Sony IMX050 10.3 Mp, 1.65 µm Pixel Pitch Second Generation Back Illuminated CMOS Image Sensor Package Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call Sales at Chipworks. 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: 613.829.0414 Fax: 613.829.0515 www.chipworks.com
Package Analysis Some of the information in this report may be covered by patents, mask, and/or copyright protection. This report should not be taken as an inducement to infringe on these rights. 2010 Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. PKG-1005-802 20427JMRF Revision 1.0 Published: August 12, 2010
Package Analysis Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Introduction 1.4 Device Summary 2 Device Identification 2.1 Package Overview 2.2 Die Overview 2.3 Cross-Sectional Package Analysis 2.4 Planar Package Analysis 3 SEM-EDS Analysis 3.1 Introduction 3.2 SEM-EDS Results 4 Critical Dimensions 4.1 Package Vertical Dimensions 4.2 Package Horizontal Dimensions 5 References 6 Statement of Measurement Uncertainty and Scope Variation About Chipworks
Overview 1-1 1 Overview 1.1 List of Figures 2 Device Identification 2.1.1 Casio EX-FH100 Exilim DSC Front 2.1.2 Casio EX-FH100 Exilim DSC Back 2.1.3 Casio EX-FH100 Exilim DSC Top 2.1.4 Casio EX-FH100 Exilim DSC Bottom 2.1.5 Casio EX-FH100 Main Board Front 2.1.6 Casio EX-FH100 Main Board Back 2.1.7 Image Sensor Assembly Front 2.1.8 Image Sensor Assembly Back 2.1.9 Sony IMX050 Package Front 2.1.10 Sony IMX050 Package Planar X-Ray 2.1.11 Sony IMX050 Package X-Ray Plane of Cross Section 2.1.12 Sony IMX050 Package Side 2.1.13 Sony IMX050 Package Side-View X-Ray 2.1.14 Detailed Side-View X-Ray 2.1.15 Sony IMX050 Package Back 2.1.16 Sony IMX050 Package Back (Metal Slug Removed) 2.2.1 IMX050 Die Photograph (Back of Die) 2.2.2 IMX050 Die Markings (Back of Die) 2.3.1 Package Cross Section Overview 2.3.2 Substrate Thickness 2.3.3 Ceramic Chip Carrier Thickness 2.3.4 Ceramic Chip Carrier Interconnect Thickness 2.3.5 Solder Joint and Land Platings 2.3.6 PWB Thickness 2.3.7 PWB Interconnect and IMDs 2.3.8 Embedded Capacitor 2.4.1 PWB Delayering Metal 1 2.4.2 PWB Delayering (B) Metal 2 2.4.3 PWB Delayering (C) Metal 3 2.4.4 Through Hole Vias 2.4.5 PWB Delayering Capacitor Vias 2.4.6 Ceramic Chip Carrier Back 2.4.7 Package X-Ray Top Level Metal Interconnect 3 SEM-EDS Analysis 3.2.1 SEM-EDS Reference (A) 3.2.2 SEM-EDS Reference (B) 3.2.3 SEM-EDS Spectrum of Ceramic Chip Carrier Interconnect Metal (Location A) 3.2.4 SEM-EDS Spectrum of Ceramic Chip Carrier Substrate (Location B) 3.2.5 SEM-EDS Spectrum of Ceramic Chip Carrier Vias (Location C)
Overview 1-2 3.2.6 SEM-EDS Spectrum of Ceramic Chip Carrier Solder Land Plating (Location D) 3.2.7 SEM-EDS Spectrum of Solder Joint (Location E) 3.2.8 SEM-EDS Spectrum of PWB Land Plating (Location G) 3.2.9 SEM-EDS Spectrum of PWB Interconnect (Location H) 3.2.10 SEM-EDS Spectrum of IMD 3 (Location L) 3.2.11 SEM-EDS Spectrum of IMD 4-1 (Location M) 3.2.12 SEM-EDS Spectrum of IMD 4-2 (Location N) 3.2.13 SEM-EDS Spectrum of Ceramic Chip Carrier Underfill (Location T) 1.2 List of Tables 1 Overview 1.3.1 Device Identification 1.4.1 IMX050 Device Summary 2 Device Identification 2.3.1 Package Vertical Dimensions 2.4.1 Package Horizontal Dimensions 4 Critical Dimensions 4.1.1 Package Vertical Dimensions 4.2.1 Package Horizontal Dimensions
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