Ambient Light Sensor in 0805 Package

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Ambient Light Sensor in 0805 Package DESCRIPTION 20043 ambient light sensor is a silicon NPN epitaxial planar phototransistor in a miniature transparent 0805 package for surface mounting. It is sensitive to visible light much like the human eye and has peak sensitivity at 550 nm. FEATURES Package type: surface mount Package form: 0805 Dimensions (L x W x H in mm): 2 x 1.25 x 0.85 AEC-Q101 qualified High photo sensitivity Adapted to human eye responsivity Supression filter for near infrared radiation Angle of half sensitivity: ϕ = ± 60 Floor life: 168 h, MSL 3, acc. J-STD-020 Lead (Pb)-free reflow soldering Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC Note ** Please see document Vishay Material Category Policy : www.vishay.com/doc?99902 APPLICATIONS Automotive sensors Ambient light sensor for display backlight dimming in: - Mobile phones - Notebook computers - PDAs - Cameras - Dashboards PRODUCT SUMMARY COMPONENT I PCE (μa) ϕ (deg) λ 0.5 (nm) 7.5 to 39 ± 60 450 to 610 Note Test condition see table Basic Characteristics ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM Tape and reel Note MOQ: minimum order quantity MOQ: 3000 pcs, 3000 pcs/reel. Label with I PCE group on each reel. Specifications of group A/B/C see table Type Dedicated Characteristics ABSOLUTE MAXIMUM RATINGS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Collector emitter voltage V CEO 6 V Emitter collector voltage V ECO 1.5 V Collector current I C 20 ma Power dissipation P V 100 mw Junction temperature T j 100 C Operating temperature range T amb - 40 to + 100 C Storage temperature range T stg - 40 to + 100 C Soldering temperature Acc. reflow profile fig. 9 T sd 260 C Thermal resistance junction/ambient Soldered on PCB with pad dimensions: 4 mm x 4 mm R thja 450 K/W 0805 Rev. 1.7, 24-Aug-11 1 Document Number: 81317

125 P V - Power Dissipation (mw) 100 75 50 25 R thja = 450 K/W 0 0 20 40 60 80 94 8308 T amb - Ambient Temperature ( C) 100 Fig. 1 - Power Dissipation Limit vs. Ambient Temperature BASIC CHARACTERISTICS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Collector emitter breakdown voltage I C = 0.1 ma V CEO 6 V Collector dark current V CE = 5 V, E = 0 lx I CEO 3 50 na Collector emitter capacitance V CE = 0 V, f = 1 MHz, E = 0 lx C CEO 16 pf Photo current E V = 20 lx, CIE illuminant A, I V CE = 5 V PCE 4.6 μa E V = 100 lx, CIE illuminant A, I V CE = 5 V PCE 7.5 39 μa CIE illuminant A TK IPCE 1.18 %/K Temperature coefficient of I PCE LED, white TK IPCE 0.9 %/K Angle of half sensitivity ϕ ± 60 deg Wavelength of peak sensitivity λ p 550 nm Range of spectral bandwidth λ 0.5 450 to 610 nm Collector emitter saturation voltage E V = 20 lx, 0.45 μa V CEsat 0.1 V TYPE DEDICATED CHARACTERISTICS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SELECTION TYPE SYMBOL MIN. MAX. UNIT Photo current E V = 100 lx, CIE illuminant A, V CE = 5 V A I PCE 7.5 15 μa B I PCE 12 24 μa C I PCE 19.5 39 μa Rev. 1.7, 24-Aug-11 2 Document Number: 81317

BASIC CHARACTERISTICS (T amb = 25 C, unless otherwise specified) I - Collector Dark Current (A) CEO 10-6 10-7 10-8 10-9 10-10 10-11 10-12 V CE = 5 V I PSE - Photo Current (ma) 10 1 0.1 10 klx 3 klx 1 klx 500 lx 200 lx 100 lx 10-13 - 40 19758-20 0 20 40 60 80 T amb - Ambient Temperature ( C) 100 0.01 0 1 2 3 4 5 V CE - Collector Emitter Voltage (V) 20770 Fig. 1 - Collector Dark Current vs. Ambient Temperature Fig. 4 - Photo Current vs. Collector Emitter Voltage I PCE rel - Relative Photo Current 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 V CE = 5 V, white LED 0-40 - 20 0 20 40 60 80 100 19759 T amb - Ambient Temperature ( C) Fig. 2 - Relative Photo Current vs. Ambient Temperature CCE0 - Collector Emitter Capacitance (pf) 25 f = 1 MHz 20 15 10 5 0 0.1 1.0 10.0 19762 V CE - Collector Emitter Voltage (V) Fig. 5 - Collector Emitter Capacitance vs. Collector Emitter Voltage I PCE - Photo Current (ma) 10 1 0.1 V CE = 5 V 0.01 0.001 10 100 1000 10 000 20769 E V - Illuminance (Ix) Fig. 3 - Photo Current vs. Illuminance S ( λ ) rel - Relative Spectral Sensitivity 20116 1.2 1.0 0.8 0.6 0.4 0.2 0.0 400 500 600 700 800 900 1000 1100 λ - Wavelength (nm) Fig. 6 - Relative Spectral Sensitivity vs. Wavelength Rev. 1.7, 24-Aug-11 3 Document Number: 81317

0 10 20 30 S rel - Relative Sensitivity 1.0 0.9 0.8 0.7 40 50 60 70 80 ϕ - Angular Displacement 0.6 0.4 0.2 0 94 8318 Fig. 7 - Relative Radiant Sensitivity vs. Angular Displacement REFLOW SOLDER PROFILE Temperature ( C) 300 250 200 150 100 50 255 C 240 C 217 C max. 120 s max. ramp up 3 C/s max. 260 C 245 C max. 30 s max. 100 s max. ramp down 6 C/s 0 0 50 100 150 200 250 300 19841 Time (s) Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Time between soldering and removing from MBB must not exceed the time indicated in J-STD-020: Moisture sensitivity: level 3 Floor life: 168 h Conditions: T amb < 30 C, RH < 60 % DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 C (+ 5 C), RH < 5 %. Rev. 1.7, 24-Aug-11 4 Document Number: 81317

PACKAGE DIMENSIONS in millimeters 19757 Rev. 1.7, 24-Aug-11 5 Document Number: 81317

BLISTER TAPE DIMENSIONS in millimeters 20690 Quantity per reel: 3000 pcs Rev. 1.7, 24-Aug-11 6 Document Number: 81317

REEL DIMENSIONS in millimeters 8.4 +2.5 8.4 +0.15 Ø 55 min. Ø 177.8 max. Z Form of the leave open of the wheel is supplier specific. Z 2:1 14.4 max. Ø 13 + - 0.2 0.5 1.5 min. Ø 20.2 min. Drawing-No.: 9.800-5096.01-4 Issue: 2; 26.04.10 20875 technical drawings according to DIN specifications Rev. 1.7, 24-Aug-11 7 Document Number: 81317

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