Application Specification Hermaphroditic Blade and Receptacle Connector 15 MAR 10 Rev E

Transcription

1 Applcaton Specfcaton Hermaphrodtc Blade and Receptacle Connector 15 MAR 10 Rev E All numercal values are n metrc unts [wth U.S. customary unts n brackets]. Dmensons are n mllmeters [and nches]. Unless otherwse specfed, dmensons have a tolerance of [+.005] and angles have a tolerance of +2_. Fgures and llustratons are fordentfcaton only and are not drawn to scale. 1. INTRODUCTION Ths specfcaton covers the requrements for applcaton of Hermaphrodtc Blade and Receptacle Connectors for use on modular prnted crcut (pc) board--to--board Surface Mount Technology (SMT) applcatons. The connector allows nstallers to top mount LED lghtng pc boards end--to--end as they are fastened to the mountng surface. The connector s avalable n 2, 4, or 6 postons. See Fgure 1. The connector can mate or unmate horzontally or vertcally allowng replacement of center pc boards n a seres of pc board strps. The connector can mate around corners, allowng the seres of pc board strps to contnue around edges. It s hermaphrodtc, so the customer only needs to stock a sngle part number. A dust cap s also avalable to protect the last connector n a seres of prnted crcut (pc) board strps. The dust cap s avalable n 2, 4, and 6 postons n natural color. The dust cap s ntended to be put on after the connector has been soldered on the pc board. When correspondng wth Tyco Electroncs Personnel, use the termnology provded n ths specfcaton to facltate your nqures for nformaton. Basc terms and features of ths product are provded n Fgure 1. Hermaphrodtc Blade and Receptacle Connector Matng End SMT Contact Tne Hermaphrodtc Blade and Receptacle wth Latchng Tab 2 -Poston Dust Cap Fgure 1 2. REFERENCE MATERIAL 2.1. Revson Summary S Updated document to corporate requrements S Added new text to Paragraph 3.8 and new Fgure 10 and renumbered E2010 Tyco Electroncs Corporaton, Berwyn, PA TOOLING ASSISTANCE CENTER All Rghts Reserved PRODUCT INFORMATION TE logo and Tyco Electroncs are trademarks. *Trademark. Other product names, logos, or company names mght be trademarks of ther respectve owners. Ths controlled document s subject to change. For latest revson and Regonal Customer Servce, vst our webste at 1 of 10 LOC B

2 2.2. Customer Assstance Reference Product Base Part Numbers and , and Product Code L012 are representatve of the Hermaphrodtc Blade and Receptacle Connector. Use of these numbers wll dentfy the product lne and expedte your nqures through a servce network establshed to help you obtan product and toolng nformaton. Such nformaton can be obtaned through a local Tyco Electroncs Representatve or, after purchase, by callng Product Informaton at the number at the bottom of ths page Drawngs Customer Drawngs for product part numbers are avalable from the servce network. If there s a conflct between the nformaton contaned n the Customer Drawngs and ths specfcaton or wth any other techncal documentaton suppled, call the Product Informaton number at the bottom of ths page Manuals Manual s avalable from the servce network. Ths manual provdes nformaton on varous flux types and characterstcs along wth the commercal desgnaton and flux removal procedures. A checklst s ncluded n the manual as requred for nformaton on solderng problems. 3. REQUIREMENTS 3.1. Safety Do not stack product shppng contaners so hgh that the contaners buckle or deform Lmtatons The connectors are desgned to operate n a temperature range of --40_ to 105_C [--40_ to 221_F] Materal The contacts are made of tn--plated phosphor bronze, and the housng s made from UL 94V--0 rated LCP. The dust cap s made from 94V--0, glass fber renforced PBT Storage A. Ultravolet Lght Prolonged exposure to ultravolet lght may deterorate the chemcal composton used n the connector materal. B. Shelf Lfe The connectors should reman n the shppng contaners untl ready for use to prevent deformaton. The connectors should be used on a frst n, frst out bass to avod storage contamnaton that could adversely affect performance. C. Chemcal Exposure Do not store connectors near any chemcal lsted below as they may cause stress corroson crackng n the contacts. Alkales Ammona Ctrates Phosphates Ctrates Sulfur Compounds Amnes Carbonates Ntrtes Sulfur Ntrtes Tartrates 3.5. PC Board A. Materal and Thckness Common pc board materals may be used such as glass epoxy (FR--4 or G--10), Alumnum--clad pc boards and flex crcuts. The pc board thckness may vary to sut the end use thckness. B. Tolerance Maxmum allowable bow of the pc board shall be 0.10 mm [.004 n.] over the length of the connector. Snce the connector housngs may rest on top of the solder mask, an excessvely hgh mask wll allow too much space between the solder tne and pad for a good solder jont. A solder jont under these condtons would be weak, and would not provde long -term performance for the connector. 2 of 10 Tyco Electroncs Corporaton Rev E

