1 TO 4 CLOCK BUFFER ICS551. Description. Features. Block Diagram DATASHEET



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DATASHEET 1 TO 4 CLOCK BUFFER ICS551 Description The ICS551 is a low cost, high-speed single input to four output clock buffer. Part of IDT s ClockBlocks TM family, this is our lowest cost, small clock buffer. See the ICS552-02B for monolithic dual version of the ICS551 in a 20 pin QSOP. IDT makes many non-pll and PLL based low skew output devices as well as Zero Delay Buffers to synchronize clocks. Contact IDT for all of your clocking needs. Features Low skew (250 ps) outputs Pb-free packaging Low cost clock buffer Packaged in -pin SOIC Input/Output clock frequency up to 160 MHz Non-inverting output clock Ideal for networking clocks Operating Voltages of 3.3 and 5.0 V Output Enable mode tri-states outputs Advanced, low power CMOS process Commercial and industrial temperature versions Block Diagram Q1 ICLK Q2 Q3 Q4 Output Enable IDT 1 TO 4 CLOCK BUFFER 1 ICS551 REV P 051310

Pin Assignment ICLK 1 OE Q1 2 7 VDD Q2 3 6 GND Q3 4 5 Q4 Pin (150 mil) SOIC Pin Descriptions Pin Number Pin Name External Components Pin Type Pin Description 1 ICLK Input Clock input. Internal pull-up resistor. 2 Q1 Output Clock output 1. 3 Q2 Output Clock output 2. 4 Q3 Output Clock output 3. 5 Q4 Output Clock output 4. 6 GND Power Connect to ground. 7 VDD Power Connect to 3.3 V or 5.0 V. OE Input Output Enable. Tri-states outputs when low. Internal pull-up resistor. A minimum number of external components are required for proper operation. A decoupling capacitor of 0.01 µf should be connected between VDD on pin 7 and GND on pin 6, as close to the device as possible. A 33Ω series terminating resistor may be used on each clock output if the trace is longer than 1 inch. IDT 1 TO 4 CLOCK BUFFER 2 ICS551 REV P 051310

Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS551. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Supply Voltage, VDD All Inputs and Outputs Ambient Operating Temperature, Commercial Ambient Operating Temperature, Industrial Storage Temperature Junction Temperature Soldering Temperature Rating 7 V -0.5 V to VDD+0.5 V 0 to +70 C -40 to +5 C -65 to +150 C 125 C 260 C Recommended Operation Conditions Parameter Min. Typ. Max. Units Ambient Operating Temperature -40 +5 C Power Supply Voltage (measured in respect to GND) +3.0 +5.5 V IDT 1 TO 4 CLOCK BUFFER 3 ICS551 REV P 051310

DC Electrical Characteristics VDD=3.3 V ±10%, Ambient temperature -40 to +5 C, unless stated otherwise Parameter Symbol Conditions Min. Typ. Max. Units Operating Voltage VDD 3.0 3.6 V Input High Voltage, ICLK V IH Note 1 VDD/2+0.7 3. V Input Low Voltage, ICLK V IL Note 1 VDD/2-0.7 V Input High Voltage, OE V IH 2 VDD V Input Low Voltage, OE V IL 0. V Output High Voltage V OH I OH = -25 ma 2.4 V Output Low Voltage V OL I OL = 25 ma 0.4 V Output High Voltage (CMOS V OH I OH = -12 ma VDD-0.4 V Level) Operating Supply Current IDD No load, 135 MHz 1 ma Nominal Output Impedance Z O 20 Ω Internal Pull-up Resistor R PU OE 500 kω Input Capacitance C IN OE pin 5 pf Short Circuit Current I OS ±50 ma VDD = 5 V ±10%, Ambient temperature -40 to +5 C, unless stated otherwise Parameter Symbol Conditions Min. Typ. Max. Units Operating Voltage VDD 4.5 5.5 V Input High Voltage, ICLK V IH Note 1 VDD/2+1 5.5 V Input Low Voltage, ICLK V IL Note 1 VDD/2-1 V Input High Voltage, OE V IH 2 VDD V Input Low Voltage, OE V IL 0. V Output High Voltage V OH I OH = -35 ma 2.4 V Output Low Voltage V OL I OL = 35 ma 0.4 V Output High Voltage (CMOS V OH I OH = -12 ma VDD-0.4 V Level) Operating Supply Current IDD No load, 135 MHz 35 ma Nominal Output Impedance Z O 20 Ω Internal Pull-up Resistor R PU OE 220 kω Input Capacitance C IN OE pin 5 pf Short Circuit Current I OS ±0 ma Notes: 1. Nominal switching threshold is VDD/2. IDT 1 TO 4 CLOCK BUFFER 4 ICS551 REV P 051310

