2SK1056, 2SK1057, 2SK1058



Similar documents
HD61203U. (Dot Matrix Liquid Crystal Graphic Display 64-Channel Common Driver)

How To Make A Field Effect Transistor (Field Effect Transistor) From Silicon P Channel (Mos) To P Channel Power (Mos) (M2) (Mm2)

SSM3K335R SSM3K335R. 1. Applications. 2. Features. 3. Packaging and Pin Configuration Rev.3.0. Silicon N-Channel MOS (U-MOS -H)

Features. Symbol JEDEC TO-220AB

TPN4R712MD TPN4R712MD. 1. Applications. 2. Features. 3. Packaging and Internal Circuit Rev.4.0. Silicon P-Channel MOS (U-MOS )

Silicon Planar Zener Diode for Surge Absorption and Stabilizer

BUZ11. 30A, 50V, Ohm, N-Channel Power MOSFET. Features. [ /Title (BUZ1 1) /Subject. (30A, 50V, Ohm, N- Channel. Ordering Information

TOSHIBA Insulated Gate Bipolar Transistor Silicon N Channel IGBT GT60J323

STN3NF06L. N-channel 60 V, 0.07 Ω, 4 A, SOT-223 STripFET II Power MOSFET. Features. Application. Description

TSM2N7002K 60V N-Channel MOSFET

200V, N-CHANNEL. Absolute Maximum Ratings. Features: 1 PD

N-channel enhancement mode TrenchMOS transistor

OptiMOS Power-Transistor Product Summary

STP80NF55-08 STB80NF55-08 STB80NF N-CHANNEL 55V Ω - 80A D2PAK/I2PAK/TO-220 STripFET II POWER MOSFET

OptiMOS TM Power-Transistor

STP60NF06FP. N-channel 60V Ω - 30A TO-220FP STripFET II Power MOSFET. General features. Description. Internal schematic diagram.

STW20NM50 N-CHANNEL Tjmax Ω - 20ATO-247 MDmesh MOSFET

STP60NF06. N-channel 60V Ω - 60A TO-220 STripFET II Power MOSFET. General features. Description. Internal schematic diagram.

OptiMOS 3 Power-Transistor

STGW40NC60V N-CHANNEL 50A - 600V - TO-247 Very Fast PowerMESH IGBT

RFG70N06, RFP70N06, RF1S70N06, RF1S70N06SM

C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

IRF740 N-CHANNEL 400V Ω - 10A TO-220 PowerMESH II MOSFET

BSN Description. 2. Features. 3. Applications. 4. Pinning information. N-channel enhancement mode field-effect transistor

OptiMOS 3 Power-Transistor

SIPMOS Small-Signal-Transistor

BIPOLAR ANALOG INTEGRATED CIRCUIT

STP55NF06L STB55NF06L - STB55NF06L-1

MOSFET N-channel enhancement switching transistor IMPORTANT NOTICE. use

IRF150 [REF:MIL-PRF-19500/543] 100V, N-CHANNEL. Absolute Maximum Ratings

CoolMOS TM Power Transistor

STP6N60FI N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR

TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) 2SA1020

Old Company Name in Catalogs and Other Documents

Symbol Parameter Value Unit V DS Drain-source Voltage (V GS =0) 50 V V DGR Drain- gate Voltage (R GS =20kΩ) 50 V

BIPOLAR ANALOG INTEGRATED CIRCUIT

STP62NS04Z N-CHANNEL CLAMPED 12.5mΩ - 62A TO-220 FULLY PROTECTED MESH OVERLAY MOSFET

STP10NK80ZFP STP10NK80Z - STW10NK80Z

UNISONIC TECHNOLOGIES CO., LTD 50N06 Power MOSFET

SMPS MOSFET. V DSS Rds(on) max I D

Symbol Parameter Value Unit IAR Avalanche Current, Repetitive or Not-Repetitive

5A 3A. Symbol Parameter Value Unit

AUTOMOTIVE MOSFET. C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

DATA SHEET. BF245A; BF245B; BF245C N-channel silicon field-effect transistors DISCRETE SEMICONDUCTORS

IRF840. 8A, 500V, Ohm, N-Channel Power MOSFET. Features. Ordering Information. Symbol. Packaging. Data Sheet January 2002

Features. Description. Table 1. Device summary. Order code Marking Package Packing. STP110N8F6 110N8F6 TO-220 Tube

IRF640, RF1S640, RF1S640SM

STW34NB20 N-CHANNEL 200V Ω - 34A TO-247 PowerMESH MOSFET

MMBF4391LT1G, SMMBF4391LT1G, MMBF4392LT1G, MMBF4393LT1G. JFET Switching Transistors. N Channel

IRF A, 100V, Ohm, N-Channel Power MOSFET. Features. Ordering Information. Symbol. Packaging. Data Sheet January 2002

