Evaluation of the Surface State Using Charge Pumping Methods



Similar documents
How to Measure 5 ns Rise/Fall Time on an RF Pulsed Power Amplifier Using the 8990B Peak Power Analyzer

CHAPTER 10 Fundamentals of the Metal Oxide Semiconductor Field Effect Transistor

Agilent AN 1316 Optimizing Spectrum Analyzer Amplitude Accuracy

CONTENTS. Preface Energy bands of a crystal (intuitive approach)

Experiment 8 : Pulse Width Modulation

Agilent U2000 Series USB Power Sensors

Basic Electronics Prof. Dr. Chitralekha Mahanta Department of Electronics and Communication Engineering Indian Institute of Technology, Guwahati

Automotive MOSFETs in Linear Applications: Thermal Instability

AMZ-FX Guitar effects. (2007) Mosfet Body Diodes. Accessed 22/12/09.

What is the difference between an equivalent time sampling oscilloscope and a real-time oscilloscope?

Agilent Television Power Consumption Testing. Application Note

802.11ac Power Measurement and Timing Analysis

Making Accurate Voltage Noise and Current Noise Measurements on Operational Amplifiers Down to 0.1Hz

81110A Pulse Pattern Generator Simulating Distorted Signals for Tolerance Testing

Agilent Automotive Power Window Regulator Testing. Application Note

MOS (metal-oxidesemiconductor) 李 2003/12/19

Agilent BenchVue Software (34840B) Data capture simplified. Click, capture, done. Data Sheet

LAB 7 MOSFET CHARACTERISTICS AND APPLICATIONS

CMOS Power Consumption and C pd Calculation

Make Better RMS Measurements with Your DMM

Fundamentals of Signature Analysis

Features. Symbol JEDEC TO-220AB

Part 1: Background - Graphing

MOSFET DEVICE MODELING FOR ANALOG CIRCUITS DESIGN

The MOS Transistor in Weak Inversion

SLC vs MLC: Which is best for high-reliability apps?

Keysight Technologies N1918A Power Analysis Manager and U2000 Series USB Power Sensors. Demo Guide

Lecture 17 The Bipolar Junction Transistor (I) Forward Active Regime

CHAPTER 11: Flip Flops

Op-Amp Simulation EE/CS 5720/6720. Read Chapter 5 in Johns & Martin before you begin this assignment.

Here we introduced (1) basic circuit for logic and (2)recent nano-devices, and presented (3) some practical issues on nano-devices.

Figure 1. Diode circuit model

BJT Ebers-Moll Model and SPICE MOSFET model

Step Response of RC Circuits

Experiment 5. Strain Gage Measurements

Use and Application of Output Limiting Amplifiers (HFA1115, HFA1130, HFA1135)

Experiment #3, Ohm s Law

Experiment 5. Lasers and laser mode structure

FREQUENCY RESPONSE OF AN AUDIO AMPLIFIER

Module 13 : Measurements on Fiber Optic Systems

The Phase Modulator In NBFM Voice Communication Systems

THE CURRENT-VOLTAGE CHARACTERISTICS OF AN LED AND A MEASUREMENT OF PLANCK S CONSTANT Physics 258/259

Agilent AEDB-9140 Series Three Channel Optical Incremental Encoder Modules with Codewheel, 100 CPR to 500 CPR Data Sheet

RF Measurements Using a Modular Digitizer

Loop Bandwidth and Clock Data Recovery (CDR) in Oscilloscope Measurements. Application Note

IRFP450. N - CHANNEL 500V Ω - 14A - TO-247 PowerMESH MOSFET

Experiment 7: Familiarization with the Network Analyzer

HOW TO SELECT VARISTORS

SMA Compound Semiconductors Lecture 2 - Metal-Semiconductor Junctions - Outline Introduction

Agilent N2717A Service Software Performance Verification and Adjustment Software for the Agilent ESA Spectrum Analyzers Product Overview

Switch Mode Power Supply Topologies

Theory of Transistors and Other Semiconductor Devices

Investigating Area Under a Curve

Transistor Characteristics and Single Transistor Amplifier Sept. 8, 1997

3.2 LOGARITHMIC FUNCTIONS AND THEIR GRAPHS. Copyright Cengage Learning. All rights reserved.

Accurate Measurement of the Mains Electricity Frequency

IRF830. N - CHANNEL 500V Ω - 4.5A - TO-220 PowerMESH MOSFET

Electrical Resonance

Physics 221 Experiment 5: Magnetic Fields

Testing WiMAX receiver performance in a multipath propagation environment using Agilent s E6651A with an EB Propsim C8 radio channel emulator

