N393, General Purpose Transistors NPN Silicon Features PbFree Packages are Available* MAXIMUM RATINGS Rating Symbol Value Unit CollectorEmitter Voltage V CEO 4 Vdc CollectorBase Voltage V CBO 6 Vdc EmitterBase Voltage V EBO 6. Vdc Collector Current Continuous I C madc Total Device Dissipation @ T A = C Derate above C Total Device Dissipation @ T C = C Derate above C Operating and Storage Junction Temperature Range P D 6 P D 1. 1 mw mw/ C W mw/ C T J, T stg to +1 C THERMAL CHARACTERISTICS (Note 1) Characteristic Symbol Max Unit Thermal Resistance, JunctiontoAmbient R JA C/W Thermal Resistance, JunctiontoCase R JC 83.3 C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Indicates Data in addition to JEDEC Requirements. TO9 CASE 9 STYLE 1 BASE COLLECTOR 3 1 EMITTER 1 1 3 3 STRAIGHT LEAD BENT LEAD BULK PACK TAPE & REEL AMMO PACK MARKING DIAGRAMS N 39x YWW x = 3 or 4 Y = Year WW = Work Week = PbFree Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 1 August, 1 Rev. 8 1 Publication Order Number: N393/D
N393, ELECTRICAL CHARACTERISTICS (T A = C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS CollectorEmitter Breakdown Voltage (Note ) (I C = madc, I B = ) V (BR)CEO 4 Vdc CollectorBase Breakdown Voltage (I C = Adc, I E = ) V (BR)CBO 6 Vdc EmitterBase Breakdown Voltage (I E = Adc, I C = ) V (BR)EBO 6. Vdc Base Cutoff Current (V CE = Vdc, V EB = 3. Vdc) I BL nadc Collector Cutoff Current (V CE = Vdc, V EB = 3. Vdc) I CEX nadc ON CHARACTERISTICS DC Current Gain (Note ) (I C =.1 madc, V CE = Vdc) N393 (I C = madc, V CE = Vdc) N393 (I C = madc, V CE = Vdc) N393 (I C = madc, V CE = Vdc) N393 (I C = madc, V CE = Vdc) N393 h FE 4 3 6 1 1 CollectorEmitter Saturation Voltage (Note ) (I C = madc, I B = madc) (I C = madc, I B = madc V CE(sat)..3 Vdc BaseEmitter Saturation Voltage (Note ) (I C = madc, I B = madc) (I C = madc, I B = madc) SMALLSIGNAL CHARACTERISTICS CurrentGain Bandwidth Product (I C = madc, V CE = Vdc, f = MHz) N393 V BE(sat).6 f T Output Capacitance (V CB = Vdc, I E =, f = MHz) C obo 4. pf Input Capacitance (V EB =. Vdc, I C =, f = MHz) C ibo 8. pf Input Impedance (I C = madc, V CE = Vdc, f = khz) N393 Voltage Feedback Ratio (I C = madc, V CE = Vdc, f = khz) N393 SmallSignal Current Gain (I C = madc, V CE = Vdc, f = khz) N393 h ie h re.1. h fe.8.9 8. 8. 4 Vdc MHz k X 4 Output Admittance (I C = madc, V CE = Vdc, f = khz) h oe 4 mhos Noise Figure (I C = Adc, V CE = Vdc, R S = k, f = khz) N393 SWITCHING CHARACTERISTICS Delay Time (V CC = 3. Vdc, V BE =. Vdc, t d 3 ns Rise Time I C = madc, I B1 = madc) t r 3 ns Storage Time (V CC = 3. Vdc, I C = madc, N393 I B1 = I B = madc) Fall Time t f ns. Pulse Test: Pulse Width s; Duty Cycle %. NF t s 6. 1 db ns
N393, ORDERING INFORMATION Device Package Shipping N393RLRM TO9 / Ammo Pack TO9 Units / Bulk G TO9 (PbFree) Units / Bulk RLRA TO9 / Tape & Reel RLRAG TO9 (PbFree) / Tape & Reel RLRM TO9 / Ammo Pack RLRMG TO9 (PbFree) / Ammo Pack RLRP TO9 / Ammo Pack RLRPG RL1G TO9 (PbFree) TO9 (PbFree) / Ammo Pack / Tape & Reel ZL1 TO9 / Ammo Pack ZL1G TO9 (PbFree) / Ammo Pack For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD811/D. DUTY CYCLE = % ns +.9 V +3 V k -. V < 1 ns C S < 4 pf* * Total shunt capacitance of test jig and connectors Figure 1. Delay and Rise Time Equivalent Test Circuit < t 1 < s DUTY CYCLE = % t 1 +.9 V +3 V k 1N916 C S < 4 pf* - 9.1 V < 1 ns * Total shunt capacitance of test jig and connectors Figure. Storage and Fall Time Equivalent Test Circuit 3
