Novel DS s Low Loss Materials for High Speed PCB

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Delphia Hodges
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1 2013 inemi Workshop Novel DS s Low Loss Materials for High Speed PCB Jeongdon Kwon Doosan Corporation, Electro-Materials BG Yongin, S. KOREA Oct Product Development Team

2 Contents 1. Development of New Low Loss Material - Background of Development - Strategy of New Resin System 2. Characteristics of New Material - Products Line-up - Properties - Transmission loss - Reliability of New materials 3. Summary and Development Plan 2

Background of Development Satellite communication Moblie communication Mobile station Base transceiver station Switching system Processing equipment Home Network

3 Background of Development Satellite communication Moblie communication Mobile station Base transceiver station Switching system Processing equipment Home Network Router/ switch Communication networks server OA Network Router High speed transmission of large volume date High frequency device & module Signal Higher Frequency 3

Why Low Dielectric? Signal Velocity (Propagation delay) V = C/ (ε) 1/2 (ε : dielectric constant (Dk), C : speed of light) Transmission loss α = Conductor loss(αc) + Dielectric loss (αd) αd = 23.

4 Why Low Dielectric? Signal Velocity (Propagation delay) V = C/ (ε) 1/2 (ε : dielectric constant (Dk), C : speed of light) Transmission loss α = Conductor loss(αc) + Dielectric loss (αd) αd = 23.7 x (ε) 1/2 tan δ f/c (tan δ : dielectric loss (Df), f : frequency) For reduction of αd Low Dk & Df Materials b t w For reduction of αc Original lower profile or profile-free Conductor (Required High adhesion technology for low surface roughness foil due to Skin Effect) ε Standard Low Profile b : Dielectric layer thickness w : Conductor width t : Conductor thickness Need Material having lower Df and better adhesion with lower profile Cu foil. 4

5 Why Low Dielectric? [Simulation by Polar] Transmission loss = Conductor loss(αc) + Dielectric loss (αd) 10.1 mil 8.74 mil [αd = 23.7 x Dk 1/2 Df f/c ] 10.1 mil 8.74 mil 1.2 mil Dk Simulation (Polar SI9000e) D D D D Df Simulation (Polar SI9000e) S21 (db/line) Df GHz 10GHz Frequency (Hz) 20GHz GHz Dk GHz Frequency (Hz) 20GHz 5

6 Why Low Dielectric? Relation Dielectric medium with Velocity, dielectric loss and signal An electrical signal propagation down an given conducting line A dielectric interaction between electric field from the signal and the surrounding dielectric medium Dielectric loss and Velocity (propagation delay) Generation of Electromagnetic field Permeation into length of the surrounding interconnect material Required lower/non-polar or symmetric molecular structure materials Peel Strength Adhesion, Processability & Reliability How To Overcome the Limitation? ε = 1 + 2(Σφi / Σ Vi) 1 - (Σφi / Σ Vi) - ε : Dielectric constant - φ : Molar polarization - V : Molar volume - Source : Handbook of Low and High Dielectric constant Materials and their Applications 6

7 Concept of Material for High-Frequency PWBs Hybrid Materials Novel high performance material Low Profile Cu Non-polar oligomer or polymer High Tg & Low Dk and Low loss Hardener Normal or Low Dk/ Low Df Glass fabric Low Dk & Low Df Thermosetting resin Low Dk & Df Inorganic Filler Low Profile Cu 7

8 Contents 1. Development of New Low Dk/Df Materials - Background of Development - Strategy of New Resin System 2. Characteristics of New Materials - Products Line-up - Properties - Transmission loss - Reliability of New materials 3. Summary and Development Plan 8

9 Line Up of High Performance Laminates Scope by CISCO RTF) Product Features Tg ( ) Td* ( ) Comment Leadfree Leadfree High Loss DS-7409S (F) > 170 > 340 Mass Prod. Standard loss DS-7409D > 170 > 360 Mass Prod. Middle Loss (0.010~ 0.015) Low loss (0.005~ 0.010) DS-7409D (X) > 185 > 360 Mass Prod. DS-7409D (XN) > 185 > 360 Mass Prod. DS-7409D (V) > 170 > 380 Ultra Low loss ( 0.005) DS-7409D (VN) > 170 > 380 Under Evaluation Under Evaluation Halogen free Standard Loss DS-7402H > 170 > 380 Mass Prod. Middle Loss DS-7402D (X) > 170 > 380 Under Developing * All products are compatible for lead-free solder process 9

10 General Properties of New material Condition Unit New Material DS-7409D (V) DS-7409D (ZN) DS-7409D (X) Glass Type E SI(Low Dk) SI(Low Dk) E Peel Strength RTF(1 Oz) kgf/cm > 0.85 > HVLP(1 Oz) > 0.75 > z-cte, α1 TMA ppm/ Z-axis Expansion % Dk (R/C 50%) 1 GHz (IPC TM ) Df (R/C 50%) 1 GHz (IPC TM ) GHz (SPDR) Tg DSC Decomposition Temperature TGA T-288 With Cu, IPC Min. >120 >120 >60 >60 inflammability UL94 V-0 (Halogen) V-0 (Halogen) V-0 (Halogen) V-0 (Halogen) 10

Resin system and Frequency dependency Measurement Method SPDR : Split Post Dielectric Resonator Vector Network Analyzer 4.3 Dk 0.01 Df 4.2 4.1 4 3.9 BMP6 DV 0.

