Welcome to the Chemnitzer Seminar System Integration Technologies. Fraunhofer ENAS
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1 Welcome to the Chemnitzer Seminar System Integration Technologies
2 Smart Systems Campus Chemnitz D C A G I E B H F A Institute of Physics and Center for Microtechnologies at the CUT B Fraunhofer ENAS G MAIN C Start-up-building H EDC Electronic Design Chemnitz GmbH D Lightweight Structures Engineering I Competence Center IT and Catering E 3D-Micromac AG F Microflex Center Chemnitz (3D-Micromac AG, Fraunhofer ENAS)
3 Fraunhofer Institute for Electronic Nano Systems Director: Prof. Dr. T. Gessner Deputy Directors: Prof. T. Otto and Prof. S. Schulz Rep. Office Manaus Brazil Rep. Office Shanghai China Rep. Office Tokyo/Sendai Japan Multi Device Integration (OE 610) Prof. Otto Printed Functionality (OE 630) Prof. Baumann System Packaging (OE 650) Dr. Wiemer Administration Mr. Höppner Micro Materials Center (OE 620) Prof. Rzepka Back-End of Line (OE 640) Prof. Schulz Advanced System Engineering (OE 660) Dr. Hedayat
4 Main working fields International Offices of Fraunhofer ENAS: Since 2001/2005 Tokyo/Sendai, Japan Since 2012 Since 2002 Since 2007 Project-Center in Sendai Shanghai, China Manaus, Brazil Systems integration by using of micro and nano technologies MEMS/NEMS design Development of MEMS/NEMS MEMS/NEMS test System packaging/waferbonding Back-end of Line technologies for micro and nano electronics Process and equipment simulation Micro and nano reliability Printed functionalities Advanced system engineering
5 Kernkompetenzen der Abteilung 500 Competence extension Ionic Liquids New materials Packaging for bio MEMS MEMS for acoustic applications Nano effects System Packaging Waferbonding Integration technologies Bonding with nano effects Temporarily bonding Low temperature bonding Characterisation for bonding Printing for bonding and contacting 3D Integration (chip- and wafer level) Harsh environment MEMS Service Dicing Wire bonding Wafer bonding Technology consulting and -transfer Dr. Maik Wiemer Seite 5
6 Department System Packaging Department Manager: M. Wiemer, Deputy J. Frömel Secretariat: S. Lötsch, U. Weltsch Materials & Technologies (Group Leader: F. Roscher) Topics Aerosol-Jet deposition Screen printing (Contacting, Bonding) Bonding by Nano effects (ionic liquids) Bond characterization Integration technologies (Group Leader: M. Baum) Topics Temporarily and permanent bonding MEMS Packaging (medical and acoustic applications, harsh environment) Integration technologies (3D MEMS+ electronics) Nanoimprinting Printed Interconnect for industrial automization MEMS Packaging for medical decives Scientists: Roscher, Seifert, Saeidi, Vogel, Hertel, Reich Scientist: Baum, Frömel, Wünsch, Haubold, Gabler, Hofmann, Wang Operators: Service: Kinner, Uhlig, Lesner wafer dicing, wire bonding, analytics, sample preparation Dr. Maik Wiemer Seite 6
7 Temporary waferbonding key technology for 3D-Integration Mean processes for temporary waferbonding Preparation of device wafer Preparation of carrier wafer Adhesive waferbonding Wafer de-bonding Dr. Maik Wiemer Seite 7
8 Temporary waferbonding key technology for 3D- Integration TEMPORARY BOND WITH THERMOPLASTIC ADHESIVE Flip Wafer TEMPORARY BOND WITH THERMOPLASTIC ADHESIVE Flip Wafer Device Wafer Spin Coat Thermoplastic Adhesive Cure Adhesive Device Wafer Spin Coat Thermoplastic Adhesive Cure Adhesive ROOM TEMPERATURE PEEL-OFF DEBOND Thinned Device Wafer Flip Wafer ZoneBOND Carrier with Low Adhesion Zone in the Center Thermocompression Bond (Temperature / Force) Flip Wafer Carrier Wafer Spin Coat Release Layer Soft Bake Release Layer ROOM TEMPERATURE PEEL-OFF DEBOND Thinned Device Wafer Flip Wafer Bond (Temperature / Force) Flip Wafer Edge Cut = Soften/dissolve adhesive at the wafer edge using a batch process Attach to Dicing Frame Clean Carrier Clean Carrier ZoneBOND Carrier Mechanical Debond at Room Temperature Carrier Wafer Attach to Dicing Frame Mechanical Debond at Room Temperature Attach to Dicing Frame Edge Cut in a single wafer process (Tape must be compatible) (1) The use of Brewer Science ZoneBOND technology requires a separate license agreement with BrewerScience Clean Device Wafer on Frame Clean Device Wafer on Frame Fig.: Process flow of Zone-Bond de-bonding process (Zone-Bond) Fig.: Process flow of new temporary zoneless debonding process (Brewer-Bond) Mechanical room temperature over peel-off process Two Zone carrier needed Edge release needed Mechanical room temperature over peel-off process One Zone carrier Edge release not needed