f N393, TYPICAL TRANSIENT CHARACTERISTICS T J = C T J = 1 C CAPACITANCE (pf). 3...1 C ibo C obo..3... 3.. 4 REVERSE BIAS VOLTAGE (VOLTS) Figure 3. Capacitance Q, CHARGE (pc) V CC = 4 V I C /I B = Q T. 3.. Figure 4. Charge Data Q A I C /I B = V CC = 4 V I C /I B = TIME (ns) 1 V t d @ V OB = V. V. 3.. Figure. TurnOn Time t r @ V CC = 3. V 4 V t, RISE TIME (ns) r. 3.. Figure 6. Rise Time t, STORAGE TIME (ns) s I C /I B = I C /I B = t s = t s - 1 / 8 t f I B1 = I B I C /I B = I C /I B = t, FALL TIME (ns) I C /I B = I C /I B = V CC = 4 V I B1 = I B. 3.. Figure. Storage Time. 3.. Figure 8. Fall Time 4
N393, TYPICAL AUDIO SMALLSIGNAL CHARACTERISTICS NOISE FIGURE VARIATIONS (V CE = Vdc, T A = C, Bandwidth = Hz) NF, NOISE FIGURE (db) 1 8 6 4 SOURCE RESISTANCE = I C = ma SOURCE RESISTANCE = I C =. ma SOURCE RESISTANCE = k I C = A NF, NOISE FIGURE (db) 14 1 8 6 4 f = khz I C =. ma I C = ma I C = A I C = A SOURCE RESISTANCE = I C = A.1..4. 4. 4 f, FREQUENCY (khz) Figure 9..1..4. 4. 4 R S, SOURCE RESISTANCE (k OHMS) Figure. h PARAMETERS (V CE = Vdc, f = khz, T A = C) h fe, CURRENT GAIN.1..3.. 3. Figure 11. Current Gain h oe, OUTPUT ADMITTANCE ( mhos) 1.1..3.. 3. Figure 1. Output Admittance h ie, INPUT IMPEDANCE (k OHMS)....1..3.. 3. Figure 13. Input Impedance h, VOLTAGE FEEDBACK RATIO (X -4 re ). 3.....1..3.. 3. Figure 14. Voltage Feedback Ratio
N393, TYPICAL STATIC CHARACTERISTICS h FE, DC CURRENT GAIN (NORMALIZED)....3. T J = +1 C + C - C V CE = V.1.1..3... 3.. Figure 1. DC Current Gain V CE, COLLECTOR EMITTER VOLTAGE (VOLTS).8.6.4..1 I C = ma..3.. T J = C ma ma ma.1..3... 3.. I B, BASE CURRENT (ma) Figure 16. Collector Saturation Region 1. T J = C V BE(sat) @ I C /I B =. + C TO +1 C V, VOLTAGE (VOLTS).8.6.4. V CE(sat) @ I C /I B = V BE @ V CE = V COEFFICIENT (mv/ C) -. - - 1. VC FOR V CE(sat) VB FOR V BE(sat) - C TO + C - C TO + C + C TO +1 C. -. 4 6 8 1 14 16 18 Figure 1. ON Voltages Figure 18. Temperature Coefficients 6
N393, PACKAGE DIMENSIONS TO9 (TO6) CASE 911 ISSUE AM R A N B STRAIGHT LEAD BULK PACK NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.M, 198.. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. P L SEATING INCHES MILLIMETERS PLANE K DIM MIN MAX MIN MAX A.1. 4.4. B.1. 4.3.33 C.1.16 3.18 4.19 D.16.1.4.33 X X D G.4. 1.1 1.39 H.9..4.66 G J.1..39. H J K. --- 1. --- V C L. --- 6.3 --- N.8..4.66 P ---. ---.4 SECTION XX R.11 ---.93 --- 1 N V.13 --- 3.43 --- R A B BENT LEAD TAPE & REEL AMMO PACK NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.M, 1994.. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. P T MILLIMETERS SEATING PLANE K DIM MIN MAX A 4.4. B 4.3.33 C 3.18 4.19 D.4.4 G X X D G.4.8 J.39. K 1. --- J N.4.66 V P 1. 4. C R.93 --- SECTION XX V 3.43 --- 1 N STYLE 1: PIN 1. EMITTER. BASE 3. COLLECTOR ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patentmarking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 163, Denver, Colorado 81 USA Phone: 361 or 8344386 Toll Free USA/Canada Fax: 3616 or 8344386 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 8898 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 41 33 9 9 Japan Customer Focus Center Phone: 81381 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative N393/D