11 Resin system and Frequency dependency Measurement Method SPDR : Split Post Dielectric Resonator Vector Network Analyzer 4.3 Dk 0.01 Df BMP6 DV BM P6 DV DZNE DZNE DX DX Frequency, GHz Frequency, GHz 11

12 Dk & Df vs. Temperature Measurement Method Impedance 1 GHz Dk Df 4.20 Dk 09DV Df 09DV 4.00 Dk D(ZN) Df D(ZN) 3.80 Dk BM Df BM Temp., Temp., 12

13 Cu Peel strength by Cu Foil type - Test Method : IPC-TM , Condition B -Copper thickness : 1oz Copper foil P/S (kgf/cm) HTE (STD) 1.15~ D (V) RTF (1) 0.90~0.95 HVLP 0.88~0.90 RTF (1) 0.94~ D (X) RTF (2) 0.95~0.99 HVLP 0.90~

14 Resin system & Moisture absorption 1.0 mm declad Laminate, #2116 PCT (121 / 2 atm) 0.50% 0.40% DS-7409SF (High Tg) DS-7409DX (Low Loss) Water Absorption (wt%) 0.30% 0.20% 0.10% DS-7409DZN (Ulta Low Loss) DS-7409DV (Ulta Low loss) 0.00% -0.10% Time (hr) 14

Transmission Loss of New material Measurement Method Stripline TV using a network analyzer (Stripline S-parameter Sweep Test Method) Zo : 50Ω,, Trace thickness : 1 Oz Trace Length : 16 inch

15 Transmission Loss of New material Measurement Method Stripline TV using a network analyzer (Stripline S-parameter Sweep Test Method) Zo : 50Ω,, Trace thickness : 1 Oz Trace Length : 16 inch Extraction of Df : C comp. Software Version 1.0 at 10 GHz Dielectric loss tangent GHz Df a RTF Mode RTF (1) HVLP (1) HVLP (2) DX (E Glass) DV (E Glass) DV (SI Glass)

16 Transmission Loss by Resin system & Glass Type (Dielectric Loss) DX RTF (1) DV RTF (1) DV(SI Glass) RTF (1) S21(d db) Frequency(GHz) 16

17 Comparison of Glass fabric Composition E-glass (Normal) NE-glass NTB Low Dk/Df L-glass AGY SiO ~56 CaO Al2O B2O MgO Na2O, K2O (Supplier s Data) Issue - Higher Price Hollow fiber (CAF) Higher moisture absorption Line-Up 17

18 Transmission Loss by Cu Foil Maker or Type (Conductor Loss) Standard RTF HVLP 1 HVLP 2 Surface X-Section Rz ( μm, AFM)

19 Thermal Resistance of New Material - Reflow Simulation Reflow test 260, 10 cycle (As-ls) - PCB : 28 layers, 2 Oz Cu in center, 3.2 T, made by a sample PCB shop - PTH: Hole 0.25Φ, Pitch 1.0 mm - No abnormality is observed from the test sample. 19

Thermal Resistance of New Material _ Solder Float cycling @288 Soldering Test at 288, 6 cycle - PCB : 28 layers, 2 Oz Cu in

20 Thermal Resistance of New Material _ Solder Float Soldering Test at 288, 6 cycle - PCB : 28 layers, 2 Oz Cu in center, 3.2 T, made by a sample PCB shop - PTH: Hole 0.25Φ, Pitch 1.0 mm - No abnormality is observed from the test sample. 20

21 Summary Feature and Status Excellent loss : ~0.032 Good Thermal-mechanical Properties Excellent Thermal Reliability of High-layer PCB Good Processability SI Test - On Evaluation by a OEM Ongoing and Future works More severe Reliability Long Term Reliability test (CAF, ATC, etc) PWB Processability(ENIG, PSR) Development of a halogen-free material having lower dielectric properties 21

22 Thank you

Circuit Board Laminates as a part of High Frequency PCB. Aspocomp Piirilevytekniikkaa 2015 Oulu on 10.2.2015 Mika Sillgren

Circuit Board Laminates as a part of High Frequency PCB Aspocomp Piirilevytekniikkaa 2015 Oulu on 10.2.2015 Mika Sillgren Content Panasonic Electronic Materials Business Division brief High speed laminate