Aspocomp, PCBs for Demanding Applications

Size: px

Start display at page:

Download "Aspocomp, PCBs for Demanding Applications"

Rodger Hawkins
7 years ago
Views:

1 HDI PIIRILEVYT

2 Aspocomp, PCBs for Demanding Applications Automotive Electronics Industrial Electronics Mobile Devices Base Station Photos ABB, Aspocomp, Vacon and Wabco

3 PCBs for Base Stations and Other Telecom Infra Typical PCB features - wide range of PCBs, from 2L to 24L HDI - Impedance control - ENIG, Imm Ag, Imm Sn - High Frequency laminates Photos ABB, Aspocomp, Vacon and Wabco

4 PCBs for Automotive Electronics Typical PCB features - HDI, Multilayer - High Tg + Mid Tg FR4, ENIG - Aluminum back - Automotive quality procedures Example PCB, HDI 1+2b+1 Alu metalback Photos Wabco, Conti, Aspocomp

Aluminum back - Automotive quality procedures Example

FR4, RCCu - Very high density, 60/60-2+ 3+,4+ stacked laser

5 PCBs for Mobile Devices PCB construction is driven by component pitch Typical PCB features - HDI - ENIG, ENIG+OSP - Halogenfree FR4, RCCu - Very high density, 60/ ,4+ stacked laser consrtuction 0,4mm pitch component with 207 I/Os 3+2b+3 construction

represent 16% of the total production Overplated vias also known as: - IPC4761 Type VII -

6 Net Sales by Application & Product Type (2014) 11% 17% 46% 26% Telecom systems & applications Automotive electronics Industrial electronics Other electronics RF materials represent 16% of the total production Overplated vias also known as: - IPC4761 Type VII - Plug & Plate - Capped Via - Filled and Capped Via - POFV Printed Over Filled Via - VIPPO Via In Pad Plated Over

7 Examples of HDI PCB Construction stacked 1+4b+1 2+4b+2 stacked staggered 3+2b+3 stacked 2+4b+2 staggered

8 Design Rules for Thick HDI PCBs ( 1,4mm), Capability 2015 E D F G B C A T Ø Typical Advanced PWB thickness PCB final A 2,4 mm 5,5mm Inner layer core 18/18 thickness min T 63µm 50µm Min conductor width Copper thickness < 25 µm (non-plated I/L) B 75 µm 60 µm Copper thickness 25u - 50u B 90 µm 75 µm Min space Copper thickness < 25 µm (non-plated I/L) C 75 µm 60 µm Copper thickness 25u - 50u C 90 µm 75 µm Min hole diameter With board thickness 2,4mm Ø 250 µm 200 µm Min pad size Via hole, outer layer (Ø=0,25mm ) D 550 µm 450 µm (no break) Via hole, inner layer (Ø=0,25mm) E 550 µm 450 µm Buried holes (Ø=0,25mm) F 550 µm 450 µm Laser hole, surface pad G 250 µm 250 µm Laser hole, inner layer pad, dielectric <=70u H 220 µm 220 µm Laser hole, inner layer pad, dielectric <=100u H 250 µm 250 µm Ø Assumed min avg 20u in PTH and buried via (IPC Class2)

90 µm 75 µm Min hole diameter With board thickness 2,4mm Ø 250 µm 200 µm Min pad size Via hole, outer layer (Ø=0,25mm ) D 550 µm 450 µm (no break) Via hole, inner layer (Ø=0,25mm) E 550 µm 450 µm

9 Design Rules for Thick HDI PCBs ( 1,4mm), Capability 2015 Ø S P, Q M I K L J Typical Advanced Min distance Laser - buried, non-connected (Ø=0,25mm) I 500 µm 450 µm Laser - buried, connected (Ø=0,25mm) J 400 µm 350 µm Laser - laser, non-connected (SM between pads) K 400 µm 375 µm Laser - laser connected L 300 µm 250 µm PTH - PTH connected P Ø Ø PTH - PTH non connected Q Ø Ø PTH to Cu clearance * M 225 µm 190 µm Aspect Ratio (A/Ø) Thickness/nominal diameter of PTH max A/Ø Solder mask registration S +/-37 µm +/-25 µm Assumed min avg 20u in PTH and buried via (IPC Class2) * See details in the next slide

250 µm PTH - PTH connected P Ø + 500 Ø + 500 PTH - PTH non connected Q Ø + 550 Ø + 550 PTH to Cu clearance * M 225 µm 190 µm Aspect Ratio (A/Ø)

10 Design Rules for Thin HDI PCBs ( 1,3mm), Capability 2015 E D F G B C A T Ø Ø Typical Advanced PWB thickness PCB final min A 0,4mm 0,25mm Plated inner layer min T 100 µm 60 µm Min conductor width Copper thickness 20 µm B 60 µm 40 µm Copper thickness 20µm 35µm B 75 µm 60 µm Min space Copper thickness 20 µm C 60 µm 50 µm Copper thickness 20µm 35µm C 75 µm 60 µm Min pad diameter Via hole, outer layer ( Ø = 200µ) D 450 µm 400 µm Via hole, inner layer ( Ø = 200µ) E 450 µm 400 µm Buried holes ( Ø = 200µ) F 450 µm 400 µm Laser hole pad µm G 220 µm 180 µm Laser hole pad, dielectric µm G 250 µm 220 µm Typical capability Assumed min avg 20u in PTH and buried via (IPC Class2) Advanced: Assumed min 15u in PTH 10 12th of Jan 2015

Min pad diameter Via hole, outer layer ( Ø = 200µ) D 450 µm 400 µm Via hole, inner layer ( Ø = 200µ) E 450 µm 400 µm Buried holes ( Ø = 200µ) F 450 µm 400 µm Laser hole pad 40.

