Collaborating Objects Workshop. Bart Van Poucke IMEC

Transcription

1 Collaborating Objects Workshop Bart Van Poucke IMEC imec 2005

2 Non-E World Sensor Node Challenges (ISSCC 2005 Keynote H. De Man) 20μW 20μW 40μW 20μW 80 Mops 2nJ/b Sensor CE-ADC Processor Radio DSP&storage Security MAC RF Avg. Power <10kb/s 1% < 500mV CMOS ULP radio Above IC MEMS, passives Grain size packaging Power Mgr Energy sensor Ambient 100 μw Avg power imec 2005 FirstName LastName Activity / Group 2

3 Demonstration Human++ program Sensors and actuators Integration Ultra low power radio Micro-power generation imec 2005 FirstName LastName Activity / Group 3

4 Sensor platform: radio Our goal is to develop ultra low power radio architectures and demonstrate them in first of a kind devices. Sensor Actuator Data Processing & Control Communication Power Management imec 2005 FirstName LastName Activity / Group 4

5 Baseline power dominates in short range applications Baseline Power (architecture) Power consumption Dynamic power (data rate, range) Short range applications Data Rate Range imec 2005 FirstName LastName Activity / Group 5

6 Model the channel for WBAN applications Channel modeling Need of an accurate model of Human body EM properties XFDTD simulations with REMCOM body Time step step cm 120cm imec 2005 FirstName LastName Activity / Group 6

7 Sensor platform: micropower generation Sensor Actuator Data Processing & Control Communication Power Management imec 2005 FirstName LastName Activity / Group 7

8 ASIP Architecture Level 2 I-Cache 2Mb External Memory Level 1 I-Cache 128Kb Decoder Loop Buffer 2Kb Loop Buffer 2Kb Controller Controller FU FU FU FU FU FU FU FU FU FU FU FU FU FU FU FU Register File Register File Wide Registers Wide Registers Main Cluster Reconfigurable Cluster Application Specific Unit Application Specific Unit imec 2005 FirstName LastName Activity / Group 8

9 Sensor platform: micropower generation Sensor Actuator Data Processing & Control Communication Power Management imec 2005 FirstName LastName Activity / Group 9

10 Goal Our goal is to develop micro-power generation techniques which we demonstrate in first of a kind devices. Features Average generated power > 100μW Thermal, mechanical and solar micro-power generators Patented architectures Designs supported by in house developed micromachining technology First prototypes available System integration including power conversion electronics operating at low V at high efficiency imec 2005 FirstName LastName Activity / Group 10

11 IMEC energy scavenging: from human thermal energy Energy consumption of human activity (mw/cm2) 55 Average 5 15 mw/cm Common Activity imec 2005 FirstName LastName Activity / Group 11

12 IMEC energy scavenging: from human thermal energy Output: 75μW, 2.7V Drivers: Higher voltage/power, smaller volume imec 2005 FirstName LastName Activity / Group 12

13 Improved TEG: test results Temperature (C) 50 IMEC 40 energy scavenging: 30 TEMPERATURE from human thermal energy Humidity (%) 50 HUMIDITY 14: /01/01 14:30 14:45 15:00 Measurement time 0 imec 2005 FirstName LastName Activity / Group 13

14 Sensor Platform: prototypes Sensor Actuator Data Processing & Control Communication Power Management imec 2005 FirstName LastName Activity / Group 14

15 Sensor platform on flexible substrate wireless range: 15 meter imec 2005 FirstName LastName Activity / Group 15

16 Wireless Sensor Platform 3cm 3 stack 1cm 3 3D stack imec 2005 FirstName LastName Activity / Group 16

17 3D Sensor Platform imec 2005 FirstName LastName Activity / Group 17

18 Competitive analysis Power (peak) Relative Absolute (mw) IMEC 3D sensor platform X-bow MICA2DOT 2,1 105 Ember 1,6 86 IMEC Volume Relative Absolute (cm3) 1 1,4 2,1 2,9 3,7 5,2 0,7 1 imec 2005 FirstName LastName Activity / Group 18

19 Performance overview Internet gateway USB radio interface Wireless sensor 1 Average Power Consumption ( uwatt ) Current (ma) μw RECEIVE TRANSMIT SENSING and POWER CONTROL SLEEP SLEEP SLEEP Measurement Interval (s) Time (s) With synchronization errors Ideally synchronized Unsynchronized imec 2005 FirstName LastName Activity / Group

20 3D Wireless Sensor Platform: present and future Package-centric techniques Advanced IC-centric techniques: through-wafer via s wafer thinning high-density solder interconnects wafer 1 wafer 2 < 100um 3 5 Full wafers (6 or 8 ) imec 2005 FirstName LastName Activity / Group 20

21 Future 3D platform with application and power layer imec 2005 FirstName LastName Activity / Group 21

22 imec 2005 FirstName LastName Activity / Group 22