SALES SPECIFICATION. SC7640 Auto/Manual High Resolution Sputter Coater

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1 SALES SPECIFICATION SC7640 Auto/Manual High Resolution Sputter Coater Document Number SS-SC7640 Issue 1 (01/02)

2 Disclaimer The components and packages described in this document are mutually compatible and guaranteed to meet or exceed the published performance specifications. No performance guarantees, however, can be given in circumstances where these component packages are used in conjunction with equipment supplied by companies other than Quorum Technologies.

3 Sales Specification SC7640 Sputter Coater 1 Table of Contents 1 Table of Contents 3 2 General Description 4 3 Mechanical Characteristics Physical Characteristics Pumping Requirements Drawing Numbers 6 4 Electrical Characteristics Electrical Connections Operating Conditions 6 5 Associated Equipment Rotary Vacuum Pumps 7 6 Optional Equipment WC7608 Water Cooled Stage RC7606 Rota Cota Stage FT7607 FTM Stage FT7690 Film Thickness Monitor 7 7 Performance Specification Vacuum Performance Sputtering Rates 8 8 Ordering Information 9 SS-SC st January 2002 Issue 1 Page 3 of 9

4 SC7640 Sputter Coater Sales Specification 2 General Description The SC7640 Sputter Coater is a simple to operate magnetron sputtering system designed to be used for coating Scanning Electron Microscopy (SEM) specimens. The system can be operated in manual or automatic mode. In the manual mode, pump down, purge and flush are still carried out automatically. The manual control of sputtering simplifies the control of the parameters essential for the production of high resolution films. The SC7640 Sputter Coater is comprised of two main parts: The Cabinet assembly The Vacuum chamber The cabinet assembly, which contains a high voltage power supply, vacuum gauging and manifold, supports the vacuum chamber. Mounted on the front panel of the cabinet are switches and meters, which provide the operator interface to the system. All service connections to the system are made via the rear panel. The cabinet is constructed in a manner to comply with the European EMC regulations. Top Plate Support Top Plate L Shaped Gaskets Sample Stage SC7640 Cabinet The vacuum chamber is formed by the top plate assembly, the glass work chamber and the baseplate assembly mounted on the top panel of the cabinet. The integrity of the vacuum is maintained by circular "L" gaskets either end of the work chamber. The top plate supports the cathode (target) and magnetic deflection system incorporating a dark space shield, which confines the plasma below the target. Flying leads (secured to the top plate), provide the necessary electrical and gas connections between the top plate and the rear panel connectors of the cabinet. The top plate is supported from a hinged pillar fixed to the rear panel. The hinging facilitates the loading and removal of samples from the work chamber and also aids the changing and replacement of targets. The SC7640 Sputter Coater produces fine grain coating with maximum versatility. The annular design of the magnetron sputter head ensures even coating over a wide area, which enables thin coatings of 2-3 nm to be achieved without charging effects being experienced in the SEM. The SC7640 sputter head, when operated at 800V DC gives high resolution coatings or standard coatings deposited rapidly at 2400V DC. Coating time is controlled by a three digit electronic timer with 1 second resolution. The vacuum level and plasma current are monitored by analogue meters. The standard adjustable height specimen stage can be replaced by an optional water cooled stage (WC7608), a rotary planetary stage (RC7606) or a FTM stage (FT7607). With the optional FTM stage, the coating thickness can be controlled by an optional FTM (FT7690 Film Thickness Monitor/controller) Page 4 of 9 1 st January 2002 Issue 1 SS-SC7640

5 Sales Specification SC7640 Sputter Coater The front panel, shown above, incorporates the chamber pressure and plasma current analogue meters, the manual/auto select switch, sequence start switch, set HT switch, repeat coating switch, and vent/stop switch. For manual operation, there are timer start and stop switches. The digital timer sets the coating time for both the manual and automatic sequences. The voltage applied to the sputter head is also selected on the front panel. The logic state in the operating sequence is also displayed by a series of LED indicating lamps. The gas pressure is controlled by the argon leak valve. The rear panel, shown above, includes the necessary fuses F1-F4, the HT outlet which is connected to the sputter head, the vacuum interlock socket for the sputter head (which prevent the operation of the HV power supply without vacuum being applied to the head), the Mains ON/OFF switch, the rotary pump socket, argon gas inlet nipple, and the ground (earthing) terminal for the sputter head. There are two 4mm sockets which enables the user to measure the actual voltage being applied to the head using a standard DVM in a ratio of 10,000:1 (i.e. 100mV = 1000V). A FT7690 film thickness monitor can be connected to the unit using the FTM socket and the Xtal socket. The power for the FTM is derived from the mains. The FTM socket provides the control of the coating. The oscillator is connected to the Xtal socket. When the FTM is connected, the front panel timer is by-passed and the coating thickness is controlled by the FTM only. If the user wishes to control the coating by time but also wishes to monitor the coating thickness, the FTM must be powered directly from the mains and the oscillator must be connected but the lead to the FTM must be disconnected. The water inlet and outlet fittings are supplied with a water cooled stage (WS7608). A switch for the operation of the Rota Cota stage (RC7606) is always fitted, but left as protected flying leads internally unless the stage is fitted. For carbon coating (SEM applications only), the top plate assembly can be replaced with an optional carbon rod (CA076R) or carbon fibre (CA076F) evaporation source operated from a low voltage, high current power supply CA7615 (10V/100A, 20V/50A). The sputter head, for safety reasons, is vacuum interlocked to prevent operation of the integral HV Power Supply when the Carbon Evaporation top plates are being used. SS-SC st January 2002 Issue 1 Page 5 of 9

