Further Details on lead free reflow soldering of LEDs the present

More information

Assembly of Flexible Circuits with Lead-Free Solder Alloy

Assembly of Flexible Circuits with Lead-Free Solder Alloy Assembly of Flexible Circuits with Lead-Free Solder Alloy Bob Willis bobwillisonline.com Your Delegate Webinar Control Panel Open and close your panel Full screen view Raise hand for Q&A at the end Submit

More information

MA4AGSW8-2. SP8T AlGaAs PIN Diode Switch Rev. V2 CHIP LAYOUT FEATURES DESCRIPTION. Absolute Maximum Ratings T AMB = +25 C (Unless Otherwise Noted) 1

MA4AGSW8-2. SP8T AlGaAs PIN Diode Switch Rev. V2 CHIP LAYOUT FEATURES DESCRIPTION. Absolute Maximum Ratings T AMB = +25 C (Unless Otherwise Noted) 1 FEATURES Specified Performance : 50 MHz to 40 GHz Operational Performance: 50 MHz to 50 GHz 2.0 db Typical Insertion Loss at 40 GHz 30 db Typical Isolation at 40 GHz thru 3 Diodes 22 db Typical Isolation

More information

Advanced Technologies and Equipment for 3D-Packaging

Advanced Technologies and Equipment for 3D-Packaging Advanced Technologies and Equipment for 3D-Packaging Thomas Oppert Semicon Russia 15 th May 2014 Outline Short Company Introduction Electroless Plating on Wafer Level Ultra-SB 2 - Wafer Level Solder Balling

More information

Manufacturing Notes for RFSW1012

Manufacturing Notes for RFSW1012 Manufacturing Notes for RFSW1012 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ( RFMD ) for its use, nor for

More information

3M Thermally Conductive Adhesive Transfer Tapes

3M Thermally Conductive Adhesive Transfer Tapes Technical Data April, 28 3M Thermally Conductive Adhesive Transfer Tapes Product Description 885, 881, 8815 and 882 are designed to provide a preferential heat-transfer path between heat-generating components

More information

ASSEMBLY INTERCONNECT RELIABILITY IN SOLID STATE LIGHTING APPLICATIONS PART 1

ASSEMBLY INTERCONNECT RELIABILITY IN SOLID STATE LIGHTING APPLICATIONS PART 1 ASSEMBLY INTERCONNECT RELIABILITY IN SOLID STATE LIGHTING APPLICATIONS PART 1 Rahul Raut, Ravi Bhatkal, Westin Bent, Bawa Singh, Sujatha Chegudi and Ranjit Pandher Cookson Electronics, 109 Corporate Boulevard,

More information

3M Thermal Bonding Film AF42

3M Thermal Bonding Film AF42 Technical Data August 2015 3M Thermal Bonding Film AF42 Product Description 3M Thermal Bonding Film AF42 is an epoxy, thermoset film adhesive developed for structural bonding of metal, glass and other

More information

VITEL Copolyester resins

VITEL Copolyester resins VITEL Copolyester resins A company of TOTAL www.bostik.com What are VITEL resins? VITEL is the trade name for our co-polyester resins mainly used as heat sealable coatings and laminating adhesives. This

More information

Qualification and Performance Specification for Flexible Printed Boards

Qualification and Performance Specification for Flexible Printed Boards Qualification and Performance Specification for Flexible Printed Boards Developed by the Flexible Circuits Performance Specifications Subcommittee (D-12) of the Flexible Circuits Committee (D-10) of IPC

More information

8-bit Atmel Microcontrollers. Application Note. Atmel AVR211: Wafer Level Chip Scale Packages

8-bit Atmel Microcontrollers. Application Note. Atmel AVR211: Wafer Level Chip Scale Packages Atmel AVR211: Wafer Level Chip Scale Packages Features Allows integration using the smallest possible form factor Packaged devices are practically the same size as the die Small footprint and package height

More information

HARD SURFACE PAPERS INSTRUCTION GUIDE

HARD SURFACE PAPERS INSTRUCTION GUIDE HARD SURFACE PAPERS INSTRUCTION GUIDE I Contents Page Paropy...2 Paropy I...3 Paropy...4 Acrylic...5 Cardboard Puzzles...6 Ceramic Mugs...7 Ceramic Tiles...9 Crystal...10 Glass...10 Leather...11 Magnets...11

More information

30 GHz 5-Bit Phase Shifter TGP2100

30 GHz 5-Bit Phase Shifter TGP2100 August, 28 3 GHz -Bit Phase Shifter TGP2 Key Features and Performance Positive Control Voltage Single-Ended Logic CMOS Compatible Frequency Range: 28-32 GHz.2µm phemt 3MI Technology Chip dimensions:.88

More information

Product Technical Bulletin #67 SMT Soldering Guidelines

Product Technical Bulletin #67 SMT Soldering Guidelines Product Technical Bulletin #67 SMT Soldering Guidelines Purpose: The purpose of this technical bulletin is to provide information regarding the proper procedure for processing AirBorn s microsi surface

