Failure Analysis (FA) Introduction
|
|
- Stuart Walsh
- 7 years ago
- Views:
Transcription
1 Failure Analysis (FA) Introduction (III - Reliability ) Tung-Bao Lu 1 of 23
2 Reliability Stress Stress Reliability Geberal Condition Temperature Humidity Electrical Others Precondition Baking/L3/Reflowing V V - - Reflowing (SMT) JEDEC 240 o C/3X V - - Shock TCT -65 o C/+150 o c/15min V - - Shock TST -65 o C/+150 o c/15min V - - Shock PCT +121 o C/100%RH/2ATM V V - - HL-SLT +150oC V - - Time LT-SLT -65 o C V - - Time TH Storage 85 o C/85%RH V V - Time THB 85 o C/85%RH/Vcc V V V - HAST +130 o C/85%RH/Vcc V V V Accleeracted Tung-Bao Lu 2 of 23
3 Typical Preconditioning Defect Mode Moisture distribution Weak point Die surface Delaimintion Die crack Package crack Tung-Bao Lu 3 of 23
4 Preconditioning - Precondition L3 found 1 st open fail - FS/SS = 11/135 (8%) - LQFP 100L 18M SSDRAM - Open failed on some corner pins - Die-surface corner delamination - Modify die-attached epoxy - Modify die-pad structure 1 st bonding lifted by preconditioning stress (slot) (Scanning Electrical Microscope) Tung-Bao Lu 4 of 23
5 Preconditioning - Precondition L3 found 1 st open fail - FS/SS > 5% - TSOPII 44L DRAM - Open failed on random pins - Die-surface delamination Delamination layer (SAT C-SCAN) Surface Element Non-uniform (Wafer Process) Ball-neck broken by die surface delamination (C, N, O, Si) (1) (4) (C, N, O, Si) (C, N, O, Si) (2) (3) (C, O, Si) (Scanning Electrical Microscope) Tung-Bao Lu 5 of 23
6 Typical TCT/TST Defect Mode Stress Die surface delamination to cause EMC lifted, ball-neck broken TCT TST Weak point (expansion/shrinkage) Tung-Bao Lu 6 of 23
7 TCT - TCT 500C open fail - FS/SS=4/100 - SOJ 40L 4M DRAM - Open can be recovered and not stable while testing - SAT shows normal, no delamination Material changed - Change molding compound to provide Wedge bond broken but still connected (Scanning Electric Microscope) Tung-Bao Lu 7 of 23
8 TCT - TCT 1000C open fail - FS/SS=1/45 - QFP 100L - One pin open, 2 nd finger find delamination Process: - Waiting time from W/S->M/D control - Enhance W/B parameter Material - Change molding compound - Cleaning Lead-frame before W/B Wedge bond broken to lift (Scanning Electric Microscope) Tung-Bao Lu 8 of 23
9 TCT - TCT 1000C function fail - FS/SS=1/200 - TSOPII 54L 64M SDRAM Only corner special block failed -65 o C cold air +150 o C hot air (MOSAID Memory Tester) Failed block LOC taped damaged (Bonding process) Passivation damaged under LOC tape Improvement: Change to long-tape LOC tape to balance force Before improved After improved Modified (Long-type) (Optical Microscope, 500X) Tung-Bao Lu 9 of 23
10 TCT - TCT 1000C open fail - FS/SS=3/45 - minibga 8x10 48B To identify substrate opened by probing substrate plating line and solder ball -65 o C cold air +150 o C hot air Substrate (BT laminate) chip epoxy ball Open Supplier improve Substrate crack is found by DPA and SEM Poor quality substrate that can t been stressed after temperature cycling tests, crack is found and through Cu-line to cause opened. Crack is found by SEM after top-side DPA made Open Cu line crack Tung-Bao Lu 10 of 23
11 TCT - TCT 300C open fail - FS/SS=40/200 - LCD Driver IC, TCP package - Inner Lead Bonding Process (TAB) - Can pass 30C/130C - TCT condition: -65 o C/+150 o C/30min - Open located on wide side - Recovery after time aging - Inner lead dimension modify - Material/Structure limit Lead broken near to bump Tung-Bao Lu 11 of 23
12 TCT - TCT 1000C open fail - FS/SS=2/10 (2%) - 256M SDRAM SODIMM module - Solder ball connected - Condition: -20 o C/+90 o C/30min - Open located on random packages - Contact recovery (press package) Modify PCB solder ball opening Solder crack on package side Tung-Bao Lu 12 of 23
