productronica 2015: All events in detail SMT Speakers Corner

Transcription

1 SMT Speakers Corner Innovations in SMT - Intelligent 3D inspection from A to X Hagen Berger Viscom AG, Hannover Session Innovative production technologies for the electronics industry Innovative space and pressure optimised progressive cavity pumps for dosing Luigi de Luca Beinlich Pumpen GmbH, Gevelsberg Automation and quality assurance excellence in the micro coax processing industry Michael Jost Schleuniger GmbH, Radevormwald Developments in high speed, high quality, precision laser stripping of enamel wire for coil winding manufacturing applications Richard Hawkins Spectrum Technologies PLC, Bridgend, Wales Cutting-Edge Quality Control in Aluminum Wire Processing Introduction of Komax Wire competencies processing aluminum wires Matthias Schulthess Komax AG, Dierikon Business Outlook for Global Electronic & EMS/ODM Industries With emphasis on Europe 13:00-13:30 h 13:00-16:30 h 13:30-14:00 h 14:00-14:30 h 14:30-15:00 h 15:00-15:30 h 15:30-16:30 h 11/13/ :00 am Page 1

2 SMT Speakers Corner Walt Custer, President Custer Consulting Group, The Sea Ranch, CA Get-together 18:00-20:00 h productronica innovation award 18:00-20:00 h Trade magazine productronic High Quality and Reliable Production of High-Power LED Boards Mauro Ceresa Cree GmbH 10:00-10:30 h Luger Research Session LED and OLED Production Luger Research Production Considerations of Phosphor Coated White LEDs Dr. Franz-Peter Wenzl 10:00-13:00 h 10:30-11:00 h Joanneum Research Luger Research Production Process-Steps and Equipment for High-Power LEDs Dr. Thomas Uhrmann 11:00-11:30 h EV Group 11/13/ :00 am Page 2

3 SMT Speakers Corner Luger Research Large Area Printing and Production Technologies for OLEDs Prof. Dr. W.A. (Pim) Groen 11:30-12:00 h Holst Center, TU Delft Luger Research Low-void soldering processes for highly reliable electronic assemblies in automotive electronics Roundtable moderation: Marisa Consée, Hüthig GmbH Participant: Claus Zabel, Asscon Systemtechnik GmbH Viktoria Rawinski, Ersa GmbH Sebastian Clärding, Pink GmbH Thermosysteme Dr. Hans Bell, Rehm Thermal Systems GmbH Andreas Reinhardt, Seho Systems GmbH Thorsten Vegelan, EKRA Automatisierungssysteme GmbH Jens Katsche, DEK Harald Grumm, Christian Koenen GmbH Dr. Nils Kopp, ELSOLD GmbH & Co. KG Olaf Römer, ATEcare Service GmbH & Co.KG From Wirebonding to Laserbonding: Connection Technologies for High Currents in Automotive Electronics and Batteries Dr. Josef Sedlmair F & K Delvotec Bondtechnik GmbH, Ottobrunn Highlight Day Automotive electronics manufacturing SMT for Automotive Electronics Void reduction in reflow soldering processes by sweep stimulation of PCB substrate Viktoria Rawinski 12:00-13:00 h 13:00-13:30 h 13:00-15:00 h 13:30-14:00 h 11/13/ :00 am Page 3

4 SMT Speakers Corner Ersa GmbH, Wertheim Effiziente in-line Inspektion von THT Baugruppen Jens Kokott GÖPEL electronic GmbH, Jena New thermosetting resins as encapsulants for high temperature resistant, robust and cost efficient power electronics and e-drive applications Dr. Werner Hollstein HUNTSMAN Advanced Materials GmbH MES in der Smart Electronic Factory - Wie finden reale Produktion, Industrie 4.0 und MES zusammen? Martin Heinz itac Software AG, Montabaur Industry the EMS Factory of the Future Panel Discussion moderation: Trevor Galbraith, Global SMT & Packaging Participant: Michael Ford, Mentor Graphics Hubert Egger, ASM Assembly Systems Dr. Friedrich W. Nolting, Aegis Ramesh Narayanan, Panasonic Factory Automation Victor Chang, WKK China Automotive evolution needs programming revolution New clusters + infotainment systems lead to breakthrough programming methods Anthony Ambrose 14:00-14:30 h 14:30-15:00 h 15:00-15:30 h 15:30-16:30 h 16:30-17:00 h Data I/O GmbH, Gräfelfing 11/13/ :00 am Page 4

5 SMT Speakers Corner Inspecting bow and warpage of wafer surfaces Dr. Klaus Veit ISRA VISION AG, Darmstadt Session Semiconductor metrology solutions and production equipment High-speed optical inspection of wafers with electrooptical components Dr. Uwe Hoffmann Philips GmbH Innovation Services, Aachen Inspecting internal micro cracks in wafers Dr. Eric Rüland ISRA VISION AG, Darmstadt Lasers as an enabling tool for electronics manufacturing Michael Lang TRUMPF Laser- und Systemtechnik GmbH, Ditzingen 3D-inspection of components using white light interferometry Dr. Klaus Veit ISRA VISION AG, Darmstadt Session Innovative metrology and inspection solutions 10:00-10:30 h 10:00-13:00 h 10:30-11:00 h 11:00-11:30 h 11:30-12:00 h 13:00-13:30 h 13:00-15:00 h 11/13/ :00 am Page 5