More information

Everline Module Application Note: Round LED Module Thermal Management

Everline Module Application Note: Round LED Module Thermal Management Everline Module Application Note: Round LED Module Thermal Management PURPOSE: Use of proper thermal management is a critical element of Light Emitting Diode (LED) system design. The LED temperature directly

More information

ELECTRONICS MANUFACTURE-Selective machine soldering

ELECTRONICS MANUFACTURE-Selective machine soldering ELECTRONICS MANUFACTURE-Selective machine soldering There are a number of designs when one wants to use a machine soldering process, but needs to confine it to just a section of the board. For example:

More information

Interconnecting the next generation of electronics

Interconnecting the next generation of electronics Ormet Circuits Inc. Interconnecting the next generation of electronics Overview Ormet Circuits provides conductive pastes that enable electrical interconnection and thermal management in electronic substrates,

More information

Copyright 2008 IEEE. Reprinted from ECTC2008 Proceedings.

Copyright 2008 IEEE. Reprinted from ECTC2008 Proceedings. Copyright 2008 IEEE. Reprinted from ECTC2008 Proceedings. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Amkor

More information

Printed Circuit Boards

Printed Circuit Boards Printed Circuit Boards Luciano Ruggiero lruggiero@deis.unibo.it DEIS Università di Bologna Flusso di progetto di un circuito stampato 1 Specifications Before starting any design, you need to work out the

More information

HDI. HDI = High Density Interconnect. Kenneth Jonsson Bo Andersson. NCAB Group

HDI. HDI = High Density Interconnect. Kenneth Jonsson Bo Andersson. NCAB Group HDI HDI = High Density Interconnect Kenneth Jonsson Bo Andersson NCAB Group Definitions / Standards (IPC) Pros & Cons Key equipment Build-ups Choice of material Design rules IPC HDI reliability (µvia stacked

More information

Recommended Soldering Techniques for ATC 500 Series Capacitors

Recommended Soldering Techniques for ATC 500 Series Capacitors Recommended Soldering Techniques for ATC 500 Series Capacitors ATC# 001-884 Rev. D; 10/05 1.0. SCOPE. The following procedures have been successful in soldering ATC500 series capacitors to both soft and

More information

Q&A. Contract Manufacturing Q&A. Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials

Q&A. Contract Manufacturing Q&A. Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials Q&A Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials 1. Do Nelco laminates have any discoloration effects or staining issues after multiple high temperature exposures?

More information

SCREEN PRINTING INSTRUCTIONS

SCREEN PRINTING INSTRUCTIONS SCREEN PRINTING INSTRUCTIONS For Photo-Imageable Solder Masks and Idents Type 5600 Two Part Solder Masks and Idents Mega Electronics Ltd., Mega House, Grip Industrial Estate, Linton, Cambridge, ENGLAND

More information

Soldering Recommendations for Chip Level Package (CLP)

Soldering Recommendations for Chip Level Package (CLP) VISHAY SEMICONDUCTORS www.vishay.com Diodes By Henry Karrer INTRODUCTION The trend in mobile applications towards reducing the package size and thickness of components is supported by chip level package

More information

"3D Etching Process of the Hybrid Laminate of Metal Foils on Polyimide Film to Build Ultra Thin Connectors for High Density Flexible Circuits

3D Etching Process of the Hybrid Laminate of Metal Foils on Polyimide Film to Build Ultra Thin Connectors for High Density Flexible Circuits PCMI BOSTON. October 11, 2011 "3D Etching Process of the Hybrid Laminate of Metal Foils on Polyimide Film to Build Ultra Thin Connectors for High Density Flexible Circuits Yosuke Kobayashi Dominique Numakura

More information

Thermal Management in Surface-Mounted Resistor Applications

Thermal Management in Surface-Mounted Resistor Applications VISHAY BEYSCHLAG Resistive Products 1. INTRODUCTION Thermal management is becoming more important as the density of electronic components in modern printed circuit boards (PCBs), as well as the applied

More information

CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN. page. Introduction 4-2. Axial and radial leaded devices 4-2. Surface-mount devices 4-3

CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN. page. Introduction 4-2. Axial and radial leaded devices 4-2. Surface-mount devices 4-3 CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 INTRODUCTION There are two basic forms of electronic component

More information

Selective Soldering Defects and How to Prevent Them

Selective Soldering Defects and How to Prevent Them Selective Soldering Defects and How to Prevent Them Gerjan Diepstraten Vitronics Soltec BV Introduction Two major issues affecting the soldering process today are the conversion to lead-free soldering

More information

Die Carrier Temporary Reusable Packages. Setting the Standards for Tomorrow

Die Carrier Temporary Reusable Packages. Setting the Standards for Tomorrow Die Carrier Temporary Reusable Packages Setting the Standards for Tomorrow Die Level Burn-in and Test The Need for KGD Historically, semiconductor manufacturers and endusers performed numerous tests on

More information

Flexible Electronics Manufacturing Solutions

Flexible Electronics Manufacturing Solutions Contract Electronics Manufacturing Flexible Electronics Manufacturing Solutions Triangle geelectronic c Services has established s ed an enviable abereputation as a totally oa flexible, high quality Contract

More information