L293, L293D QUADRUPLE HALF-H DRIVERS

Transcription

1 Featuring Unitrode L and LD Products Now From Texas Instruments Wide Supply-Voltage Range: 4.5 V to 6 V Separate Input-Logic Supply Internal ESD Protection Thermal Shutdown High-Noise-Immunity Inputs Functional Replacements for SGS L and SGS LD Output Current A Per Channel (6 ma for LD) Peak Output Current A Per Channel (. A for LD) Output Clamp Diodes for Inductive Transient Suppression (LD) description The L and LD are quadruple high-current half-h drivers. The L is designed to provide bidirectional drive currents of up to A at voltages from 4.5 V to 6 V. The LD is designed to provide bidirectional drive currents of up to 6-mA at voltages from 4.5 V to 6 V. Both devices are designed to drive inductive loads such as relays, solenoids, dc and bipolar stepping motors, as well as other high-current/high-voltage loads in positive-supply applications. SLRS8B SEPTEMBER 86 REVISED JUNE,EN A Y HEAT SINK AND GROUND Y A V CC HEAT SINK AND GROUND,EN A Y Y A V CC N, NE PACKAGE (TOP VIEW) V CC 4A 4Y HEAT SINK AND GROUND All inputs are TTL compatible. Each output is a complete totem-pole drive circuit, with a Darlington transistor sink and a pseudo-darlington source. Drivers are enabled in pairs, with drivers and enabled by,en and drivers and 4 enabled by,4en. When an enable input is high, the associated drivers are enabled and their outputs are active and in phase with their inputs. When the enable input is low, those drivers are disabled and their outputs are off and in the high-impedance state. With the proper data inputs, each pair of drivers forms a full-h (or bridge) reversible drive suitable for solenoid or motor applications. On the L, external high-speed output clamp diodes should be used for inductive transient suppression. A V CC terminal, separate from V CC, is provided for the logic inputs to minimize device power dissipation. The Land LD are characterized for operation from C to C DWP PACKAGE (TOP VIEW) Y A,4EN V CC 4A 4Y Y A,4EN HEAT SINK AND GROUND Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright, Texas Instruments Incorporated POST OFFICE BOX 655 DALLAS, TEXAS 565

2 SLRS8B SEPTEMBER 86 REVISED JUNE block diagram VCC M 4 M M VC NOTE: Output diodes are internal in LD. TEXAS INSTRUMENTS AVAILABLE OPTIONS PACKAGE TA C to C PLASTIC DIP (NE) LNE LDNE TA C to C AVAILABLE OPTIONS PACKAGED DEVICES SMALL OUTLINE (DWP) LDWP LDDWP PLASTIC DIP (N) LN LDN The DWP package is available taped and reeled. Add the suffix TR to device type (e.g., LDWPTR). POST OFFICE BOX 655 DALLAS, TEXAS 565

3 FUTION TABLE (each driver) INPUTS OUTPUT A EN Y H H H L H L X L Z H = high level, L = low level, X = irrelevant, Z = high impedance (off) In the thermal shutdown mode, the output is in the high-impedance state, regardless of the input levels. SLRS8B SEPTEMBER 86 REVISED JUNE logic diagram A,EN A A,4EN 4A 5 ÁÁ Á Á Á Á ÁÁ 6 4 Y Y Y 4Y schematics of inputs and outputs (L) EQUIVALENT OF EACH INPUT TYPICAL OF ALL OUTPUTS VCC VCC Current Source Input Output POST OFFICE BOX 655 DALLAS, TEXAS 565

4 SLRS8B SEPTEMBER 86 REVISED JUNE schematics of inputs and outputs (LD) EQUIVALENT OF EACH INPUT TYPICAL OF ALL OUTPUTS VCC VCC Current Source Input Output absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, V CC (see Note ) V Output supply voltage, V CC V Input voltage, V I V Output voltage range, V O V to V CC + V Peak output current, I O (nonrepetitive, t 5 ms): L ± A Peak output current, I O (nonrepetitive, t µs): LD ±. A Continuous output current, I O : L ± A Continuous output current, I O : LD ±6 ma Continuous total dissipation at (or below) 5 C free-air temperature (see Notes and ) mw Continuous total dissipation at 8 C case temperature (see Note ) mw Maximum junction temperature, T J C Lead temperature,6 mm (/6 inch) from case for seconds C Storage temperature range, T stg C to 5 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES:. All voltage values are with respect to the network ground terminal.. For operation above 5 C free-air temperature, derate linearly at the rate of 6.6 mw/ C.. For operation above 5 C case temperature, derate linearly at the rate of.4 mw/ C. Due to variations in individual device electrical characteristics and thermal resistance, the built-in thermal overload protection may be activated at power levels slightly above or below the rated dissipation. 4 POST OFFICE BOX 655 DALLAS, TEXAS 565