6 SMT Speakers Corner Large area thickness measurement for ultra-thin layers Robert Thieme GT&E Prüfabdeckung gefällig? Schnelles 3D-Röntgen (AXI) und AOI in Kombination Andreas Türk GÖPEL electronic GmbH, Jena AOI in multiline integration - Industry 4.0 best practice Volker Pape Viscom AG, Hannover Obsoleszenz-Management: automatisierte Rückgewinnung von CAD-Daten Digitizer 2.0 Software zur Reparatur und Instandhaltung obsoleter Baugruppen Erik Horn Digitaltest GmbH, Stutensee Business Outlook for Global Electronic & EMS/ODM Industries With emphasis on Europe Walt Custer, President Custer Consulting Group, The Sea Ranch, CA An Outlook on performs based diffusion soldering technology: Microstructure, thermal and mechanical properties Dr.-Ing. Haneen Daoud 13:30-14:00 h 14:00-14:30 h 14:30-15:00 h 15:00-15:30 h 15:30-16:30 h 16:30-17:00 h PFARR Stanztechnik GmbH, Buttlar 11/13/ :00 am Page 6

7 SMT Speakers Corner ESD/EOS- Electronic components in danger Wolfgang Schurig Weller Tools GmbH, Besigheim Student Day SchuhEder Consulting GmbH semica IPC Hand Soldering Competition Award ceremony IPC? Association Connecting Electronics Industries 10:00-10:30 h 11:15-13:00 h 14:00-15:00 h 11/13/ :00 am Page 7

8 PCB & EMS Speakers Corner The Transparent Factory - Achieving Total Factory Information Visibility Dr.-Ing. Friedrich W. Nolting Diplan GmbH / Aegis Industrial Software Corporation Application of printable heatsinks designed to improve the heatsink on PCBs Hartmut Giesen Lackwerke Peters GmbH & Co. KG Coating Innovations for Electronics, Kempen Different base material for flexible printed circuits Dr. Graham Farmer GTS Flexible Materials Ltd., Ebbw Vale, Gwent Innovative Lösungen bei der mechanischen Bearbeitung der Leiterplatte Armin Gutbrod HPTec GmbH, Ravensburg Parylenebeschichtung - Dauerhafte Versiegelung elektronischer Baugruppen mit extremen Anforderungen Rudolf Heicks Heicks Industrieelektronik GmbH, Geseke Facing incredible times where the only constant is change Robin Taylor 13:00-13:30 h 13:30-14:00 h 14:00-14:30 h 14:30-15:00 h 15:30-16:00 h 16:00-16:30 h Atotech Deutschland GmbH, Berlin 11/13/ :00 am Page 8

9 PCB & EMS Speakers Corner Component Cleanliness - Bauteilsauberkeit Participant: Dr. Marc Nikolussi, Robert Bosch GmbH Harald Hundt, Vacuumschmelze GmbH & Co. KG Highlight Day Electronic Manufacturing Services (EMS) ZVEI - Fachverband Electronic Components and Systems, Frankfurt WEKA FACHMEDIEN GmbH, Haar Repair & Rework Thomas Lauer Airbus Defence and Space Produktentwicklung ist Teamwork - Entwicklungsdienstleistungen vom EMS-Partner moderation: Michael Velmeden, cms electronics gmbh Participant: Ulrich Niklas, Zollner Elektronik AG Helmut Bechtold, PROFECTUS GmbH Electronic Solutions Dr. Peter Schmitt, CCS Group Gustl Keller, Eltroplan GmbH WEKA EMS-Roundtable: "Industrie 4.0 meets EMS" Participant: Johann Weber, Chairman, Zollner Elektronik AG Thomas Kaiser, Group CEO, CCS Group Michael Velmeden, CEO, cms electronics gmbh Gerd Ohl, CEO, Limtronik GmbH / Smart Electronic Factory Rüdiger Stahl, CEO, TQ Group Stephan Baur, CEO, BMK professional electronics BestEMS Readers Award 2015 Markt&Technik elektroniknet.de 10:00-11:00 h 10:00-17:00 h 11:00-12:30 h 13:30-15:00 h 15:00-16:00 h 16:00-17:00 h 11/13/ :00 am Page 9

10 PCB & EMS Speakers Corner Marktsession: Märkte, Trends und Ausblick moderation: Dieter G. Weiss, Ingenieurbüro Weiss Participant: Michael Gasch, Data4PCB Dirk Schönherr, LUST Hybrid-Technik GmbH Jörg Jungbauer, TQ-Systems GmbH Design Chain Participant: Markus Biener, Zollner Elektronik AG Arnold Wiemers, ILFA, Leiterplatten Akademie Carmina Läntsch, LaserJob GmbH Innovation based on proven practice - Base material for demanding challenges Dr. Anna Graf Isola GmbH, Düren Nuvogo - The new way of imaging Uwe Altmann Orbotech Deutschland GmbH, Stuttgart Digital PCB production using industrial inkjet printing Dr. Roel De Mondt Agfa-Gevaert N.V., Mortsel Electronics Industry Today: How smart are we? 3.0 or 4.0 or 5.0? Alexander M. Schmoldt 10:00-11:00 h 12:00-13:00 h 13:30-14:00 h 14:30-15:00 h 15:30-16:00 h 10:00-10:10 h RFID Value Creators 11/13/ :00 am Page 10

