SMPM Male Printed Circuit

Transcription

1 SMPM Male Prnted Crcut Applcaton Specfcaton Board Surface and Edge Mount Connectors 21 Mar 11 Rev B All numercal values are n metrc unts [wth U.S. customary unts n brackets]. Dmensons are n mllmeters [and nches]. Unless otherwse specfed, dmensons have a tolerance of [+.005] and angles have a tolerance of +2_. Fgures and llustratons are fordentfcaton only and are not drawn to scale. 1. INTRODUCTION Ths specfcaton covers the requrements for applcaton of SMPM Male Prnted Crcut (PC) Board Surface and Edge Mount Connectors. These connectors are desgned to be soldered to the surface of pc boards on a specfc pattern for each connector type. When correspondng wth TE Connectvty Personnel, use the termnology provded n ths specfcaton to facltate your nqures for nformaton. Basc terms and features of ths product are provded n Fgure 1. SMPM Male PC Board SMT Connector Contact SMPM Male PC Board Edge Mount Connector Body Contact Fgure 1 2. REFERENCE MATERIAL 2.1. Revson Summary S Updated document to corporate requrements Customer Assstance Reference Product Base Part Numbers and , and Product Code K595 are representatve of SMPM Male PC Board Surface and Edge Mount Connectors. Use of these numbers wll dentfy the product lne and expedte your nqures through a servce network establshed to help you obtan product and toolng nformaton. Such nformaton can be obtaned through a local TE Representatve or, after purchase, by callng Product Informaton at the number at the bottom of ths page Drawngs Customer Drawngs for product part numbers are avalable from the servce network. If there s a conflct between the nformaton contaned n the Customer Drawngs and ths specfcaton or wth any other techncal documentaton suppled, call the Product Informaton number at the bottom of ths page. E2011 Tyco Electroncs Corporaton, a TE Connectvty Ltd. Company TOOLING ASSISTANCE CENTER All Rghts Reserved PRODUCT INFORMATION TE Connectvty, TE connectvty (logo), and TE (logo) are trademarks. *Trademark. Other logos, product and/or Company names may be trademarks of ther respectve owners. Ths controlled document s subject to change. For latest revson and Regonal Customer Servce, vst our webste at 1 of 8 LOC B

2 2.4. Manuals Manual s avalable from the servce network. Ths manual provdes nformaton on varous flux types and characterstcs along wth the commercal desgnaton and flux removal procedures. A checklst s ncluded n the manual as requred for nformaton on solderng problems Specfcatons Desgn Objectve provdes expected product performance and test nformaton for the SMPM Male PC Board Surface and Edge Mount Connectors. 3. REQUIREMENTS 3.1. Safety Do not stack product shppng contaners so hgh that the contaners buckle or deform Lmtatons The connectors are desgned to operate n a temperature range of --55_ to 125_C [--67_ to 257_F] 3.3. Storage A. Ultravolet Lght Prolonged exposure to ultravolet lght may deterorate the chemcal composton used n the connector materal. B. Shelf Lfe The connectors should reman n the shppng contaners untl ready for use to prevent deformaton. The connectors should be used on a frst n, frst out bass to avod storage contamnaton that could adversely affect performance. C. Chemcal Exposure Do not store connectors near any chemcal lsted below as they may cause stress corroson crackng n the contacts. Alkales Ammona Ctrates Phosphates Ctrates Sulfur Compounds Amnes Carbonates Ntrtes Sulfur Ntrtes Tartrates 3.4. PC Board A. Materal and Thckness Common pc board materals may be used such as glass epoxy (FR--4 or G--10), Alumnum--clad pc boards and flex crcuts. The pc board thckness may vary to sut the end use thckness. B. Tolerance Maxmum allowable bow of the pc board shall be 0.10 mm [.004 n.] over the length of the connector. Snce the connector housngs may rest on top of the solder mask, an excessvely hgh mask wll allow too much space between the solder tne and pad for a good solder jont. A solder jont under these condtons would be weak, and would not provde long -term performance for the connector. C. Pads The pc board crcut pads must be solderable n accordance wth Test Specfcaton (Test Method A, non--actvated rosn flux). D. Layout The pc board layout must be desgned usng the dmensons provded on the customer drawng for the specfc connector. The recommended pc board layout s shown n Fgure 2. 2 of 8 Rev B

3 Surface Mount PC Board Layout 2.24 [.088] [ ] 1.30 [.051] 2.26 [.089] 0.48 [.019] 1.37 [.054] 2.67 [.105] 2.16 [.085] 0.53 [.021] 0.76 [.030] 1.17 [.046] 2.16 [.085] [ ] 4Plc 1.91 [.075] Edge Mount PC Board Layout 1.27 [.050] 2x 5.08 [.200] [ ] 1.27 [.050] 1.27 [.050] «0.30 [.012 Plated Through Hole 6.73 [.265] 0.46 [.018] Typ 7.75 [.305] 1.98 [.078] 1.02 [.040] 1.60 [.063] 0.36 [.014] 2x Full R [.0125] Fgure Spacng Connectors are able to be placed sde--by--sde on the pc board when pads are constructed on centerlne spacng of 5.23 mm [.206 n.] for surface mount connectors; and 5.74 mm [.226 n.] for edge mount connectors. See Fgure 3 for mnmum (n--between) spacng. Connectors should be handled only by the housng to avod deformaton, contamnaton, or damage to the contact tnes. Rev B 3 of 8

4 1.27 [.050] Mn 3.6. Connector Placement Fgure 3 Connectors may be placed on the pc board by hand or wth robotc equpment. Robotc/grpper placement requres total equpment accuracy of 0.13 mm [.005 n.] to locate the connector for nserton. Ths ncludes grpper and fxture tolerances, as well as equpment repeatablty. Inserton locaton wll be programmed by a smple pantograph/template system or software package. Optmally, the contact solder tnes should be centered on the pc board pads. However, slght msalgnment s permssble for the performance classfcatons specfed n Assocaton of Connectng Electroncs Industres (IPC)--S--815, General Requrements for Solderng Electronc Interconnecton. See Fgure 4. PC Board Contact Solder Tne Overhang Permssble Per IPC -S -815 Optmum Placement of Contact Solder Tne Centered on Crcut Pad Fgure Solderng Observe gudelnes and procedures when solderng contacts. Solder, clean, and dry all leads to contacts accordng to the followng. The connectors should be soldered usng vapor phase reflow (VPR), double--sded, non--focused nfrared (IR), forced ar convecton, or equvalent solderng technques. All solder jonts should conform to the Workmanshp Specfcaton and IPC--S A. Flux Selecton Contacts must be fluxed pror to solderng wth a mldly actve, rosn base flux. Selecton of the flux wll depend on the type of pc board and other components mounted on the board. Addtonally, the flux must be compatble wth the wave solder lne, manufacturng, health, and safety requrements. Flux that s compatble wth the connectors s provded n Fgure 5. COMMERCIAL DESIGNATION FLUX TYPE ACTIVITY RESIDUE KESTERY ALPHAU Type RMA (Mldly Actvated) Mld Noncorrosve 185/ YTrademark of MacDonald & Co. U Desgnaton of Alpha Metals Inc. Fgure 5 4 of 8 Rev B

5 B. Connectors wth SMT Contacts 1. Solderablty The pc board pads must be solderable n accordance wth Test Specfcaton (Test Method A, non--actvated rosn flux) and all other requrements for surface mount contacts specfed n ths document. 2. Solder Paste Characterstcs a. Alloy type shall be SAC 305; Sn 96.5/Ag 3.0/Cu 0.5 b. Flux ncorporated n the paste shall be rosn, mldly actve (RMA) type. c. Paste wll be at least 80% solds by volume. d. Mesh desgnaton to +325 (74 to 44 square mcron openngs, respectvely). e. Mnmum vscosty of screen prnt shall be 5 10% cp (centpose). f. Mnmum vscosty of stencl prnt shall be % cp (centpose). 3. Solder Volume Solder paste volumes are requred as follows (calculated per 50% solds content). Paste volume may vary dependng on the composton. Solder volume for each SMPM Male PC Board Surface Mount Connector must be accordng to the followng: 1.75 mm 3 [ n. 3 ] per contact solder tne 4. Stencl The stencl aperture shall be determned by the crcut pad sze and stencl thckness. It may be any shape as long as t prevents solder brdgng from one pad to another. Generally, the thnner stencl wll need a larger aperture to mantan the gven volume of solder paste. The stencl layouts llustrated apply to the top (connector) sde (unless otherwse noted) of the pc board. For any other varatons, refer to the pc board mountng confguratons on the approprate customer drawng to determne modfcatons necessary to the solder stencls n Fgure 2. All traces must be covered by solder mask n the solder depost area. Exposed traces could cause brdgng and create a short, or wck solder away from the solder tnes, producng a weak solder jont. If a hold -down aperture s requred other than that specfed, the desgn must ensure that the connector housng wll not st on the solder depost. The stencl aperture s the same sze as the recommended pc board layout. Refer to Fgure Solder Mask Solder mask s recommended between all pads when solderng connectors wth surface mount contacts to mnmze solder brdgng between pads. The mask must not exceed the heght of the pad by more than 0.05 mm [.002 n.]. If a trace s run between adjacent pads on the solder sde of the pc board, a solder mask must be appled over the trace to prevent brdgng and wckng of solder away from the contact solder tnes. Those most sutable are Lqud Photo Imageable and Dry Flm. Snce the connector may rest on top of the solder mask, an excessvely hgh mask wll allow too much space between the lead and pad for a good solder jont. A solder jont under these condtons would be weak and would not provde long -term performance for the connector. Rev B 5 of 8