13 TST - Customer find after SMT process - TCP package - fixed pin open V1 Change tape design, and all pass Advanced RA After TST 200C, about 50% all open V2 Previous Design Revised Design -65 o C cold liq o C hot liq. Tung-Bao Lu 13 of 23
14 Typical Moisture (PCT, THB, HAST) Defect Mode Stress - Die surface delamination to cause EMC lifted, ball-neck broken - Al-pad corrosion Weak point - Metal migration Tung-Bao Lu 14 of 23
15 PCT - PCT 240H open fail - FS/SS=1/45 - PLCC 32L Flash - Open failed around corner special pins - Serious die surface delamination Change molding compound (Scanning Acoustic Tomograph) Ball lightly lifted around corner pins (Scanning Electrical Microscope) Tung-Bao Lu 15 of 23
16 PCT - PCT 216H open fail - FS/SS=1/45 - mbga 48B (Substrate) - Open failed - Die-surface delamination chip Substrate (BT laminate) epoxy ball - Change molding compound (Scanning Acoustic Tomograph) 1 st bonding lifted from device pad (Scanning Electrical Microscope) Tung-Bao Lu 16 of 23
17 PCT - PCT 96H open fail - FS/SS=3/45 - mbga 48B (Substrate) - Open failed around corner special pins - Substrate surface delamination chip Substrate (BT laminate) epoxy ball - Change molding compound - Change substrate solder resistance (Scanning Acoustic Tomograph) 2 nd Bonding finger lifted from substrate (Scanning Electrical Microscope) Tung-Bao Lu 17 of 23
18 PCT - PCT 240H leakage failed - FS/SS=1/45 - TSOPII 40L 4M DRAM Leakage failed on Pin 31 (LCAS) Normal Pin (Curve Tracer) - 3.2m Failed Pin:LCASB Gate oxide damaged (Wafer Process) For Normal Pin: Vcc=5.5V, VI=0~5.5V, Leakage Current 0 For Failed Pin: Vcc=5.5V, VI=0V, Leakage Current= -3.2mA Hot-spot is found around failed pin Hot-spot (Scanning Electrical Microscope) ( Liquid Crystal Microscope) Tung-Bao Lu 18 of 23
19 THB - THB 500H Open/Leakage failed - FS/SS=7/32 - SOJ 40L 4M DRAM - Open/leakage failed on random pins - Serious die surface delamination THB passed THB failed (Scanning Acoustic Tomograph) Reliability ovens over-stressed Ball lightly lifted around failed pins (Scanning Electrical Microscope) Tung-Bao Lu 19 of 23
20 Typical HT/LT-SLT Defect Mode IMC Layer Crack (Au-Ball Lift) Kirkendall Void Tung-Bao Lu 20 of 23
21 Un-predicting Reliability Ion Migration Copper Migration Temperature-Humidity-Voltage/Bias Solder Migration Evaluation: Tandem pattern + Dew Cycling Test Tung-Bao Lu 21 of 23
22 Un-predicting Reliability Tin Whisker EIA JESD22-A12, May, 2005 Measuring Whisker Growth on Tin and Tin Alloy This document is not qualification standard!!! Tung-Bao Lu 22 of 23
23 Reliability and Failure Mechanism Process Step Failure Mechanism Detect R. Test Implantation - Junction leakage due to crystal defects Degradation of BV HTOL, LTOL - Implantation effects (Isolation & Channel) Leakage or Short ESD, EOS - Hot carrier effect Oxidation - Silk bulk defect - thin oxide Short curcuit HTOL - Particle contamination Si surface Increase in Leakage ESD, EOS & on oxide layer - Dielectric breakdown Photolithography - Photoresist particle defect & pinholes Open curcuit HTOL, LTOL - Photoresist contamination Increase in Leakage THB - Masking problem Wire bonding - Ball missing & intermetallic Open curcuit TCT, TST, PCT - Compound, bonding problem Intermitant open THB - Pad contamination Leakage Resistance - Over bonding condition - Underlayer cracking - Loop & wire sagging problem Package - Corrosion due to bulk or lead-to-emc Open TCT, TST, PCT gap moisture pentetration Surface leakage THB - Poor material solderability (refer to: Samsung/quality assurance/reliability) Tung-Bao Lu 23 of 23
Failure Analysis (FA) Introduction
Failure Analysis (FA) Introduction (IC ) Tung-Bao Lu 1 of 29 Structure of conventional package gold wire leadframe chip EMC die-pad Failure Classification Physical Failure (Structure) - Popcorn - Delamination
More information1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.