11 PCB & EMS Speakers Corner PCB The PCB in the Industry 4.0 creates value also after the PCB assembly line 10:00-13:00 h RFID on PCB - The smart way to Electronics Industry :15-10:35 h Alexander M. Schmoldt Murata Manufacturing Co., Ltd. How to embed RFID into a PCB? - PCB Manufacturer Gernot Seeger Beta LAYOUT GmbH How to embed RFID into a PCB? - PCB Manufacturer Thomas Kunz Schmoll Maschinen GmbH, Rödermark RFID Infrastructure - Solutions for a Smart Electronics Factory Olaf Wilmsmeyer HARTING Electric GmbH & Co. KG PCB 4.0 & More: Towards an Industry 4.0 Life Cycle Claus Heller Nokia Solutions and Networks RFID & PCB 4.0: The smart link between EMS and OEM WAGO Kontakttechnik GmbH & Co. KG 10:40-11:00 h 11:05-11:20 h 11:25-11:45 h 11:50-12:10 h 12:15-13:35 h 11/13/ :00 am Page 11

12 PCB & EMS Speakers Corner What does the Industry expect from Industry 4.0 & RFID? Alois Mahr Zollner Elektronik AG Business Outlook for Global Electronic & EMS/ODM Industries With emphasis on Europe Walt Custer, President 12:40-13:00 h 13:00-14:00 h Custer Consulting Group, The Sea Ranch, CA 11/13/ :00 am Page 12

13 Innovation Forum CEO Roundtable Cyber Security - Challenges for the Manufacturing Industry moderation: Kilian Reichert, TV- and Eventmoderator Participant: Prof. Dr. Claudia Eckert, Director, Fraunhofer AISEC Günter Schindler, President, ASM Assembly Systems GmbH & Co. KG Willy van Puymbroeck, Head of Unit (Components), DG Connect - European Commission Lars Reger, CTO/ Vice President, NXP Semiconductors Germany GmbH Dr.-Ing. Lutz Jänicke, Chief Technology Officer, Innominate Security Technologies AG Smart Assistance: Augmented Reality as a digital Assistant Kerim Ispir RE'FLEKT GmbH Augmented Reality in der Praxis Rainer Krauss Ersa GmbH, Wertheim Session: Special Show Augmented Reality revolutionizes machine operation Enhance ease of use of fume extraction technology by means of Augmented Reality Alexander Jakschik ULT AG, Löbau Very real virtual - The production machine becomes digital Dr. Andreas Reinhardt 11:00-12:00 h 12:30-13:00 h 13:00-13:30 h 13:00-16:00 h 13:30-14:00 h 14:00-14:30 h SEHO Systems GmbH, Kreuzwertheim 11/13/ :00 am Page 13

14 Innovation Forum Manufacturing Dashboards - flexible production control for individual user groups Jochen Kinauer AIS Automation Dresden GmbH Die Vernetzung von Planungstafeln zur Steuerung der Produktion WEIGANG.NEO lebt agiles Shopfloor-Management - Die Produktionsorganisation der Zukunft! Prof. Dr. Oliver Kramer WEIGANG-Vertriebs-GmbH, Ebern Custom automation solutions in wire processing from Komax Introduction of Komax' competencies, capabilities and the value added it generates for customers Günther Silberbauer Komax AG, Dierikon 10th Annual Global Technology Awards Global SMT & Packaging Introduction to Printed Electronics Dr. Klaus Hecker OE-A Organic and Printed Electronics Association, Frankfurt Session Printed Electronics I: Future Technology for Daily Life OE-A Organic and Printed Electronics Association, Frankfurt Advanced R2R Manufacturing of Printed, Organic, Flexible Electronics Dr. Sorin Stan 14:30-15:00 h 15:00-15:30 h 15:30-16:00 h 18:00-19:00 h 10:00-10:15 h 10:00-13:00 h 10:15-10:30 h 11/13/ :00 am Page 14

15 Innovation Forum VDL Enabling Technology & Business Development Printed Electronics and Packaging Prof. Dr. Ulrich Moosheimer Munich University of Applied Sciences Innovative Touch & Gesture solutions based on transparent conductive films Dr. Wolfgang Clemens PolyIC GmbH & Co. KG High Performance Organic Semiconductor Materials for use in Flexible and Printed Electronics Dr. David Sparrowe Merck KGaA Organic solar films - a novel and truly urban-fit source of energy Thomas Bickl Heliatek GmbH Continuous production of large area electroluminescence Moritz Graf zu Eulenburg InovisCoat GmbH High efficient and flexible 3D energy storage devices enabled by a 3D Ink Dispenser Dr. Maziar Ahmadi 10:30-10:45 h 10:45-11:00 h 11:00-11:15 h 11:15-11:30 h 11:30-11:45 h 11:45-12:00 h Leitat technological center 11/13/ :00 am Page 15

