DE275-102N06A RF Power MOSFET

Similar documents
C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

Features. Symbol JEDEC TO-220AB

AUTOMOTIVE MOSFET. C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

IRF740 N-CHANNEL 400V Ω - 10A TO-220 PowerMESH II MOSFET

STW20NM50 N-CHANNEL Tjmax Ω - 20ATO-247 MDmesh MOSFET

V DSS R DS(on) max Qg. 30V 3.2mΩ 36nC

RoHS Compliant Containing no Lead, no Bromide and no Halogen. IRF9310PbF SO8 Tube/Bulk 95 IRF9310TRPbF SO8 Tape and Reel 4000

UNISONIC TECHNOLOGIES CO., LTD 50N06 Power MOSFET

N-channel enhancement mode TrenchMOS transistor

CoolMOS TM Power Transistor

V DS 100 V R DS(ON) 10V 72.5 m: Q g typ. 15 nc Q sw typ. 8.3 nc R G(int) typ. 2.2 Ω T J max 175 C

Power MOSFET. IRF510PbF SiHF510-E3 IRF510 SiHF510. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 100 V Gate-Source Voltage V GS ± 20

TSM2N7002K 60V N-Channel MOSFET

Power MOSFET FEATURES. IRF610PbF SiHF610-E3 IRF610 SiHF610. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 200 V Gate-Source Voltage V GS ± 20

IRFP460LC PD HEXFET Power MOSFET V DSS = 500V. R DS(on) = 0.27Ω I D = 20A

Power MOSFET FEATURES. IRF740PbF SiHF740-E3 IRF740 SiHF740. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 400 V Gate-Source Voltage V GS ± 20

Power MOSFET FEATURES. IRFZ44PbF SiHFZ44-E3 IRFZ44 SiHFZ44 T C = 25 C

IRLR8743PbF IRLU8743PbF HEXFET Power MOSFET

BUZ11. 30A, 50V, Ohm, N-Channel Power MOSFET. Features. [ /Title (BUZ1 1) /Subject. (30A, 50V, Ohm, N- Channel. Ordering Information

Power MOSFET FEATURES. IRL540PbF SiHL540-E3 IRL540 SiHL540

W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery e 38. V/ns T J. mj I AR

C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

IRF6201PbF. HEXFET Power MOSFET V DS 20 V. R DS(on) max mω. Q g (typical) 130 nc 27 A. Absolute Maximum Ratings

W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery f 5.0. V/ns T J. mj I AR. Thermal Resistance Symbol Parameter Typ. Max.

Power MOSFET FEATURES. IRF540PbF SiHF540-E3 IRF540 SiHF540. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 100 V Gate-Source Voltage V GS ± 20

IRF5305PbF. HEXFET Power MOSFET V DSS = -55V. R DS(on) = 0.06Ω I D = -31A

OptiMOS 3 Power-Transistor

SMPS MOSFET. V DSS Rds(on) max I D

Lower Conduction Losses Low Thermal Resistance to PCB ( 0.5 C/W)

W/ C V GS Gate-to-Source Voltage ± 16 dv/dt Peak Diode Recovery e 21

OptiMOS Power-Transistor Product Summary

91 P C = 25 C Power Dissipation 330 P C = 100 C Power Dissipation Linear Derating Factor

Features. Description. Table 1. Device summary. Order code Marking Package Packing. STP110N8F6 110N8F6 TO-220 Tube

Power MOSFET FEATURES. IRF9640PbF SiHF9640-E3 IRF9640 SiHF9640

V DSS I D. W/ C V GS Gate-to-Source Voltage ±30 E AS (Thermally limited) mj T J Operating Junction and -55 to + 175

A I DM. W/ C V GS Gate-to-Source Voltage ± 20. Thermal Resistance Symbol Parameter Typ. Max. Units