Agilent AN 1315 Optimizing RF and Microwave Spectrum Analyzer Dynamic Range. Application Note

Inductors in AC Circuits

1. True or False? A voltage level in the range 0 to 2 volts is interpreted as a binary 1.

Clock Jitter Definitions and Measurement Methods

Statistical Models for Hot Electron Degradation in Nano-Scaled MOSFET Devices

University of California, Berkeley Department of Electrical Engineering and Computer Sciences EE 105: Microelectronic Devices and Circuits

The New Radio Receiver Building Handbook

Agilent Evolution of Test Automation Using the Built-In VBA with the ENA Series RF Network Analyzers

Chapter 4. LLC Resonant Converter

Study Guide for the Electronics Technician Pre-Employment Examination

DRIVE CIRCUITS FOR POWER MOSFETs AND IGBTs

RF Network Analyzer Basics

LAB IV. SILICON DIODE CHARACTERISTICS

ELECTRON SPIN RESONANCE Last Revised: July 2007

Application Note. PCIEC-85 PCI Express Jumper. High Speed Designs in PCI Express Applications Generation GT/s

FUNDAMENTAL PROPERTIES OF SOLAR CELLS

Variable Frequency Drive Troubleshooting with U1610A/U1620A

N Q.3 Choose a level of accuracy appropriate to limitations on measurement when reporting quantities.

TDA4605 CONTROL CIRCUIT FOR SWITCH MODE POWER SUPPLIES USING MOS TRANSISTORS

Supplement Reading on Diode Circuits. edu/~ee40/fa09/handouts/ee40_mos_circuit.pdf

SHORE A DUROMETER AND ENGINEERING PROPERTIES

ENEE 313, Spr 09 Midterm II Solution

Fig. 1 :Block diagram symbol of the operational amplifier. Characteristics ideal op-amp real op-amp

Agilent EEsof EDA.

Calibration and Use of a Strain-Gage-Instrumented Beam: Density Determination and Weight-Flow-Rate Measurement

EXPERIMENT NUMBER 8 CAPACITOR CURRENT-VOLTAGE RELATIONSHIP

Safety technique. Emergency stop module BO 5988 safemaster

5A 3A. Symbol Parameter Value Unit

Characteristic curves of a solar cell

EXPERIMENT NUMBER 5 BASIC OSCILLOSCOPE OPERATIONS

Chapter 2. Technical Terms and Characteristics

CIRCUITS LABORATORY. In this experiment, the output I-V characteristic curves, the small-signal low

1.2 GRAPHS OF EQUATIONS. Copyright Cengage Learning. All rights reserved.

Cell Phone Vibration Experiment

Evaluating Oscilloscope Bandwidths for Your Application

AN3022. Establishing the Minimum Reverse Bias for a PIN Diode in a High-Power Switch. 1. Introduction. Rev. V2

Experiment #11: LRC Circuit (Power Amplifier, Voltage Sensor)

Agilent Measuring Noninsertable Devices

Field-Effect (FET) transistors

These help quantify the quality of a design from different perspectives: Cost Functionality Robustness Performance Energy consumption

Transcription:

Evaluation of the Surface State Using Charge Pumping Methods Application Note 4156-9 Agilent 4155C/4156C Semiconductor Parameter Analyzer Introduction As device features get smaller, hot carrier induced degradation of MOSFET devices is likely to occur. To make more reliable ULSI devices, it is critical to understand this degradation mechanism. One way is the charge pumping method, which is a measurement technique that can evaluate the surface-states at the Si-SiO2 interface of MOSFET devices. This application note gives an example of evaluating the interface-states by using the Agilent 4155C/4156C to perform pumping method. There are three different charge pumping methods that are commonly used today. This application note covers the following methods: Square Method The square pulse method applies a fixed-shaped pulse to the gate. The base of the pulse is stepped from well below gate threshold to well above. At each step, the substrate leakage current is monitored. The flat part of the resultant curve is proportional to interface-state density. Triangular Method The triangle pulse method applies a constant height triangle wave to the gate. The frequency is increased in steps, each time measuring the resultant substrate leakage current. The average interface-state density and capture cross section are easily measured by this method. Three Methods of Charge Pumping Charge pumping is one of the measurement methods that extracts Si-SiO2 interface-state density and captures cross section of MOSFET devices. Gate Source Drain Figure 1 shows the measurement circuit diagram of charge pumping. The gate of MOSFET is connected to a pulse generator, and a reverse bias (Vr) is applied to the source and drain, while the substrate current is measured. This current is caused by the repetitive recombination at the interface traps of minority carriers with majority carriers, when the gate pulses the channel between inversion and accumulation. n+ n+ p Substrate A Icp SMU 4 SMU 1 A Vr PGU1 or Figure 1. Measurement Circuit Diagram