16 Innovation Forum Using Printed Electronics to enable Large-Area Organic Robust Imager for X-Ray Sensing (LORIX) Dr. Octavio Trovarelli, Director of Process Engineering Plastic Logic GmbH Introduction to Printed Electronics Dr.-Ing. Constanze Ranfeld OE-A Organic and Printed Electronics Association, Frankfurt Session Printed Electronics II: Technologies & Applications OE-A Organic and Printed Electronics Association, Frankfurt PEDOT:PSS - an intrinsically conductive polymer Dr. Detlef Gaiser Heraeus Deutschland GmbH & Co. KG Heraeus Electronics, Hanau Customised Solutions for Rapid Photonic Processing Prof. Uwe Kroenert Heraeus Noblelight Ltd. Improved requirements for web guiding systems used in electronics printing machines Thomas Grimm Ehrhardt & Leimer GmbH Adhesive Coating for touch panel display by high prescision slot die Nakao Rikita 12:00-12:15 h 13:00-13:15 h 13:00-16:30 h 13:15-13:30 h 13:30-13:45 h 13:45-14:00 h 14:00-14:15 h 11/13/ :00 am Page 16

17 Innovation Forum MMC Ryotec Corp. (Mitsubishi Materials) NextFactory - a one stop shop solution for customised 3D micro-mechatronics systems Matthias Burgard Fraunhofer-Institut für Produktionstechnik und Automatisierung IPA, Stuttgart R2R printing and hybrid integration combined with overmoulding flexible electronics device manufacturing Sami Ihme VTT Technical Research centre of Finland ltd. Boost your productivity: platform strategy and modularisation in automation Torsten Schulz FESTO AG & Co. KG, Esslingen Business Outlook for Global Electronics Industry With emphasis on Europe Walt Custer, President Custer Consulting Group, The Sea Ranch, CA The German engineering industry as a comprehensive user of industry electronics - market perspective Dr. Eric Maiser VDMA Productronic Highlight Day Manufacturing industrial electronics I Customer view & robots 14:15-14:30 h 14:30-14:45 h 15:00-15:30 h 15:30-16:30 h 10:00-10:30 h 10:00-13:00 h VDMA Productronic 11/13/ :00 am Page 17

18 Innovation Forum EPP Europe Lasers and machine tools need reliable electronics - an example for industry electronics demands in the machinery industry Thomas Brauchle TRUMPF Laser- und Systemtechnik GmbH, Ditzingen Collaborative Robotics - key for scalable electronic production volume Carsten Busch ABB Automation GmbH / Robotics Division Automating through-hole placement - "colleage robot" assumes repetitive placement tasks Rainer Krauss Ersa GmbH, Wertheim Industrie-Elektronik - Anforderungen, Lösungen und innovative Produktionstechnik Roundtable moderation: Dr. Eric Maiser, VDMA Productronic Participant: Jacques Olaf Kruse Brandao, NXP Semiconductors Germany GmbH Michael Pawellek, Eltroplan GmbH Jörg Friedrich, Leesys - Leipzig Electronic Systems GmbH Rainer Krauss, ERSA GmbH Carsten Busch, ABB Automation GmbH Thomas Brauchle, Trumpf Laser- und Systemtechnik GmbH Hardware security as key enabler for Cyber security in Industry can we learn from Smart Metering? Jacques Olaf Kruse Brandao 10:30-11:00 h 11:00-11:30 h 11:30-12:00 h 12:00-13:00 h 13:00-13:30 h NXP Semiconductors 11/13/ :00 am Page 18

19 Innovation Forum Highlight Day Manufacturing industrial electronics II Industry 4.0 VDMA Electronics, Micro and Nano Technologies, Frankfurt EPP Europe Towards the resilient factory - insights from semiconductor production for "Industrie 4.0" Dr. Martin Schellenberger Fraunhofer IISB Assembly and test automation in an MES environment of the wiring harness industry Martin Stier Schleuniger GmbH, Radevormwald The new evolution for flexible assembly in electronics production Andreas Gryglewski 13:00-15:00 h 13:30-14:00 h 14:00-14:30 h 14:30-15:00 h Bosch Rexroth Going for Industry Next Generation Micro-CPS for Wireless Automation ensure low Latency, Safety und high Robustness 10:00-10:30 h Harald Pötter Fraunhofer IZM Session Future Markets - Micro-Nano and 3D Printing Integrierte Reinigung in Mikrotechnik: CO2-Schneestrahl schafft Innovation und Kostenreduzierung Hans-Jörg Wössner 10:00-13:00 h 10:30-11:00 h 11/13/ :00 am Page 19

20 Innovation Forum acp - advanced clean production GmbH Micro-Laser-Sintering as manufacturing tool for individualisation, function integration and miniaturisation trends Matthias Winderlich 3D MicroPront GmbH Additive Manufacturing: Fascinating manufacturing technologies becoming industrial reality Dr. Christoph Kiener 11:00-11:30 h 11:30-12:00 h Siemens AG 11/13/ :00 am Page 20