9 Temporary waferbonding key technology for 3D- Integration Different Methods established with different requirements regarding thermal, chemical and mechanical stress Traditionally Methods: Thermal slide, Laser release New Trend: Mechanical room temperature over peel-off process Zone-Bond de-bonding process (Zone-Bond); New: zone-less de-bonding process (BrewerBond) ENAS-focus: Zone-less de-bonding process from Brewer Science with temporary waferbonding over an adhesive Reason room temperature de-bonding technology
10 Temporary waferbonding key technology for 3D-Integration ENAS method adhesive temporary waferbonding Complete process flow to fabricate thin wafer (up to 50µm) ZoneBond process established Research focus: from Zone-Bond to zone-less de-bonding techniques to reduce process time and costs Critical: cracks on wafer edge after wafer thinning Abb.: waferbonding system (SÜSS-SB 8e) Fig.: Puddle-dispense cleaning of thin device wafer on tape frame Abb.: De-bonding (SÜSS-DB 12T) and Coater system (SÜSS RCD 8) Dr. Maik Wiemer Seite 10
11 Technology Screen Printing DEK Horizon 03iX Strukturmorphologie: Lateral 50 µm mm; Vertikal 10 µm - 1 mm Screen frame: 736 x 736mm (29" x 29") standard Printable Area (510mm x 508.5mm) Modul for Via Filling Modul for Dispensing Vector Guard stencil printing Machine Alignment >2 +/- 12.5μm, 6 Sigma Process Alignment >2 +/- 25μm, 6 Sigma # Source: SMTnet Dr. Maik Wiemer Seite 11
12 IV. Technology DEK Via Filling Technology Pro Flow Confidential Filled through glass vias by stencil printing Tobias Seifert Page 12 Fraunhofer ENAS
13 First Day Tuesday June 23, 2015 from Time to Speaker Company Titel 13:00 13:20 M. Wiemer Fraunhofer ENAS Welcome note, Packaging of MEMS devices An overview 13:20 13:55 Jörg Siegert ams AG 13:55 14:20 Dr. Peter O Brien University College Cork 14:20 14:45 Thomas Krebs Heraeus Deutschland GmbH & Co. KG 14:45 15:10 Toru Kondo Olympus Open TSV technology for 3D sensor applications Packaging of integrated photonic devices; applications, user foundry services and design rules Silver sinter interconnects in diversified applications 16Mpixel 3D stacked CMOS image sensor 15:10 15:40 Coffee break 15:40 16:05 Felix Gabler Fraunhofer ENAS 16:05 16:30 Margarete Zoberbier SUSS MicroTec Lithography GmbH Towards MEMS loudspeaker fabrication by using metallic glass thin films MEMS packaging Infinite variety of bonding applications 16:30 16:55 Reinhard Jurisch Microsensys Passive RFID sensor solutions 16:55 17:20 Dr. Dieter Rammlmair Federal Institute for Geosciences and Natural Resourcesa Geology needs MEMS and sensors
14 Second Day Wednesday June 24, 2015 Time Speaker Company Titel from to Welcome 09:00 09:10 M. Wiemer Fraunhofer ENAS 09:10 09:35 Sven Bochmann Turck Duotec GmbH MEMS-based industry 4.0 applications 09:35 10:00 Dr. Ursula Palfinger 10:00 10:25 Steffi Proschwitz JOANNEUM RESEARCH Forschungsgesellschaft mbh University of Applied Sciences Zwickau KG Large-area patterning by roller-based nanoimprint lithography Applications of thermal nano imprint lithography 10:25 10:55 Coffee break 10:55 11:20 Dr. Martin Eibelhuber EV Group Oxide free direct wafer bonding 11:20 11:45 Dr. Axel Müller Klinikum Chemnitz 11:45 12:10 Marco Haubold Fraunhofer ENAS 12:10 12:35 Prof. Dr. Richard Funk Technische Universität Dresden 12:35 13:00 Michel Brizoux Thales Global Services Telecardiology Technical innovations and challenges in clinical practice Packaging and fabrication opportunities enabled by the room temperature deposition of Parylene MEMS and biological cells advances in designing sensors, actuators and biocompatible surfaces for medical use Thales vision and need in advanced packaging for high end applications
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