Wafer Bumping & Wafer Level Packaging for 300mm Wafer
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1 31 st International Conference on Electronics Manufacturing and Technology - IEMT November 2006 Sunway Resort Hotel, Petaling Jaya, Malaysia Wafer Bumping & Wafer Level Packaging for 300mm Wafer Thomas Oppert, Elke Zakel, Thorsten Teutsch
2 Content Short company profile Electroless NiAu UBM History Eless NiAu Market share, Usage Pac Tech Licenses Pac Tech Asia (Penang) Pac Tech Worldwide Bumping Capacity Processes Equipment Soldering Paste Printing Gang Ball Placement
3 Pac Tech Corporate Profile 1995 Pac Tech GmbH established, Berlin-Germany st Bumping facility in Nauen, Germany nd Bumping facility in Fukui, Japan (Alpha Bumping Technologies - ABT, JV with Nagase) 2002, 3rd Bumping facility PacTech USA Inc., CA, USA 2005, Customer Service Center Thailand 2006, Pac Tech Asia (Penang, Malaysia - planned Q4) PT Germany: 125 employees PT USA, Inc.: 20 employees Sales Turnover 2005: 14 Million Euro (PT Germany) Shareholder Structure: NAGASE & CO., Ltd. Founders
4 NAGASE PROFILE HISTORY : Founded 1832, Incorporated 1917 SALES : 5 billion US$ STOCK : Listed TSE-1, OSE-1 TYPE : Trading & Manufacturing FIELDS : Industrial & Consumer ITEMS : Electronics, Chemicals, Plastics, Pharmaceuticals, Beauty Care, Tokyo Head Office NAGASE & CO.,LTD. Osaka Head Office
5 Locations Worldwide Pac Tech USA Inc Santa Clara, CA Boston Sweden Denmark France Finland Pac Tech GmbH Nauen, Germany Italy Israel Thailand Korea China Tokyo Fukui Taiwan Philippines Malaysia Singapore Pac Tech facilities Distributor/ Sales Agent
6 Location in Penang Pac Tech Asia Penang Int l Airport
7 Pac Tech Asia, Penang Front View
8 Pac Tech Asia, Penang Process qualification orders June 2007 Accept production orders October 2007
9 I Electroless Ni/Au Bumping History
10 1st Ni Bumps 1990
11
12 II Electroless Ni/Au Bumping Market Share, Usage, Pac Tech Licenses & Worldwide Bumping Capacity
13 Worldwide use of electroles Ni & solder printing Memory RFID Pass. Comp./CSP's MOSFET Power MOS LCD Driver ASIC IGBT Mobile Phone Medical
14 Business Development Installed Equipment for eless NiAu & Technology Transfer/Licenses of Pac Tech Germany France Germany 300 mm France Q4/06 Q2/07 France 300 mm Q3/07 Growth Japan (ABT) Subcon Korea (STW) LCD-Driver USA Memory 300 mm USA (PacTech) SubCon 300 mm Philippines 300 mm USA Italy Q4/06 Germany Q3/ Year
15 Pac Pac Tech Group Worldwide Wafer Bumping Capacity 2006 Pac Tech GmbH Pac Tech USA ABT ("Pac Tech Japan") <4-8" Wafer> 600k 600k 450k <12" Wafer> 100k 150k Pac Tech GmbH Pac Tech USA ABT ("Pac Tech Japan") Pac Tech Asia <4-8" Wafer> 600k 600k 600k 300k <12" Wafer> 100k 150k - 100k 2008 Pac Tech GmbH Pac Tech USA ABT ("Pac Tech Japan") Pac Tech Asia <4-8" Wafer> 600k 600k 600k 600k <12" Wafer> 100k 150k - 150k
16 III Electroless Ni/Au Bumping - eless NiAu on Al - eless NiAu on Cu - eless NiPdAu
17 Under Bump Metal Process Electroless Plating of Ni/Au Bumps on Al pad 1/2 Backside Coating Pad Cleaning Pad Activation Electroless Nickel Flash Gold Coating Removal
18 Under Bump Metal Process Electroless Plating of Ni/Au Bumps on Al pad 2/2 Backside Coating Aluminum Cleaning Zincate Pretreatment Electroless Nickel Immersion Gold Coating Removal
19 Electroless Ni/Au on Copper Pad Backside Coating Pad Cleaning Pd Treatment Electroless Nickel Flash Gold Coating Removal 300 mm Capability!