21 IT2Industry Industrial internet of things - die Transformation von Produkten zu Services und neuen Geschäftsmodellen Bodo Körber, Managing Director Accenture Mehr Effizienz und Qualität in der Produktion mit MES und Industrie 4.0 Prof. Dr. Jürgen Kletti, CEO MPDV Mikrolab GmbH Trusted Data Port - der sichere Hafen für Ihre Produktionsdaten Tina Marx, Leader Sales Manufacturing arvato Systems GmbH Die nächste Welle kommt - Schlüsselstrategien für die effektive Bekämpfung von Cyberrisiken Sebastian Michels, Partnermanagement RadarServices Smart IT-Security GmbH Produktion im Wandel: digital, effizent und flexibel MSc Georg Kürmayr, Business Consultant Jürgen Weiss, Sales Representative 11:30-12:00 h 12:00-12:30 h 12:30-13:00 h 13:00-13:30 h 13:30-14:00 h Arelion GmbH 11/13/ :00 am Page 21

22 IT2Industry Customer Event Processing in der Cloud - vom Sensor zum automatisierten Geschäftsprozess Ing. Martin Schweitzer, CEO PROCON DATA Datenverarbeitung Gesellschaft m.b.h. Risiken im Bereich der Software-Entwicklung Dipl.-Ing. Johannes Bergsmann, Owner Software Quality Lab GmbH Nimble Storage Adaptive Flash - Schluss mit Kompromissen Technology Track Pierre Flammer, System Engineer Nimble Storage Unified Monitoring für Sicherheit in IT und Produktion Technology Track Sebastian Krüger, Partner Account Manager DACH Paessler AG Herausforderungen für Unternehmen durch das neue IT-Sicherheitsgesetz Dr. Johannes Franck, Lawyer SCHÜRMANN WOLSCHENDORF DREYER Rechtsanwälte Sichere Fernanbindung von Anlagen - machen Sie Ihre Produktion fit für die Zukunft Technology Track 14:00-14:30 h 14:30-15:00 h 15:00-15:20 h 15:20-15:40 h 10:30-11:00 h 11:00-11:30 h 11/13/ :00 am Page 22

23 IT2Industry Dr. Werner Eberle, Senior Technical Consultant INSYS MICROELECTRONICS GmbH Industrie 4.0 oder The Industrial Big Change Technology Track Prof. Dr. Dr. h.c. mult. August-Wilhelm Scheer, Owner and CEO Scheer GmbH Mittelstand 4.0 Dpl. Kfm. Helmut Schnierle, Head M2M Sales / Member of the Board M2M Allaince Telefónica Germany GmbH & Co. OHG Industrie 4.0 im Spannungsfeld von Konvergenz als "Zukunftsmotor" der digitalen Wirtschaft Renatus Zillis, Leader of the Board DVTM e.v. Willkommen zur neuen Art des Arbeitens - Bedarf, Umsetzung und Ausblick Volkmar Rudat, Vice President Customer Engagement Unify GmbH & Co. KG Industrie 4.0 und ihre Folgen Dr. -Ing. Rainer Stetter, CEO Dipl.-Kffr. Sandra Fritsch 11:30-12:00 h 12:00-12:30 h 13:00-13:30 h 13:30-14:00 h 14:00-14:30 h 11/13/ :00 am Page 23

24 IT2Industry ITQ GmbH Industrie 4.0, Cloud-basierte MES in der Praxis und die Produktion der Zukunft Technology Track Dipl.-Inform. Andreas Zerfas, Director Product Management ITAC Software AG Smart Services und cloudbasierte Lösungen für die Industrie Technology Track Ulrich Graf, Solution and Marketing Management Huawei Technologies Steigerung der Wettbewerbsfähigkeit mit Industrie 4.0 ITK Innovationen Dr. Jijun Luo, VP Solution Management and Marketing Huawei Technologies Anwendungsszenarien und Referenzarchitektur für Dienste in der Industrie 4.0 Technology Track Dr.-Ing. Mike Heidrich, Geschäftsfeldleiter Industrial Communication Fraunhofer-Institut für Eingebettete Systeme und Kommunikationstechnik ESK Sichere vernetzte Fertigungen - Verfügbarkeit erhöhen, Kosten reduzieren, IP schützen Technology Track Johanna Zimmermann 14:30-15:00 h 15:00-15:20 h 15:20-15:40 h 15:40-16:00 h 11:00-11:20 h Infineon Technologies AG 11/13/ :00 am Page 24

25 IT2Industry Internet of Things als nächste Evolutionsstufe der mobilen Entwicklung Achim Himmelreich, Vicepresident BVDW e.v. Hamburger Hafen ready for Industrie 4.0 Markus Willner Sascha Westermann T-Systems International GmbH & Hamburg Port Authority AöR Hamburg Port Authority AöR HTML5 Apps für den industriellen Einsatz am Beispiel Instandhaltung Technology Track Mag. Werner Kroiss, IT Manager B&IT Business & IT Consulting GmbH Cost Saving Dashboard for Manufactures with plants around the globe Technology Track Ing. Michael Bruckberger, CEO IMB Beratung für Industrieautomation GmbH Real Collective Intelligence - INTREST AGV Technology Track DI (FH), M.A. Franz Humer, CEO 11:30-12:00 h 11:30-12:00 h 12:30-13:00 h 13:00-13:30 h 13:30-14:00 h INTREST Services GmbH 11/13/ :00 am Page 25