STP10NK80ZFP STP10NK80Z - STW10NK80Z

OptiMOS TM Power-Transistor

N-Channel 60-V (D-S), 175 C MOSFET

Description. TO-220F FDPF Series. Symbol Parameter FDP26N40 FDPF26N40 Units V DSS Drain to Source Voltage 400 V V GSS Gate to Source Voltage ±30 V

IRF A, 100V, Ohm, N-Channel Power MOSFET. Features. Ordering Information. Symbol. Packaging. Data Sheet January 2002

IRF840. 8A, 500V, Ohm, N-Channel Power MOSFET. Features. Ordering Information. Symbol. Packaging. Data Sheet January 2002

STP60NF06FP. N-channel 60V Ω - 30A TO-220FP STripFET II Power MOSFET. General features. Description. Internal schematic diagram.

STP60NF06. N-channel 60V Ω - 60A TO-220 STripFET II Power MOSFET. General features. Description. Internal schematic diagram.

N-Channel 40-V (D-S) 175 C MOSFET

IRF640, RF1S640, RF1S640SM

IRF150 [REF:MIL-PRF-19500/543] 100V, N-CHANNEL. Absolute Maximum Ratings

SPW32N50C3. Cool MOS Power Transistor V T jmax 560 V

SIPMOS Small-Signal-Transistor

A I DM. W/ C V GS Gate-to-Source Voltage ± 12. Thermal Resistance Symbol Parameter Typ. Max. Units

AUIRFR8405 AUIRFU8405

STN3NF06L. N-channel 60 V, 0.07 Ω, 4 A, SOT-223 STripFET II Power MOSFET. Features. Application. Description

Power MOSFET FEATURES. IRF740PbF SiHF740-E3 IRF740 SiHF740. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 400 V Gate-Source Voltage V GS ± 20

RFG70N06, RFP70N06, RF1S70N06, RF1S70N06SM

STW34NB20 N-CHANNEL 200V Ω - 34A TO-247 PowerMESH MOSFET

IRLR8729PbF IRLU8729PbF

Final data. Maximum Ratings Parameter Symbol Value Unit

QFET TM FQP50N06. Features. TO-220 FQP Series

Power MOSFET FEATURES. IRF520PbF SiHF520-E3 IRF520 SiHF520. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 100 V Gate-Source Voltage V GS ± 20

P-Channel 20 V (D-S) MOSFET

NTMS4920NR2G. Power MOSFET 30 V, 17 A, N Channel, SO 8 Features

STP80NF55-08 STB80NF55-08 STB80NF N-CHANNEL 55V Ω - 80A D2PAK/I2PAK/TO-220 STripFET II POWER MOSFET

N-Channel 100 V (D-S) MOSFET

AUIRLR2905 AUIRLU2905

IRFR3707Z IRFU3707Z HEXFET Power MOSFET

STP10NK60Z/FP, STB10NK60Z/-1 STW10NK60Z N-CHANNEL 600V-0.65Ω-10A TO-220/FP/D 2 PAK/I 2 PAK/TO-247 Zener-Protected SuperMESH Power MOSFET

STB75NF75 STP75NF75 - STP75NF75FP

STB60N55F3, STD60N55F3, STF60N55F3 STI60N55F3, STP60N55F3, STU60N55F3

IRF540N. HEXFET Power MOSFET V DSS = 100V. R DS(on) = 44mΩ I D = 33A

N-Channel 20-V (D-S) 175 C MOSFET

TSM020N03PQ56 30V N-Channel MOSFET

SMPS MOSFET. V DSS R DS (on) max I D

Power MOSFET. IRF9520PbF SiHF9520-E3 IRF9520 SiHF9520. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS V Gate-Source Voltage V GS ± 20

OptiMOS 3 Power-Transistor

IRF1010N. HEXFET Power MOSFET V DSS = 55V. R DS(on) = 11mΩ I D = 85A

IRL2203N. HEXFET Power MOSFET V DSS = 30V. R DS(on) = 7.0mΩ I D = 116A

W/ C V GS Gate-to-Source Voltage ± 30 dv/dt Peak Diode Recovery e V/ns T J. mj I AR

