11th European Advanced Equipment Control/Advanced Process Control Conference 2011

Transcription

1 11th European Advanced Equipment Control/Advanced Process Control Conference 2011 (AEC/APC 2011) Dresden, xxx Germany 4-6 April 2011 ISBN:

2 Printed from e-media with permission by: Curran Associates, Inc. 57 Morehouse Lane Red Hook, NY Some format issues inherent in the e-media version may also appear in this print version. Copyright (2011) by Silicon Saxony e.v. All rights reserved. Printed by Curran Associates, Inc. (2011) For permission requests, please contact Silicon Saxony e.v. at the address below. Silicon Saxony e.v. Manfred von Ardenne-Ring Dresden Germany Phone: +49 (351) Fax: +49 (351) Additional copies of this publication are available from: Curran Associates, Inc. 57 Morehouse Lane Red Hook, NY USA Phone: Fax: Web:

3 TABLE OF CONTENTS Chamber Matching and Spare Parts Influence in III-V Plasma Etching... 1 H.P. Maucher, G. Boedege, M. Klick In Situ Monitoring of Plasma Etch Processes of Ultra Low-k Dielectrics Using Optical Diagnostic Methods Norbert Lang, Sven Zimmermann, Benjamin Uhlig, Matthias Schaller, Stefan E. Schulz, Jürgen Röpcke Correlation Between in Situ and Ex Situ Analysis of Ultra Low-k Dielectric Etch Processes Benjamin Uhlig, Norbert Lang, Sven Zimmermann, Matthias Schaller Modified Principal Component Analysis for Real-Time Endpoint Detection of SiO 2 Etching Using Plasma Impedance Monitoring Haegyu Jang, Daekyoung Kim, Heeyeop Chae Chamber Matching at Sputter Clean Chambers with Inductively Coupled Plasma N. Urbansky, S. Franke, T. Beger, M. Klick, R. Rothe APC/AEC-control of AMAT ASP + Chambers by Monitoring Heating-lamp Current for Prevention of Metal Corrosion Karsten Spinger, Andreas Brand, Dieter Wenz Substitution of Tool Checks in Etch by Deployment of FDC Software Maestria Martin Birkle, Dennis Föh Anomaly Detection in FDC Time Series Data James N D Amour, Jan Neirynck, Vladimir Martyanov, Eugene Tuv Design Specific APC: Dedicated Spatial Compensation Using Design Analysis and Product Classification Martin Häcker, Clemens Utzny Multi-factor Statistic Modelling of Transport Processes on Factory Level in Semiconductor Manufacturing André Gellrich, Thomas Wagner, Volodymyr Vasyutynskyy, Klaus Kabitzsch A New Variance Component Algorithm Tailored to the Needs of Semiconductor Industry Ulf Seidel Leveraging Experimental Design to Improve Virtual Metrology Predictions Tamara Byrne Improvement of Prediction Performance in Virtual Metrology A. Dementjev, H.-D. Ribbecke Using Operating Envelope Models to Create Improved Operation at Unit Process and Fab Levels Robin Brooks, Alan Mahoney, John Wilson, Na Zhao Economic Control Strategy Selection Andrea Laurenzi, Stefano Pettirossi Advanced Process Control at Wafertest Andreas Thamm, Jan Zimpel, Knut Voigtländer, Olaf Reichelt Conductivity, Thickness and Defect Characterization of Thin-films with Imaging Eddy Current Technology for Inline and Offline Applications H. Heuer, S. Hillmann, M. Schulze, M. Klein Optimal Metrology Sampling Strategies for AEC/APC Applications Anand Subramanian, Tyrone Vincent, Kameshwar Poolla Use of a Sensor Network for Semiconductor Production Plants: Motivation, Design and Preliminary Tests Francesco Rametta, Antonio Bonanno, Daniele LaValle, Stefano Vitturi Mastering the Flood of Data Enabling Relational Standard Databases to Store High Frequent Sensor Data Wolfgang Benn, Sebastian Leuoth, Alexander Adam Application of APC Solutions on Coating Plants in the Photovoltaic Industry S. Dittrich, Torsten Gertler, Bert Müller Add-on Sensor Using Object Messaging Protocol E Modbus/TCP Dirk Suchland Achieving World-class Production Cycle Time Performance by a Start-up Factory in High Volume Manufacturing Adar Kalir Use of FDC for RTP Equipment Monitoring: Motivation and Solutions Marco Cavallaro, Marco Bagagiolo, Salvatore Restivo