11 Design Rules for Thin HDI PCBs ( 1,3mm), Capability 2015 Ø S P, Q M I K Typical Advanced Min distance Laser - buried, non-connected I 425 µm 375 µm Laser - buried, connected J 375 µm 325 µm Laser - laser, non-connected K 350µm 300 µm Laser - laser connected L 250 µm 250 µm PTH - PTH connected (also buried - buried) P Ø Ø PTH - PTH non connected (also buried - buried) Q Ø Ø Hole wall to copper clearance (PTH to Cu) * M 200 µm 160 µm Solder mask registration S +/-37 µm +/-25 µm L J Typical capability Assumed min avg 20u in PTH and buried via (IPC Class2) Advanced: Assumed min 15u in PTH 11 12th of Jan 2015

buried) P Ø + 350 Ø + 300 PTH - PTH non connected (also buried - buried) Q Ø + 450 Ø + 400 Hole wall to copper clearance (PTH to Cu) * M 200 µm 160 µm Solder

12 Thin HDI PCBs Advanced Capability 2014 E D F G B C A T H PWB thickness PCB final min 0,3mm A Plated inner layer min 75u T Min conductor width Copper thickness 25 µm 50 µm B Copper thickness 25u 40u** 60 µm B Min space Copper thickness 25 µm 50 µm C Copper thickness 25u 40u ** 60 µm C Min pad diameter Via hole, outer layer (200u hole size) 400 µm D (no break) Via hole, inner layer (200u hole size) 450 µm E Buried holes (200u hole size) 400 µm F Laser hole, surface pad 220 µm G Laser hole, inner layer pad, dielectric <=70u 220 µm H Laser hole, inner layer pad, dielectric <=100u 250 µm H Assume min 15u in PTH (mobile PCB customer specific specs), assume max 1,3mm PCB thickness * Sequencial buildup PTH to copper add 50u ** Surface laser Cu viafill: add 15u Please note that advanced parameters should be used carefully and case by case on demand since they have significant yield impacts.

450 µm E Buried holes (200u hole size) 400 µm F Laser hole, surface pad 220 µm G Laser hole, inner layer pad, dielectric <=70u 220 µm H Laser hole, inner layer pad, dielectric <=100u 250 µm H Assume

13 PTH to Cu Clearance Requirement at Inner Layers Area of the annular ring is required for true drill position tolerance (regardless if there is annular ring or not) Clearance PTH to Cu PTH wall (by nominal diameter) Drill length L PTH to Cu Clearance PTH to Cu Risk of short circuit if too low PTH to Cu Required safe PTH to Cu parameter is depending on the length and the diameter of the associated drilling : L max Ø0,2 Ø0,3 Ø0,35 1,6µm 210µm 200µm 190µm 3,2mm N/A 225µm 200µm For sequential blind please add + 50µm

Clearance PTH to Cu Risk of short circuit if too low PTH to Cu Required safe PTH to Cu parameter is depending on the length and

14 Solder Masks And Printing Solder mask, min. clearance to pad 37um (25u) Solder mask, min dam/line shape 100u Solder mask, min dam/round 50u SM opening at the PTH via min nominal diameter Legend printing, min. clearance to pad 150u Legend printing, min. track width 150u Legend printing, min. font height 0,7 mm Peel-able solder mask, min resolution 400u

dam/round 50u SM opening at the PTH via min nominal diameter Legend printing, min.

15 HDI Layer Material Options (For laser drilling) MATERIAL TYPE MATERIAL NAME ESTIMATED FINAL THICKNESS T MANUFACTURER 1037 prepreg R µm Panasonic 106 prepreg (or 2 x 106pp) Several 50µm (100µm) Several T 1080 prepreg Several 60µm-70µm* Several 1035, 1078 prepregs R-5670 (Megtron 6) 40µm, 60µm Panasonic RO4450B prepreg RO4450B 100µm Rogers RCCu MRG-200 * 50µm, 75µm Mitsui * Different resin contents give different thickness value Most of the materials have halogen free options

Several 1035, 1078 prepregs R-5670 (Megtron 6) 40µm, 60µm Panasonic RO4450B prepreg RO4450B 100µm Rogers RCCu MRG-200 *

16 Surface Finish Options ENIG Atotech Aurotech CNN (mid P) OSP Entek Plus Cu- 106 A (X) HT Immersion tin Atotech Stannatech HASL SN100C ENIG /OSP (SIT) HASL SnPb Additional options available subcontracted Immersion silver McDermid Sterling Silver 2.0 Galvanic NiAu contact surfaces

ENIG /OSP (SIT) HASL SnPb Additional options available subcontracted

17 End of the Slides

Rogers 3003, 3006, 3010, 3035, 3203, 3206, 3210

Rogers 3003, 3006, 3010, 3035, 3203, 3206, 3210 Stocked Materials: RIGID STANDARD FR4 High Tg 170c Black FR4 Polyclad 370HR (Lead Free) HIGH RELIABILITY Polyimide (Arlon 85N, Isola P96) BT (G200) HIGH FREQUENCY: Park Nelco 4000-13, 4000-13si Getek Gore