STP55NF06L STB55NF06L - STB55NF06L-1

STP62NS04Z N-CHANNEL CLAMPED 12.5mΩ - 62A TO-220 FULLY PROTECTED MESH OVERLAY MOSFET

P-Channel 1.25-W, 1.8-V (G-S) MOSFET

IRLR8256PbF IRLU8256PbF HEXFET Power MOSFET

STP6NK60Z - STP6NK60ZFP STB6NK60Z - STB6NK60Z-1 N-CHANNEL 600V - 1Ω - 6A TO-220/TO-220FP/D 2 PAK/I 2 PAK Zener-Protected SuperMESH Power MOSFET

IRL3803 PD D. HEXFET Power MOSFET V DSS = 30V. R DS(on) = 0.006Ω I D = 140A. Absolute Maximum Ratings. Thermal Resistance

200V, N-CHANNEL. Absolute Maximum Ratings. Features: 1 PD

IRF3710. HEXFET Power MOSFET V DSS = 100V. R DS(on) = 23mΩ I D = 57A

BSN Description. 2. Features. 3. Applications. 4. Pinning information. N-channel enhancement mode field-effect transistor

= 600 V = 56 A = 2.7 V. C2-Class High Speed IGBTs (Electrically Isolated Back Surface) = 32 ns V CE(SAT) t fi(typ. Preliminary Data Sheet

SMPS MOSFET. V DSS Rds(on) max I D

Features 1.7 A, 20 V. R DS(ON) Symbol Parameter Ratings Units

UGF W, 1 GHz, 26V Broadband RF Power N-Channel Enhancement-Mode Lateral MOSFET

STB4NK60Z, STB4NK60Z-1, STD4NK60Z STD4NK60Z-1, STP4NK60Z,STP4NK60ZFP

P-Channel 20-V (D-S) MOSFET

How To Make A Field Effect Transistor (Field Effect Transistor) From Silicon P Channel (Mos) To P Channel Power (Mos) (M2) (Mm2)

SD2942. HF/VHF/UHF RF power N-channel MOSFETs. Features. Description

MOSFET N-channel enhancement switching transistor IMPORTANT NOTICE. use

Symbol Parameter Value Unit V DS Drain-source Voltage (V GS =0) 50 V V DGR Drain- gate Voltage (R GS =20kΩ) 50 V

Transcription:

N-Channel Enhancement Mode Low Q g and R g High dv/dt Nanosecond Switching Ideal for Class C, D, & E Applications Symbol Test Conditions Maximum Ratings V DSS T J = 25 C to 150 C 00 V V DGR T J = 25 C to 150 C; R GS = 1 MΩ 00 V V GS Continuous ±20 V V GSM Transient ±30 V I D25 T c = 25 C 8 A I DM T c = 25 C, pulse width limited by T JM 48 A I AR T c = 25 C 6 A E AR T c = 25 C 20 mj dv/dt I S I DM, di/dt 0A/µs, V DD V DSS, T j 150 C, R G = 0.2Ω 5 V/ns I S = 0 >200 V/ns DE275-2N06A GATE V DSS = 00 V I D25 = 8 A R DS(on) = 1.5 Ω P DC = 590 W DRAIN P DC 590 W P DHS T c = 25 C Derate 2.0W/ C above 25 C 300 W P DAMB T c = 25 C 3.0 W R thjc 0.25 C/W R thjhs 0.50 C/W Symbol Test Conditions Characteristic Values T J = 25 C unless otherwise specified min. typ. max. V DSS V GS = 0 V, I D = 3 ma 00 V V GS(th) V DS = V GS, I D = 250 µa 3.5 5.0 V I GSS V GS = ±20 V DC, V DS = 0 ±0 na I DSS V DS = 0.8 V DSS T J = 25 C V GS = 0 T J = 125 C R DS(on) V GS = 15 V, I D = 0.5I D25 Pulse test, t 300µS, duty cycle d 2% 50 1 µa ma 1.5 Ω g fs V DS = 20 V, I D = 0.5I D25, pulse test 2.5 4.3 7 S R thjhs 0.50 C/W T J -55 +175 C T JM 175 C T stg -55 +175 C T L 1.6mm (0.063 in) from case for s 300 C Weight 2 g SG1 Features SG2 Isolated Substrate high isolation voltage (>2500V) excellent thermal transfer Increased temperature and power cycling capability IXYS advanced low Q g process Low gate charge and capacitances easier to drive faster switching Low R DS(on) Very low insertion inductance (<2nH) No beryllium oxide (BeO) or other hazardous materials Advantages SD1 SD2 Optimized for RF and high speed switching at frequencies to 0MHz Easy to mount no insulators needed High power density