20 Electroless Ni/Pd/Au Bumping on Al Backside Coating Aluminum Cleaning Zincate Pretreatment Electroless Nickel Electroless Palladium Immersion Gold Coating Removal
21 25µm Ni/Au UBM on RFID-Wafers 1/2 Customer A
22 Wafer Level RDL & Ni/Au-Bumping
23 Applications RFID-Tag
24 Flip chip on coil for contactless smart cards
25 Flip Chip Modules for contactless Smart Cards Substrate handling: reel to reel Assembly: Laplace soldering Flip chip attach
26 IV Equipment for Electroless Ni/Au UBM
27 Pacline A mm 8 Plating Systems in the Field
28 Pacline A50 - Capability for parallel processing of 3 carriers with 50 wafers 8 or 3 carriers with 26 wafers 12 - UPH: max. 150 Wafers 8"/hour or max. 78 wafers 12 /hour (5µm Ni/Au UBM) - Thick Au ability for wire bonding reliability - Ni bath control with ConPac 2.0 (bath conditioner) and ConPac control set - Central Computer Control Unit (CCCU) - PLC with Profi Bus system - Additional security tanks for each module and pump system - Design will be adapted to customer s facility - SECS GEM Interfacing - The system fulfils the fire safety standard FM 4910
29 Advantages of PacLine 300 A50 & electroless Ni/Au UBM 1) Low Capital Investment Cost ElectroPlating: Mio US$ Electroless UBM + Solder Print/Ball: 3-5 Mio US$ 2) High Throughput wafers per year 8 ; wafers 12 per year 3) Maskless Process No tooling required 4) Low Process Cost compared to Electroplating Low Cost Process (~20 US$ per wafer for high volume in house processing) 5) Compatible for wafers from 4 to 12 no additional invest for different wafer sizes 6) Proven Reliability 8) Compatibility with all FC-Assembly processes Soldering ACF NCP 9) Suitable for Al and Cu pad metallization 10) Compatibility with Wire Bonding Revolution: one pad metallization for wire bonding and Flip Chip
30 V Soldering (Paste Printing)
31 Comparison of Solder Bumping Technologies Evaporated Solder Bump Sputtered UBM + Plating Sputtered UBM + Print (FCT) Electroless UBM (+) (+) Print or Ball Attach C4 Solder Solder Solder Solder Au Ni/Au
32 Stencil Solder Printing Process Flow SnPb37, Lead-free: SnAgCu Electroless Ni/Au Bumping PbSn Solder Paste Printing Reflow Wafer Cleaning Wafer Inspection Pack & Ship
33 Solder Printing on 300mm Wafer
34 Solder Printing on 300mm Wafer 739,840 I/O s 680 I/O per chip 1,088 Chips per wafer 225µm pitch 100µm pad size 70µm solder height
35 VI Soldering (Micro Gang Ball Placement)
36 Automatic Gang Ball Placer for Micro Ball Placement 1/2 Cassette to Cassette robot handling f. wafer up to 12 Integrated rework capability 100% yield 2x optical inspection 1st after ball transfer 2nd after repair min ball size 80µm pre- fluxing by printing/spraying UPH 5min/Wafer (8 ) 300 mm Capability! 1st fully auto machine already installed in Japan
37 Automatic Gang Ball Placer for Micro Ball Placement 2/2 8 Wafer Pitch 200µm I/O S 100µm solder balls SnAgCu
38 Wafer Level CSP Application eutectic SnPb or lead-free pitches: 120µm or higher wafer sizes: 4 8 solder ball diameter: µm
39 Semiautomatic Gang Solder Ball Placer GBP Wafer
40 Comparison Tooling (time) Tooling (cost) Ball size Pitch Accuracy UPH Yield Techn. limits Capital cost 25 Ball Drop Process 4 6 weeks ~ 2,500 $ 300µm (250µm) 500µm (400µm) ± 10µm 30 missing 80k Pitch, Layout density, fluxing ~ 300k $ 1 week 500 1,000 $ µm 120µm or higher ± 10µm 25 Solder Transfer by GBP 5 missing 80k ~ 275k $ + Fluxing (semiauto)
41 Contacts: Pac Tech GmbH Contact Telephone Fax Dr. Elke Zakel Thomas Oppert Pac Tech USA Inc. Contact Telephone Fax Dr. Thorsten Teutsch
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