.Introduction If the automobile had followed the same development cycle as the computer, a Rolls- Royce would today cost $00, get one million miles to the gallon and explode once a year Most of slides
More informationFlip Chip Package Qualification of RF-IC Packages
Flip Chip Package Qualification of RF-IC Packages Mumtaz Y. Bora Peregrine Semiconductor San Diego, Ca. 92121 mbora@psemi.com Abstract Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages
More informationReliability Stress Test Descriptions
1. Solder Reflow Preconditioning (PRECON): The preconditioning stress sequence is performed for the purpose of evaluating the capability of semiconductor devices to withstand the stresses imposed by a
More informationA Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages
A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages Bernd K Appelt Director WW Business Development April 24, 2012 Table of Content Definitions Wafer Level
More informationHow to Avoid Conductive Anodic Filaments (CAF)
How to Avoid Conductive Anodic Filaments (CAF) Ling Zou & Chris Hunt 22 January 20 1 Your Delegate Webinar Control Panel Open and close your panel Full screen view Raise hand for Q&A at the end Submit
More informationRJR Polymers Reliability Qualification Report RQFN55-24-A and RQFN44-12-A
Reliability Qualification Report RQFN55-24-A and RQFN44-12-A Package Qualification September 14, 2011 RJR Polymers Reliability Qualification Report RQFN55-24-A and RQFN44-12-A Table of Contents Purpose.3
More informationPreface xiii Introduction xv 1 Planning for surface mount design General electronic products 3 Dedicated service electronic products 3 High-reliability electronic products 4 Defining the environmental
More informationWire Bonding A Closer Look
ISTFA'91: The 17th International Symposium for Testing & Failure Analysis, Los Angeles, California, USA / 11-15 November 1991 Wire Bonding A Closer Look G. E. Servais and S.D. Brandenburg Delco Electronics
More informationGood Boards = Results
Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.
More informationDesign for Reliability & Quality Class From DfRSoft...
Design for Reliability & Quality Class From DfRSoft... Includes DfRSoft Reliability & Quality Software to Provide Tools for Success This course is available in person to companies, on-line videos, or live
More informationWhat is surface mount?
A way of attaching electronic components to a printed circuit board The solder joint forms the mechanical and electrical connection What is surface mount? Bonding of the solder joint is to the surface
More informationRecommended Soldering Techniques for ATC 500 Series Capacitors
Recommended Soldering Techniques for ATC 500 Series Capacitors ATC# 001-884 Rev. D; 10/05 1.0. SCOPE. The following procedures have been successful in soldering ATC500 series capacitors to both soft and
More informationMuAnalysis. Printed Circuit Board Reliability and Integrity Characterization Using MAJIC. M. Simard-Normandin MuAnalysis Inc. Ottawa, ON, Canada
Printed Circuit Board Reliability and Integrity Characterization Using MAJIC M. Simard-Normandin Inc. Ottawa, ON, Canada Abstract The recent need to develop lead-free electrical and electronic products
More informationSelective Soldering Defects and How to Prevent Them
Selective Soldering Defects and How to Prevent Them Gerjan Diepstraten Vitronics Soltec BV Introduction Two major issues affecting the soldering process today are the conversion to lead-free soldering
More informationIPC/JEDEC J-STD-020C. Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices
IPC/JEDEC J-STD-020C Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices Proposed Standard for Ballot January 2004 1 PURPOSE The purpose of this standard is to
More informationWinbond W2E512/W27E257 EEPROM
Construction Analysis Winbond W2E512/W27E257 EEPROM Report Number: SCA 9703-533 Global Semiconductor Industry the Serving Since 1964 15022 N. 75th Street Scottsdale, AZ 85260-2476 Phone: 602-998-9780 Fax:
More informationInvestigation of Components Attachment onto Low Temperature Flex Circuit
Investigation of Components Attachment onto Low Temperature Flex Circuit July 2013 Q. Chu, N. Ghalib, H. Ly Agenda Introduction to MIRA Initiative MIRA Manufacturing Platforms Areas of Development Multiphase
More informationQ&A. Contract Manufacturing Q&A. Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials
Q&A Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials 1. Do Nelco laminates have any discoloration effects or staining issues after multiple high temperature exposures?
More informationPCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices
Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices Introduction There is an industry-wide trend towards using the smallest package possible for a given pin count. This is driven primarily
More informationSelf Qualification Results
(ATO) Divisional Philips Semiconductors Philips Internal Report No.: RNR- 8 3-03/RdH/RdH- 2 0 3 6 QTS Report Database No.: 030692 Self Qualification Results NiPdAu lead- free solution of SO14/16/20 Products
More informationSM712 Series 600W Asymmetrical TVS Diode Array
SM712 Series 6W Asymmetrical TVS Diode Array RoHS Pb GREEN Description The SM712 TVS Diode Array is designed to protect RS-485 applications with asymmetrical working voltages (-7V to from damage due to
More informationAdapters - Overview. Quick-Turn Solutions for IC Supply Issues
Adapters - Overview BGA to BGA Adapter BGA to PGA BGA to QFP BGA to BGA QFP to BGA SMT to DIP SMT to SMT PGA to PGA BGA to QFP Adapter with VR using FlexFrame Interconnect TSOP Adapter Packaged Die to
More information5W HI-POWER LED SPECIFICATION
5W HI-POWER LED SPECIFICATION HPG8b-495xWHCx Drawn by Checked by Approved by RoHS Conformity DATE:2013/4/9 REV:A HUEY JANN High Power 5W LED is made of GaInN chips with precise package technique which
More informationWhite Paper. Recommendations for Installing Flash LEDs on Flex Circuits. By Shereen Lim. Abstract. What is a Flex Circuit?
Recommendations for Installing Flash LEDs on Circuits By Shereen Lim White Paper Abstract For the mobile market some PCB assemblies have been converted to flex circuit assemblies, in part because flex
More information, Yong-Min Kwon 1 ) , Ho-Young Son 1 ) , Jeong-Tak Moon 2 ) Byung-Wook Jeong 2 ) , Kyung-In Kang 2 )
Effect of Sb Addition in Sn-Ag-Cu Solder Balls on the Drop Test Reliability of BGA Packages with Electroless Nickel Immersion Gold (ENIG) Surface Finish Yong-Sung Park 1 ), Yong-Min Kwon 1 ), Ho-Young
More informationIntroduction to the Plastic Ball Grid Array (PBGA)
Introduction to the Plastic Ball Grid Array (PBGA) Q1, 2008 Terry Burnette Dec. 15, 2005 Presentation Outline PBGA Introduction and Package Description PC Board Design for PBGA PBGA Assembly PBGA Solder
More informationSURFACE FINISHING FOR PRINTED CIRCUIT BOARDS
SURFACE FINISHING FOR PRINTED CIRCUIT BOARDS In a world of ever-increasing electronic component complexity and pin count requirements for component packaging, focus is once again on the age-old question
More informationPOWER GOLD FOR 175 C Tj-max
POWER GOLD FOR 175 C Tj-max James J. Wang and Bob Baird Motorola Inc. Tempe, Arizona USA James.J.Wang@motorola.com ABSTRACT Automotive is requesting engine control IC to operate in 145 C ambient. Power
More informationFaszination Licht. Entwicklungstrends im LED Packaging. Dr. Rafael Jordan Business Development Team. Dr. Rafael Jordan, Business Development Team
Faszination Licht Entwicklungstrends im LED Packaging Dr. Rafael Jordan Business Development Team Agenda Introduction Hermetic Packaging Large Panel Packaging Failure Analysis Agenda Introduction Hermetic
More informationReliability Handbook
Contents Integrity and Reliability Package Integrity Tests Device Reliability Tests Appendix 1 Calculations Appendix 2 Example of Failure Rate Calculation INTEGRITY AND RELIABILITY ZETEX Semiconductors
More informationSolder Reflow Guide for Surface Mount Devices
June 2015 Introduction Technical Note TN1076 This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is
More informationEffect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints
Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints Y. Zheng, C. Hillman, P. McCluskey CALCE Electronic Products and Systems Center A. James Clark School of Engineering
More informationMolded. By July. A chip scale. and Omega. Guidelines. layer on the silicon chip. of mold. aluminum or. Bottom view. Rev. 1.