Trapezoidal Method The trapezoidal pulse method applies fixed height pulse to the gate. By varying the leading/trailing time of the pulse, you can plot interfacestate density vs energy. Problems with the Charge Pumping Method To apply pulse bias to the gate, a pulse generator is used. The pulse voltages, frequency, width, leading time, and trailing time should be swept. While sweeping these parameters, the charge pumping currents (Icp) through the substrate are measured. The mean interface-state density and capture cross section are extracted by drawing Icp vs pulse base curve or by drawing a least-squares fit line for recombined charge calculated from Icp vs pulse frequency curve. The following are typical problems for this method: Interconnection between measurement instruments and pulse generator is complicated. Space for the external controller is also required. Programming to control the measurement instruments (especially to control the pulse voltages or timing) is complicated, and debugging takes a long time. Programming for graphics plot, data analysis, and calculation of the mean interface-state density and capture cross section is very complicated. STAR T Input measurement parameter Get initial measurement setup file Set pulse conditions ( base voltage and peak voltage) Measure Icp End of pulse base? T Draw Icp vs base voltage graph Extract interface-state density END Figure 2. Flowchart of Square Method PGU1 Output Vo l tage V T SMU 4 Output Vol tage Peak Vol ta ge Ampli tude Base Voltage F Increment pulse base voltage and peak voltage Stepping Base Voltage with Fixed Amplitude...... SMU Measurements... measurements points... The Agilent 4155C/4156C Solution The 4155C/4156C includes the SMUs to accurately measure the charge pumping current. As an option, you can add the Agilent 41501B, which is an expander that can contain SMUs and two pulse generator channels (PGUs). This expander solves the problem of complicated interconnection between the measurement instruments and pulse generator. Figure 3. Timing Chart of Square Method The PGU can be controlled as one of the modules of the 4155C/4156C. This solves the problem of complicated programming to control measurement instruments and pulse generators. Using the front panel of the 4155C/ 4156C, you can easily set the pulse parameters, such as pulse peak and base voltage, pulse period, pulse width, leading time, and trailing time in fill-in-the-blank manner. You can save the setup to a diskette. 2

Figure 4. CHANNELS: CHANNEL DEFINITION Page Figure 5. MEASURE: PGU SETUP Page Period Width Peak Leading 90% Tra iling Amp litude Base 10% tr(rise time) tf (fall time) f ( Frequency) = 1 / Period Figure 6. Definition of Square Setup Parameters Figure 7. MEASURE: SAMPLING SETUP Page The 4155C/4156C features a built-in IBASIC controller, which allows you to automate the entire test and control the modules of the Agilent 4155C/4156C. No external computer is required. The IBASIC program can get the setup files from the diskette and perform the test. This simplifies programming, and also enables you to easily debug the setup. Just get the setup file and execute measurements manually. And you can check the pulse signal using an oscilloscope. You can use the graphics page to display the data of several measurements, and to use the analysis functions, such as regression line. So, you do not need to create programs to draw graphs and analyze data. Procedure for Measurement of Interfacestate Density Using Square Method The flowchart for the test to extract interface-state density (Nss) by using the Agilent 4155C/4156C is shown in Figure 2. The entire test is performed by the IBASIC program according to the timing chart of this test shown in Figure 3. Figure 4 shows the CHANNELS: CHANNEL DEFINITION page on which the measurement units are defined for the circuit diagram of Figure 1. Figure 5 shows the MEASURE: PGU SETUP page on which the pulse conditions are set. In this page, the pulse period, width, leading time, and trailing time are defined. For the definition of these parameters, refer to Figure 6. The IBASIC program steps the pulse base voltage from well below threshold voltage to well above, as shown in Figure 3. The pulse amplitude is fixed. At each step, the substrate current is measured by sampling. The MEASURE: SAMPLING SETUP page is shown in Figure 7. The charge pumping current (Icp) for each pulse base voltage is the maximum sampling measurement result for the step. 3

