CENTER FOR MICROSYSTEMS TECHNOLOGY (CMST) IMEC UGENT TECHNOLOGIEPARK (BLDG 914) B-9052 GENT HTTP://WWW.CMST.BE
CMST: DESIGN & TECHNOLOGY OF MICROSYSTEMS
ORGANIZATIONAL STRUCTURE Faculty of Engineering and Architecture Smart Systems and Energy Technology Department of Electronics and Information Systems Body Area Networks Personnel Infrastructure Equipment Personnel Equipment
WORKING MODEL Open innovation partnership Funded projects (UGent funds, FWO, IWT-SBO) SIF program Large area electronics Human++, GaN, Solar Funded projects (EC, IWT) Industrial Affiliation programs
CMST FIGURES Employees : 55 (status 5/2013) Imec payroll : 25 University payroll : 30 Income UGent : University projects / grants / wages Imec : Industrial project income Investments in 2011-2012 : 3 MEuro EU - FP7 Bilateral Ind. IWT - SBO IWT - O&O Personal grants IWT-SBO FWO UGent projects Sponsored grants imec budget UGent budget
Biomedical & Health Telecom Energy Ambient intelligence Displays & Lighting CMST TECHNOLOGY AND APPLICATION DOMAINS Advanced Packaging X X X X Stretchable Microsystems X X X Polymer Structuring and microfluidics X X Polymer Photonics and Laser Technology X X X X Smart Power X X X Display technology X X
ADVANCED PACKAGING Foil-based interconnects UTCP Component embedding Modeling 2 nd level assembly PET-Cu & PET-Al UTCP processing Embedding in PCB UTCP embedding Yield & Cost Processing Adaptive circuitry RF UTCP Embedding in foil UTCP stacking High-frequency Testing & Analysis CHIP2FOIL IMOLA HOLST-SIF IMEC-IAP PhD Post-PhD HERMES HOLST-SIF IMOLA IMEC-IAP PhD I SEE PROSPERITA GREENELEC THEMA-CNT SUGAR BILATERAL Contact : Maarten.Cauwe@elis.UGent.be
RGB display Fitness monitor Conformable light tiles Conformable light systems Washing Endurance testing STRETCHABLE MICROSYSTEMS Printed circuit board and foil based Textile integration Characterization EC-FP7 PLACE-IT HUMAN++ HOLST-SIF EC-FP7 PLACE-IT EC-FP7 PASTA HOLST-SIF EC-FP7 ARMOURS EC-FP7 PLACE-IT EC-FP7 PASTA HOLST-SIF HUMAN++ Contact : Frederick.Bossuyt@elis.UGent.be
POLYMER STRUCTURING AND MICROFLUIDICS Soft polymer based bioreactors Rigid bioreactors Electronics integration Porous membrane integration Cell seeding Glass / PC bioreactor Osmotic pump Stretchable MEA s PDMS porous membranes Biodegradable bioreactors Si Microsieve integration Chip in PDMS microfluidics UTCP / thin-film stretch integration IWT-SBO Hepstem, FWO-BioPOM, imec PhD grant EC-FP7-MIRACLE, EC-FP7 Hemibio IWT-SBO Brainstar, imec PhD grants (2) Contact : Jan.Vanfleteren@elis.UGent.be
POLYMER PHOTONICS AND LASER TECHNOLOGY Board-level optical interconnects Fiber connectivity Artificial optical skin Opto-electronic nose Laser patterning organic electronics Flex waveguide Laser cleaved fiber OE pressure sensor Stretch waveguide Patterned flex OLED Waveguide fluorescence Embedded VCSEL Self-written waveguide OE shear sensor PEDOT ablation EC-FP7 FIREFLY BILATERAL IWT O&O LIAM IWT O&O EP2CON IWT-SBO FAOS EC-FP7 PHOSFOS EC-FP7 ACTMOST HOLST-SIF HOLST-SIF EC-FP7 FAST2LIGHT EC-FP7 IMPROV Contact : Geert.VanSteenberge@elis.UGent.be
DISPLAY SYSTEMS Microdisplays Solid-state projection Multiview 3-D projection Smart lenses LC and polymers LCOS LED drivers Optical setup (VUB) Curved display technology Materials research Micromirrors Cockpit display Efficient multiview coding Solar contact lens Light steering IWT-SBO Gemini EC-FP7 ODICIS EC-FP7 ODICIS FWO 3D FWO 3D FWO Licofast FWO - Licofast IWT-SBO - Secondos Contact : Herbert.DeSmet@elis.UGent.be
SMART POWER ASIC DESIGN Integrated power converters Drivers for displays / lighting Smart PV components MEMS devices / drivers Power devices (TCAD) Bistable LCD driver MEMS microswitch Si lateral IGBT Monolithic drivers + rectifiers for DC-DC converters OLED driver Active bypass IC, Reconfiguration switch MEMS bias generator GaN HEMT Bilateral EC-FP7 IMOLA IWT-SBO Smart PV Bilateral IIAP GaN-on-Si Contact : Jan.Doutreloigne@elis.UGent.be
CLEANROOM and LAB FACILITIES Cleanroom area : 730 m 2, 438 m 2 production bays 120 m 2 ISO 3 / 306 m 2 ISO 4 / 12 m 2 ISO 5 Lab facilities area : 290 m 2 14
Analysis and measurement Process analysis Surface analysis: - 3D optical profilometry (WYKO) - Step height measurement (Tencor) - Static contact angle Microscopy: - Optical - SEM-EDS Electrical measurements Measurement platforms: - Four-point measurements - Custom PCB probe table - Parametric probe station Analysis equipment: Source-measure unit, Parametric analyzer, Precision LCR meter, RF Impedance analyzer, Spectrum analyzer, Vector Network Analyzer (10 MHz 50 GHz) Reliability & Failure Analysis Cross sections: - Molding in resins - Ion beam polisher - Au & C coater Climate Chambers: - TS, THT, TCT - In-situ resistance monitoring Solder ball Mechanical testing: - Peel force (90 &180 ) - Shear and pull testing - Stress/strain - Cyclic endurance 15
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