6 SC7640 Sputter Coater Sales Specification 3 Mechanical Characteristics 3.1 Physical Characteristics The borosilicate glass work chamber is 165 mm external diameter x 135 mm high. The target to sample distance is nominally 45 mm. The sample holder will retain 6 specimen stubs either of the 3mm pin type or 10mm diameter and the height is adjustable. The unit measures 445 x 375 x 145mm (375 including vacuum chamber) and weighs 35Kg. 3.2 Pumping Requirements The work chamber has to be evacuated to <2 x 10-2 bar. This can be achieved in a reasonable time using a 90 l/m two stage rotary pump preferably incorporating an anti-suck back device. The pump should be fitted with an oil mist filter on the exhaust. 3.3 Drawing Numbers The assembly drawing numbers are as follows: LB764001C Top plate Assembly LB764002C Base plate Assembly LB764003B FTM Assembly LB764004D Chassis plate Assembly LB764005B Water Cooled Stage Assembly 4 Electrical Characteristics 4.1 Electrical Requirements The units are supplied as either 230V or 110V operation at 50/60Hz. The power rating is 250VA excluding the rotary pump. 4.2 Output Specifications The HV power supply can operate at up to 2800V DC at 50mA. Normal operation is at 2400V DC at 20mA or 800V DC at 10mA. The actual voltage as supplied to the cathode (target) can be monitored using an output on the back panel (10,000:1). Page 6 of 9 1 st January 2002 Issue 1 SS-SC7640

7 Sales Specification SC7640 Sputter Coater 5 Associated Equipment 5.1 Rotary Vacuum Pumps The SC7640 Sputter coater requires a two stage 90 l/m rotary pump with an anti-suck back device. The pump should be fitted with an oil mist exhaust filter. Quorum Technologies offer the EDWARDS HIGH VACUUM RV series pumps fitted with exhaust filters as our part number: E5005G: RV5 110/230V 50/60Hz 90 l/min two stage pump. 6 Optional Equipment 6.1 WS 7608 Water Cooled Stage The standard stage can be replaced with a water cooled stage. Cooled water can be circulated to lower the stage temperature. This reduced temperature should be kept above the Dew point to avoid condensation of atmospheric moisture whilst the stage is open to the atmosphere. This will result in excessive pump down times on re-evacuation and possible sample damage. 6.2 RC 7606 Rota Cota Stage The standard stage can be replaced with a rotary planetary stage. This is of particular interest for users with open pore high surface area samples and for carbon evaporation. The power supply for the rotary stage is built into the system as standard. 6.3 FT 7607 FTM Stage The standard stage can be replaced with an adjustable height stage incorporating a crystal holder. This enables the user to monitor and control the coating thickness with the optional FT7690 Film Thickness monitor. 6.4 FT 7690 Film Thickness Monitor The optional FTM monitors and controls thickness of the sputter coater by over-riding the timer when plugged into the unit. The deposition thickness is selected and controlled to 0.1 nm with a range of nm. The density of the evaporant is selected and the percentage of the crystal useful life can be displayed. The crystal life is typically 2-4 microns for gold. The unit operates using an oscillating 5MHz crystal and monitoring the change of resonant frequency as the crystal becomes loaded with evaporant. 7 Performance Specification 7.1 Vacuum Performance The ultimate vacuum in a clean system is better than 2 x 10-2 mbar SS-SC st January 2002 Issue 1 Page 7 of 9

8 SC7640 Sputter Coater Sales Specification 7.2 Sputtering Rates The following curves give experimentally determined sputtering rates for various metals as a function of voltage and current. It is noted that at low voltages and high currents, the rate of coating is lower than that at higher currents. This is as a result of the gas pressure being excessively high to achieve the current at the particular voltage. 15 6SXWWHULQJUDWH6& GOLD 10 9 Sputtering rate SC7640 PLATINUM Rate (nm/min) Rate (nm/min) Plasma Current (ma) 2500V 2000V 1500V 1000V 800V Plasma Current (ma) 2500V 2000V 1500V 1000V 800V 10 9 Sputtering rate SC7640 NICKEL 15 6SXWWHULQJUDWH6& GOLD/PALLADIUM Rate (nm/min) Rate (nm/min) Plasma Current (ma) 2500V 2000V 1500V 1000V 800V Plasma Current (ma) 2500V 2000V 1500V 1000V 800V Page 8 of 9 1 st January 2002 Issue 1 SS-SC7640

9 Sales Specification SC7640 Sputter Coater 8 Ordering Information Order No. SC7640 SC7640/110V E5005G E5004 WS7608 RC7606 FT7607 FT 7690 CA7615 CA7615/110V CA076R CA076F Order information High resolution Sputter Coater 230V 50/60Hz with Au/Pd target and kit High resolution Sputter Coater 110V 50/60Hz with Au/Pd target and kit 90 l/m two stage Rotary Pump with oil mist filter and kit Replacement Oil Mist Filter Water cooled stage Rota Cota stage FTM stage Film Thickness Monitor 110/230V 50/60Hz Carbon Evaporation PSU 230V 50/60Hz Carbon Evaporation PSU 110V 50/60Hz Carbon Rod Head with carbon rods A0834A Carbon Fibre Head with carbon fibre A0816 SS-SC st January 2002 Issue 1 Page 9 of 9

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