2016 Shanghai International Workshop on Thermoelectric Materials. Announcement

Transcription

1 2016 Shanghai International Workshop on Thermoelectric Materials May 27 May Shanghai Institute of Ceramics, Shanghai, China Announcement 2016 Shanghai International Workshop on Thermoelectric Materials will be held on May , at Shanghai, China. This is the third workshop on thermoelectric materials organized by Shanghai Institute of Ceramics, Chinese Academy of Sciences. This workshop is set up to invite world-wide active scientists to join together for addressing the currently hot topics in the field of thermoelectrics. As a resurgent active area in materials science, thermoelectric research has attracted much attention, and quite a few great advancements have been made in recent years. There are, however, still many scientific issues yet to be resolved, which calls for breakthrough effect and interdisciplinary collaboration. Of special importance are the fundamentals, including electrical and thermal transports in complex compounds and composite materials, sophisticated physical measurements and in-depth characterization of those properties. In the workshop, the invited speakers and lectures are carefully chosen to cover some leading-edge directions in the thermoelectric transport fundamentals and materials. The forum will allow the invited speakers ample time to explain their understanding on scientific problems in detail, and also encourage participants to question and have deep discussions. The two-day meeting will mainly discuss scientific and technological issues related to the following topics: physical mechanisms of electrical and thermal transports; novel aspects of thermoelectric transports; in-depth physical measurement and characterization; thermoelectric performance optimization strategy; novel thermoelectric materials and physical mechanisms. The workshop will cover the cost of your accommodation and meal expenses. Our program coordinator, Dr. Shan Zheng (zhengshan@mail.sic.ac.cn) will assist you in making all your travel arrangements. Organizing Committee: Prof. Lidong Chen (chairman, cld@mail.sic.ac.cn) Prof. Wenqing Zhang (wqzhang@mail.sic.ac.cn) Prof. Xun Shi (xshi@mail.sic.ac.cn) Dr. Shan Zheng (secretary, zhengshan@mail.sic.ac.cn) Sponsors: State Key Laboratory of High Performance Ceramics and Superfine Microstructure Shanghai Institute of Ceramics, Chinese Academy of Sciences Wiley Beijing Office

2 Participants 21 invited speakers, and some audiences. Conference place Shanghai Institute of Ceramics, Chinese Academy of Science, Shanghai, China. (1295 Dingxi Road, Shanghai ) Hotels: We will book Penta Hotel (1525 Dingxi Road, Shanghai) for all the invited speakers. It is 3 minutes to Shanghai Institute of Ceramics by walk. Financial All invited speakers need to cover their own international traveling fees. Local expenses, including hotel and food, for all invited speakers and invited participants will be covered. This workshop is just before the ICT 2016 (May 29-June 2, 2016, Wuhan). Workshop attendants need to cover their own ICT-related expenses if they plan to join ICT Traveling issues The workshop would be held at Shanghai city. All participants can fly to Shanghai Pudong Airport or Shanghai Hongqiao Airport directly. It is convenient from the airports to the workshop hotel or Shanghai Institute of Ceramics by taxis or by No. 2 Subway. We may provide certain service when necessary.

3 2016 Shanghai International Workshop on Thermoelectric Materials May 27 May 28, 2016 Shanghai Institute of Ceramics, Shanghai, China Program May 26, 2016 Shanghai Institute of Ceramics Morning, May 27, 2016 Opening ceremony, Chaired by Prof. Jing Sun 8:30 8:40 am, Welcoming address by Prof. Lixin Song Chaired by Prof. Wenqing Zhang (3 invited lectures, 25+5 min) KL1 8:40 9:10 am G. Jeffrey Snyder, Phonon scattering in thermoelectrics a look at grain boundaries, dislocations and alloys KL2 9:10 9:40 am Qiang Li, Dirac semimetals and thermoelectric materials KL3 9:40 10:10 am John Plummer, Recent initiatives at Nature journals Coffee Break: 10:10-10:40 (Group photo) KL4 KL5 KL6 Chaired by Prof. Terry M. Tritt (3 invited lectures, 25+5 min) 10:40 11:10 am Citrad Uher, Progress in Mg 2Si 1-xSn x-based thermoelectric materials 11:10 11:40 am Tiejun Zhu, Design and optimization of p-type half-heusler thermoelectric materials 11:40 12:10 am Yanzhong Pei, Electron and phonon engineering in PbTe and SnTe Lunch, 12:20 1:00 pm

4 Afternoon, May 27, 2016 Chaired by Prof. Ctirad Uher (4 invited lectures, 25+5 min) KL7 1:40 2:10 pm Kamran Behnia, Low-temperature thermoelectric response of hopping electrons KL8 2:10 2:40 pm Wei Xu, Electrically conductive coordination polymers: a novel inorganic-organic hybrid approach for thermoelectric conversion KL9 2:40 3:10 pm Olivier Delaire, Lattice dynamics and thermal transport in thermoelectrics KL10 3:10 3:40 pm Jiaqing He, Lifting up the average thermoelectric figure of merit Coffee Break: 3:40 4:00 pm KL11 KL12 KL13 KL14 Chaired by Prof. Qiang Li (4 invited lectures, 25+5 min) 4:00 4:30 pm Yuri Grin, Scattering centers formation in oxide-based thermoelectric materials 4:30 5:00 pm Yuanhua Lin, Layered-oxides thermoelectric ceramics 5:00 5:30 pm Lidong Zhao, Oxyselenides: new promising thermoelectric materials 5:30 6:00 pm Zhigang Chen, Realization of high performance thermoelectric nanomaterials by interphase design and band engineering Banquet,6:30 8:00 pm Morning, May 28, 2016 Chaired by Dr. Hsin Wang (3 invited lectures, 25+5 min) KL15 8:30 9:00 am Zhifeng Ren, New understanding of thermoelectric figure-of-merit and efficiency KL16 9:00 9:30 am Ryoji Funahashi, Development of thermoelectric technology form material to unit KL17 9:30 10:00 am Lulu Ma, Publishing in Wiley materials dcience journals Coffee Break: 10:00 10:20 am

5 KL18 KL19 KL20 Chaired by Prof. Lidong Chen (3 invited lecture, 25+5 min) 10:20 10:50 am Emmanuel Guilmeau, Recent progress in sulfur based compounds 10:50 11:20 am Jiong Yang, The general conductive network in compounds with chalcogenide sublattices 11:20 11:50 am Xun Shi, Cu-based thermoelectric materials Lunch, 12:00 am