Menachem Shoval Metro450

Semi CNSE open day, Jun 2013 Menachem Shoval Metro450

Business environment Why changing the wafer size? 450mm: IC community status and schedule The equipment vendors dilemma Metrology industry the Israeli example Metro450 consortium Boundaries: Focusing on the platform Metro450 metrology challenges and Goal Consortium plan: 5 work packages Options for collaboration between Metro450 and others Summary Wafers Metrology Equipment = Measurement and Inspection Tools for Lithography, Thin Film and Defect Inspection, Used on the Production Floor 2

Business environment Why change the wafer size? 450mm: IC community status and schedule The equipment vendors dilemma Metrology industry the Israeli example Metro450 consortium Boundaries: Focusing on the platform Metro450 metrology challenges and Goal Consortium plan: 5 work packages Summary 3

WW GDP (Gross Domestic Products) WW economy is struggling Although ups and downs, the semiconductor Industry continue growing

Market in Billions of Dollars Another look at the Semiconductor Market

Market in Billions of Dollars Another look at the Semiconductor Market ~ $350B market Exponential growth Ongoing technology improvements Need huge investments

Why changing the wafer size? Component prices are trending down Manufacturing cost is trending up For how long can the silicon cow can be milked? As long as normalized die cost is trending down Increasing wafer size will enable it Daniel George MIT, 2005

It had happened before ITRS 2005 Gardner 2011

TSMC plan the first 450mm pilot line in 2017 Samsung invested in ASML 450mm EUV Intel Continue building its 450mm FAB in Portland, G450C, the 450mm consortium, continue in full gear in developing process modules ITRS 450mm Project is running G450C

The Equipment vendors are expected to carry most of the development budget themselves Only limited orders for preliminary /one of a kind tools needed for 450mm process development have been issued For small and medium companies investing 6 years ahead without holding actual orders may be beyond their capability How can this gap be closed? Collaborating through consortia and using public/government money is one way to stay relevant The Metro450 consortium, now running in Israel is a good example

Equipment sales in B$ 40 35 30 25 20 15 10 5 0 Wafer Fab Equipment = 35B$ Process Control Equipment = 3.5B$ * Not including 1) Mask Inspection/correction 2) Back End (AMAT, Pixer/Zeiss, Orbotech) 15

Equipment sales in B$ 40 35 30 25 20 15 10 5 0 Semiconductors $350B Fab Equipment $35B Metro Tools $3.5B Israel 1.3B Wafer Fab Equipment = 35B$ Process Control Equipment = 3.5B$ * Not including 1) Mask Inspection/correction 2) Back End (AMAT, Pixer/Zeiss, Orbotech) 16

Equipment sales in B$ 40 35 30 25 20 15 10 5 0 Semiconductors $350B Fab Equipment $35B Metro Tools $3.5B Israel 1.3B Wafer Fab Equipment = 35B$ Process Control Equipment = 3.5B$ * Not including 1) Mask Inspection/correction 2) Back End (AMAT, Pixer/Zeiss, Orbotech) 17

5 Member companies: AMIL, Nova, Jordan Valley, Nanomotion and Intel. AMIL - Metrology division of AMAT: CD SEM, DR SEM, Defect Inspection Nova Integrated and stand alone: TF Metro, OCD technology Jordan Valley- X-ray based metrology: TF and Back End Nanomotion: Advance stage movement technology using Piezo electric elements Intel: Advanced parallel computing; Fab/User point of view 2 Observer companies: Mellanox, CI-Semi Mellanox: Fast inter-sever communication / Huge data transfer CI-Semi: Integrated temperature measurement techniques 4 Universities, 14 researchers from: The Technion, BGU, TAU, Haifa University Israeli Chief Scientist Office budget (~ 66%)

1. Focus on Metro tool platform, not on the core IP 2. Be ready to meet 2017 design rules (<10nm) 3. Focus on High volium Manufacturing (HVM) readiness on 2017 4. We develop technologies relevant for 450mm tools. We do not build toos The name of the game is TPT = 2.5X faster to meet CoO expectations 21

3 Year Goal: Develop and demonstrate the generic technologies needed for the best 450mm metrology platform The differences: The challenges: 300mm 450mm Dies out X 1.0 X 2.5 Stage accuracy 1.0 u 0.1 u Data Processing 1GB/S 100GB/s Backside Contamination 1 PWP /500nm 1 PWP/50nm Reaction response time 12 hours 1 hour 22

WP1: Wafer Handling / Chucking / Stepping WP 2: Sampling Optimization WP3: Wafer Damage and Contamination WP4: 450mm Standard Calibration Wafer WP5: Fast Data Collection and Processing 23

Business environment Why change the wafer size? 450mm: IC community status and schedule The equipment vendors dilemma Metrology industry the Israeli example Metro450 consortium Boundaries: Focusing on the platform Metro450 metrology challenges and Goal Consortium plan: 5 work packages Options for collaboration between Metro450 and others Summary 24

Collaborating with CNSE/ G450 An umbrella contract between OCS/Matimop and CNSE was signed First version of collaboration plan between CNSE/G450 and Metro450 had been agreed. Actual work started OCS/ISRD agreement with Eniac Enabling Metro450 companies to also work with Eniac More opportunities in Europe: IMEC, Fraunhoffer, Leti, TNO ASML, Zeiss, FP7, EEMI, Eniac..

Damage data; 450 mm wafers WP3 : damage /contamination prevention Damage precursor modeling Capability; Proof of Concept HVM Worthiness Metrology Performance Continual Improvement (EPM) 300+- 450 mm prototype fabrication WP4 : Standard Metro Calibration Wafer Design/Specs/ Usage model Metro450C Confidential 6/17/2013 26

Moving to a 450mm wafer is not an option, it is a requirement for the semiconductor industry. First 450mm Fab will run in the second half of this decade Converting Metrology tools to 450mm is not trivial, as X2.5 dies out @ >10nm design rules are expected Equipment vendors in general and metrology vendors specifically, need to carry most of the development burden Collaboration work, consortia and public / government money can help being prepared on time 27