Freescale Semiconductor. Integrated Silicon Pressure Sensor. On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPX4080D.
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1 Freescale Semiconductor Integrated Silicon Pressure Sensor + On-Chip Signal Conditioned, Temperature Compensated and Calibrated The series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Series Pressure Rev 4, 1/ to 80 kpa (0 to 11.6 psi) 0.6 to 4.9 V Output Features 3.0% Maximum Error over 0 to 85 C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from -40 to 105 C Easy-to-Use, Durable Epoxy Unibody Package ORDERING INFORMATION Device Name Package Case # of Ports Pressure Type Options No. None Single Dual Gauge Differential Absolute Device Marking Tray 867 UNIBODY PACKAGE CASE Freescale Semiconductor, Inc., 2005, 2008, All rights reserved.
2 Operating Characteristics Table 1. Operating Characteristics (V S = 5.1 Vdc, T A = 25 C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Pressure Range (1) Supply Voltage (2) Characteristic Symbol Min Typ Max Unit P OP 0 80 kpa V S Vdc Supply Current I o madc Minimum Pressure Offset (3) (0 to 85 V S = 5.1 V Full Scale Output (4) (0 to 85 V S = 5.1 V Full Scale Span (5) (0 to 85 V S = 5.1 V V off Vdc V FSO Vdc V FSS Vdc Accuracy 3.0 %V FSS Sensitivity V/P 54 mv/kpa 1. 1 kpa (kilopascal) equals psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (V off ) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 2 Freescale Semiconductor
3 Maximum Ratings Pressure Table 2. Maximum Ratings (1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) P max 400 kpa Operating Temperature T A -40 to +105 C Storage Temperature T stg -40 to +125 C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. V S 3 Sensing Element Thin Film Temperature Compensation and Gain Stage #1 Gain Stage #2 and Ground Reference Shift Circuitry V out 1 GND 2 Pins 4, 5, and 6 Are NO CONNECTS Figure 1. Fully Integrated Pressure Sensor Schematic Freescale Semiconductor 3
4 On-Chip Temperature Compensation and Calibration Figure 2 shows the sensor output signal relative to differential pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85 C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 3 illustrates the differential sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The pressure sensor operating characteristics, internal reliability, and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Output (V) kpa PSI VS = 5.1 Vdc TA = 25 C MPX4080 TYP MAX MIN Pressure (kpa) Figure 2. Output versus Pressure Differential Span Range (TYP) Output Range (TYP) Offset (TYP) Fluoro Silicone Gel Die Coat Die Stainless Steel Metal Cover Wire Bond Epoxy Plastic Case Lead Frame Differential/Gauge Element Die Bond Figure 3. Cross-Sectional Diagrams (not to scale) +5.0 V Vs V out OUTPUT IPS 1.0 µf 0.01 µf GND 470 pf Figure 4. Recommended Power Supply Decoupling and Output Filter (For additional output filtering information, refer to Application Note AN1646.) 4 Freescale Semiconductor
5 Transfer Function () Nominal Transfer Value: V out = V S (P x ) ± (Pressure Error x Temp. Mult. x x V S ) V S = 5.1 V ± 0.25 V DC Temperature Error Multiplier Temp. Multiplier to Temperature in C 140 NOTE: The Temperature Multiplier is a linear response from 0 to -40 C and from 85 to 105 C. Pressure Error Band 3.0 Error Limits for Pressure 2.0 Error (kpa) Pressure in kpa Pressure Error (max) 0 to 6 kpa 0 to 60 kpa 60 to 80 kpa ± 1.8 kpa ± 1.5 kpa ± 2.3 kpa PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE The two sides of the pressure sensor are designated as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side is identified by the stainless steel cap. Freescale Semiconductor 5
6 PACKAGE DIMENSIONS B C M -A- R POSITIVE PRESSURE (P1) NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED (0.630). J S SEATING PLANE PIN 1 -T- F G N L D 6 PL (0.005) M T A M DIM A B C D F G J L M N R S INCHES MILLIMETERS MIN MAX MIN MAX BSC 2.54 BSC NOM 30 NOM STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX STYLE 2: PIN 1. OPEN 2. GROUND 3. -VOUT 4. VSUPPLY 5. +VOUT 6. OPEN STYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPLY 5. -VOUT 6. OPEN CASE ISSUE N BASIC ELEMENT 6 Freescale Semiconductor
7 How to Reach Us: Home Page: Web Support: USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL East Elliot Road Tempe, Arizona or Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen Muenchen, Germany (English) (English) (German) (French) Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo Japan or support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing China support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado or Fax: LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals, must be validated for each customer application by customer s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. Freescale Semiconductor, Inc All rights reserved. Rev. 4 1/2009
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