28 Volt NOT RECOMMENDED FOR NEW DESIGNS Features Attenuation 0 db from 110 khz to 0 MHz Operating temperature - to +8 C Nominal 28 V input, 0 V to 0 V operation 1.7 to A throughput current Transient suppression Compliant to MIL-STD-61C CE-0 (V) 0-0 0-0 0-0 models Voltage and Current Current (A) 1.7.8.0 Size (max.): Non-flanged case H - FM-6.110 x 1.120 x 0.17 inches (.9 x 28. x 10.9 mm) H - FMA/FMB 2.110 x 1.120 x 0.9 inches (.9 x 28. x 12.7* mm) Flanged case K - FM-6.910 x 1.11 x 0.17 inches (7.91 x 28.2 x 10.9* mm) K6 - FMA/FMB 2.910 x 1.11 x 0.9 inches (7.91 x 28.2 x 12.7 mm) Weight: Maximum FM-61 8 grams, FMA-61 2 grams, FMB-61 grams Screening: Standard or ES. See screening table for more information. Description The, EMI filter modules have been specifically designed to reduce the input line reflected ripple current of Interpoint s MTO, MTW, MHE, MLP, and MFW Series of DC/DC converters. They are intended for use in applications of high frequency (100 khz) switch-mode DC/DC converters which must meet MIL-STD-61C levels of conducted power line noise. These filters are built using thick-film hybrid technology and are sealed in metal packages for military, aerospace, and other highreliability applications. See Section B8, cases H, H, K, and K6 for dimensions. See Section C2 for screening options. Filter Operation A fast-reacting (1 picosecond) transient suppressor clamps the input voltage at approximately 7 V, protecting the DC/DC converter from line induced transients. The filters are rated to operate, with no degradation of performance, over the temperature range of C to +8 C (as measured at the baseplate). Above 8 C, input voltage and current must be derated as specified in Derating on the following page. The maximum power dissipation of the filters at maximum input current represents a power loss of less than % at typical input voltage. MIL-STD Noise Management When used in conjunction with Interpoint s DC/DC converters (see connection diagram, Figure 2), the input ripple current will be reduced by 0 db within the frequency band of 100 khz to 0 MHz. This gives the filter/converter combination a performance which exceeds the CE0 test limit of MIL-STD-61C. The CE0 performance of a model MHE280S converter with and without the FM-61 filter is shown in Figures 6 and 7. Layout Requirements The case of the filter must be connected to the case of the converter through a low impedance connection to minimize EMI. Crane Aerospace & Electronics Electronics Group (Interpoint Brand) PO Box 9700 Redmond WA 9807-970 2.882.100 power@crane-eg.com Page 1 of 9
absolute maximum ratings Voltage 0 to 0 VDC continuous Lead Soldering Temperature (10 sec per lead) 00 C Storage Temperature Range (Case) C to +1 C Isolation 100 megohm minimum at 00 V Any pin to case (except case pin) recommended operating conditions Voltage Range 0 to 0 VDC continuous Case Operating Temperature (Tc) C to +8 C full power C to +12 C absolute derating Voltage Derate linearly from 100% at 8 C case to the VDC at 12 C case Ripple Current Derate linearly from 100% at 8 C case to the following at 12 C case 270 ma rms FM-61 00 ma rms FMA-61 80 ma rms FMB-61 DC and Current Derate linearly from 100% at 8 C case to the following at 12 C case 70 ma FM-61 1.7 A FMA-61 1.7 A FMB-61 Electrical Characteristics: 2 C Tc, nominal Vin, unless otherwise specified. Note 1. Typical applications result in Vout within 2% of Vin. fm-61 FMA-61 fmb-61 PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS input voltage continuous 0 28 0 0 28 0 0 28 0 VDC input clamping voltage - C 8.9.2 7. 8.9.2 7. 8.9.2 7. +2 C +12 C 2. 7.0 1.7.9 9.9.8 2. 7.0 1.7.9 9.9.8 2. 7.0 1.7.9 9.9.8 VDC input current DC 1.7.8.0 A ripple 0.67 1.0 1.2 A rms noise rejection 1 khz to 0 MHz 0 0 0 db dc resistance (r dc ) steady state 0.8 0.2 0.07 0.10 0.1 0.07 0.09 0.10 Ω capacitance any pin to case 1900 2200 700 00 60 8000 pf output voltage 1 steady state V OUT = V IN - I IN (R DC ) VDC output current steady state 1.7.8.0 A power dissipation max current 1. 1.6 2. W 1000 pf 69 H 2. H x2 0.1 F 0.01 F 0.001 F 0 10 7 pf.7 F FM-61 1000 pf 00 V Figure 1: Schematic Page 2 of 9