Symbol Test Conditions Characteristic Values (T J = 25 C unless otherwise specified) DE275-2N06A min. typ. max. R G 0.3 Ω C iss 1650 pf C oss V GS = 0 V, V DS = 0.8 V DSS(max), f = 1 MHz 80 pf C rss 18 pf C stray Back Metal to any Pin 21 pf T d(on) 3 ns T on V GS = 15 V, V DS = 0.8 V DSS 2 ns I D = 0.5 I DM T d(off) R G = 0.2 Ω (External) 4 ns T off 5 ns Q g(on) 46 nc Q gs V GS = V, V DS = 0.5 V DSS I D = 0.5 I D25 IG = 3mA 8 nc Q gd 25 nc -Drain Diode Characteristic Values (T J = 25 C unless otherwise specified) Symbol Test Conditions min. typ. max. I S V GS = 0 V 6 A I SM Repetitive; pulse width limited by T JM 48 A V SD I F = I S, V GS = 0 V, 1.5 V Pulse test, t 300 µs, duty cycle 2% T rr 200 ns Q RM I F = I S, -di/dt = 0A/µs, V R = 0V 0.6 µc I RM 4 A CAUTION: Operation at or above the Maximum Ratings values may impact device reliability or cause permanent damage to the device. Information in this document is believed to be accurate and reliable. IXYSRF reserves the right to make changes to information published in this document at any time and without notice. For detailed device mounting and installation instructions, see the Device Installation & Mounting Instructions technical note on the IXYSRF web site at; http://www.ixysrf.com/pdf/switch_mode/appnotes/7de_series_mosfet_installation_instructions.pdf IXYS RF reserves the right to change limits, test conditions and dimensions. IXYS RF MOSFETS are covered by one or more of the following U.S. patents: 4,835,592 4,860,072 4,881,6 4,891,686 4,931,844 5,017,508 5,034,796 5,049,961 5,063,307 5,187,117 5,237,481 5,486,715 5,381,025 5,640,045

Fig. 1 Typical Output Characteristics Fig. 2 DE275-2N06A Typical Transfer Characteristics V DS = 60V PW = 4uS ID, Drain Currnet (A) 24 22 20 18 16 14 12 8 6 4 2 0 Top 8-V 7.5V 7V 6.5V 6V 5.5V Bottom 5V 0 20 30 40 50 60 V DS, Drain-to- Voltage (V) ID, Drain Current (A) 25 20 15 5 0 5 6 7 8 9 V GS, Gate-to Voltage (V) Fig. 3 Gate-to- Voltage vs. Gate Charge Fig. 4 V DS = 500 V I D = 4 A Gate-to- Voltage (V) 16 14 12 8 6 4 2 0 0 20 40 60 80 Gate Charge (nc) Capacitance (pf) 000 00 0 VD S vs. Capacitance 1 0 200 400 600 800 V DS Voltage (V) Ciss Coss Crss

