11th European Advanced Equipment Control/Advanced Process Control Conference 2011 (AEC/APC 2011) Dresden, xxx Germany 4-6 April 2011 ISBN: 978-1-61839-085-1
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TABLE OF CONTENTS Chamber Matching and Spare Parts Influence in III-V Plasma Etching... 1 H.P. Maucher, G. Boedege, M. Klick In Situ Monitoring of Plasma Etch Processes of Ultra Low-k Dielectrics Using Optical Diagnostic Methods... 14 Norbert Lang, Sven Zimmermann, Benjamin Uhlig, Matthias Schaller, Stefan E. Schulz, Jürgen Röpcke Correlation Between in Situ and Ex Situ Analysis of Ultra Low-k Dielectric Etch Processes... 36 Benjamin Uhlig, Norbert Lang, Sven Zimmermann, Matthias Schaller Modified Principal Component Analysis for Real-Time Endpoint Detection of SiO 2 Etching Using Plasma Impedance Monitoring... 54 Haegyu Jang, Daekyoung Kim, Heeyeop Chae Chamber Matching at Sputter Clean Chambers with Inductively Coupled Plasma... 70 N. Urbansky, S. Franke, T. Beger, M. Klick, R. Rothe APC/AEC-control of AMAT ASP + Chambers by Monitoring Heating-lamp Current for Prevention of Metal Corrosion... 80 Karsten Spinger, Andreas Brand, Dieter Wenz Substitution of Tool Checks in Etch by Deployment of FDC Software Maestria... 81 Martin Birkle, Dennis Föh Anomaly Detection in FDC Time Series Data... 90 James N D Amour, Jan Neirynck, Vladimir Martyanov, Eugene Tuv Design Specific APC: Dedicated Spatial Compensation Using Design Analysis and Product Classification... 104 Martin Häcker, Clemens Utzny Multi-factor Statistic Modelling of Transport Processes on Factory Level in Semiconductor Manufacturing... 117 André Gellrich, Thomas Wagner, Volodymyr Vasyutynskyy, Klaus Kabitzsch A New Variance Component Algorithm Tailored to the Needs of Semiconductor Industry... 130 Ulf Seidel Leveraging Experimental Design to Improve Virtual Metrology Predictions... 141 Tamara Byrne Improvement of Prediction Performance in Virtual Metrology... 153 A. Dementjev, H.-D. Ribbecke Using Operating Envelope Models to Create Improved Operation at Unit Process and Fab Levels... 173 Robin Brooks, Alan Mahoney, John Wilson, Na Zhao Economic Control Strategy Selection... 186 Andrea Laurenzi, Stefano Pettirossi Advanced Process Control at Wafertest... 189 Andreas Thamm, Jan Zimpel, Knut Voigtländer, Olaf Reichelt Conductivity, Thickness and Defect Characterization of Thin-films with Imaging Eddy Current Technology for Inline and Offline Applications... 203 H. Heuer, S. Hillmann, M. Schulze, M. Klein Optimal Metrology Sampling Strategies for AEC/APC Applications... 214 Anand Subramanian, Tyrone Vincent, Kameshwar Poolla Use of a Sensor Network for Semiconductor Production Plants: Motivation, Design and Preliminary Tests... 221 Francesco Rametta, Antonio Bonanno, Daniele LaValle, Stefano Vitturi Mastering the Flood of Data Enabling Relational Standard Databases to Store High Frequent Sensor Data... 238 Wolfgang Benn, Sebastian Leuoth, Alexander Adam Application of APC Solutions on Coating Plants in the Photovoltaic Industry... 248 S. Dittrich, Torsten Gertler, Bert Müller Add-on Sensor Using Object Messaging Protocol E54.9 - Modbus/TCP... 263 Dirk Suchland Achieving World-class Production Cycle Time Performance by a Start-up Factory in High Volume Manufacturing... 275 Adar Kalir Use of FDC for RTP Equipment Monitoring: Motivation and Solutions... 289 Marco Cavallaro, Marco Bagagiolo, Salvatore Restivo
Comparison of Control Methods for Temperature Control of Heated Plates... 302 D. de Roover, J.L. Ebert, G.W. van der Linden, L.L. Porter, R.L. Kosut, A. Emami-Naeini In-situ Analytics for Development and Control of Atomic Layer Deposition Processes... 320 Martin Knaut, Matthias Albert, Johann W. Bartha Stepper and Cleantrack Control using Tool Interdiction Monitoring System (TIMS) in TI s Freising FAB... 342 Gernot Biese Predictive Process Control of Photoresist Thickness Variation... 343 Gabriele Porri, Massimo Carattoli, Alessia Verticchio, Milena Vaccaro, Fabio Ferri, Giorgio Tullio, Giuseppe Murzilli, Sonia Tatti, Mario Ciccolella, Patricia Maccarone, Massimo Ianni Cost Benefit Analysis Model of In-line Inspection in Wafer Fabrication Line... 364 Israel Tirkel, Gad Rabinowitz Automatic Metrology Recipe Creation A study of a productive Application... 