03 Loop Antennas 3rd unit in course 3, RF Basics and Components

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3 Loop Antennas 3rd unit in course 3, RF Basics and Components Dipl.-Ing. Dr. Michael Gebhart, MSc RFID Qualification Network, University of Applied Sciences, Campus WS 13/14, September 3 th

Content What is a loop antenna? Production technologies - Etched antenna - Embedded wire antenna - Electroplated antenna - Printed antenna - Assembly Antenna design for Readers and Cards - Inductance, resistance, capacitance Antenna equivalent circuit element value measurement Ferrite foils Tolerances - Production tolerance, temperature dependency page

What is a loop antenna? The loop antenna is a distributed component with inductance (L) as main element and capacitance (C) and resistance (R) as parasitic network elements. End of coil turns Start of coil turns C L R L 1 C 1 R 1 L n C n R n For simulation it must be represented by an equivalent circuit network of lumped elements. Over a wide frequency range this can be a loose coupled reactive ladder network of resonance circuits - it has several resonances in frequency domain. C A L A R A At 13,56 MHz carrier frequency we use the fundamental (lowest) resonance. So we can simplify the equivalent circuit e.g. to a parallel resonance circuit (since losses are mainly determined by chip current consumption in Proximity Systems). Note: This is a narrow-band approximation only! page 3

Design-Targets for loop antennas Assuming a simplified parallel resonance circuit, the following applies: f RES = π 1 L A C A Q A = R C L M = N I A Self-resonance shall be higher than operating frequency - Cards: target value together with chip input cap (no matching network) L A Quality factor shall be higher than a target value - Cards: Q A > 1 Q T, to keep antenna losses low R A (serial max., parallel min.) Magnetic momentum shall be high - allowable current (effective & reactive) page 4

Design-Targets for loop antennas Starting point for Readers: Pre-defined antenna size, antenna technology, RF power Target criterions: Contactless performance Spec (H MIN, Modulation, RX sensitivity to Load Modulation. - for coupling (Reader antenna to test device) and H MIN criterion estimate required total current (e.g. using Biot-Savart law), - for loop antenna size (and environment) try number of turns to meet L A range specification (e.g. NFC typ..3 1.5 µh) antenna current - for protocol, data rate, modulation, etc. estimate max. Q SYS (@ 13.56) - with matching, this defines a maximum allowable Q for the antenna (operating at resonance 13.56 MHz) Q A (@ 13.56) must be larger - Take into account coupling effects (inductance variation ) - Verify, if reader RF power is sufficient to operate this antenna page 5

Production Technologies: Etching Process: Standard Printboard process. Conductor is etched out. Good design rules (.1 mm typ.) Material: Copper, Alu (lower costs) - thickness: 35 µm, µm, 16 µm, 8 µm, Assembly: Copper allows welding, crimping, soldering and conductive glueing. Conductive glueing can be problematic for Alu because of corrosion, soldering is not possible. Performance: - Low parasitic capacitance significant, may be used for design (mainly bridge cap) - Coils of high Q-factor, lowest (best) tolerances Applications: Reader antennas, Vicinity Label antennas (accurate resonance frequency ) page 6

Production Technologies: Embedded Wire Process: Wire heated by ultrasound is melted into Card substrate. Material: Copper wire - HF: 11 µm, 8 µm - LF: 5 µm, 3 µm, µm Assembly: All processes possible, welding preferred Performance: - Low parasitic capacitance (~ 1 3 pf) - Coils of high Q-factor, although tolerances are higher than for etching, as the coil shape can be changed during lamination. Application: Typical contactless personal card. page 7

Production Technologies: Electroplating Process: First, a very thin conductive seed-layer is sputtered on the substrate. Then several µm of copper are deposited in a galvanic process. Material: Copper Assembly: Copper allows welding, crimping, soldering and conductive glueing Performance: - Coils of medium / high Q-factor, but high tolerances due to variable thickness over production and fiberstructures on the border. Application: E.g. contactless personal card. page 8