Application Note PAC-006 By J. Lu, Y. Ding, S. Liu, J. Gong, C. Yue July 2012 Molded Chip Scale Package Assembly Guidelines Introduction to Molded Chip Scale Package A chip scale package (CSP) has direct
More informationThermal Management for Low Cost Consumer Products
Thermal Management for Low Cost Consumer Products TI Fellow Manager: Advanced Package Modeling and Characterization Texas Instruments rvin@ti.com Outline The challenges Stacked die, Package-on-Package,
More informationPb-Free Plating for Electronic Components
Pb-Free Plating for Electronic Components by Morimasa Tanimoto *, Hitoshi Tanaka *, Satoshi Suzuki * and Akira Matsuda * The authors have developed Pb-free tin alloy plating materials. Preliminary ABSTRACT
More informationCypress Semiconductor Technology Qualification Report
Cypress Semiconductor Technology Qualification Report QT# 012415 VERSION 1.2 November, 2002 TSMC 0.15um Technology, Fab TSMC CY7C1371B/CY7C1373B CY7C1381B/CY7C1383B CY7C1381BV25/CY7C1383BV25 CY7C1371BV25/CY7C1373BV25
More informationWhite Paper. Modification of Existing NEBS Requirements for Pb-Free Electronics. By Craig Hillman, PhD
White Paper Modification of Existing NEBS Requirements for Pb-Free Electronics By Craig Hillman, PhD Executive Summary Thorough review of the relevant NEBS requirements identified several areas of concerns
More informationLEAD FREE HALOGENFREE. Würth Elektronik PCB Design Conference 2007. Lothar Weitzel 2007 Seite 1
LEAD FREE HALOGENFREE Würth Elektronik PCB Design Conference 2007 Lothar Weitzel 2007 Seite 1 Content Solder surfaces/overview Lead free soldering process requirements/material parameters Different base
More informationCHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS
CHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS 5.1 INTRODUCTION The manufacturing plant considered for analysis, manufactures Printed Circuit Boards (PCB), also called Printed Wiring Boards (PWB), using
More informationScanning Acoustic Microscopy Training
Scanning Acoustic Microscopy Training This presentation and images are copyrighted by Sonix, Inc. They may not be copied, reproduced, modified, published, uploaded, posted, transmitted, or distributed
More informationWinbond W971GG6JB-25 1 Gbit DDR2 SDRAM 65 nm CMOS DRAM Process
Winbond W971GG6JB-25 1 Gbit DDR2 SDRAM 65 nm CMOS DRAM Process Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationAuditing Contract Manufacturing Processes
Auditing Contract Manufacturing Processes Greg Caswell and Cheryl Tulkoff Introduction DfR has investigated multiple situations where an OEM is experiencing quality issues. In some cases, the problem occurs
More informationMeeting the Thermal Management Needs of Evolving Electronics Applications
Meeting the Thermal Management Needs of Evolving Electronics Applications Dr. Glenn Mitchell / August 2015 Agenda Introduction Thermal Industry Trends TIM Challenges, Needs & Criteria TIM Industry Solutions
More informationCustomer Service Note Lead Frame Package User Guidelines
Customer Service Note Lead Frame Package User Guidelines CSN30: Lead Frame Package User Guidelines Introduction Introduction When size constraints allow, the larger-pitched lead-frame-based package design
More informationSoldering Techniques N I A G A R A C O L L E G E T E C H N O L O G Y D E P T.
Soldering Techniques N I A G A R A C O L L E G E T E C H N O L O G Y D E P T. Soldering 101 Soldering is the process of joining two metals together to form an electrically and mechanically secure bond
More informationBall Grid Array (BGA) Technology
Chapter E: BGA Ball Grid Array (BGA) Technology The information presented in this chapter has been collected from a number of sources describing BGA activities, both nationally at IVF and reported elsewhere
More information1W High Power Purple LED Technical Data Sheet. Part No.: LL-HP60MUVA
1W High Power Purple LED Technical Data Sheet Part No.: LL-HP60MUVA Spec No.: HP60M Rev No.: V.2 Date: Aug./18/2009 Page: 1 OF 8 Features: Luckylight High power LED type. Lead frame type package (Heat
More informationDual Integration - Verschmelzung von Wafer und Panel Level Technologien
ERÖFFNUNG DES INNOVATIONSZENTRUMS ADAPTSYS Dual Integration - Verschmelzung von Wafer und Panel Level Technologien Dr. Michael Töpper BDT Introduction Introduction Why do we need such large machines to
More informationCopyright 2008 IEEE. Reprinted from ECTC2008 Proceedings.
