TIP140, TIP141, TIP142, (NPN); TIP145, TIP146, TIP147, (PNP) Darlington Complementary Silicon Power Transistors



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TIP140, TIP141, TIP142, (); TIP145, TIP146, TIP147, () Darlington Complementary Silicon Power Transistors Designed for generalpurpose amplifier and low frequency switching applications. Features High DC Current Gain Min h FE = 00 @ I C = A, V CE = 4 V CollectorEmitter Sustaining Voltage @ 30 ma V CEO(sus) = 60 Vdc (Min) TIP140, TIP145 = 80 Vdc (Min) TIP141, TIP146 = 0 Vdc (Min) TIP142, TIP147 Monolithic Construction with BuiltIn BaseEmitter Shunt Resistor These are PbFree Devices* MAXIMUM RATINGS Rating Symbol TIP140 TIP145 TIP141 TIP146 TIP142 TIP147 Unit Collector Emitter Voltage V CEO 60 80 0 Vdc Collector Base Voltage V CB 60 80 0 Vdc Emitter Base Voltage V EB Vdc Collector Current Continuous Peak (Note 1) I C 15 Adc Base Current Continuous I B 0.5 Adc Total Power Dissipation @ T C = 25 C Operating and Storage Junction Temperature Range THERMAL CHARACTERISTICS P D 125 W T J, T stg 65 to +150 C Characteristic Symbol Max Unit Thermal Resistance, JunctiontoCase R JC C/W AMPERE DARLINGTON COMPLEMENTARY SILICON POWER TRANSISTORS 600 VOLTS, 125 WATTS SOT93 (TO218) CASE 340D STYLE 1 CASE 340L STYLE 3 NOTE: Effective June 2012 this device will be available only in the package. Reference FPCN# 16827. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Thermal Resistance, JunctiontoAmbient R JA 35.7 C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. 5 ms, % Duty Cycle. *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 May, 2012 Rev. 6 1 Publication Order Number: TIP140/D

MARKING DIAGRAMS TO218 TIP14x AYWWG AYWWG TIP14x 1 BASE 3 EMITTER 1 BASE 3 EMITTER 2 COLLECTOR 2 COLLECTOR TIP14x A Y WW G = Device Code = Assembly Location = Year = Work Week = PbFree Package TIP140 TIP141 TIP142 BASE COLLECTOR DARLINGTON SCHEMATICS TIP145 TIP146 TIP147 BASE COLLECTOR 8.0 k 40 8.0 k 40 EMITTER EMITTER ORDERING INFORMATION TIP140G TIP141G TIP142G TIP145G TIP146G TIP147G TIP140G TIP141G TIP142G TIP145G TIP146G TIP147G Device Package Shipping SOT93 (TO218) SOT93 (TO218) SOT93 (TO218) SOT93 (TO218) SOT93 (TO218) SOT93 (TO218) 2