1000 pf >10 H 2. H x2 x x2 0.1 F 0.01 F 0.001 F 0 10.7 F FMA-61 x2 1000 pf 00 V 7 pf Figure 2: Schematic P6KE7 0.6. H. H 0.7 F 9. F 18.8 F 7 pf 00V FMB-61 00 pf 00 V Figure : Schematic +Vin EMI FILTER +Vout Case DC/DC CONVERTER +Vin Case +Vout R L Chassis ground Multiple units allowed up to rated output current of filter R L The case ground connection should be as low an impedance as possible to minimize EMI. Direct contact of baseplate to chassis ground provides the lowest impedance. Figure : Connection Diagram Page of 9
pin out pin designation 1 2 Case Ground of package indicate pin one. BOTTOM VIEW, FMB-61 Dotted line outlines flanged package option. See cases H, H, K, and K6, for dimensions. Figure : Pin Out model numbering key Base Model FM, FMA, or FMB FMB - 61 F / ES MIL-STD-61 reference Case Option (Non-flanged case has no designator in this position) Screening (Standard screening has no designator in this position) Typical Performance Curves: 2 C Tc, nominal Vin, unless otherwise specified. 90 90 70 CE0 Limit 70 CE0 Limit EMISSION LEVEL (dma) 0 0 EMISSION LEVEL (dma) 0 0 10 10.01.1 1 10 0 FREQUENCY (MHz).01.1 1 10 0 FREQUENCY (MHz) MHE Converter Without Filter Figure 6 MHE Converter With FM-61 EMI Filter Figure 7 Page of 9
BOTTOM VIEW CASE H Solder Tip-off Solder Seal 0.00 dia (1.02) 1.120 (28.) 0.960 (2.8) 0.60 (1.22) 0.160 (.06) of case indicate pin one. 0.17 max (10.9) 0.2 +0.0/-0.00 (6. +1./-0.0) 0.2 (6.8) 1.8 (7.12) 2.110 (.9) Case dimensions in inches (mm) Tolerance ±0.00 (0.1) for three decimal places ±0.01 (0.) for two decimal places unless otherwise specified CAUTION Heat from reflow or wave soldering may damage the device. Solder pins individually with heat application not exceeding 00 C for 10 seconds per pin. Materials Header Cover Pins Cold Rolled Steel/Nickel/Tin Cold Rolled Steel/Nickel/Tin #2 alloy, compression glass seal Case H, Rev C - 20100211 Please refer to the numerical dimensions for accuracy. All information is believed to be accurate, but no responsibility is assumed for errors or omissions. Interpoint reserves the right to make changes in products or specifications without notice. Copyright 1999-2010 Interpoint Corp. All rights reserved. Figure 8: Case H - FM-61 Non-Flanged Page of 9
BOTTOM VIEW CASE H Solder Seal 1.120 (28.) 0.960 (2.8) of case indicate pin one. 0.00 dia (1.02) 0.60 (1.22) Solder Tip-off 0.160 (.06) 0.9 max (12.7) 0.2 +0.0/-0.00 (6. +1./-0.0) 0.2 (6.8) 1.8 (7.12) 2.110 (.9) Case dimensions in inches (mm) Tolerance ±0.00 (0.1) for three decimal places ±0.01 (0.) for two decimal places unless otherwise specified CAUTION Heat from reflow or wave soldering may damage the device. Solder pins individually with heat application not exceeding 00 C for 10 seconds per pin. Materials Header Cover Pins Cold Rolled Steel/Nickel/Tin Cold Rolled Steel/Nickel/Tin #2 alloy, compression glass seal Case H, Rev C - 20100211 Please refer to the numerical dimensions for accuracy. All information is believed to be accurate, but no responsibility is assumed for errors or omissions. Interpoint reserves the right to make changes in products or specifications without notice. Copyright 1999-2010 Interpoint Corp. All rights reserved. Figure 9: Case H - FMA/FMB-61 Non-Flanged Page 6 of 9