Copyright 2008 IEEE. Reprinted from ECTC2008 Proceedings. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Amkor
More informationSEMI Equipment and Materials Outlook. Daniel Tracy Senior Director Industry Research & Statistics Group at SEMI in San Jose, California
SEMI Equipment and Materials Outlook Daniel Tracy Senior Director Industry Research & Statistics Group at SEMI in San Jose, California Wednesday March 18, 2015 Outline o Fab Investments and Equipment Spending
More informationPCB Quality Inspection. Student Manual
PCB Quality Inspection Student Manual Unit 2: Inspection Overview Section 2.1: Purpose of Inspection What Is The Purpose of Inspection? There are 2 reasons why Inspection is performed: o To verify the
More informationPrinted Circuits. Danilo Manstretta. microlab.unipv.it/ danilo.manstretta@unipv.it. AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica
Lezioni di Tecnologie e Materiali per l Elettronica Printed Circuits Danilo Manstretta microlab.unipv.it/ danilo.manstretta@unipv.it Printed Circuits Printed Circuits Materials Technological steps Production
More informationElectronic component assembly
Electronic component assembly itrogen is commonly used to provide a suitable atmosphere for complex fine pitch assembly in electronic printed circuit board, hard disk and semiconductor manufacture where
More informationMiniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M
Miniaturizing Flexible Circuits for use in Medical Electronics Nate Kreutter 3M Drivers for Medical Miniaturization Market Drivers for Increased use of Medical Electronics Aging Population Early Detection
More informationOverview of Risk Assessment, Mitigation, and Management Research for Pb-free Electronics
Overview of Risk Assessment, Mitigation, and Management Research for Pb-free Electronics Formed 1987 Electronic Products and Systems Center College Park, MD 20742 (301) 405-5323 http://www.calce.umd.edu
More informationRoHS-Compliant Through-Hole VI Chip Soldering Recommendations
APPLICATION NOTE AN:017 RoHS-Compliant Through-Hole VI Chip Soldering Recommendations Ankur Patel Associate Product Line Engineer Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 4 Pin/Lead
More informationQuality Assurance Program for Purchased Parts
Quality Assurance Program for Purchased Parts V Teruhisa Kitani V Motoko Sazanami V Masaru Seita (Manuscript received July 10, 2007) We continuously promote quality assurance activities to provide our
More informationSLLP-5630-150-G PRODUCT DATASHEET. RoHS Compliant
PRODUCT DATASHEET SLLP-5630-150-G Table of Contents Features... 1 Applications 1 Characteristics.. 1 Typical Electro optical Characteristics Curves... 3 Mechanical Dimensions... 4 Carrier Tape Dimensions.....
More informationJOINT INDUSTRY STANDARD
JOINT INDUSTRY STANDARD IPC/JEDEC J-STD-020A APRIL 1999 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices NOTICE JEDEC standards and publications contain material
More informationAnalysis of BGA Solder Joint Reliability for Selected Solder Alloy and Surface Finish Configurations
Analysis of BGA Solder Joint Reliability for Selected Solder Alloy and Surface Finish Configurations Hugh Roberts / Atotech USA Inc Sven Lamprecht and Christian Sebald / Atotech Deutschland GmbH Mark Bachman,
More informationJOHANSON DIELECTRICS INC. 15191 Bledsoe Street, Sylmar, Ca. 91342 Phone (818) 364-9800 Fax (818) 364-6100
Arc Season and Board Design Observations John Maxwell, Director of Product Development, Johanson Dielectrics Inc. Enrique Lemus, Quality Engineer, Johanson Dielectrics Inc. This years arcing season is
More informationChip-on-board Technology
Hybrid Technology The trend in electronics is to continue to integrate more and more functions and numbers of components into a single, smaller assembly. Hybrid circuit technology is a key method of increasing
More informationFlex Circuit Design and Manufacture.
Flex Circuit Design and Manufacture. Hawarden Industrial Park, Manor Lane, Deeside, Flintshire, CH5 3QZ Tel 01244 520510 Fax 01244 520721 Sales@merlincircuit.co.uk www.merlincircuit.co.uk Flex Circuit
More informationGaN IC Die Handling, Assembly and Testing Techniques
GaN IC Die Handling, Assembly and Testing Techniques Page 1 of 9 1. Scope This document describes the storage and handling requirements for GaN IC chips. It also describes recommended assembly and testing
More informationHow to Build a Printed Circuit Board. Advanced Circuits Inc 2004
How to Build a Printed Circuit Board 1 This presentation is a work in progress. As methods and processes change it will be updated accordingly. It is intended only as an introduction to the production
More informationPRINTED CIRCUIT BOARD SURFACE FINISHES - ADVANTAGES AND DISADVANTAGES
PRINTED CIRCUIT BOARD SURFACE FINISHES - ADVANTAGES AND DISADVANTAGES By Al Wright, PCB Field Applications Engineer Epec Engineered Technologies Anyone involved within the printed circuit board (PCB) industry
More informationEvaluation of Soft Soldering on Aluminium Nitride (AlN) ESTEC Contract No. 19220/05/NL/PA. CTB Hybrids WG ESTEC-22nd May 2007
Evaluation of Soft Soldering on Aluminium Nitride (AlN) ESTEC Contract No. 19220/05/NL/PA CTB Hybrids WG ESTEC-22nd May 2007 Evaluation of Soft Soldering on AlN Schedule Project presentation Feasibility