3 C. Pads The pc board crcut pads must be solderable n accordance wth Test Specfcaton (Test Method A, non--actvated rosn flux). D. Layout The pc board layout must be desgned usng the dmensons provded on the customer drawng for the specfc connector. The recommended pc board layout s shown n Fgure [.280] Typ 1.00 [.039] Typ 2.00 [.079] Typ 4.00 [.157] Typ Typcal PC Board Layout Fgure Connector Placement Ths product s packaged n SMT tape and reel packagng per ANSI/EIA Std 481--B. Robotc/grpper placement requres total equpment accuracy of 0.25 mm [.010 n.] to locate the connector for nserton. Ths ncludes grpper and fxture tolerances, as well as equpment repeatablty. Inserton locaton wll be programmed by a smple pantograph/template system or software package. Optmally, the contact solder tnes should be centered on the pc board pads. However, slght msalgnment s permssble for the performance classfcatons specfed n Assocaton of Connectng Electroncs Industres (IPC)--S--815, General Requrements for Solderng Electronc Interconnecton. See Fgure 3. Fgure 3B shows the permssble msalgnment between the connector face and pc board edge. Ths algnment s mportant to ensure that the latch n the wre--to--board connector engages wth the latchng tab n the hermaphrodtc blade and receptacle connector. PC Board Permssble Msalgnment Between PC Board Edge and Connector Face: 0.13 mm [.005 n.] Max Optmum Placement of Contact Solder Tne Centered on Crcut Pad 3A Contact Solder Tne Overhang Permssble Per IPC -S B Fgure Solderng Observe gudelnes and procedures when solderng contacts. Solder, clean, and dry all leads to contacts accordng to the followng. The connectors should be soldered usng vapor phase reflow (VPR), double--sded, non--focused nfrared (IR), forced ar convecton, or equvalent solderng technques. All solder jonts should conform to the Workmanshp Specfcaton and IPC--S Rev E Tyco Electroncs Corporaton 3 of 10

4 A. Flux Selecton Contacts must be fluxed pror to solderng wth a mldly actve, rosn base flux. Selecton of the flux wll depend on the type of pc board and other components mounted on the board. Addtonally, the flux must be compatble wth the wave solder lne, manufacturng, health, and safety requrements. Flux that s compatble wth the connectors s provded n Fgure 4. FLUX TYPE ACTIVITY RESIDUE COMMERCIAL DESIGNATION KESTER ALPHA Type RMA (Mldly Actvated) Mld Noncorrosve 185/ Fgure 4 B. Connectors wth SMT Contacts 1. Solderablty The pc board pads must be solderable n accordance wth Test Specfcaton (Test Method A, non--actvated rosn flux) and all other requrements for surface mount contacts specfed n ths document. 2. Solder Paste Characterstcs a. Alloy type shall be SAC 305; Sn 96.5/Ag 3.0/Cu 0.5 b. Flux ncorporated n the paste shall be rosn, mldly actve (RMA) type. c. Paste wll be at least 80% solds by volume. d. Mesh desgnaton to +325 (74 to 44 square mcron openngs, respectvely). e. Mnmum vscosty of screen prnt shall be 5 10% cp (centpose). f. Mnmum vscosty of stencl prnt shall be % cp (centpose). 3. Solder Volume Solder paste volumes are requred as follows (calculated per 50% solds content). Paste volume may vary dependng on the composton. Solder volume for each Hermaphrodtc Blade and Receptacle Connector must be accordng to the followng: 1.75 mm 3 [ n 3 ] per contact solder tne 4. Stencl The stencl aperture shall be determned by the crcut pad sze and stencl thckness. It may be any shape as long as t prevents solder brdgng from one pad to another. Generally, the thnner stencl wll need a larger aperture to mantan the gven volume of solder paste. See Fgure 5. The recommended stencl thckness s 0.13 mm [.005 n.] mnmum. The stencl layouts llustrated apply to the top (connector) sde (unless otherwse noted) of the pc board. For any other varatons, refer to the pc board mountng confguratons on the approprate customer drawng to determne modfcatons necessary to the solder stencls n Fgure 5. 4 of 10 Tyco Electroncs Corporaton Rev E

