Direct Contact Liquid Cooling (DCLC ) PRODUCT GUIDE. Industry leading data center solutions for HPC, Cloud and Enterprise markets.

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1 Direct Contact Liquid Cooling (DCLC ) PRODUCT GUIDE Industry leading data center solutions for HPC, Cloud and Enterprise markets.

2 Leadership, Collaboration & Expertise CooIIT Systems Innovates and Delivers CoolIT Systems is a world leader in direct contact liquid cooling for the Data Center and Desktop markets. CoolIT has been dedicated to the invention and design of safe and reliable liquid cooling technology since As an experienced innovator with 44 patents and more than 1.8 million liquid cooling units deployed in desktop computers, servers and data centres around the world, CoolIT s Rack DCLC technology is the top choice for many OEMs and system integrators. Rack DCLC is a three module approach (Server, Manifold and Heat Exchanger) that allows for a tremendous amount of product flexibility when integrating liquid cooling. With a reputation for working intimately with customers, CoolIT Systems delivers industry leading liquid cooling solutions for a variety of applications. With options for data centers with and without facility water hook up, any server in any rack can be liquid cooled with CoolIT s hardware, and benefit from immediate and measurable CAPEX and OPEX benefits. Proven Technology Selling 30-40K DCLC units/month >1.85M units sold worldwide % leak free and improving 45 issued patents, 19 more in process Awards Profit #34 in Canada 2014 (1780% 5-year growth rate) Geoff Lyon Nominated for E&Y Entrepreneur of the Year Deloitte 2014 Technology Fast 50 Canada - ranked #23 Deloitte 2014 Technology Fast 500 North America - ranked #257 We strive to deliver the highest level of product and service so that when customers choose CoolIT, they know they are getting the best. Geoff Lyon, CEO/CTO CoolIT Technology Partners OEM Partners , CoolIT Systems. All Rights Reserved

3 Focused on Your Cooling Challenges Liquid Cooling for the Modern Data Center Power savings, increased rack density and high performance are the three key advantages of using liquid cooling. Performance Efficiency Density Rack DCLC facilitates peak performance for higher powered or overclocked processors. Rack DCLC provides a significant reduction in total data center energy consumed. Rack DCLC allows for densities of 45kW or greater per rack. Immediate CAPEX & OPEX Benefits Modern air conditioning techniques are very expensive and inefficient at cooling computers. Data centers often employ chiller-based air systems that consume 50% of all data center power. W3-W5 warm liquid cooling eliminates the need for chilled water supply and delivers a rapid ROI (within 1-6 months). Trust is a huge factor when putting liquids in close proximity to critical electronics. CoolIT s technology outfitted with Stäubli s non-spill connectors works flawlessly. Skeptics become converts. Rusty Robertson, Aerospace/Defense Application Specialist Staubli Corporation CAPEX CAPEX (annualized) (annualized) OPEX OPEX (annualized) (annualized) Rack Rack Power Power Total IT Total Power IT Power 1.5 MW 1.5 MW 1.5 MW 1.5 MW Total Data Total Center Data Center Power Power 2.7 MW 2.7 MW *Including *Including Cooling IT Cooling UPS & IT AUX UPS & AUX 1.8 MW 1.8 MW # of Racks # of Racks Required Required IT Density IT Density 15kW/rack 15kW/rack 27.7kW/rack 27.7kW/rack * Using * Koomey s Using Koomey s data center data costing center costing methods methods T: Toll Free:

4 A Modular Approach to Liquid Cooling Cooling Solutions for All IT Demands Rack DCLC Modules are designed for a flexible fit to various compute environments. While Server Modules and Manifold Modules are installed with each system and are local to the rack, the appropriate heat rejection method may vary. Rack DCLC offers a variety of heat exchanging modules depending on load requirements and availability of facility water. Server Module Patented cold plate technology supports multiple combinations of CPUs/GPUs and other types of interposers, heat pipes, or heat spreaders. Manifold Module Reliable stainless steel manifolds employing dry break, quick connect technology in horizontal, multiple horizontal, or vertical chassis, blades or any other server array. Heat Exchange Module Your choice of heat exchange module. Liquid-to-Air or Liquid-to-Liquid. UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE IN MM(INCH) TOLERANCES: DATE: (MM/DD/YY) ANGULAR: ± 0.5 ± 0.2(0.01) X.X (X.XX) = ± 0.05(0.001) X.XX (X.XXX) PROPRIETARY AND CONFIDENTIAL THIS DRAWING IS THE PROPERTY OF COOLIT SYSTEMS AND IS SUBJECT TO RETURN UPON REQUEST. THE DRAWING Requires Facility Water CHx and AHx solutions support all sizes of racks. Various sizing and designs are available depending on customer needs and environmental factors. Modules Server Module Manifold Module CHx650 Module CHx40 Module AHx35 Module AHx20 Module , CoolIT Systems. All Rights Reserved No Facility Water SCALE: NTS COOLIT SYSTEMS INC th Street NE Tel: (403) Calgary, AB T1Y 6B6 Fax: (403) AHx Module, L109cm x W58cm x H13cm