More informationMADP-000504-10720T. Non Magnetic MELF PIN Diode
MADP-54-172T Features High Power Handling Low Loss / Low Distortion Leadless Low Inductance MELF Package Non-Magnetic Surface Mountable RoHS Compliant MSL 1 Package Style 172 Dot Denotes Cathode Description
More informationSpecializing in Open Cavity Packages & Complete IC Assembly Services ISO 9001:2008 Certified and ITAR Registered
TowerJazz Global Symposium Specializing in Open Cavity Packages & Complete IC Assembly Services and TowerJazz Global Symposium Quik-Pak a division of Delphon Industries 2011 Gold Sponsor and TowerJazz
More informationDry Film Photoresist & Material Solutions for 3D/TSV
Dry Film Photoresist & Material Solutions for 3D/TSV Agenda Digital Consumer Market Trends Components and Devices 3D Integration Approaches Examples of TSV Applications Image Sensor and Memory Via Last
More informationDOMINANT. Opto Technologies Innovating Illumination. InGaN White S-Spice : SSW-SLD DATA SHEET: SpiceLED TM. Features: Applications:
DATA SHEET: SpiceLED TM SpiceLED TM Like spice, its diminutive size is a stark contrast to its standout performance in terms of brightness, durability and reliability. Despite being the smallest in size
More informationh e l p s y o u C O N T R O L
contamination analysis for compound semiconductors ANALYTICAL SERVICES B u r i e d d e f e c t s, E v a n s A n a l y t i c a l g r o u p h e l p s y o u C O N T R O L C O N T A M I N A T I O N Contamination
More informationLast Time Buy. Deadline for receipt of LAST TIME BUY orders: April 30, 2011
Last Time Buy This part is in production but has been determined to be LAST TIME BUY. This classification indicates that the product is obsolete and notice has been given. Sale of this device is currently
More informationEdition 2012-032 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon Technologies AG All Rights Reserved.
Recommendations for Printed Circuit Board Assembly of Infineon Laminate Packages Additional Information DS1 2012-03 Edition 2012-032 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon
More informationQuad Flat Package (QFP)
Freescale Semiconductor Application Note AN4388 Rev. 2.0, 2/2014 Quad Flat Package (QFP) 1 Introduction This document provides guidelines for handling and assembly of Freescale QFP packages during Printed
More informationVertical Probe Alternative for Cantilever Pad Probing
Robert Doherty Analog Devices, Inc. Robert Rogers Wentworth Laboratories, Inc. Vertical Probe Alternative for Cantilever Pad Probing June 8-11, 8 2008 San Diego, CA USA Introduction This presentation summarizes
More informationIntegrated Circuit Packaging and Thermal Design
Lezioni di Tecnologie e Materiali per l Elettronica Integrated Circuit Packaging and Thermal Design Danilo Manstretta microlab.unipv.it danilo.manstretta@unipv.it Introduction to IC Technologies Packaging
More informationAN10706. Handling bare die. Document information
Rev. 02 10 June 2011 Application note Document information Info Keywords Abstract Content bare die, handling, ESD, clean room, mechanical damages, delivery forms, transport conditions, store conditions
More informationHOT BAR REFLOW SOLDERING FUNDAMENTALS. A high quality Selective Soldering Technology
HOT BAR REFLOW SOLDERING FUNDAMENTALS A high quality Selective Soldering Technology Content 1. Hot Bar Reflow Soldering Introduction 2. Application Range 3. Process Descriptions > Flex to PCB > Wire to
More informationAN900 APPLICATION NOTE
AN900 APPLICATION NOTE INTRODUCTION TO SEMICONDUCTOR TECHNOLOGY INTRODUCTION by Microcontroller Division Applications An integrated circuit is a small but sophisticated device implementing several electronic
More informationMULTI-FLEX CIRCUITS AUSTRALIA. International Suppliers of PRINTED CIRCUIT BOARDS
MULTI-FLEX CIRCUITS AUSTRALIA International Suppliers of PRINTED CIRCUIT BOARDS AUSTRALIA Multi-Flex Circuits Australia Leading suppliers of HIGH QUALITY PRINTED CIRCUIT BOARDS for every purpose OUR COMMITMENT
More informationChapter 14. Printed Circuit Board
Chapter 14 Printed Circuit Board A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, or traces, etched from copper
More informationGraduate Student Presentations
Graduate Student Presentations Dang, Huong Chip packaging March 27 Call, Nathan Thin film transistors/ liquid crystal displays April 4 Feldman, Ari Optical computing April 11 Guerassio, Ian Self-assembly
More informationQPL. Advanced Lead Frame Services From Design to Delivery
QPL Advanced Lead Frame Services From Design to Delivery CORPORATE OVERVIEW Founded in 1982, QPL Limited is a global supplier of lead frames for the semiconductor industry. With headquarters in Hong Kong
More informationAdvancements in High Frequency, High Resolution Acoustic Micro Imaging for Thin Silicon Applications
Advancements in High Frequency, High Resolution Acoustic Micro Imaging for Thin Silicon Applications Janet E. Semmens Sonoscan, Inc. 2149 E. Pratt Boulevard Elk Grove Village, IL 60007 USA Phone: (847)
More informationTechnical Note. NOR Flash Cycling Endurance and Data Retention. Introduction. TN-12-30: NOR Flash Cycling Endurance and Data Retention.