5 All traces must be covered by solder mask n the solder depost area. Exposed traces could cause brdgng and create a short, or wck solder away from the solder tnes, producng a weak solder jont. If a hold -down aperture s requred other than that specfed, the desgn must ensure that the connector housng wll not st on the solder depost. Typcal Stencl Layout 4.00 [.157] (Typ) 2.00 [.079] (Typ) 5.75 [.226] (Typ) Fgure 5 5. Solder Mask Solder mask s recommended between all pads when solderng connectors wth surface mount contacts to mnmze solder brdgng between pads. The mask must not exceed the heght of the pad by more than 0.05 mm [.002 n.]. If a trace s run between adjacent pads on the solder sde of the pc board, a solder mask must be appled over the trace to prevent brdgng and wckng of solder away from the contact solder tnes. Those most sutable are Lqud Photo Imageable and Dry Flm. Snce the connector may rest on top of the solder mask, an excessvely hgh mask wll allow too much space between the lead and pad for a good solder jont. A solder jont under these condtons would be weak and would not provde long -term performance for the connector. 6. Process Connectors wth surface mount contacts should be soldered usng vapor phase (VPR), double--sded, non--focused nfrared reflow (IR) or equvalent solderng technques. Due to many varables nvolved wth the reflow process (.e., component densty, orentaton, etc.), t s recommended that tral runs be conducted under actual manufacturng condtons to ensure product and process compatblty. These connectors wll wthstand the temperature and exposure tme specfed n Fgure 6. SOLDERING PROCESS TEMPERATURE (Max) TIME (At Max Temperature) IR 260_C [468_F] 10 Seconds The lead--free reflow profle s shown n Fgure 7. Fgure 6 Rev E Tyco Electroncs Corporaton 5 of 10

6 300 C Kester Lead- Free Reflow Profle Alloys: Sn96.5/Ag3.0/Cu0.5 and Sn96.5/Ag C Peak Temperature C 200 C 150 C 100 C <2.5 C/Second Soakng Zone (2.0 Mnutes Max) Seconds Typ Reflow Zone Tme Above 217 C (90 Seconds Max) Seconds Typ 50 C Pre -Heatng Zone ( Mnutes Max) 0 C Tme (Seconds) Fgure 7 C. Cleanng After solderng, removal of fluxes, resdues, and actvators s necessary. Consult wth the suppler of the solder and flux for recommended cleanng solvents. Common cleanng solvents that wll not affect the connectors or assembles for the tmes and temperatures provded wthout any adverse effects on the connector assembly are lsted n Fgure 8. DANGER Consderaton must be gven to toxcty and other safety requrements recommended by the solvent manufacturer. Trchloroethylene and Methylene Chlorde can be used wth no harmful affect to the connectors; however, Tyco Electroncs does not recommend them because of the harmful occupatonal and envronmental effects. Both are carcnogenc (cancer -causng) and Trchloroethylene s harmful to the earth s ozone layer. If you have a partcular solvent that s not lsted, contact Tyco Electroncs Toolng Assstance Center or Product Informaton at the number on the bottom of page 1. 6 of 10 Tyco Electroncs Corporaton Rev E