Production Technologies: Printing Process: Conductive ink or paste is used to print the conductor, Material: e.g. silver ink, carbon ink, polymer paste Assembly: Mostly conductive glueing (pressure dependent, tolerances) or crimping Performance: - High resistance (e.g. 5 Ω before lamination, Ω after lamination) low Q Applications: Alternative for contactless personal cards page 9

Antenna and assembly technology overview Antenna Technologies Embedded Wire Antenna Etched Antenna Printed Antenna Galvano Antenna Assembly Technology Crimping Welding Soldering (not Alu) Conductive Glueing Conductor materials: Chip packages: Copper, aluminum, conductive paste (e.g. silver ink) Module (8 x 5 mm), Flip-Chip, Strap, bumped wafer page 1

13.56 MHz loop antenna appearence... NFC & Reader loop antenna Card & Label loop antenna 75µm 75µm 5µm Overlay Printing layer Seal layer 35-4µm Prelam 75µm 5µm 75µm Seal layer Printing layer Overlay page 11

The World of SmartCards ISO/IEC14443...The Contactless Proximity Air Interface for person-related applications was standardized 1 decade ago. - Applications in Government (e-passports, driver license, health card...), Payment (Contactless Credit Cards), Public Transport (Ticketing), Secure Access Control, etc. are successfully deployed. - The same battery-less, proven secure chip technology now migrates into objects e.g. SD-Cards, watches, USB-Sticks, which requires small antennas. Very High Data Rates ~ 1 Mbit/s also allow new applications. This requires more accurate chip characterization and tolerance consideration. Standards (ISO/IEC) 781...Card geometry (e.g. ID-1 format) and physical properties 7811-3/-3...Embossing (letters raised in relief) 7811...magnetic stripe cards 781...optical character recognition cards 7813...bank cards 7816...contact cards with ICs 1373...test methods ID-1 (ISO/IEC781) Card format: 85.6 x 54 mm 64 mm 81 mm Class 1 antenna zone Radius 3 mm "forbidden zone" Card geometry specifications. 34 mm 49 mm page 1

Loop antenna design - inductance In the first step, antenna geometry and material properties are defined. Antenna geometry - a (maximum) length in mm, - b (maximum) width in mm, - w conductor track width in mm, - g track gap in mm, - t track thickness in mm - N number of turns w a avg a g b b avg page 13

Loop antenna design - inductance - The multi-turn loop of rectangular cross-section is re-calculated to one average loop of circular cross-section: equivalent conductor diameter d = t w π average length [ a N ( g )] w a + + a avg = average width [ b N ( g )] w b + + b avg = - E is the fitting parameter of the model, it depends on edges, radius, etc. Typical value is 1.65 (range is 1.6. 1.85). - Inductance of this average loop is constituated of mutual inductance (for parallel conductor parts). M M L 1 L µ = a ln π d and self-inductance for straight parts = A µ a 16π a b ( ) a + a + b L = µ b 16π 1 µ = b ln π d a b b + E ( M + M + L + L ) N = 1 1 a + a + b + b ( ) b + a + b - Finally, all parts are summarized and a number of turns is taken into accout in µh. a page 14

Loop antenna design - inductance Main parameter for loop antenna design is inductance. For an air coil, this can be estimated from geometry. - Geometry of a several turn loop antenna is re-calculated to one average loop (length x width). - A rectangular conductor cross-section is approximated by a circular cross section of equal area. t w d = π - Between all parallel current lines, we consider mutual inductance from geometry... M µ = a ln π d a b b + + b ( ) a + a + b 1 -...and self-inductance inductance... L 1 µ a = 16π -...then we can add up all terms and take into account the number of antenna turns N to the power of E (close to ). L A ( ) E M + M + L + L N = 1 1 a Antenna geometry (mm) Electrical parameters outline 79 x 49 Inductance 4.75 µh track width.7 Capacitance 3.93 pf track gap.4 DC-Resistance.55 Ω thickness.18 R A (@13.56) 5 k turns 6 Q-factor ~ 14 page 15