6 6. Process Connectors wth surface mount contacts should be soldered usng vapor phase (VPR), double--sded, non--focused nfrared reflow (IR) or equvalent solderng technques. Due to many varables nvolved wth the reflow process (.e., component densty, orentaton, etc.), t s recommended that tral runs be conducted under actual manufacturng condtons to ensure product and process compatblty. These connectors wll wthstand the temperature and exposure tme specfed n Fgure 6. SOLDERING PROCESS TEMPERATURE (Max) TIME (At Max Temperature) C. Cleanng IR 220_C [428_F] 3 Mnutes Fgure 6 After solderng, removal of fluxes, resdues, and actvators s necessary. Consult wth the suppler of the solder and flux for recommended cleanng solvents. Common cleanng solvents that wll not affect the connectors or assembles for the tmes and temperatures provded wthout any adverse effects on the connector assembly are lsted n Fgure 7. DANGER Consderaton must be gven to toxcty and other safety requrements recommended by the solvent manufacturer. Trchloroethylene and Methylene Chlorde can be used wth no harmful affect to the connectors; however, TE does not recommend them because of the harmful occupatonal and envronmental effects. Both are carcnogenc (cancer -causng) and Trchloroethylene s harmful to the earth s ozone layer. If you have a partcular solvent that s not lsted, contact TE Toolng Assstance Center or Product Informaton at the number on the bottom of page 1. CLEANER TIME TEMPERATURES (Maxmum) NAME TYPE (Mnutes) CELSIUS FAHRENHEIT Alpha 2110H Aqueous Boact EC -7z Solvent Butyl CarbtolD Solvent 1 Room Ambent Isopropyl Alcohol Solvent Kester 5778s Aqueous Kester 5779s Aqueous Loncoterge 520D Aqueous Loncoterge 530D Aqueous Terpene Solvent Solvent H Product of Fry s Metals, Inc. z Product of Petroferm, Inc. D Product of Unon Carbde Corp. s Product of Ltton Systems, Inc. Fgure 7 D. Dryng Excessve temperatures may cause housng and platng degradaton. When dryng cleaned assembles and pc boards, temperatures to whch the connectors are subject should not exceed 220_C [428_F] for more than 3 mnutes Checkng Installed Connector All solder jonts should comply wth Workmanshp Specfcaton For typcal fllets for surface mount tne requrements, refer to Fgure 8. 6 of 8 Rev B

7 Connector Body Bottomed on PC Crcut Pad Contact Pad PC Board Solder Fllets Evenly Formed Around Contact Connector Body Bottomed on PC Crcut Pad 3.9. Removal and Repar Fgure 8 SMPM Male PC Board Surface and Edge Mount Connectors are not reparable. If a connector s damaged, t must be removed from the pc board and replaced wth a new one. Industry wde de--solderng methods are acceptable. 4. QUALIFICATIONS SMPM Male PC Board Surface and Edge Mount Connectors are not requred to be agency evaluated or approved. 5. TOOLING 5.1. Robotc Equpment Automatc machne placement s recommended for connectors nstead of manual placement wth surface mount contacts. The robotc equpment must have a true poston accuracy tolerance of 0.25 mm [.010 n.] to properly locate the connectors. Ths ncludes grpper and fxture tolerances as well as equpment repeatablty PC Board Support For automatc machne placement, a pc board support must be used to prevent bowng of the pc board durng the placement of connectors. It should have flat surfaces wth holes or a channel large enough and deep enough to receve any protrudng components. The pc board support must be customer made. Rev B 7 of 8

8 6. VISUAL AID Fgure 9 shows a typcal applcaton of SMPM Male PC Board Surface and Edge Mount Connectors. Ths llustraton should be used by producton personnel to ensure a correctly appled product. Applcatons whch DO NOT appear correct should be nspected usng the nformaton n the precedng pages of ths specfcaton and n the nstructonal materal shpped wth the product or toolng. Solder Fllets Evenly Formed Around Contact THIS PORTION OF CONNECTOR BODY MUST BE LOCATED ON PC CIRCUIT PAD (2 PLACES) CONTACTS MUST BE LOCATED ON PC CIRCUIT PAD CONNECTOR BODY MUST BE LOCATED ON PC CIRCUIT PAD FIGURE 9. VISUAL AID 8 of 8 Rev B