5 V, 1 A H-Bridge Motor Driver

Transcription

1 , A H-Bridge Motor Driver DESCRIPTION The SIP200 is an integrated, buffered H-bridge with TTL and CMOS compatible inputs with the capability of delivering up to A continuous current at DD supply. The SIP200 has two independent logic inputs that can set four different motor operation modes: normal rotation, reverse rotation, stop (idling) and braking. The internal shoot-through protection logic also prevents upper and lower outputs from being turned on simultaneously. The offers high efficiency with an extremely low operating current. The device also benefits from over temperature protection with a shut down hysteresis of 20. The SIP200 is available in SOIC8 package. FEATURES A drive capability Optimized for DD bias Extremely low idle current Shoot-through protection scheme Thermal shutdown Material categorization: For definitions of compliance please see /doc?9992 APPLICATIONS High performance servo Optical/tape disk drives Brush/stepper motor driver PACKAGE OUTLINE S A 8 OUT A SOIC (Top iew) GND 2 7 IN A DD 6 IN B S B OUT B Fig. - Package and Pinout FUNCTIONAL BLOCK DIAGRAM AND TRUTH TABLE TRUTH TABLE Fig. 2 - Functional Block Diagram IN A IN B OUT A Out B HiZ HiZ THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9000

2 ABSOLUTE MAXIMUM RATINGS (T A = 2, unless otherwise noted) Electrical Parameter Conditions Limits Unit DD Reference to GND - 0. to 6 OUT A, OUT B Reference to GND - 0. to 6 S A, S B Reference to GND - 0. to IN A, IN B Reference to GND - 0. to DD Temperature Operating Temperature - 0 to 8 Max. Operating Junction Temperature 0 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating/conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Parameter Min. Typ. Max. Unit DD.8. Temperature Operating Junction Temperature 0 2 Recommended Ambient Temperature 0 70 THERMAL RESISTANCE RATINGS Parameter Max. Unit Thermal Resistance (Junction to Ambient) SO-8, R thja SO-8 PowerPAD, R thjc 0 /W Power Dissipation SO-8, T A = mw SO-8 PowerPAD, T A = 70 2 W Junction Temperature - 6 to 0 Storage Temperature - to 0 2 THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9000

3 SPECIFICATIONS (T A = 2, unless otherwise specified) Parameter Driver Power Supply Symbol Notes: a. Pulse test; pulse width 00 µs, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. Test Conditions DD = Limits Min. a Typ. b Max. a DD Bias Supply Current I DD IN = 20 khz 0 80 µa IN = 00 khz Quiescent state 0 DD Rising Threshold DD TH_R DD rising 2.8 DD Falling Threshold DD TH_F DD falling 2 2. DD ULO Hysteresis DD ULO 00 m Input Logic Input oltage High IN H 2 Input oltage Low IN L 0.7 Input Sourcing Current I INH µa Input Sinking Current I INL - Output Stage I OUT = - 00 ma. Output oltage High OUTH I OUT = ma.2 DD =.7 I OUT = + 00 ma 0.2 Output oltage Low OUTL I OUT = ma 0. Output High Propagation Delay TP LH 20 2 Output Low Propagation Delay TP HL 20 2 ns Thermal Protection Thermal Shutdown Threshold 0 Thermal Shutdown Hysteresis 20 Unit PIN DESCRIPTION (SOIC PACKAGE) Pin Number Name Function S A Driver output return A 2 GND Analog ground of internal logic DD Input of internal logic bias and power stage S B Driver output return B OUT B Driver output B 6 IN B Driver input B 7 IN A Driver input A 8 OUT A Driver output A THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9000

4 TYPICAL CHARACTERISTICS (2, unless otherwise noted) 00 DD =.,00 khz OUT - Output oltage () IN =... IN = Fig. Output oltage vs. Temperature (at. A Load) I DD - Supply Current (µa) DD =.8,00 khz 0 DD =., 20 khz 00 DD =.,0 khz 0 DD =.8,0 khz DD =.8, 20 khz Fig 2. Supply Current I DD vs. Temperature 0 9 Current (µa) 0 DD =. Delay Time (ns) TPLH, DD =.8 TPLH, DD =. TPHL, DD = DD =.8 0 TPHL, DD = Fig. Quiescent Current vs. Temperature Fig. Propagation Delay vs. Temperature DD =. IN =..6 R OUT (Ω) IN =.8 IH ().. DD = DD = Fig. R OUT vs. Temperature Fig 6. PWM Rising Threshold vs. Temperature THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9000

5 TYPICAL CHARACTERISTICS (2, unless otherwise noted)..0 IL () DD = DD =.8 DD = Fig 7. PWM Falling Threshold vs. Temperature maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see /ppg?699. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9000

6 Package Information SOIC (NARROW): 8-LEAD JEDEC Part Number: MS E H 2 S D A 0.2 mm (Gage Plane) h x C All Leads e B A L q 0.0 mm 0.00" MILLIMETERS INCHES DIM Min Max Min Max A A B C D E e.27 BSC 0.00 BSC H h L q S ECN: C-0627-Rev. I, -Sep-06 DWG: 98 Document Number: 792 -Sep-06

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