BOTTOM VIEW CASE K *Flanged case: Designator F required in Case Option position of model number. Solder Seal 1.11 (28.2) 0.9 (2.26) of case indicate pin one. 0.00 dia (1.02) 0. (1.1) 0.162 dia (.11) Solder Tip-off 0.1 (.9) 0.17 max (10.9) 0.2 ±0.0 (6. ±0.8) 0.20 (.8) 0.2 (6.22) 2.910 max (7.91) 1.8 (6.86) 2.20 (8.9) Flange Thickness: 0.067 +0.00/-0.007 (1.70 +0.1/-0.8) Case dimensions in inches (mm) Tolerance ±0.00 (0.1) for three decimal places ±0.01 (0.) for two decimal places unless otherwise specified CAUTION Heat from reflow or wave soldering may damage the device. Solder pins individually with heat application not exceeding 00 C for 10 seconds per pin. Case K, Rev E - 20100211 Please refer to the numerical dimensions for accuracy. All information is believed to be accurate, but no responsibility is assumed for errors or omissions. Interpoint reserves the right to make changes in products or specifications without notice. Copyright 1999-2010 Interpoint Corp. All rights reserved. Figure 10: Case K - FM-61 Flanged Page 7 of 9
BOTTOM VIEW CASE K6 *Flanged case: Designator F required in Case Option position of model number. Solder Seal 1.11 (28.2) of case indicate pin one. 0.9 (2.26) 0.00 dia (1.02) 0. (1.1) 0.162 dia (.11) Solder Tip-off 0.1 (.9) 0.9 max (12.7) 0.2 ±0.0 (6. ±0.8) 0.20 (.8) 0.2 (6.22) 2.910 max (7.91) 1.8 (6.86) 2.20 (8.9) Flange Thickness: 0.067 +0.00/-0.007 (1.70 +0.1/-0.8) Case dimensions in inches (mm) Tolerance ±0.00 (0.1) for three decimal places ±0.01 (0.) for two decimal places unless otherwise specified CAUTION Heat from reflow or wave soldering may damage the device. Solder pins individually with heat application not exceeding 00 C for 10 seconds per pin. Case K6, Rev E - 20100211 Please refer to the numerical dimensions for accuracy. All information is believed to be accurate, but no responsibility is assumed for errors or omissions. Interpoint reserves the right to make changes in products or specifications without notice. Copyright 1999-2010 Interpoint Corp. All rights reserved. Figure 11: Case K6 - FMA/FMB-61 Flanged Page 8 of 9
STANDARD AND /ES (NON-QML) PRODUCTS ENVIRONMENTAL SCREENING 1 test performed standard non-qml 2 /es non-qml 2 Pre-cap Inspection Method 2017, 202 yes yes Temperature Cycle (10 times) Method 1010, Cond. B, - C to +12 C, ambient no yes Constant Acceleration Method 2001, 00 g no yes Burn-in Method 101 96 hours no yes Final Electrical Test MIL-PRF-8, Group A Subgroups 1 and : +2 C case yes yes Hermeticity Test Fine Leak, Method 101, Cond. A Gross Leak, Method 101, Cond. C Gross Leak, Dip (1 x 10 - ) Final visual inspection Method 2009 yes yes no no yes yes yes no Test methods are referenced to MIL-STD-88 as determined by MIL-PRF-8. Test methods are referenced to MIL-STD-88 as determined by MIL-PRF-8. Notes: Notes: 1. refers to products that do not offer QML screening. 1. 2. Refers Standard to products and /ES, non-qml that do not products, offer QML do not screening. meet all of the requirements of MIL-PRF-8. 2.. Standard Burn-in designed and /ES, to non-qml bring the products, case temperature do not meet to the all of maximum the requirements case temperature of MIL-PRF-8. of the product. Refer to the specific product information. Burn-in for the designed maximum to case bring temperature. the case temperature to the maximum case temperature of 8 C. FM/FMA/FMB-61 EMI Filter,. This revision supersedes all previous releases. All technical information is believed to be accurate, but no responsibility is assumed for errors or omissions. Interpoint reserves the right to make changes in products or specifications without notice. FM/FMA/FMB-61 Series is a trademark of Interpoint. Copyright 1999-2010 Interpoint Corporation. All rights reserved. www.interpoint. com Page 9 of 9