BAS16 series. 1. Product profile. High-speed switching diodes. 1.1 General description. 1.2 Features and benefits. 1.

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1 Rev. 6 4 September 04 Product data sheet. Product profile. General description, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table. Product overview Type number Package Configuration Package NXP JEITA JEDEC configuration BAS6 SOT3 - TO-36AB single small BAS6H SOD3F - - single small and flat lead BAS6J SOD33F SC-90 - single very small and flat lead BAS6L SOD single leadless ultra small BAS6T SOT46 SC-75 - single ultra small BAS6VV SOT triple isolated ultra small and flat lead BAS6VY SOT363 SC-88 - triple isolated very small BAS6W SOT33 SC-70 - single very small BAS36 SOD33 SC-76 - single very small BAS56 SOD53 SC-79 - single ultra small and flat lead. Features and benefits High switching speed: t rr 4ns Low capacitance Low leakage current Reverse voltage: V R 00 V Repetitive peak reverse voltage: Small SMD plastic packages V RRM 00 V AEC-Q0 qualified.3 Applications High-speed switching General-purpose switching

2 .4 Quick reference data. Pinning information Table. Quick reference data T amb =5 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per diode V R reverse voltage V I R reverse current V R =80V - - A t rr reverse recovery time I F =0mA; I R =0mA; R L = 00 ; I R(meas) = ma ns Table 3. Pinning Pin Description Simplified outline Graphic symbol BAS6; BAS6T; BAS6W anode not connected 3 3 cathode 006aaa aaa764 BAS6H; BAS6J; BAS36; BAS56 cathode [] anode 006aab040 00aab540 BAS6L cathode [] anode BAS6VV; BAS6VY anode (diode ) anode (diode ) 3 anode (diode 3) 4 cathode (diode 3) 5 cathode (diode ) 6 cathode (diode ) Transparent top view aab aab aab06 [] The marking bar indicates the cathode. Product data sheet Rev. 6 4 September 04 of

3 3. Ordering information 4. Marking Table 4. Type number Ordering information Package Name Description Version BAS6 TO-36AB plastic surface-mounted package; 3 leads SOT3 BAS6H - plastic surface-mounted package; leads SOD3F BAS6J SC-90 plastic surface-mounted package; leads SOD33F BAS6L DFN006- leadless ultra small plastic package; terminals; SOD88 body.0 mm BAS6T SC-75 plastic surface-mounted package; 3 leads SOT46 BAS6VV - plastic surface-mounted package; 6 leads SOT666 BAS6VY SC-88 plastic surface-mounted package; 6 leads SOT363 BAS6W SC-70 plastic surface-mounted package; 3 leads SOT33 BAS36 SC-76 plastic surface-mounted package; leads SOD33 BAS56 SC-79 plastic surface-mounted package; leads SOD53 5. Limiting values Table 5. Marking codes Type number Marking code [] BAS6 A6* BAS6H A BAS6J AR BAS6L S BAS6T A6 BAS6VV 53 BAS6VY 6* BAS6W A6* BAS36 A6 BAS56 6 [] * = placeholder for manufacturing site code Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 6034). Symbol Parameter Conditions Min Max Unit Per diode V RRM repetitive peak reverse - 00 V voltage V R reverse voltage - 00 V Product data sheet Rev. 6 4 September 04 3 of

4 Table 6. Limiting values continued In accordance with the Absolute Maximum Rating System (IEC 6034). Symbol Parameter Conditions Min Max Unit I F forward current BAS6 [] - 5 ma BAS6H [] - 5 ma BAS6L BAS6T [] - 55 ma BAS6VV [][3] - 00 ma BAS6VY BAS6W [] - 75 ma BAS6J [] - 50 ma BAS36 BAS56 I FRM repetitive peak forward current t p ms; ma I FSM non-repetitive peak forward current [] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [] Device mounted on an FR4 PCB with 60 m copper strip line. square wave; T j(init) = 5 C t p = s - 4 A t p =ms - A t p =s - A P tot total power dissipation BAS6 T amb 5 C [] - 50 mw BAS6H T amb 5 C [] mw [5] mw BAS6J T amb 5 C [5] mw BAS6L T amb 5 C [] - 50 mw BAS6T T sp 90 C [][4] - 70 mw BAS6VV T amb 5 C [][3] - 80 mw BAS6VY T sp 85 C [][3][6] - 50 mw BAS6W T amb 5 C [] - 00 mw BAS36 T sp 90 C [][4] mw BAS56 T sp 90 C [][4] mw Per device T j junction temperature - 50 C T amb ambient temperature C T stg storage temperature C [3] Single diode loaded. [4] Soldering point of cathode tab. [5] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode cm. [6] Soldering points at pins 4, 5 and 6. Product data sheet Rev. 6 4 September 04 4 of