The measurement setup should be saved to diskette file before executing the test. The setup file is loaded by the IBASIC program. As the test result, the Icp vs pulse base voltage curve is drawn and Nss is extracted from the maximum Icp. The Icp is given by equation (1). Icp = ƒ Qss = ƒ Ag q 2 Dit ψ s = ƒ Ag q Nss (1) Nss is expressed as equation (2). Nss = Icp/ƒ Ag q (2) Where, Figure 8. Square Method Nss Measurement Result Qss: recombined charge per pulse period ƒ: pulse frequency Ag: channel area of the transistor q: electron charge ψ s : total sweep of the interface potential Dit: mean interface-state density, averaged over the energy levels swept through the Fermi level (cm-2 ev-1) Figure 8. shows a measurement example of Nss. Procedure for Measurement of Mean Interface-state Density and Capture Cross Section Using Triangle Method The flowchart for the test to evaluate mean interface-state density (Dit) and capture cross section(s) is shown in Figure 9. The timing chart for this test is shown in Figure 10. The frequency of the triangular pulse is swept, and the substrate currents are measured by sampling. The charge pumping current (Icp) for each frequency is the maximum sampling measurement result for the frequency. Figure 11 shows the MEASURE: PGU SETUP page on which the pulse conditions are set. The IBASIC program calculates and sets the pulse period, width, leading time, and trailing time according to the pulse frequency. The leading time and trailing time are equal so that applied pulses are triangular pulses. Figure 12 shows the definition of triangle pulse setup parameters. For the test result, Dit and s are extracted by drawing a regression line for the recombined charge (Qss) vs pulse frequency (ƒ) curve on a linear-log graph. The recombined charge (Qss) per pulse period is calculated by equation (3). Icp = ƒ Qss (3) When using triangular pulses, Qss can also be calculated by equation (4): Qss = 2q Dit Ag kt [ln(υ th n i σ n σ p ) V FB V T 1 +ln( α(1 α) )] (4) V GH V GL ƒ On the Qss vs ƒ curve, the pulse frequency f0 (frequency when the charge becomes zero) is the X-intercept of the regression line. Frequency f0 is used to calculate the geometric mean of the capture cross sections as shown in equation (5): σ = σ n σ p 1 V GH V GL ƒ 0 = (5) υ th n i V FB V T α(1-α) And the slope of the regression line is used to calculate the interface-state density Dit as shown in equation (6). d Qss 2qkT Dit Slope = = Ag (6) d log f log e 4

Where, σ n : capture cross section of electrons σ p : capture cross section of holes υ th : thermal velocity of the carriers V GH : peak voltage value of the pulse V GL : base voltage value of the pulse V FB : flat band voltage V T : threshold voltage of the transistor t r : rise time of the pulse t f : fall time of the pulse ƒ 0 : pulse frequency at which the charge becomes zero. n i : intrinsic carrier concentration α: t r /(t r +t f ) Figure 13 shows a measurement example of Dit and s. The X-axis intercept of the regression line is f 0, and slope of the regression line is used to calculate Dit. By using the graphics screen and analysis capability of Agilent 4155C/ 4156C, you can obtain mean interface-state density Dit and capture cross section easily with minimum programming. STAR T Input measurement parameter G et in itial m easurem ent setup file Set pulse conditions ( period, width, leading time and trailing time) according to the pulse frequency Measure Icp End of pulse F frequency? T Draw Qss vs frequency graph Extract interface-state density and capture cross section END Figure 9. Flowchart of Triangle Method Procedure for Measuring the Energy Distribution of Surface States Using Trapezoidal Method The flowchart for the test to evaluate the energy distribution of interfacestates by using the Agilent 4155C/ 4156C is shown in Figure 14. Increment pulse frequency This is similar to the triangle pulse method. First, Icp is measured while sweeping the pulse trailing time with constant pulse leading time. Then, Icp is measured while sweeping the pulse leading time with constant pulse PGU 1 Output Voltage Stepping Frequency of Triangular Amplitude......... SMU4 Output Voltage SMU Measurements point Measurements Figure 10. Timing Chart of Triangle Method Figure 11. MEASURE: PGU SETUP Page 5