AC Electrical Characteristics VDD = 3.3 V ±10%, Ambient Temperature -40 to +5 C, unless stated otherwise Parameter Symbol Conditions Min. Typ. Max. Units Input Frequency 0 160 MHz Output Frequency 15 pf load, Note 4 160 MHz Output Clock Rise Time t OR 0. to 2.0 V 1.0 ns Output Clock Fall Time t OF 2.0 to 0. V 1.0 ns Propagation Delay Note 1 135 MHz 2 4 ns Output to Output Skew Note 2 Rising edges at VDD/2 250 ps VDD = 5 V ±10%, Ambient Temperature -40 to +5 C, unless stated otherwise Parameter Symbol Conditions Min. Typ. Max. Units Input Frequency 0 135 MHz Output Frequency 15 pf load, Note 4 135 MHz Output Clock Rise Time t OR 0. to 2.0 V 1.0 ns Output Clock Fall Time t OF 2.0 to 0. V 1.0 ns Propagation Delay Note 1 135 MHz 1.5 3 6 ns Output to Output Skew Note 2 Rising edges at VDD/2 250 ps Notes: 1. With rail to rail input clock. 2. Between any 2 outputs with equal loading. 3. Duty cycle on outputs will match incoming clock duty cycle. Consult IDT for tight duty cycle clock generators. 4. With external series resistor of 33Ω positioned close to each output pin. Marking Diagram (ICS551MLF) Marking Diagram (ICS551MLN) 5 5 551MLF ###### YYWW 551MLN ###### YYWW 1 4 1 4 IDT 1 TO 4 CLOCK BUFFER 5 ICS551 REV P 051310

Marking Diagram (ICS551MILF) 5 551MILF ###### YYWW 1 4 Notes: 1. ###### is the lot number. 2. YYWW is the last two digits of the year and week that the part was assembled. 3. LF denotes Pb (lead) free package. 4. Bottom marking: (origin) Origin = country of origin if not USA. IDT 1 TO 4 CLOCK BUFFER 6 ICS551 REV P 051310

Package Outline and Package Dimensions (-pin SOIC, 150 Mil. Narrow Body) Package dimensions are kept current with JEDEC Publication No. 95 Millimeters Inches Symbol Min Max Min Max A 1.35 1.75.0532.06 A1 0.10 0.25.0040.009 INDEX AREA E H B 0.33 0.51.013.020 C 0.19 0.25.0075.009 D 4.0 5.00.190.196 E 3.0 4.00.1497.1574 1 2 e 1.27 BASIC 0.050 BASIC H 5.0 6.20.224.2440 D h 0.25 0.50.010.020 L 0.40 1.27.016.050 α 0 0 A h x 45 A1 - C - C e B SEATING PLANE.10 (.004) C L IDT 1 TO 4 CLOCK BUFFER 7 ICS551 REV P 051310

Ordering Information Part / Order Number Marking Shipping Packaging Package Temperature 551MLF 551MLF Tubes -pin SOIC 0 to +70 C 551MLFT 551MLF Tape and Reel -pin SOIC 0 to +70 C 551MLN 551MLN Tubes -pin SOIC 0 to +70 C 551MLNT 551MLN Tape and Reel -pin SOIC 0 to +70 C 551MILF 551MILF Tubes -pin SOIC -40 to +5 C 551MILFT 551MILF Tape and Reel -pin SOIC -40 to +5 C "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. LN denotes parts that are Pb free and annealed. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT 1 TO 4 CLOCK BUFFER ICS551 REV P 051310

Innovate with IDT and accelerate your future networks. Contact: www.idt.com For Sales 00-345-7015 40-24-200 Fax: 40-24-2775 For Tech Support www.idt.com/go/clockhelp Corporate Headquarters Integrated Device Technology, Inc. www.idt.com 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA