TSFF55 High Speed Infrared Emitting Diode, 87 nm, GaAlAs Double Hetero 26 DESCRIPTION TSFF55 is an infrared, 87 nm emitting diode in GaAlAs double hetero (DH) technology with high radiant power and high speed, molded in a clear, untinted plastic package. FEATURES Package type: leaded Package form: T-¾ Dimensions (in mm): Ø 5 Leads with stand-off Peak wavelength: p = 87 nm High reliability High radiant power High radiant intensity Angle of half intensity: = ± 38 Low forward voltage Suitable for high pulse current operation High modulation bandwidth: f c = 24 MHz Good spectral matching with Si photodetectors Compliant to RoHS Directive 22/95/EC and in accordance to WEEE 22/96/EC ** Please see document Vishay Material Category Policy : www.vishay.com/doc?9992 APPLICATIONS Infrared video data transmission between camcorder and TV set Free air data transmission systems with high data transmission rates PRODUCT SUMMARY COMPONENT I e (mw/sr) (deg) p (nm) t r (ns) TSFF55 32 ± 38 87 5 Test conditions see table Basic Characteristics ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM TSFF55 Bulk MOQ: 4 pcs, 4 pcs/bulk T-¾ MOQ: minimum order quantity ABSOLUTE MAXIMUM RATINGS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage V R 5 V Forward current I F ma Peak forward current t p /T =.5, t p = μs I FM 2 ma Surge forward current t p = μs I FSM A Power dissipation P V 8 mw Junction temperature T j C Operating temperature range T amb - 4 to + 85 C Storage temperature range T stg - 4 to + C Soldering temperature t 5 s, 2 mm from case T sd 26 C Thermal resistance junction/ambient J-STD-5, leads 7 mm soldered on PCB R thja 23 K/W Rev..3, 23-Aug- Document Number: 8835 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
TSFF55 P V - Power Dissipation (mw) 2 8 6 4 2 R thja = 23 K/W 8 6 4 2 2 3 4 5 6 7 8 9 242 T amb - Ambient Temperature ( C) 2 8 R thja = 23 K/W 6 4 2 2 3 4 5 6 7 8 9 243 T amb - Ambient Temperature ( C) Fig. - Power Dissipation Limit vs. Ambient Temperature Fig. - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT I F = ma, t p = 2 ms V F.3.45.7 V Forward voltage I F = 45 ma, t p = μs V F.5.75 2. V I F = A, t p = μs V F 2. V Temperature coefficient of V F I F = ma TK VF -.8 mv/k Reverse current V R = 5 V I R μa Junction capacitance V R = V, f = MHz, E = C j pf Radiant intensity I F = ma, t p = 2 ms I e 6 32 48 mw/sr Radiant power I F = ma, t p = 2 ms e 55 mw Temperature coefficient of e I F = ma TK e -.35 %/K Angle of half intensity ± 38 deg Peak wavelength I F = ma p 87 nm Spectral bandwidth I F = ma 55 nm Temperature coefficient of p I F = ma TK p.25 nm/k Rise time I F = ma t r 5 ns Fall time I F = ma t f 5 ns Cut-off frequency I DC = 7 ma, I AC = 3 ma pp f c 24 MHz Rev..3, 23-Aug- 2 Document Number: 8835 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
TSFF55 BASIC CHARACTERISTICS (T amb = 25 C, unless otherwise specified) t p /T =. T amb < 5 C.2.5.2.5 φ e - Radiant Power (mw) t p = µs t p /T =.2. 63 t p - Pulse Duration (ms) Fig. 2 - Pulse Forward Current vs. Pulse Duration 262 Fig. 5 - Radiant Power vs. Forward Current.25 I F - Forward Current (A). - Relative Radiant Power Φ e, rel..75.5.25..5.5 2 2.5 3 3.5 4 29 V F - Forward Voltage (V) Fig. 3 - Forward Current vs. Forward Voltage 75 79 83 87 9 95 2 λ - Wavelength (nm) Fig. 6 - Relative Radiant Power vs. Wavelength I e - Radiant Intensity (mw/sr) t p = µs t p /T =.2 2 Fig. 4 - Radiant Intensity vs. Forward Current...9.8.7.6.5.4.3.2-9 - 7-5 - 3-3 5 7 9 22 Angle ( ) I e, rel - Relative Radiant Intensity Fig. 7 - Relative Radiant Intensity vs. Angular Displacement Rev..3, 23-Aug- 3 Document Number: 8835 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
TSFF55 PACKAGE DIMENSIONS in millimeters Ø 5.9 ± 5 A C 4.4 ±.3 3.8 ± 5 (.72) SR2.35 9.5 ±.3 Area not plane Ø 4.8 ± 5 3.4 ±.55. ±.25 min..5 + 5 -.5 2.54 nom..5 + 5 -.5 technical drawings according to DIN specifications Drawing-No.: 6.544-539.-4 Issue: 2; 9.5.9 2796 Rev..3, 23-Aug- 4 Document Number: 8835 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
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