5 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R th(j-a) thermal resistance from in free air junction to ambient BAS6 [] K/W BAS6H [] K/W [3] K/W BAS6J [3] K/W BAS6L [] K/W BAS6VV [][4] K/W [3][4] K/W R th(j-sp) BAS6W [] K/W thermal resistance from junction to solder point BAS K/W BAS6H [5] K/W BAS6J [5] K/W BAS6T K/W BAS6VY [4][6] K/W BAS6W K/W BAS36 [5] K/W BAS56 [5] K/W [] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [] Device mounted on an FR4 PCB with 60 m copper strip line. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode cm. [4] Single diode loaded. [5] Soldering point of cathode tab. [6] Soldering points at pins 4, 5 and 6. Product data sheet Rev. 6 4 September 04 5 of

6 7. Characteristics Table 8. Characteristics T amb =5 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per diode V F forward voltage [] I F = ma mv I F = 0 ma mv I F = 50 ma - - V I F = 50 ma V I R reverse current V R = 5 V na V R = 80 V - - A V R =5V; T j =50 C A V R =80V; T j =50 C A C d diode capacitance f = MHz; V R =0V BAS6; BAS6H; pf BAS6J; BAS6L; BAS6T; BAS6VV; BAS6VY; BAS6W; BAS36 BAS pf t rr reverse recovery time I F =0mA; I R =0mA; ns R L = 00 ; I R(meas) = ma V FR forward recovery voltage I F =0mA; t r = 0 ns V [] Pulse test: t p 300 s; 0.0. Product data sheet Rev. 6 4 September 04 6 of

7 aab3 0 mbg704 I F (ma) 0 I FSM (A) 0 0 () () (3) (4) V F (V) t p (μs) () T amb = 50 C () T amb =85 C (3) T amb =5 C (4) T amb = 40 C Fig. Forward current as a function of forward voltage; typical values Fig. Based on square wave currents. T j(init) =5 C Non-repetitive peak forward current as a function of pulse duration; maximum values 0 I R (μa) 0 () 006aab C d (pf) mbg446 () 0 0 (3) (4) V R (V) V R (V) () T amb = 50 C () T amb =85 C (3) T amb =5 C (4) T amb = 40 C Fig 3. Reverse current as a function of reverse voltage; typical values Fig 4. f=mhz; T amb =5 C Diode capacitance as a function of reverse voltage; typical values Product data sheet Rev. 6 4 September 04 7 of

8 8. Test information R S = 50 Ω I F D.U.T. SAMPLING OSCILLOSCOPE t r t p t 0 % + I F trr t V = V R + I F R S R i = 50 Ω mga88 V R 90 % input signal output signal () () I R =ma Input signal: reverse pulse rise time t r = ns; reverse voltage pulse duration t p = 00 ns; duty cycle =0.05 Oscilloscope: rise time t r =0.35ns Fig 5. Reverse recovery time test circuit and waveforms I kω 450 Ω I 90 % V R S = 50 Ω D.U.T. OSCILLOSCOPE R i = 50 Ω VFR 0 % t r t p t t input signal output signal mga88 Fig 6. Input signal: forward pulse rise time t r = 0 ns; forward current pulse duration t p 00 ns; duty cycle Forward recovery voltage test circuit and waveforms 8. Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q0 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. Product data sheet Rev. 6 4 September 04 8 of

9 9. Package outline Fig 7. Package outline BAS6 (SOT3/TO-36AB) Fig 8. Package outline BAS6H (SOD3F) cathode marking on top side (if applicable) Fig 9. Package outline BAS6J (SOD33F/SC-90) Fig 0. Package outline BAS6L (SOD88/DFN006-) pin index Fig. Package outline BAS6T (SOT46/SC-75) Fig. Package outline BAS6VV (SOT666) Product data sheet Rev. 6 4 September 04 9 of