5 SLRS8B SEPTEMBER 86 REVISED JUNE recommended operating conditions VIH Supply voltage High-level input voltage MIN MAX UNIT VCC 4.5 VCC VCC 6 V VCC V. VCC V VCC V. V VIL Low-level output voltage..5 V TA Operating free-air temperature C The algebraic convention, in which the least positive (most negative) designated minimum, is used in this data sheet for logic voltage levels. electrical characteristics, V CC = 5 V, V CC = 4 V, T A = 5 C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOH High-level output voltage L: IOH = A LD: IOH =.6 A VCC.8 VCC.4 V VOL Low-level output voltage L: IOL = A LD: IOL =.6 A..8 V VOKH High-level output clamp voltage LD: IOK =.6 A VCC +. V VOKL Low-level output clamp voltage LD: IOK =.6 A. V IIH High-level input current A EN VI =V.. µa IIL Low-level input current A VI = EN µa All outputs at high level ICC Logic supply current IO = All outputs at low level 5 6 ma All outputs at high impedance 8 4 All outputs at high level 4 4 ICC Output supply current IO = All outputs at low level 6 ma All outputs at high impedance 4 switching characteristics, V CC = 5 V, V CC = 4 V, T A = 5 C PARAMETER TEST CONDITIONS LNE, LDNE MIN TYP MAX UNIT tplh Propagation delay time, low-to-high-level output from A input 8 ns tphl Propagation delay time, high-to-low-level output from A input 4 ns CL = pf, See Figure ttlh Transition time, low-to-high-level output ns tthl Transition time, high-to-low-level output ns switching characteristics, V CC = 5 V, V CC = 4 V, T A = 5 C PARAMETER TEST CONDITIONS LDWP, LN LDDWP, LDN UNIT MIN TYP MAX tplh Propagation delay time, low-to-high-level output from A input 5 ns tphl Propagation delay time, high-to-low-level output from A input ns CL = pf, See Figure ttlh Transition time, low-to-high-level output ns tthl Transition time, high-to-low-level output 5 ns POST OFFICE BOX 655 DALLAS, TEXAS 565 5

6 SLRS8B SEPTEMBER 86 REVISED JUNE PARAMETER MEASUREMENT INFORMATION tf tr % % V Input 5 V 4 V Input 5% 5% Pulse Generator (see Note B) V VCC VCC A Y EN Output CL = pf (see Note A) Output % % tw tphl tplh % % VOH 5% 5% % % VOL tthl ttlh TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: tr ns, tf ns, tw = µs, PRR = 5 khz, ZO = 5 Ω. Figure. Test Circuit and Voltage Waveforms 6 POST OFFICE BOX 655 DALLAS, TEXAS 565

7 APPLICATION INFORMATION SLRS8B SEPTEMBER 86 REVISED JUNE 5 V 4 V kω VCC 6 VCC,EN Control A A Y Motor A Y 6,4EN Control B A Y 4A 5 4Y 4 Thermal Shutdown 4, 5,, Figure. Two-Phase Motor Driver (L) POST OFFICE BOX 655 DALLAS, TEXAS 565

8 SLRS8B SEPTEMBER 86 REVISED JUNE APPLICATION INFORMATION 5 V 4 V kω VCC VCC 6,EN Control A A Y Motor A Y 6,4EN Control B A Y 4A 5 4Y 4 Thermal Shutdown 4, 5,, Figure. Two-Phase Motor Driver (LD) 8 POST OFFICE BOX 655 DALLAS, TEXAS 565

9 SLRS8B SEPTEMBER 86 REVISED JUNE APPLICATION INFORMATION VCC SES5 M SES5 M 8 A 4A 5 4 / L 4, 5,, 6 VCC EN EN A M 4A M H H Fast motor stop H Run H L Run L Fast motor stop L X Free-running motor stop L = low, H = high, X = don t care X Free-running motor stop Figure 4. DC Motor Controls (connections to ground and to supply voltage) VCC SES5 M SES5 A A VCC / L 4, 5,, EN Figure 5. Bidirectional DC Motor Control EN A A FUTION H L H Turn right H H L Turn left H L L Fast motor stop H H H Fast motor stop L X X Fast motor stop L = low, H = high, X = don t care POST OFFICE BOX 655 DALLAS, TEXAS 565

10 SLRS8B SEPTEMBER 86 REVISED JUNE IL/IL = ma APPLICATION INFORMATION C. µf L 6 5 VCC D5 D + + D8 D4 4 4 VCC L IL 5 L IL 6 D6 D D D D D8 = SES5 Figure 6. Bipolar Stepping-Motor Control mounting instructions The Rthj-amp of the L can be reduced by soldering the pins to a suitable copper area of the printed circuit board or to an external heatsink. Figure shows the maximum package power P TOT and the θ JA as a function of the side of two equal square copper areas having a thickness of 5 µm (see Figure ). In addition, an external heat sink can be used (see Figure 8). During soldering, the pin temperature must not exceed 6 C, and the soldering time must not be longer than seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. POST OFFICE BOX 655 DALLAS, TEXAS 565

11 APPLICATION INFORMATION SLRS8B SEPTEMBER 86 REVISED JUNE Copper Area 5-µm Thickness Printed Circuit Board Figure. Example of Printed Circuit Board Copper Area (used as heat sink). mm. mm 8. mm Figure 8. External Heat Sink Mounting Example (θ JA = 5 C/W) POST OFFICE BOX 655 DALLAS, TEXAS 565

12 SLRS8B SEPTEMBER 86 REVISED JUNE APPLICATION INFORMATION 4 MAXIMUM POWER AND JUTION vs THERMAL RESISTAE 8 5 MAXIMUM POWER DISSIPATION vs AMBIENT TEMPERATURE TOT Power Dissipation W P θja PTOT (TA = C) θja Thermal Resistance C/W P TOT Power Dissipation W With Infinite Heat Sink 4 Heat Sink With θja = 5 C/W Free Air Side mm TA Ambient Temperature C Figure Figure POST OFFICE BOX 655 DALLAS, TEXAS 565

13 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Mailing Address: Texas Instruments Post Office Box 655 Dallas, Texas 565 Copyright, Texas Instruments Incorporated

14 This datasheet has been download from: Datasheets for electronics components.