7 CLEANER TIME TEMPERATURES (Maxmum) NAME TYPE (Mnutes) CELSIUS FAHRENHEIT ALPHA 2110 Aqueous BIOACT EC -7 Solvent BUTYL CARBITOL Solvent 1 Room Ambent Isopropyl Alcohol Solvent KESTER 5778 Aqueous KESTER 5779 Aqueous LONCOTERGE 520 Aqueous LONCOTERGE 530 Aqueous Terpene Solvent Solvent D. Dryng Fgure 8 Excessve temperatures may cause housng and platng degradaton. When dryng cleaned assembles and pc boards, temperatures to whch the connectors are subject should not exceed 220_C [492_F] for more than 3 mnutes Algnment Proper algnment s essental to ensure full engagement of matng connectors and also to ensure the contacts are not bent or otherwse damaged durng matng and unmatng. For algnment tolerances, see Fgure 9. Horzontal Algnment 1.27 [.050] Max. Vertcal Algnment 0.73 [.029] Max. Angular Algnment 3 Max. Fgure 9 Rev E Tyco Electroncs Corporaton 7 of 10

8 Fgure 10 provdes the maxmum dstance between the connector faces. Permssble Gap Between Connector Faces s 5.75 mm [.226 n.] Max. Fgure Checkng Installed Connector All solder jonts should comply wth Tyco Electroncs Workmanshp Specfcaton For typcal fllets for surface mount tne requrements, refer to Fgure 11. PC Board (Ref) Solder Fllet Pad Length Pad Wdth Fgure 11 8 of 10 Tyco Electroncs Corporaton Rev E

9 3.10. Algnng and Applyng the Dust Cap Fgure 12 shows the algnment of placng the dust cap on the blade and receptacle connector. Plastc Fn n the Hermaphrodtc Connector s Contaned n ths Openng to Prevent Sdeways Movement of the Dust Cap Markng to Help Orent the Dust Cap Thcker Wall to Prevent Dust Cap from Matng n the Wrong Orentaton Plastc Blade n Dust Cap Mates wth Socket n the Hermaphrodtc Connector Fgure Removal and Repar Damaged product should not be used. If a damaged product s evdent, t should be removed from the pc board and replaced wth a new one. Removal of the Hermaphrodtc Blade and Receptacle Connector from the pc board may be done by standard de -solderng methods. 4. QUALIFICATIONS Hermaphrodtc Blade and Receptacle Connectors are Underwrters Laboratores, Inc. (UL) / CSA Internatonal Component Recognzed n Fle E28476 and Volume TOOLING 5.1. Robotc Equpment The robotc equpment must have a true poston accuracy tolerance of 0.25 mm [.010 n.] to properly locate the connectors. Ths ncludes grpper and fxture tolerances as well as equpment repeatablty. Automatc machne placement s recommended for connectors nstead of manual placement wth surface mount contacts PC Board Support For automatc machne placement, a pc board support must be used to prevent bowng of the pc board durng the placement of connectors. It should have flat surfaces wth holes or a channel large enough and deep enough to receve any protrudng components. The pc board support must be customer made. Rev E Tyco Electroncs Corporaton 9 of 10

10 6. VISUAL AID Fgure 13 shows a typcal applcaton of a Hermaphrodtc Blade and Receptacle Connector. Ths llustraton should be used by producton personnel to ensure a correctly appled product. Applcatons whch DO NOT appear correct should be nspected usng the nformaton n the precedng pages of ths specfcaton and n the nstructonal materal shpped wth the product or toolng. CONTACT TINE SHOULD BE VISUALLY CENTERED ON PAD SOLDER FILLET MUST BE FORMED EVENLY AROUND SOLDER TINE FIGURE 13. VISUAL AID 10 of 10 Tyco Electroncs Corporaton Rev E