ÎÎ ELECTRICAL CHARACTERISTICS (T C = 25 C unless otherwise noted) ÎÎ Characteristic Symbol Min Typ Max ÎÎ Unit OFF CHARACTERISTICS ÎÎ CollectorEmitter Sustaining Voltage (Note 2) V CEO(sus) Vdc (I C = 30 ma, I B = 0) TIP140, TIP145ÎÎ 60 Î TIP141, TIP146 80 TIP142, TIP147ÎÎ 0 Î Collector Cutoff Current ÎÎ I CEO Î Î ma (V CE = 30 Vdc, I B = 0) TIP140, TIP145ÎÎ Î (V CE = 40 Vdc, I B = 0) TIP141, TIP146 (V CE = 50 Vdc, I B = 0) TIP142, TIP147 ÎÎ Collector Cutoff Current I CBO ÎÎ ma (V CB = 60 V, I E = 0) TIP140, TIP145ÎÎ Î (V CB = 80 V, I E = 0) TIP141, TIP146 (V CB = 0 V, I E ÎÎ Î = 0) TIP142, TIP147 ÎÎ Î Î Emitter Cutoff Current (V BE = V) I EBO 2 0 ÎÎ ma ON CHARACTERISTICS (Note 2) ÎÎ DC Current Gain h (I C = A, V CE = 4.0 V) ÎÎ FE Î 00 Î (I C = A, V CE = 4.0 V) ÎÎ 500 Î CollectorEmitter Saturation Voltage ÎÎ V CE(sat) Î Î Vdc (I C = A, I B = ma) (I C = A, I B = 40 ma) 3.0 ÎÎ BaseEmitter Saturation Voltage V BE(sat) 3.5 Vdc (I C = A, I B = 40 ma) BaseEmitter On Voltage ÎÎ V BE(on) Î Î 3.0 Vdc (I C = A, V CE = 4.0 Vdc) SWITCHING CHARACTERISTICS ÎÎ Resistive Load (See Figure 1) ÎÎ Delay Time t ÎÎ d ÎÎ Î 0.15 Î s Rise Time (V ÎÎ CC = 30 V, I C = A, t I B = 20 ma, Duty Cycle %, r ÎÎ Î 0.55 Î s Storage Time ÎÎ I B1 = I B2, R C & R B Varied, T J = 25 C) t s ÎÎ Î 2.5 Î s Fall Time t Î f 2.5 Î s 2. Pulse Test: Pulse Width = 300 s, Duty Cycle %. R B & R C VARIED TO OBTAIN DESIRED CURRENT LEVELS D 1, MUST BE FAST RECOVERY TYPE, eg: 1N5825 USED ABOVE I B 0 ma MSD60 USED BELOW I B 0 ma V 2 approx +12 V 0 V 1 appox. - 8.0 V t r, t f ns DUTY CYCLE = % 25 s 51 Figure 1. Switching Times Test Circuit R B D 1 + 4.0 V R C TUT 8.0 k 40 for t d and t r, D1 is disconnected and V 2 = 0 For test circuit reverse diode and voltage polarities. V CC - 30 V SCOPE t, TIME ( s) μ 0.5 0.2 t s 0.1 0.2 t f 0.5 3.0 20 I C, COLLECTOR CURRENT (AMP) Figure 2. Switching Times t r t d @ V BE(off) = 0 V CC = 30 V I C /I B = 250 I B1 = I B2 T J = 25 C 3

TYPICAL CHARACTERISTICS hfe, DC CURRENT GAIN V CE(SAT), COLLECTOR-EMITTER SATURATION VOLTAGE (VOLTS) 5000 2000 00 500 300 0.5 3.0 0.7 0.5-75 TIP140, TIP141, TIP142 T J = 150 C 0 C 25 C V CE = 4.0 V - 55 C 3.0 4.0 7.0 I C, COLLECTOR CURRENT (AMPS) TIP145, TIP146, TIP147 Figure 3. DC Current Gain versus Collector Current I C = A, I B = 4.0 ma I C = A, I B = ma I C = A, I B = ma - 50-25 0 25 50 75 0 125 150 175 T J, JUNCTION TEMPERATURE ( C) hfe, DC CURRENT GAIN VCE(SAT), COLLECTOR-EMITTER SATURATION VOLTAGE (VOLTS) 20,000,000 7000 5000 3000 2000 Figure 4. CollectorEmitter Saturation Voltage 00 0.5 0.7 3.0 4.0 7.0 3.0 0.7 0.5-75 T J = 150 C 0 C 25 C - 55 C V CE = 4.0 V I C, COLLECTOR CURRENT (AMPS) I C = A, I B = 4.0 ma I C = A, I B = ma I C = A, I B = ma - 50-25 0 25 50 75 0 125 150 175 T J, JUNCTION TEMPERATURE ( C) VBE, BASE-EMITTER VOLTAGE (VOLTS) 4.0 3.6 3.2 2.8 2.4 1.6 1.2 0.8-75 V CE = 4.0 V I C = A A A - 25 25 75 125 175 VBE, BASE-EMITTER VOLTAGE (VOLTS) 4.0 3.6 V CE = 4.0 V 3.2 2.8 2.4 I C = A 1.6 1.2 A A 0.8-75 - 25 25 75 125 175 T J, JUNCTION TEMPERATURE ( C) T J, JUNCTION TEMPERATURE ( C) Figure 5. BaseEmitter Voltage 4

