Advanced Technologies and Equipment for 3D-Packaging

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1 Advanced Technologies and Equipment for 3D-Packaging Thomas Oppert Semicon Russia 15 th May 2014

2 Outline Short Company Introduction Electroless Plating on Wafer Level Ultra-SB 2 - Wafer Level Solder Balling SB 2 - Solder Jetting & Laser Reflow for 3D Devices Process Applications LAPLACE Laser Placement of Flip Chips and others Summary

3 PacTech Group - Corporate Profile 1995 PacTech GmbH founded in Berlin, Germany as spin-off from Fraunhofer-IZM st Manufacturing facility: PacTech GmbH, Nauen, Germany nd Manufacturing facility: PacTech USA Inc., CA, USA 2005 Equipment Field Service & Support Center, Thailand 2006 NAGASE & Co., Ltd. takes 60% shares in PacTech PacTech Europe (HQ) rd Manufacturing facility: PacTech Asia Sdn. Bhd., Malaysia 2009 NAGASE & Co., Ltd. increases shares in PacTech to 74% 2012 > 800 Production Machines in the field 2013 > 115 patents granted PacTech USA 2013 NAGASE & Co., Ltd. increases shares in PacTech to 97,2% PacTech Group (Europe, USA, Asia): 280 employees PacTech Asia 3

4 Eletroless Plating of NiAu, NiPd, NiPdAu

5 Electroless NiAu / NiPdAu Plating & Bumping Services 1. E-less Bumping RFID attach by adhesive on antenna LCD driver 2. E-less UBM for solder ball attach Wafer Level CSP Flip chip 3. E-less OPM for fine pitch wire bonding 4. E-less Metallization for Power MOSFET application Automotive high rel./ high temp. wire bonding Copper wire bonding Wire bonding on active pad Aluminum or Copper Clip attached Wire bonding and soldering 5

6 Process Flow Ni/Au & Ni/Pd/Au Bumping Al Pad Cu Pad Zinkating Pd Seed Ni Plating Flash Au Pd Barrier Flash Au UBM for FC & WLCSP OPM for Wire Bonding 6

Volume Wafer Bumping matched to Customer s Supply Chain Requirements.

7 Turnkey Bumping Solutions Worldwide Support and Highest Quality through Turnkey Process Ownership! One Source! Volume Wafer Bumping matched to Customer s Supply Chain Requirements. 3 location worldwide: 2 nd sourcing! Development Support in customer s R&D Center Time Zone Turnkey Process Transfer to customer possible at Any Time 7

8 PacLine 300 A50 ENEPIG Plating Systems in the major OEM s 300 mm 8

9 Ultra-SB 2 Wafer Level Solder Balling

10 Wafer Level Solder Sphere Transfer 1/2 Vacuum picking of solder spheres from reservoir to stencil Removal of excess balls by Ultra Sonic & optical inspection of balls in stencil Vacuum Solder Ball Bond Tool Mask Vibration Floating Solder Balls by Ultra Sonic Jumping Solder Balls Air knife 10

11 Wafer Level Solder Sphere Transfer 2/2 Placement of solder spheres & optical inspection of balls on wafer Per robot back to cassette Next step: Reflow Solder Ball Bond Tool Mask Flux Wafer UBM 11

12 Automatic Wafer Level Solder Ball Transfer with Ultra-SB Cassette to Cassette robot handling for wafer up to 12" UPH 8" >40 wafer/hour * UPH 12" >25 wafer/hour * ball sizes: 60µm - 500µm 2x optical inspection (optional) Integrating fluxing (optional) Integrated reflow oven (optional) Integrated rework capability for yield Improvement (optional) * depending on ball size and on I/O count 12

13 SB 2 Solder Jetting & Laser Reflow

14 Advantages of SB 2 Solder Jetting Solder ball diameter capability: 40µm - 760µm (qualified for volume production) 30µm (in qualification) Solder alloys: SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi No tooling No flux No mechanical stress/contact No thermal stress No additional reflow No cleaning of flux residues Fine pitch applications (< 80µm) 14

15 Solder Sphere Jetting (SB²) 1/2 Schematic diagram of Solder Ball Bumping (SB²) process: Optical sensor Ball Reservoir Laser Singulation Disk Optical sensors N 2 Pressure sensor Reflowed solder balls N 2 gas Capillary Search level Bond level Semiconductor wafer Bond pad 15

16 Solder Sphere Jetting (SB²) 2/2 Process video for solder jetting and solder stacking 16

SB 2 - Jet Applications BGA / clcc Balling Rework/ Repair of BGA-like packages Hard Disk Drive (HGA, HSA, Hook-Up) Camera Modules Wafer Bumping Reworked Package HGA for