P-Channel 1.25-W, 1.8-V (G-S) MOSFET

SMPS MOSFET. V DSS R DS (on) max I D

CD4511BM CD4511BC BCD-to-7 Segment Latch Decoder Driver

STB75NF75 STP75NF75 - STP75NF75FP

2N5460, 2N5461, 2N5462. JFET Amplifier. P Channel Depletion. Pb Free Packages are Available* Features. MAXIMUM RATINGS

Power MOSFET. IRF510PbF SiHF510-E3 IRF510 SiHF510. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 100 V Gate-Source Voltage V GS ± 20

Power MOSFET FEATURES. IRF610PbF SiHF610-E3 IRF610 SiHF610. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 200 V Gate-Source Voltage V GS ± 20

Power MOSFET FEATURES. IRF740PbF SiHF740-E3 IRF740 SiHF740. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 400 V Gate-Source Voltage V GS ± 20

DATA SHEET PNP SILICON EPITAXIAL TRANSISTOR FOR HIGH-VOLTAGE HIGH-SPEED SWITCHING

Taping code. Reel size (mm) 2SCR513P MPT T ,000 NC

Features 1.7 A, 20 V. R DS(ON) Symbol Parameter Ratings Units

Power MOSFET FEATURES. IRF740PbF SiHF740-E3 IRF740 SiHF740. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 400 V Gate-Source Voltage V GS ± 20

Power MOSFET FEATURES. IRFZ44PbF SiHFZ44-E3 IRFZ44 SiHFZ44 T C = 25 C

IRF6201PbF. HEXFET Power MOSFET V DS 20 V. R DS(on) max mω. Q g (typical) 130 nc 27 A. Absolute Maximum Ratings

TLP521 1,TLP521 2,TLP521 4

Power MOSFET FEATURES. IRL540PbF SiHL540-E3 IRL540 SiHL540

Item Symbols Conditions Ratings Units Repetitive peak reverse voltage VRRM V

TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT Process) 2SC2383

Power MOSFET FEATURES. IRF540PbF SiHF540-E3 IRF540 SiHF540. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 100 V Gate-Source Voltage V GS ± 20

STB4NK60Z, STB4NK60Z-1, STD4NK60Z STD4NK60Z-1, STP4NK60Z,STP4NK60ZFP

STP10NK60Z/FP, STB10NK60Z/-1 STW10NK60Z N-CHANNEL 600V-0.65Ω-10A TO-220/FP/D 2 PAK/I 2 PAK/TO-247 Zener-Protected SuperMESH Power MOSFET

Power MOSFET FEATURES. IRF9640PbF SiHF9640-E3 IRF9640 SiHF9640

IRFP460LC PD HEXFET Power MOSFET V DSS = 500V. R DS(on) = 0.27Ω I D = 20A

SPW32N50C3. Cool MOS Power Transistor V T jmax 560 V

MM54C150 MM74C Line to 1-Line Multiplexer

P-Channel 20 V (D-S) MOSFET

Final data. Maximum Ratings Parameter Symbol Value Unit

STB60N55F3, STD60N55F3, STF60N55F3 STI60N55F3, STP60N55F3, STU60N55F3

Old Company Name in Catalogs and Other Documents

P-Channel 20-V (D-S) MOSFET

INTEGRATED CIRCUITS. 74LVC08A Quad 2-input AND gate. Product specification IC24 Data Handbook Jun 30

IRF830. N - CHANNEL 500V Ω - 4.5A - TO-220 PowerMESH MOSFET

BD241A BD241C. NPN power transistors. Features. Applications. Description. NPN transistors. Audio, general purpose switching and amplifier transistors

Power MOSFET FEATURES. IRF520PbF SiHF520-E3 IRF520 SiHF520. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 100 V Gate-Source Voltage V GS ± 20

LM381 LM381A Low Noise Dual Preamplifier

STP6NK60Z - STP6NK60ZFP STB6NK60Z - STB6NK60Z-1 N-CHANNEL 600V - 1Ω - 6A TO-220/TO-220FP/D 2 PAK/I 2 PAK Zener-Protected SuperMESH Power MOSFET

C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

N-Channel 100 V (D-S) MOSFET

2N6056. NPN Darlington Silicon Power Transistor DARLINGTON 8 AMPERE SILICON POWER TRANSISTOR 80 VOLTS, 100 WATTS

N-Channel 60-V (D-S), 175 C MOSFET

UGF W, 1 GHz, 26V Broadband RF Power N-Channel Enhancement-Mode Lateral MOSFET

60 V, 360 ma N-channel Trench MOSFET. Symbol Parameter Conditions Min Typ Max Unit V DS drain-source T amb = 25 C V

K817P/ K827PH/ K847PH. Optocoupler with Phototransistor Output. Vishay Semiconductors. Description. Applications. Features.