4 Comparison of Control Methods for Temperature Control of Heated Plates D. de Roover, J.L. Ebert, G.W. van der Linden, L.L. Porter, R.L. Kosut, A. Emami-Naeini In-situ Analytics for Development and Control of Atomic Layer Deposition Processes Martin Knaut, Matthias Albert, Johann W. Bartha Stepper and Cleantrack Control using Tool Interdiction Monitoring System (TIMS) in TI s Freising FAB Gernot Biese Predictive Process Control of Photoresist Thickness Variation Gabriele Porri, Massimo Carattoli, Alessia Verticchio, Milena Vaccaro, Fabio Ferri, Giorgio Tullio, Giuseppe Murzilli, Sonia Tatti, Mario Ciccolella, Patricia Maccarone, Massimo Ianni Cost Benefit Analysis Model of In-line Inspection in Wafer Fabrication Line Israel Tirkel, Gad Rabinowitz Automatic Metrology Recipe Creation A study of a productive Application André Holfeld, Mark Stark, Jörg Nothnagel An APC Strategy for LED Manufacturing Focusing on Yield Improvement James Moyne Deployment of Advanced Process Control in LED Manufacturing Heribert Zull Providing APC and Related Updates to the International Technology Roadmap for Semiconductors (ITRS) in James Moyne Enhanced Equipment Health Monitoring Practice and Methodology Gino Crispieri GLOBALFOUNDRIES and the New Dynamic of the Global Semiconductor Industry Elke Eckstein Future Control Concept in a Mature 200mm Fab Virtual Metrology, R2R Control, Dynamic Sampling Thomas Leitermann Strategic Objective for Process Optimization of Cell Productions in the Photovoltaic Dietmar Roth Q-Goal: Zero PPM for Automotive IC's Reinhard Senf Semiconductor Manufacturing in Europe A Reality Test Georg Kelm Manufacturing Applications Enabled By Detailed Equipment Data Alan Weber In-situ FDC by Interferometric Endpoint Detection During Plasma Etch Frank Hoffmann Using Optical Emission Spectroscopy (OES) for Leak Monitoring of Sputter Preclean Chambers P. Heger, S. Franke, T. Beger, G. Hoyer Stochastic Gradient Boosting Methodology for Virtual Metrology on a PVD Tool D. Gleispach, P. Scheibelhofer, G. Hayderer On the Way to a Comprehensive APC Library: Identification of Process Models and Design of Controllers for Vacuum Coating Processes U. Hartung, T. Unkelbach, L. Gebauer, A. Dementjev, S. Dittrich Real-Time Wafer Temperature Sensing During A Live Plasma Process Matteo Galbiati, Gary Marshall, Mei-Wei Tsao Real-time Process Control Based on Simultaneous In-Situ Plasma Emission and Electrical Plasma Key Parameter Monitoring D. Rogler, F. Stahr, H. Auerswald, P. Klement, K.V. Maydell Developing a Predictive Maintenance Model to Minimize Helium Backside Cooling Faults on a AMAT Centura Dry Etch Tool Stefan Schindler, Sandrine Monot, Frédéric Duvivier Near In-Situ Fault Detection and Classification of VLSI Contacts Shai Haimson, Lior Rettig Prediction of Wafer Homogeneity Maps Using a Virtual Metrology Scheme Consisting of Time Resolved OES Measurements and a Neural Network Sven Zimmermann, René Reich, Manuela Zacher, Stefan E. Schulz, Thomas Gessner Development of an Interactive Modeling Based Diagnostic Tool set for Plasma Processes Giuseppe Fazio, Giuseppe Garozzo, Bernard Keville, Aidan Cowley, Stephen Daniels, Antonino La Magna, Loredana Chiaramente, Andrea Schirru, João Gabriel Pires, Nuno Almeida

5 Modular Approach for High Volume Data Analysis Modelling, Visualization and Reporting Jan Zimpel, Knut Voigtländer, Michael Rettelbach, Peter Doherr, Andreas Thamm, Roland Beier Process Analysis and Control Engineering for APC in EB PVD and PMS Coating Processes A. Dementjev, M. Benesch, H. Kubin, C. Metzner, U. Hartung Comparison of Yield Prediction Techniques against Common Manufacturing Data Quality Issues Ramy Baly, James Moyne, Hazem Hajj Enhancing Legacy Diffusion Cell Controllers with an APC Framework for Fault Detection Marco Bagagiolo, Brad Schulze, Justin Taylor A New Approach for Cleanroom Monitoring by Using AMOR (Ambient Monitoring Robot) Christoph Hocke Introduction of the openapc Foundation e.v Bernhard Schimunek Information Technology Used for Process Control System Implementation in IMPROVE Giuseppe Fazio, Flavio Crippa, Silvia Zoia, Andreas Kyek, Cristian Valeanu, Marius Ghiga, Josef Bichlmeier Random Tree Ensembles for Predictive Maintenance of Filament Breakdown on an Implanter P. Scheibelhofer, M. Berger, P. Schröttner, D. Gleispach, G. Hayderer FFAB's Metal Control Strategy with u-pcd Michael Bauer Applied Materials Precision 5000 CVD Lamp Module Health Monitoring for Improved Fault Prediction/Detection Gunter Welde, P. Heger, Martin Kunath Dynamic Dose to Target (D2T) Filtering In Litho Exposure R2R Controller Boyidi Ravi Kiran, Sanjay Kumar, Srinivasan Visveswaran Correlation Analysis of WAT Data to FDC Data from a CVD Tool A. Proßegger, F. Fratte, D. Gleispach, G. Hayderer Author Index