Loop antenna design - resistance Antenna losses are the result of conductor DC-resistance, and AC-losses due to skin effect. Depending on substate material, additional (e.g. dielectric) losses may also be significant. - Serial DC-resistance for the planar spiral antenna can be calculated from the conductor track to R DC ( a + b ) ( N 1)( w + g) N = σ t w - Skin effect losses are difficult to model, especially for rectangular conductor cross-sections, and in the magnetic field influence of neighbour turns. An approximation is R AC R DC 1 d f π µ σ + 4 48 - The equivalent parallel antenna resistance can be calculated for one frequency (typ. carrier at 13.56 MHz) R A = ( π f L ) R A SERIAL Antenna geometry (mm) Electrical parameters outline 78.6 x 3 Inductance 1.64 µh track width.8 Capacitance 3.74 pf track gap. DC-Resistance.65 Ω thickness.35 R A (@13.56) k turns 4 Q-factor ~ 155 - If the optimum achievable chip performance should not be significantly degraded, R A > 1 R C should apply. This also means, the transponder operational Q-factor is mainly determined by the chip, R T ~ R C. page 16

Loop antenna design - capacitance Parasitic capacitance for planar loop coils consists of up to 3 contributions: Bridge capacitance - The conductor bridge between end of inner turns and end of outer turn builds up a plate capacitor C BRIDGE = ε ε r Area distance Turn capacitance - Considers area and distance between (n-1) turns, and voltage phase-shift Electrical length C TURN ( ( n 1)( a + b ) ( n )( w + g) ) t = ε ε r g 1 n - Resonance conditon if the el. track length is equal to half the wavelength of a resonance frequency C EL ( π f ) RES A [ ( n( a + b ) ( n 1)( w + g) )] ( µ ε ε r ) ( π ) LA 1 = = L page 17

Antenna equivalent parameter measurement - The complex impedance of a loop antenna can be measured with an Impedance Analyzer (or a Network Analyzer) over frequency. - An equivalent circuit consisting of lumped elements is extracted from such a trace. - Most simple this can be a parallel resonant circuit, consisting on Inductance L A, Resistance R A and Capacitance C A. This is most accurate for the carrier frequency. inductance inductive behaviour best point to read out coil inductance self-resonance frequency - L A is measured at low frequency out of Im{Z} (where C A can be neglected). - C A is calculated from self-resonance frequency and L A fs = CA = π LACA ( π fs ) LA - R A either can be measured as Re{Z} at 13.56 MHz, or can be calculated from R A = 1 ( π f ) R C S DC + f f S C R P SKIN 1 instrument cut-off frequency frequency C C R C R CAS R AS AS C A R A L A inaccurate range cap. behaviour Chip Assembly Antenna page 18

Measurement with Agilent 4395A (1) Switch on Instrument Preset Use Impedance-Analyzer Mode Meas => Analyzer Type => Impedance Analyzer Choice of frequency range 1 1 MHz Start => 1 => MHz Stop => 1 => MHz Sweep => number of points => 81 => x1 Set to Inductance Measurement Meas => More => Ser (Ls) Calibrate Instrument Cal => Cal Kit => 3,5 mm => Return Cal => Calibrate Menu connect calibration kit to test fixture and check good connection, Open, Short, Load, Done Leave 5-Ohm reference connected and check successful calibration using... Scale Ref => Autoscale A horizontal trace over frequency must show up with 5 Ohms (no frequency dependency) else repeat procedure. page 19

Measurement with Agilent 4395A () Compensate Fixture (measurement adaptor) Cal => Fixture Compen => Compen Menu Connect a SMA-connector with open contacts to fixture => Open solder open contacts to get a short => Short, Done Check: Flat trace over frequency Actual measurement of antenna parameters Meas => Ser(Ls) Marker => 1 => MHz Read out value Meas => More => Ser(Rs) Read out value Meas => More => Ser(Ls) Manually set the marker to the zero crossing, Read out the (resonance) frequency Meas => More => Prl(Rp) Read out Rp at fres page