N-Channel 40-V (D-S) 175 C MOSFET

N-Channel 20-V (D-S) 175 C MOSFET

V DSS R DS(on) max Qg. 30V 3.2mΩ 36nC

NTMS4920NR2G. Power MOSFET 30 V, 17 A, N Channel, SO 8 Features

Transcription:

SK6, SK7, SK8 Silicon N-Channel MOS FET Application Low frequency power amplifier Complementary pair with SJ160, SJ161 and SJ16 Features Good frequency characteristic High speed switching Wide area of safe operation Enhancement-mode Good complementary characteristics Equipped with gate protection diodes Suitable for audio power amplifier

1 3 SK6, SK7, SK8 Outline TO-3P D G S 1. Gate. Source (Flange) 3. Drain Absolute Maximum Ratings (Ta = C) Item Symbol Ratings Unit Drain to source voltage SK6 V DSX V SK7 140 SK8 160 Gate to source voltage V GSS ±1 V Drain current I D 7 A Body to drain diode reverse drain current I DR 7 A Channel dissipation Pch* 1 0 W Channel temperature Tch 10 C Storage temperature Tstg to +10 C Note: 1. Value at T C = C

SK6, SK7, SK8 Electrical Characteristics (Ta = C) Item Symbol Min Typ Max Unit Test conditions Drain to source SK6 V (BR)DSX V I D = ma, V GS = V breakdown voltage SK7 140 SK8 160 Gate to source breakdown voltage V (BR)GSS ±1 V I G = ±0 µa, V DS = 0 Gate to source cutoff voltage V GS(off) 0.1 1.4 V I D = 0 ma, V DS = V Drain to source saturation voltage V DS(sat) 1 V I D = 7 A, V GD = 0 * 1 Forward transfer admittance yfs 0.7 1.4 S I D = 3 A, V DS = V * 1 Input capacitance Ciss 600 pf V GS = V, V DS = V, Output capacitance Coss 30 pf f = 1 MHz Reverse transfer capacitance Crss pf Turn-on time t on 180 ns V DD = 0 V, I D = 4 A, Turn-off time t off 60 ns Note: 1. Pulse test 3

SK6, SK7, SK8 Channel Dissipation Pch (W) 10 0 0 0 Power vs. Temperature Derating 0 0 Case Temperature T C ( C) 10 0 Maximum Safe Operation Area I D max (Continuous) PW = ms 1 shot DC Operation (T C = C) PW = 0 ms 1 shot PW = 1 s 1 shot Ta = C 0. SK6 SK7 SK8 0. 0 0 0 00 00 Drain to Source Voltage V DS (V) Typical Output Characteristics Typical Transfer Characteristics 8 6 4 0 V GS = V T C = C 9 8 7 6 4 Pch = 0 W 1 0 0 30 40 0 Drain to Source Voltage V DS (V) 3 0.8 0.6 0.4 0. V DS = V T C = C 7 0 0.4 0.8 1. 1.6.0 Gate to Source Voltage V GS (V) 4

SK6, SK7, SK8 Drain to Source Saturation Voltage V DS (on) (V) 0. 0. 0.1 0.1 V GD = 0 Drain to Source Saturation Voltage vs. Drain Current C 7 C T C = C 0. 0. Drain to Source Voltage V DS (V) 8 6 4 Drain to Source Voltage vs. Gate to Source Voltage T C = C A A I D = 1 A 0 4 6 8 Gate to Source Voltage V GS (V) Input Capacitance Ciss (pf) 00 00 00 0 Input Capacitance vs. Gate Source Voltage V DS = V f = 1 MHz 0 4 6 8 Gate to Source Voltage V GS (V) Forward Transfer Admittance yfs (S) 3.0 0.3 0.1 0.03 0.01 Forward Transfer Admittance vs. Frequency T C = C V DS = V I D = A 0.003 k 30 k 0 k 300 k 1 M 3 M M Frequency f (Hz)

SK6, SK7, SK8 00 Switching Time vs. Drain Current Switching Time ton,toff (ns) 00 0 0 0 t on t off 0.1 0. 0. Switching Time Test Circuit Output R L = Ω Input PW = 0µs duty ratio = 1 % 0 Ω 0 V Input Waveforms 90 % % t on t off Output % 90 % 6

1.6 ± 0.3 φ3. ± 0..0 ± 0.3 4.8 ± 0. 1. Unit: mm 0. 1.6 1.4 Max.0.0 14.9 ± 0. 18.0 ± 0. 19.9 ± 0. 0.3.8 ± 0. 0.6 ± 0. 3.6 0.9.4 ± 0..4 ± 0. Hitachi Code JEDEC EIAJ Weight (reference value) TO-3P Conforms.0 g

Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi s or any third party s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party s rights, including intellectual property rights, in connection with use of the information contained in this document.. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., -6-, Ohte-machi, Chiyoda-ku, Tokyo 0-0004, Japan Tel: Tokyo (03) 370-111 Fax: (03) 370-9 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/e/product/sicd_frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 9134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-03 Hitachi Europe GmbH Electronic components Group Dornacher Stra e 3 D-86 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 9 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (168) 8000 Fax: <44> (168) 7783 Hitachi Asia Pte. Ltd. 16 Collyer Quay #0-00 Hitachi Tower Singapore 049318 Tel: 3-0 Fax: 3-133 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei () Tel: <886> () 718-3666 Fax: <886> () 718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <8> () 73 918 Fax: <8> () 730 081 Telex: 4081 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.