26 IT2Industry Die Weißwurst in der Industrie 4.0 Technology Track Dr. Dipl.-Ing. René Fachberger, CEO sensideon GmbH door2solution software gmbh - Find the right parts! Technology Track Ing. Robert Siegel, CEO door2solution software gmbh Industrie 4.0: Von der Vision in die Praxis Technology Track Dr. Verena Majuntke, Senior Solution Architect Bosch Software Innovations GmbH D-Check - ein Orientierungsinstrument für die digitale Transformation Christian Hasselbring, Partner Berend Neumann, Partner HasselbringNeumann Unternehmensberatung Lösungen und Skalierbarkeit von IT-Bedarfen für den Mittelstand, um den Anforderungen der industriellen Revolution gerecht zu werden Simon Klingenmaier, CIO IT and Personal Services 14:00-14:30 h 14:30-15:00 h 15:00-15:20 h 15:20-15:40 h 15:40-16:00 h barcatta GmbH 11/13/ :00 am Page 26

27 IT2Industry "Diskussionsrunde: ITandENERGIE - Digital, Effizient, Sicher " Participant: Werner Reuss, Internet of Things Commercial Lead, Microsoft Deutschland GmbH Nicolas Deutsch, Finance & Regulation, PricewaterhouseCoopers AG 16:00-17:00 h moderation: Rolf Lambertz, CEO, VALORA Consulting Participant: Dr. Georg Geyer, CEO, Information Factory Deutschland GmbH Robert Reinermann, CEO, VdS Schadenverhütung GmbH Michael Schrader-Bölsche, CEO Member, IS4IT GmbH Peter Eilers, CEO, Bilfinger Efficiency GmbH Dr. Franz Georg Strauß, Board Member, Bundeslicht - Verband gewerbliche und öffentliche Beleuchtung e.v. Praxisnahe Umsetzung von 4.0 Prinzipien im Mittelstand Horst Maywald, Business Unit Manager Work Stations ELABO GmbH - ein Unternehmen der euromicron Gruppe Vision Zentrum Digitalisierung.Bayern Dr. Holger Wittges, Leiter Taskforce ZD.B Zentrum Digitalisierung.Bayern Cyber-Physikalische Produktionssysteme (CPPS): Potentiale und Ansätze Technology Track Felix Mayer Technische Universität München TUM Interoperability as key for Digitalization from Sensor to IT Enterprise Technology Track 10:00-10:30 h 10:30-11:00 h 11:00-11:30 h 11:30-12:00 h 11/13/ :00 am Page 27

28 IT2Industry Stefan Hoppe, President OPC Europe OPC Europe Digitalisierung - Chancen und Risiken für Innovationsarbeit und gestalterische Prozesse Dr. Axel Klopprogge, Managing Partner Strategy for People HTML5 vs. Native Mobile Apps: Fight Is Over? Technology Track Ilya Kurilin PANTHEON PRO GmbH HTML5 vs. Native Mobile Apps: Fight Is Over? Technology Track Ilya Kurilin, Managing Director PANTHEON PRO GmbH Geschäftsmodelle im Internet der Dinge Tim Gutsche, Student 12:00-12:30 h 12:30-13:00 h 12:30-13:00 h 13:00-13:30 h 11/13/ :00 am Page 28

29 Hands-on Sessions Enhancing profit with highly exact inventory records for electronic components optical control GmbH & Co. KG, Weißenohe Current challenges in rework and repair of SMD components Finetech GmbH & Co.KG, Berlin Inner layer prototype production with LDI and wet processing Bungard-Elektronik GmbH & Co. KG, Windeck Enhancing profit with highly exact inventory records for electronic components optical control GmbH & Co. KG, Weißenohe Inner layer prototype production with LDI and wet processing Bungard-Elektronik GmbH & Co. KG, Windeck Enhancing profit with highly exact inventory records for electronic components optical control GmbH & Co. KG, Weißenohe Current challenges in rework and repair of SMD components Finetech GmbH & Co.KG, Berlin Enhancing profit with highly exact inventory records for electronic components optical control GmbH & Co. KG, Weißenohe Inner layer prototype production with LDI and wet processing Bungard-Elektronik GmbH & Co. KG, Windeck Current challenges in rework and repair of SMD components Finetech GmbH & Co.KG, Berlin 10:00-10:15 h Hall A2 / A :00-11:15 h Hall A4 / A :00-11:15 h Hall B1 / B :00-13:15 h Hall A2 / A :00-15:15 h Hall B1 / B :00-15:15 h Hall A2 / A :00-16:15 h Hall A4 / A :00-10:15 h Hall A2 / A :00-11:15 h Hall B1 / B :00-11:15 h Hall A4 / A /13/ :00 am Page 29