trailing time. Figure 15 shows the timing chart for this test. Applied pulses are trapezoidal pulses. Width Period The energy distribution of interfacestates is obtained by the follow equations (7), (8), (9), and (10): Peak Leading 90% Trailing tr d Icp Dit (E2) = (7) q Ag k T f d t f Amplitude V FB V T E2=E1 kt ln (υ th σ p n i t f ) (8) V GH V GL Base 10% tr(rise time) tf (fall time) t r d Icp Dit (E1) = (9) q Ag k T f d t r f ( Frequency) = 1 / Period Figure 12. Definition of Triangle Setup Parameters V FB V T E1=Ei kt ln (υ th σ n n i t r ) (10) V GH V GL Where, Dit: interface state density at energy E E1 (E2): Boundaries of the energy range that is scanned Ei: Intrinsic Fermi-level Figure 16 shows a measurement example for energy distribution of interface-states. Figure 13. Measurement Result 6

STAR T Input measurement parameter Get initial measurement setup file Set pulse period, width and leading time Set pulse trailing time Measure Icp End of pulse trailing time? T Increment pulse trailing time Figure 14. Flowchart of Trapezoidal Method PGU 1 Output Voltage F Stepping Trailing Set pulse period, width and trailing time Set pulse leading time Measure Icp End of pulse leading time? Draw Dit vs energy graph T END F Increment pulse leading time Conclusion By using the Agilent 4155C/4156C with its PGU options and Agilent 16440A, you can easily configure a small and inexpensive system to perform flash memory cell evaluation. The control of this system can easily be done by using previously saved stress and measurement setup files. The 16440A has a special relay for opening the measurement circuit. You can perform memory cell evaluation without worrying about the life of relay. By using the same system configuration, you can perform pulse width dependency test and pulse voltage dependency test too. The system can also be used for NAND type flash memory evaluation. The Agilent 4155C/ 4156C s PGU can force high enough voltage pulses for NAND type flash memory cells. Amplitude SM U 4 Output Voltage PGU 1 Output Voltage SMU Measurements.......... Measurements Stepping Leading If you want much higher speed test capability or much narrower and faster pulse stresses, Agilent has a solution by using the Agilent 4062F Flash Memory Test System, which can be used for process monitoring in production lines as well........... SM U 4 Output Voltage SMU Measurements Measurements Figure 15. Timing Chart of Trapezoidal Method 7

GRAPH/ LIST: GRAPHICS MEDIUM 9 5 A P R 3 0 0 1 : 3 8 A M S u r f a c e s t a t e s ( D i t ) v s E n e r g y ( e V ) M A R K E R ( - 2 2 2. 9 1 4 9 7 2 * m e V 2. 5 3 3 6 6 8 5 9 4 6 T - 1. 7 9 7 6 9 * E + 3 0 8 ) ( ) ( ) 3. 7 * T 3. 7 * T D i t 1 D i t 2 o 5 0 0. G 5 0 0. G / d i v / d i v 0. 0 0 0. 0 0 * - 2 9 5 * m E n e r g y ( e V ) 5 0. 0 m / d i v 2 9 5 * m Figure 16. Trapezoidal Method Measurement Result For more information about Agilent Technologies semiconductor test products, applications, and services, visit our website: www.agilent.com/go/semiconductor or you can call one of the centers listed and ask to speak with a semiconductor test sales representative. For more information about other Agilent test and measurement products, go to www.agilent.com United States: 1 800 452 4844 Canada: 1 877 894 4414 Europe: (31 20) 547 2000 Japan: (81) 426 56 7832 Fax: (81) 426 56 7840 Latin America: (305) 269 7500 Fax: (305) 269 7599 Australia/New Zealand: 1 800 629 485 (Australia) Fax: (61 3) 9272 0749 0 800 738 378 (New Zealand) Fax: (64 4) 495 8950 Asia Pacific: (852) 2599 7889 Fax: (852) 2506 9233 Taiwan: (886 2) 717 9524 Fax: (886) 2 718 9860 Korea: (822) 769 0800 Fax: (822) 786 1083 Singapore: (65) 1 800 292 8100 Fax: (65) 275 0387 Product specifications and descriptions in this document subject to change without notice. Copyright 2000 Agilent Technologies Printed in U.S.A. 11/00 5964-2195E 8