DE275-2N06A Fig. 5 Package Drawing Gate Drain

DE275-2N06A Fig. 6 Class C Test Circuit 250V 13.56MHz Class C RF Test Circuit 1. T1-2:1 Turns ratio, Ferronics binocular core P/N 12-365-J Primary - 2 turns of 26 AWG, single strand Teflon Wire. Secondary - 1 turn of braid with the primary wire run inside of it. 2. L1 - < 90nH, 5 turns, 0.25" id, 18 AWG single strand magnet wire, 0.55" long. 3. C1-3000pf, 3 x 00pf, ATC capacitors, P/N 2KW. 4. C2-470pf, ATC capacitor, P/N 471JW. 5. R1-3.3 ohm, 3 x ohm Caddock resistors, P/N MP850--. 8. C4-60pf - 0pf air variable capacitor 9. L2-800nH, 6 turns, 1" id, 12 AWG single strand magnet wire, 0.85" long.. C5-250pf - 480pf mica compression capacitor, Sprague Goodman GME90901. 11. L3-5.4uH, 20 turns, 18 AWG single strand magnet wire, Micrometals core T-6-2, powered iron core. 12. C6A - 0.02uf, 2 x 0.01uf ceramic disc capacitors. 13. C6B - 0.08uf, 8 x 0.01uf ceramic disc capacitors. 14. FB1-3 x 900mu ferrite beads on 18 AWG buss wire. 6. Q1 - DE275-2N06A 7. C3-5nf, 5 x.001uf, ceramic disc capacitors

2N06A DE-SERIES SPICE Model DE275-2N06A The DE-SERIES SPICE Model is illustrated in Figure 7. The model is an expansion of the SPICE level 3 MOSFET model. It includes the stray inductive terms L G, L S and L D. Rd is the R DS(ON) of the device, Rds is the resistive leakage term. The output capacitance, C OSS, and reverse transfer capacitance, C RSS are modeled with reversed biased diodes. This provides a varactor type response necessary for a high power device model. The turn on delay and the turn off delay are adjusted via Ron and Roff. DRAIN Ld 4 20 GATE Lg Doff Roff D1crs 5 6 D2crs 8 Rd 1 Ron 2 3 M3 Dcos Rds Don 7 Ls 30 SOURCE Figure 7 DE-SERIES SPICE Model This SPICE model may be downloaded as a text file from the IXYSRF web site at http://www.ixysrf.com/products/switch_mode.html http://www.ixysrf.com/spice/de275-2n06a.html Net List: *SYM=POWMOSN.SUBCKT 2N06A 20 30 * TERMINALS: D G S * 00 Volt 6 Amp 1.6 Ohm N-Channel Power MOSFET M1 1 2 3 3 DMOS L=1U W=1U RON 5 6.5 DON 6 2 D1 ROF 5 7 1.0 DOF 2 7 D1 D1CRS 2 8 D2 D2CRS 1 8 D2 CGS 2 3 1.9N RD 4 1 1.6 DCOS 3 1 D3 RDS 1 3 5.0MEG LS 3 30.5N LD 4 1N LG 20 5 1N.MODEL DMOS NMOS (LEVEL=3 VTO=4 KP=2.3).MODEL D1 D (IS=.5F CJO=P BV=0 M=.5 VJ=.2 TT=1N).MODEL D2 D (IS=.5F CJO=400P BV=00 M=.6 VJ=.6 TT=1N RS=M).MODEL D3 D (IS=.5F CJO=400P BV=00 M=.35 VJ=.6 TT=400N RS=M).ENDS Doc #9200-0221 Rev 5 2009 IXYS RF An IXYS Company 2401 Research Blvd., Suite 8 Fort Collins, CO USA 80526 970-493-1901 Fax: 970-493-1903 Email: sales@ixyscolorado.com Web: http://www.ixyscolorado.com