30 Hands-on Sessions Enhancing profit with highly exact inventory records for electronic components optical control GmbH & Co. KG, Weißenohe Enhancing profit with highly exact inventory records for electronic components optical control GmbH & Co. KG, Weißenohe Inner layer prototype production with LDI and wet processing Bungard-Elektronik GmbH & Co. KG, Windeck Current challenges in rework and repair of SMD components Finetech GmbH & Co.KG, Berlin Enhancing profit with highly exact inventory records for electronic components optical control GmbH & Co. KG, Weißenohe Inner layer prototype production with LDI and wet processing Bungard-Elektronik GmbH & Co. KG, Windeck Current challenges in rework and repair of SMD components Finetech GmbH & Co.KG, Berlin Enhancing profit with highly exact inventory records for electronic components optical control GmbH & Co. KG, Weißenohe Inner layer prototype production with LDI and wet processing Bungard-Elektronik GmbH & Co. KG, Windeck Enhancing profit with highly exact inventory records for electronic components optical control GmbH & Co. KG, Weißenohe 13:00-13:15 h Hall A2 / A :00-15:15 h Hall A2 / A :00-15:15 h Hall B1 / B :00-16:15 h Hall A4 / A :00-10:15 h Hall A2 / A :00-11:15 h Hall B1 / B :00-11:15 h Hall A4 / A :00-13:15 h Hall A2 / A :00-15:15 h Hall B1 / B :00-15:15 h Hall A2 / A /13/ :00 am Page 30

31 Hands-on Sessions Current challenges in rework and repair of SMD components Finetech GmbH & Co.KG, Berlin Enhancing profit with highly exact inventory records for electronic components optical control GmbH & Co. KG, Weißenohe Current challenges in rework and repair of SMD components Finetech GmbH & Co.KG, Berlin Inner layer prototype production with LDI and wet processing Bungard-Elektronik GmbH & Co. KG, Windeck Enhancing profit with highly exact inventory records for electronic components optical control GmbH & Co. KG, Weißenohe Enhancing profit with highly exact inventory records for electronic components optical control GmbH & Co. KG, Weißenohe Inner layer prototype production with LDI and wet processing Bungard-Elektronik GmbH & Co. KG, Windeck 16:00-16:15 h Hall A4 / A :00-10:15 h Hall A2 / A :00-11:15 h Hall A4 / A :00-11:15 h Hall B1 / B :00-13:15 h Hall A2 / A :00-15:15 h Hall A2 / A :00-15:15 h Hall B1 / B /13/ :00 am Page 31

32 Awards 10th Annual Global Technology Awards Global SMT & Packaging productronica innovation award Trade magazine productronic BestEMS Readers Award 2015 Markt&Technik elektroniknet.de IPC Hand Soldering Competition IPC? Association Connecting Electronics Industries 18:00-19:00 h Innovation Forum Hall B3 / B :00-20:00 h SMT Speakers Corner Hall A1 / A :00-17:00 h PCB & EMS Marketplace Hall B1 / B :00-15:00 h SMT Speakers Corner Hall A1 / A /13/ :00 am Page 32

33 Special Show NPL & SMART Group Solder Paste & Solder Joint Automatic Inspection Experience Smart Group National Physical Laboratory (NPL) Hall A4 / A4.506 Elektromobilität verbindet Hall B3 / B Years productronica A journey to the past ELECTRONICS.PRODUCTION.AUGMENTED. VDMA Electronics, Micro and Nano Technologies, Frankfurt IPC Hand Soldering Competition IPC? Association Connecting Electronics Industries Cleanroom Event mycleanroom.de ELECTRONICS.PRODUCTION.AUGMENTED. VDMA Electronics, Micro and Nano Technologies, Frankfurt 40 Years productronica A journey to the past NPL & SMART Group Solder Paste & Solder Joint Automatic Inspection Experience National Physical Laboratory (NPL) Smart Group Cleanroom Event Halle A1 / A1.501 Hall B3 / B3.133 Hall A2 / A2.405 Hall B3 / B3.151 Hall B3 / B3.133 Halle A1 / A1.501 Hall A4 / A4.506 Hall B3 / B3.151 mycleanroom.de Elektromobilität verbindet Hall B3 / B /13/ :00 am Page 33

34 Special Show IPC Hand Soldering Competition IPC? Association Connecting Electronics Industries 40 Years productronica A journey to the past Cleanroom Event mycleanroom.de ELECTRONICS.PRODUCTION.AUGMENTED. VDMA Electronics, Micro and Nano Technologies, Frankfurt NPL & SMART Group Solder Paste & Solder Joint Automatic Inspection Experience Smart Group National Physical Laboratory (NPL) IPC Hand Soldering Competition Hall A2 / A2.405 Halle A1 / A1.501 Hall B3 / B3.151 Hall B3 / B3.133 Hall A4 / A4.506 Hall A2 / A2.405 IPC? Association Connecting Electronics Industries Elektromobilität verbindet Hall B3 / B3.521 IPC Hand Soldering Competition 09:00-14:00 h Hall A2 / A2.405 IPC? Association Connecting Electronics Industries Elektromobilität verbindet 09:00-16:00 h Hall B3 / B3.521 ELECTRONICS.PRODUCTION.AUGMENTED. 09:00-16:00 h Hall B3 / B3.133 VDMA Electronics, Micro and Nano Technologies, Frankfurt Cleanroom Event mycleanroom.de 09:00-16:00 h Hall B3 / B /13/ :00 am Page 34