ACTIVEREGION SAFE OPERATING AREA There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate I C V CE limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate. The data of Figure 6 is based on T J(pk) = 150 C; T C is variable depending on conditions. At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown. 20 IC, COLLECTOR CURRENT (AMP) (ma) 7.0 3.0 0.2 dc T J = 150 C SECONDARY BREAKDOWN LIMIT BONDING WIRE LIMIT THERMAL LIMITATION @ T C = 25 C TIP140, 145 TIP141, 146 TIP142, 147 15 20 30 50 70 0 V CE, COLLECTOR-EMITTER VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (AMPS) 15 7.0 0 mj 0.5 20 50 0 L, UNCLAMPED INDUCTIVE LOAD (mh) Figure 6. ActiveRegion Safe Operating Area Figure 7. Unclamped Inductive Load INPUT MPS-U52 50 50 R BB1 1.5 k R BB2 = 0 V BB2 = 0 V BB1 = V V CE MONITOR TUT 0 mh V CC = 20 V I C MONITOR R S = 0.1 INPUT VOLTAGE COLLECTOR CURRENT 1.42 A V CE(sat) - 20 V COLLECTOR VOLTAGE w 7.0 ms (SEE NOTE 1) V 0 0 ms 0 V (BR)CER TEST CIRCUIT NOTE 1: Input pulse width is increased until I CM = 1.42 A. VOLTAGE AND CURRENT WAVEFORMS NOTE 2: For test circuit reverse polarities. Figure 8. Inductive Load 5

h fe, SMALL-SIGNAL FORWARD CURRENT TRANSFER RATIO 0 70 50 20 7.0 V CE = V I C = A T J = 25 C 3.0 7.0 f, FREQUENCY (MHz) Figure 9. Magnitude of Common Emitter SmallSignal ShortCircuit Forward Current Transfer Ratio PD, POWER DISSIPATION (WATTS) 4.0 3.0 0 0 40 80 120 160 200 T A, FREE-AIR TEMPERATURE ( C) Figure. FreeAir Temperature Power Derating 6

PACKAGE DIMENSIONS SOT93 (TO218) CASE 340D02 ISSUE E B Q E C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. K S L U V 1 2 3 G 4 D A J H MILLIMETERS INCHES DIM MIN MAX MIN MAX A --- 20.35 --- 0.801 B 14.70 15.20 0.579 0.598 C 4.70 4.90 0.185 0.193 D 1. 1.30 0.043 0.051 E 1.17 1.37 0.046 0.054 G 5.40 5.55 0.213 0.219 H 0 3.00 0.079 0.118 J 0.50 0.78 0.020 0.031 K 30 REF 1.220 REF L --- 16.20 --- 0.638 Q 4.00 4. 0.158 0.161 S 17.80 18.20 0.701 0.717 U 4.00 REF 0.157 REF V 1.75 REF 0.069 STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR CASE 340L02 ISSUE F N A K F 2 PL B U L 1 2 3 P Y W J G D 3 PL 0.25 (0.0) M Y Q S C T E H 4 Q 0.63 (0.025) M T B M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 20.32 28 0.800 8.30 B 15.75 16.26 0.620 0.640 C 4.70 5.30 0.185 0.209 D 0 1.40 0.040 0.055 E 1.90 2.60 0.075 0.2 F 1.65 2.13 0.065 0.084 G 5.45 BSC 0.215 BSC H 1.50 2.49 0.059 0.098 J 0.40 0.80 0.016 0.031 K 19.81 20.83 0.780 0.820 L 5.40 6.20 0.212 0.244 N 4.32 5.49 0.170 0.216 P --- 4.50 --- 0.177 Q 3.55 3.65 0.140 0.144 U 6.15 BSC 0.242 BSC W 2.87 3.12 0.113 0.123 STYLE 3: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR 7

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