10 pin index Fig 3. Package outline BAS6VY (SOT363) Fig 4. Package outline BAS6W (SOT33/SC-70) Fig 5. Package outline BAS36 (SOD33/SC-76) Fig 6. Package outline BAS56 (SOD53/SC-79) Product data sheet Rev. 6 4 September 04 0 of

11 0. Soldering solder paste 0.7 (3 ) (3 ) (3 ) (3 ) sot03_fr Fig 7. Reflow soldering footprint BAS6 (SOT3/TO-36AB) preferred transport direction during soldering sot03_fw Fig 8. Wave soldering footprint BAS6 (SOT3/TO-36AB) Product data sheet Rev. 6 4 September 04 of

12 solder paste. Fig 9. Reflow soldering footprint BAS6H (SOD3F) solder paste sod33f_fr Fig 0. Reflow soldering footprint BAS6J (SOD33F) Product data sheet Rev. 6 4 September 04 of

13 R0.05 (8 ) solder paste sod88_fr Fig. Reflow soldering footprint BAS6L (SOD88/DFN006-) (3 ) solder paste (3 ).3 sot46_fr Fig. Reflow soldering footprint BAS6T (SOT46/SC-75) Product data sheet Rev. 6 4 September 04 3 of

14 (6 ) 0.3 placement area solder paste (4 ) (4 ) 0.45 (4 ) (4 ) 5 sot666_fr Fig 3. Reflow soldering footprint BAS6VV (SOT666) (4 ) (4 ) solder paste (4 ) (4 ).8 sot363_fr Fig 4. Reflow soldering footprint BAS6VY (SOT363/SC-88) Product data sheet Rev. 6 4 September 04 4 of

15 preferred transport direction during soldering sot363_fw Fig 5. Wave soldering footprint BAS6VY (SOT363/SC-88) (3 ) 3.3 solder paste (3 ) 5 (3 ) sot33_fr Fig 6. Reflow soldering footprint BAS6W (SOT33/SC-70) Product data sheet Rev. 6 4 September 04 5 of

16 .45 (3 ) preferred transport direction during soldering sot33_fw Fig 7. Wave soldering footprint BAS6W (SOT33/SC-70) solder paste. sod33_fr Fig 8. Reflow soldering footprint BAS36 (SOD33/SC-76) Product data sheet Rev. 6 4 September 04 6 of

17 preferred transport direction during soldering sod33_fw Fig 9. Wave soldering footprint BAS36 (SOD33/SC-76).5.4. solder paste 0.4 sod53_fr Fig 30. Reflow soldering footprint BAS56 (SOD53/SC-79) Product data sheet Rev. 6 4 September 04 7 of

18 . Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes BAS6_SER_ Product data sheet - BAS6_SER_5 Modifications: Section. Features and benefits : updated Section 4 Marking : updated Table 6 Limiting values : updated Section 8 Test information : updated Section Legal information : updated BAS6_SER_ Product data sheet - BAS6_4 BAS6H_ BAS6J_ BAS6L_ BAS6T_ BAS6VV_BAS6VY_3 BAS6W_4 BAS36_4 BAS56_ BAS6_ Product specification - BAS6_3 BAS6H_ Product data sheet - - BAS6J_ Product data sheet - - BAS6L_ Product specification - - BAS6T_ Product specification - - BAS6VV_BAS6VY_ Product data sheet - BAS6VV_BAS6VY_ BAS6W_ Product specification - BAS6W_3 BAS36_ Product specification - BAS36_3 BAS56_ Product specification - - Product data sheet Rev. 6 4 September 04 8 of

19 . Legal information. Data sheet status Document status [][] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [] Please consult the most recently issued document before initiating or completing a design. [] The term short data sheet is explained in section Definitions. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet..3 Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). NXP does not accept any liability in this respect. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 6034) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Product data sheet Rev. 6 4 September 04 9 of

20 No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Translations A non-english (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions..4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 3. Contact information For more information, please visit: For sales office addresses, please send an to: Product data sheet Rev. 6 4 September 04 0 of

21 4. Contents Product profile General description Features and benefits Applications Quick reference data Pinning information Ordering information Marking Limiting values Thermal characteristics Characteristics Test information Quality information Package outline Soldering Revision history Legal information Data sheet status Definitions Disclaimers Trademarks Contact information Contents Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. NXP Semiconductors N.V. 04. All rights reserved. For more information, please visit: For sales office addresses, please send an to: Date of release: 4 September 04 Document identifier: BAS6_SER

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