35 Special Show NPL & SMART Group Solder Paste & Solder Joint Automatic Inspection Experience Smart Group National Physical Laboratory (NPL) 40 Years productronica A journey to the past 09:00-16:00 h Hall A4 / A :00-16:00 h Halle A1 / A /13/ :00 am Page 35

36 Press Press event Keysight Technologies Keysight Technologies Deutschland GmbH Main Press Conference of productronica 2015 Messe Muenchen CEO Roundtable Cyber Security - Challenges for the Manufacturing Industry moderation: Kilian Reichert, TV- and Eventmoderator Participant: Prof. Dr. Claudia Eckert, Director, Fraunhofer AISEC Günter Schindler, President, ASM Assembly Systems GmbH & Co. KG Willy van Puymbroeck, Head of Unit (Components), DG Connect - European Commission Lars Reger, CTO/ Vice President, NXP Semiconductors Germany GmbH Dr.-Ing. Lutz Jänicke, Chief Technology Officer, Innominate Security Technologies AG The latest advances in Precision Jetting of Fluids Nordson EFD, Dunstable Pressekonferenz des ZVEI Fachverbands Electronic Components and Systems Marktentwicklung der elektronischen Bauteile und Baugruppen Stephan zur Verth, Zentralverband der Elektrotechnik- und Elektronikindustrie e.v., Frankfurt Presserundgang Schnell, scharf und in 3D: Optimale Prüfstrategien in AOI und AXI Volker Pape, Viscom AG, Hannover Press Briefing Fast, sharp, 3D: Optimal Inspection strategies in AOI and AXI Volker Pape, Executive Board, Viscom AG, Hannover 09:00-11:00 h Entrance West, 1. OG, Restaurant "Bierstüberl" by Käfer 09:30-10:30 h Press Center West of Messe München 11:00-12:00 h Innovation Forum Hall B3 / B :15-14:30 h Conference Room A11 14:00-15:00 h Raum B13 über Halle B1 14:15-14:45 h Viscom Booth A :45-15:15 h Viscom Booth A /13/ :00 am Page 36

37 Press Presseinfo Rehm Thermal Systems Vorstellung der Messeneuheiten moderation: Michael Hanke, Rehm Thermal Systems GmbH, Blaubeuren Pressegespräch Weißwurtsfrühstück mit der Fachpresse moderation: Tom Weber, Clustermanager East Bavaria, Cluster Mechatronik & Automation, Augsburg 09:00-10:00 h Halle A4, Stand :00-12:00 h A2.534 BMK professional electronics Cluster Mechatronik & Automation, Augsburg BMK professional electronics Press Conference hosted by the ITW Electronics Assembly Equipment Group Patrick O'Brien, VP/GM, ITW Electronics Assembly Equipment Group Pressekonferenz mit bayerischer Brotzeit Andrea Bodenhagen, Weiss Umwelttechnik GmbH, Reiskirchen-Lindenstruth Weiss Umwelttechnik GmbH, Reiskirchen-Lindenstruth JBC Press Tour moderation: Silvia Ayerdi, Social Media & Communication, JBC Soldering S.L., Molins de Rei LPKF Jahrespressekonferenz Daten, Zahlen, Fakten Dr. Ingo Bretthauer Kai Bentz Bernd Lange Dr.-Ing. Christian Bieniek Britta Schulz 10:30-11:30 h Hall A4 Booth :30-13:30 h Messestand Weiss Umwelttechnik GmbH, Halle A.2, Stand :30-12:00 h Hall 4 Stand :00-13:00 h Pressezentrum West 11/13/ :00 am Page 37

38 Press Nils Heininger Thomas Nether Lars Ederleh Jürgen Bergedieck LPKF Laser & Electronics AG, Garbsen 11/13/ :00 am Page 38

39 Others Photo competition 40 Years productronica The best picture can win an ipad Air! Entrance West / Hall A1.401 Job Area 10:00-18:00 h Hall B3 / B3.124 Get-together 18:00-20:00 h SMT Speakers Corner Hall A1 / A1.411 Photo competition 40 Years productronica The best picture can win an ipad Air! Entrance West / Hall A1.401 Job Area 10:00-18:00 h Hall B3 / B3.124 Photo competition 40 Years productronica The best picture can win an ipad Air! Entrance West / Hall A1.401 Job Area 10:00-18:00 h Hall B3 / B3.124 Photo competition 40 Years productronica The best picture can win an ipad Air! 09:00-16:00 h Entrance West / Hall A1.401 Job Area 10:00-16:00 h Hall B3 / B3.124 Student Day SchuhEder Consulting GmbH semica 11:15-13:00 h SMT Speakers Corner Hall A1 / A /13/ :00 am Page 39