Technical Note TN-12-30: NOR Flash Cycling Endurance and Data Retention Introduction NOR Flash Cycling Endurance and Data Retention Introduction NOR Flash memory is subject to physical degradation that
More informationPCN Structure FY 13/14
PCN Structure FY 13/14 A PCN FY 13/14 PCN text FY 13/14 QMS FY 12/14 Front End Materials A0101 Process Wafers CZ 150 mm CQT A0102 Process Wafers CZ 200 mm CQT A0103 Process Wafers FZ 150 mm CQT A0104 Process
More information8-bit Atmel Microcontrollers. Application Note. Atmel AVR211: Wafer Level Chip Scale Packages
Atmel AVR211: Wafer Level Chip Scale Packages Features Allows integration using the smallest possible form factor Packaged devices are practically the same size as the die Small footprint and package height
More informationAutomotive Electronics Council Component Technical Committee
AEC - Q101-005 - REV- ATTACHMENT 5 AEC - Q101-005 Rev- CAPACITIVE DISCHARGE MODEL (CDM) ELECTROSTATIC DISCHARGE (ESD) TEST METHOD - 005 DISCRETE COMPONENT CHARGED DEVICE MODEL (CDM) ELECTROSTATIC DISCHARGE
More informationPOWER FORUM, BOLOGNA 20-09-2012
POWER FORUM, BOLOGNA 20-09-2012 Convertitori DC/DC ad alta densità di potenza e bassa impedenza termica. Massimo GAVIOLI. Senior Field Application Engineer. Intersil SIMPLY SMARTER Challenges when Designing
More informationSurface Mount Technology cooling for high volumes applications by: Cesare Capriz Aavid Thermalloy via XXV Aprile 32 Cadriano (BO) ITALY
Surface Mount Technology cooling for high volumes applications by: Cesare Capriz Aavid Thermalloy via XXV Aprile 32 Cadriano (BO) ITALY Abstract: The automotive technology is fast moving in integrating
More informationChoosing a Low-Cost Alternative to SAC Alloys for PCB Assembly
Choosing a Low-Cost Alternative to SAC Alloys for PCB Assembly Our thanks to Indium Corporation for allowing us to reprint the following article. By Brook Sandy and Ronald C. Lasky, PhD, PE., Indium Corporation
More informationPRDUCT SPECIFICATON TFT LCD MODULE Model : ELT240320ATP
PRDUCT SPECIFICATON TFT LCD MODULE Model : ELT240320ATP 2.8 inch TFT LCD with Touch Screen This specification is subject to change without notice. 2 Contents Page 1. LCM Specification.....3 2. Functional
More informationINTERNATIONAL ATOMIC ENERGY AGENCY INSTRUMENTATION UNIT SMD (SURFACE MOUNTED DEVICES) REPAIR S. WIERZBINSKI FEBRUARY 1999
(SURFACE MOUNTED DEVICES) REPAIR S. WIERZBINSKI FEBRUARY 1999 (SURFACE MOUNTED DEVICES) REPAIR 1 TABLE OF CONTENTS PAGE 1. INTRODUCTION 3 2. ADVANTAGES 4 3. LIMITATIONS 4 4. DIALECT 5 5. SIZES AND DIMENSIONS
More informationHarvatek Surface Mount LED Data Sheet. HT-F195 Series
Harvatek Surface Mount LED Data Sheet Official Product Product: Data Sheet No. Tentative Product **************** Jul. 15, 2005 Version of 1.4 Page 1/20 DISCLAIMER...3 PRODUCT SPECIFICATIONS...4 ATTENTION:
More informationHand Soldering Basics
Technical Note Hand Soldering Basics Table of Contents Abstract...1 Process Control...1 Tip Selection...2 Temperature Selection...3 Flux Selection...4 Soldering Techniques...5 Soldering Iron Tip Plating
More informationCompliant Terminal Technology Summary Test Report
Engineering Report ER04100 October 5th, 2004 Revision A Copyright Autosplice Inc., September 2004 Table of Contents Summary Overview 3 Compliant Terminal Specifications 3 Test Plan 4 Test Conditions 4
More informationAPPLICATION NOTES FOR SMD LEDs
Storage conditions SMD devices are usually moisture/reflow sensitive. Moisture from atmospheric humidity enters permeable packaging materials by diffusion. Assembly processed used to solder SMD packages
More information