Measurement with Agilent 4395A (3) Inductance Ls at 1 MHz Serial resistance Rs at 1 MHz Resonance frequency reactive component = (e.g. Ls) Parallel resistance Rp max at f page 1

Ferrite foil - functional principle Ferrite material can conduct the magnetic flux multiple times better than free air. If the application requires an NFC antenna to be very close to a metal plate, a thin ferrite foil can help to isolate the antenna from the metal. NFC antenna metal (battery pack in phone) ferrite sheet inbetween normal operation no function on metal (degraded) function - It is important to note, compared to an antenna in free air, the contactless performance will still be degraded - but not completely blocked. - Only a part of the magnetic flux is conducted in thin ferrite - presence or absence of metal in close coupling below will de-tune the antenna matching! page

Ferrite foil - when to use? If the application requires an NFC antenna to be very close to a metal plate, a thin ferrite foil can help to isolate the antenna from the metal. Antenna on ferrite Operating Distance in mm 5 45 4 35 3 5 15 1 5 Air coil antenna - Air coil allows no function very close to metal plate, - Equal function in ~ 1 mm distance, - In free air the air coil will perform always better... 1 3 4 5 6 7 8 9 1 Distance metal plate to antenna in mm page 3

Ferrite foil - types are available Polymer absorber sheets Sintered ferrite sheets - Re (µ R ) ~... 6, - mechanically very flexible, - available also on reels (simple antenna production process) - higher conductivity (losses) - Re (µ R ) ~ 1..., - mechanically rather rigid, - available in sheets (e.g. x mm) - very low conductivity losses page 4

NFC antennas on ferrite foils - Smart mobile devices are very thin and compact, offer little extra space. - Metal parts or other RF components may be very close to NFC antenna (e.g. antenna on battery pack) - Ferrite Foils can conduct the magnetic flux and allow dense packaging - Real part of µ R determines how much magnetic flux can be conducted ( good property) - should be very high (e.g. 1... 16) - Imaginary part of µ R means HF losses ( bad property) - should be low (e.g. < 3) = Im(µ r) µ r µ ŕ µ r δ = Re(µ ) r rel. permeability 15 Real part of relative permeability µ r 1 Imaginary part of the relative permeability µ r 13.56 MHz frequency band 5 1 MHz 1 MHz 1 MHz 1 MHz frequency page 5

Example: : NFC Antenna Inductive Loop antenna (planar spiral coil), H-field antenna Conductor on ferrite foil, to isolate antenna from metal and electronic PCB La Lb R A C A L A EQ. CIRCUIT Antenna Geometry Data Dimension Air Coil Coil on ferrite ferrite outline mm --- 39 x 39 antenna outline mm 35 x 35 35 x 35 track width mm.4.4 track gap mm.4.4 number of turns 4 4 Equivalent Circuit Element Values Inductance L A µh 1.314 1.98 Capacitance C A pf.351.9 Resistance R A Ω.58.85 page 6

Loop antenna production tolerances Production tolerances require to measure an average of several parts Errors differentiate into offset (deterministic) and variance (random) - Soft substrate (e.g. Cards) can shrink during lamination process - Ferrite foils have typically +/- 15 % tolerance of µr may be +/- 7.5 & for L A Example: NFC antenna on ferrite foil - Matching network for Q ~ 7-8 samples measured @ 5 C - Avg. impedance 17.84 + j 1.78 Ω Impedance at 13.56 MHz page 7

Temperature dependency for NFC antenna Air coil (blue) Coil on ferrite (red) Specific conductance has a significant temperature gradient L on ferrite has a temp. dependency page 8

Temperature dependency for NFC antenna Impedance towards the chip TX (due to impedance adjustment network Q ~ 1) varies significantly over temperature! Znw Cpa Ls Rs differential C in pf L in nh56 C1 in pf16 C in pf19,5 page 9

Thank you for your Audience! Please feel free to ask questions... page 3