17 SB 2 - Jet Applications BGA / clcc Balling Rework/ Repair of BGA-like packages Hard Disk Drive (HGA, HSA, Hook-Up) Camera Modules Wafer Bumping Reworked Package HGA for HDD (Source: Seagate) Wafer Level CSP Bumping Optoelectronics/ Microoptics Filter Devices (SAW, BAW) MEMS & 3D-Packaging Camera Module Solder Jetting for Microoptics 17

18 Soldering of stacked chips Laser Beam Chip 1 Fig.1 Capillary Chip 2 Solder Ball Pin to Pin Fig.2 Pin soldering of two stacked chips 18

19 PIN-Soldering Laser Beam Fig.3 Chip FR4 Substrate PIN Au Pad Capillary Solder Ball Fig.4 Pin soldering onto organic substrate 19

20 3D HGA Soldering Soldering Read-Write Head of a Hard Disk Drive (HDD) Movie starts with mouse click

21 Hook-Up Soldering for HDD 1/5 Solder Jetting FPC - Solder jetting with 2x 760µm - Solder alloy SAC305 Solder Jetting FPC - Solder jetting with 1x 760µm - Solder alloy SAC305

22 Hook-Up Soldering for HDD 2/5 Solder Jetting FPC - Solder jetting with 2x 760µm - Solder alloy SAC305

23 Hook-Up Soldering for HDD 3/5 Solder Jetting FPC - Solder jetting with 1x 760µm - Solder alloy SAC305

24 Hook-Up Soldering for HDD 4/5 Solder Jetting VCM - Middle pad with 3x solder ball stacking, each 760µm - Wire soldering left and right with 1x 760µm - Solder alloy SAC305

25 Hook-Up Soldering for HDD 5/5 Solder Jetting VCM - Middle pad with 3x solder ball stacking, each 760µm - Wire soldering left and right with 1x 760µm - Solder alloy SAC305

26 CMOS Camera Market

27 Camera Module Terminal Soldering VCM Terminal Contacts

28 VCM Camera Module Terminal Soldering 1. Gap Between FPCB and Pad < 200um (for better wettability on VCM and Gold Pad) Solder 2. Length of FPCB > 600UM (for better solder flow without housing burning issues) Gold Pad 3. Width of Pad with angle Tolerance > 200UM ( for um solder ball) Figure above shows the best case for Camera Module bonding

29 Soldering Quality of Terminal Bonding Picture above shows good solder wettability on Gold Pad and VCM. Solder covered 100% of the pad and 90% of the pin. 400µm Solder ball size was used (SAC 305) without flux.

30 Camera Module Bonding with 600µm solder balls Reliable wetting on the pre-soldered ground pad as well as on the titanium pin. No burnings or discoloration of the epoxy material around the solder connection, pad or pin. Minimized influence of alternating quality of the pre-soldered ground pad, with 600µm solder spheres.

31 Camera Module Bonding with 2x 300µm solder ball

32 LAPLACE (LAser PLACEr)

33 33 LAPLACE with Reel-To-Reel-System

34 LAPLACE Flip Chip Bonding Final assembled Flip Chip Flip Chip placement and laser reflow 34

35 LAPLACE Capacitor Bonding LAPLACE Capacitor attach on PCB 35

36 Cantilever Assembly Line for Probe Cards Cantilever Sorter Cantilever Bonder SB 2 -Jet: Solder Jetting Features Input: MEMS substrates Inspection of cantilever Laser cutting with the Laser Placement of cantilever in waffle packs Features Cantilever supplied in waffle packs Cantilever pick & rotation in vertical position Substrate height measurement Dual camera for x, y alignment of cantilever to the substrate Probe tip z alignment Laser bonding of cantilever Post inspection Cantilever rework capability Features Solder Jetting on ceramic substrate Solder Balls sizes: µm Solder alloys capability: PbSn, SnAgCu or AuSn 36

37 Cantilever Bonder Specifications Linear axis or gantry system Probe card sizes up to 13 inch Full process control Alignment control by position bonding Placement Accuracy: down to +/- 2µm High power laser for bond reflow Height control: 1µm accuracy Cantilever thickness: µm Pitch: down to 60µm High mechanical stability of probes Process suitable for rework and complete card assembly 37

38 Summary Brief Introduction in electroless plating Solder Balling Processes Wafer Level Ultra-SB 2 process SB 2 -process for 3D applications Laser Placement and bonding by LAPLACE

39 THANK YOU

Wafer Bumping & Wafer Level Packaging for 300mm Wafer

31 st International Conference on Electronics Manufacturing and Technology - IEMT 2006 8-10 November 2006 Sunway Resort Hotel, Petaling Jaya, Malaysia Wafer Bumping & Wafer Level Packaging for 300mm Wafer