5 Liquid-to-liquid heat exchange that manages a network of IT cabinets. The CHx650 is designed to manage the distribution of clean, treated coolant to and from a network of IT cabinets. This CHx accepts W3-W5 warm facility water and can manage 650kW of processor load per network. Key Features Features Supports 40kW+ cooling capacity per rack W3-W5 warm water cooling Redundant pumps Full control system Benefits Key Benefits Dramatically increase CPU/GPU density Eliminates the need for chillers and CRACs Monitor system health remotely ROI in 1 year or less The CHx650 Module can be customized to fit various data center environments. Standard equipment groups offer N+1 redundancy and when used in tandem can provide tier 4 resiliency. CoolIT s Rack DCLC solutions help us achieve what some would consider the impossible. Patrick Scateni, VP Sales & Marketing CIARA CHx650 Cooling Capacity Maximum Cooling Load (kw) vs. Facility Liquid Input Temperature ( C) Capacity (kw) Cooling Capacity (@ 30 C facility water) Power Consumption (Max) Racks Per Solution ROI (months) 650kW 4.2kW Facility Water Integration Yes Facility Input Temperature ( C) T: Toll Free:

6 Liquid-to-liquid heat exchange that manages a single IT cabinet. The CHx40 is designed to manage the distribution of clean, treated coolant within a single IT cabinet. This 2U CHx accepts W3-W5 warm facility water and can manage 40kW of processor load per rack. Features Key Features Supports 40kW+ cooling capacity per rack W3-W5 warm water cooling Redundant pumps 2U form factor Full control system Key Benefits CHx40 Cooling Capacity Dramatically increase CPU/GPU density Eliminates the need for chillers and CRACs Monitor system health remotely ROI in 1 year or less Cooling Capacity (kw) Facility water temperature 20 C 30 C 40 C Cooling Capacity (@ 30 C facility water) Power Consumption (Max) Racks Per Solution ROI (months) Facility Water Integration 40kW 95 watts Yes Facility Flow Rate (L/min) CASE STUDY: Cooling a Supercomputer Intel Selects CoolIT s Rack DCLC AHx35 to Liquid Cool Top500 Cherry Creek Cluster CoolIT Systems teamed up with Intel and Supermicro to create an innovative HPC cluster that ranked #400 on the Top500 list of supercomputers and an impressive #41 on the Green 500 list. The cluster uses CoolIT s Rack DCLC AHx solution and Supermicro s ultra-dense FatTwin server platform, featuring 9936 cores with a peak performance of teraflops. The system consumed a total of 74.25kW of power even though each Supermicro FatTwin node featured dual Intel Xeon processors and three Intel Xeon Phi coprocessors that were generating over 1,000 watts of heat per node. Cherry Creek Cluster running live on the SC13 floor , CoolIT Systems. All Rights Reserved

7 Liquid-to-air heat exchange for faster, more powerful clusters in less space. AHx Module - various designs available (hot aisle, cold aisle, chimney, or other) AHx35 Cooling Capacity *Cherry Creek AHx Cooling Capacity (kw) Facility Air Inlet Temperature ( C) The AHx35 is a unique top-of-rack solution that can manage 35kW of processor load without the need of facility water. The AHx dissipates heat to the surrounding environment via a liquid-to-air heat exchanger. Key Features Features Supports 35kW+ cooling capacity per rack No facility water required Redundant pumps Full control system Benefits Key Benefits Dramatically increase CPU/GPU density Stand alone rack-based liquid cooling Monitor system health remotely ROI in 1 year or less Cooling Capacity (@ 25 C air) Power Consumption (Max) Racks Per Solution ROI (months) Facility Water Integration 35kW 795 watts No Liquid-to-air heat exchange. Key Features Supports 20kW+ cooling capacity per rack No facility water required Redundant pumps Full control system Key Benefits Dramatically increase CPU/GPU density Stand alone rack-based liquid cooling Monitor system health remotely ROI in 1 year or less The AHx20 packs an incredible amount of heat load management into a small form factor. This top-of-rack solution provides superior processor performance and very high densities. The AHx20 is perfect for compute environments that are short on space, big on compute, and don t have access to facility water. Cooling Capacity (@ 25 C air) Power Consumption (Max) Racks Per Solution ROI (months) Facility Water Integration 20kW 300 watts No T: Toll Free:

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