384 André Holfeld, Mark Stark, Jörg Nothnagel An APC Strategy for LED Manufacturing Focusing on Yield Improvement... 396 James Moyne Deployment of Advanced Process Control in LED Manufacturing... 423 Heribert Zull Providing APC and Related Updates to the International Technology Roadmap for Semiconductors (ITRS) in 2011... 448 James Moyne Enhanced Equipment Health Monitoring Practice and Methodology... 468 Gino Crispieri GLOBALFOUNDRIES and the New Dynamic of the Global Semiconductor Industry... 478 Elke Eckstein Future Control Concept in a Mature 200mm Fab Virtual Metrology, R2R Control, Dynamic Sampling... 479 Thomas Leitermann Strategic Objective for Process Optimization of Cell Productions in the Photovoltaic... 480 Dietmar Roth Q-Goal: Zero PPM for Automotive IC's... 481 Reinhard Senf Semiconductor Manufacturing in Europe A Reality Test... 495 Georg Kelm Manufacturing Applications Enabled By Detailed Equipment Data... 496 Alan Weber In-situ FDC by Interferometric Endpoint Detection During Plasma Etch... 498 Frank Hoffmann Using Optical Emission Spectroscopy (OES) for Leak Monitoring of Sputter Preclean Chambers... 508 P. Heger, S. Franke, T. Beger, G. Hoyer Stochastic Gradient Boosting Methodology for Virtual Metrology on a PVD Tool... 512 D. Gleispach, P. Scheibelhofer, G. Hayderer On the Way to a Comprehensive APC Library: Identification of Process Models and Design of Controllers for Vacuum Coating Processes... 518 U. Hartung, T. Unkelbach, L. Gebauer, A. Dementjev, S. Dittrich Real-Time Wafer Temperature Sensing During A Live Plasma Process... 532 Matteo Galbiati, Gary Marshall, Mei-Wei Tsao Real-time Process Control Based on Simultaneous In-Situ Plasma Emission and Electrical Plasma Key Parameter Monitoring... 535 D. Rogler, F. Stahr, H. Auerswald, P. Klement, K.V. Maydell Developing a Predictive Maintenance Model to Minimize Helium Backside Cooling Faults on a AMAT Centura Dry Etch Tool... 538 Stefan Schindler, Sandrine Monot, Frédéric Duvivier Near In-Situ Fault Detection and Classification of VLSI Contacts... 541 Shai Haimson, Lior Rettig Prediction of Wafer Homogeneity Maps Using a Virtual Metrology Scheme Consisting of Time Resolved OES Measurements and a Neural Network... 543 Sven Zimmermann, René Reich, Manuela Zacher, Stefan E. Schulz, Thomas Gessner Development of an Interactive Modeling Based Diagnostic Tool set for Plasma Processes... 549 Giuseppe Fazio, Giuseppe Garozzo, Bernard Keville, Aidan Cowley, Stephen Daniels, Antonino La Magna, Loredana Chiaramente, Andrea Schirru, João Gabriel Pires, Nuno Almeida
Modular Approach for High Volume Data Analysis Modelling, Visualization and Reporting... 552 Jan Zimpel, Knut Voigtländer, Michael Rettelbach, Peter Doherr, Andreas Thamm, Roland Beier Process Analysis and Control Engineering for APC in EB PVD and PMS Coating Processes... 560 A. Dementjev, M. Benesch, H. Kubin, C. Metzner, U. Hartung Comparison of Yield Prediction Techniques against Common Manufacturing Data Quality Issues... 571 Ramy Baly, James Moyne, Hazem Hajj Enhancing Legacy Diffusion Cell Controllers with an APC Framework for Fault Detection... 574 Marco Bagagiolo, Brad Schulze, Justin Taylor A New Approach for Cleanroom Monitoring by Using AMOR (Ambient Monitoring Robot)... 578 Christoph Hocke Introduction of the openapc Foundation e.v... 584 Bernhard Schimunek Information Technology Used for Process Control System Implementation in IMPROVE... 590 Giuseppe Fazio, Flavio Crippa, Silvia Zoia, Andreas Kyek, Cristian Valeanu, Marius Ghiga, Josef Bichlmeier Random Tree Ensembles for Predictive Maintenance of Filament Breakdown on an Implanter... 599 P. Scheibelhofer, M. Berger, P. Schröttner, D. Gleispach, G. Hayderer FFAB's Metal Control Strategy with u-pcd... 604 Michael Bauer Applied Materials Precision 5000 CVD Lamp Module Health Monitoring for Improved Fault Prediction/Detection... 605 Gunter Welde, P. Heger, Martin Kunath Dynamic Dose to Target (D2T) Filtering In Litho Exposure R2R Controller... 611 Boyidi Ravi Kiran, Sanjay Kumar, Srinivasan Visveswaran Correlation Analysis of WAT Data to FDC Data from a CVD Tool... 615 A. Proßegger, F. Fratte, D. Gleispach, G. Hayderer Author Index