# CHAPTER 6 THERMAL DESIGN CONSIDERATIONS. page. Introduction 6-2. Thermal resistance 6-2. Junction temperature 6-2. Factors affecting R th(j-a) 6-2

Save this PDF as:

Size: px
Start display at page:

Download "CHAPTER 6 THERMAL DESIGN CONSIDERATIONS. page. Introduction 6-2. Thermal resistance 6-2. Junction temperature 6-2. Factors affecting R th(j-a) 6-2"

## Transcription

1 CHAPTER 6 THERMAL DESIGN CONSIDERATIONS page Introduction 6-2 Thermal resistance 6-2 Junction temperature 6-2 Factors affecting 6-2 Thermal resistance test methods 6-3 Test procedure 6-3 Forced air factors for thermal resistance 6-4 Thermal resistance data - assumptions and precautions 6-5 Thermal resistance ( ) data 6-6 Thermal resistance (R th(j-c) ) data tables - power packages 6-24

4 I = CONSTANT I F V F D = ON DIE TSP DIODE D Fig.2 Test procedure. OIL BATH MAINTAINED AT CONSTANT TEMPERATURE MSB474 Where: V F(amb) V F(s) V H I H = forward voltage of TSP at ambient temperature (mv) = forward voltage of TSP at steady-state temperature (mv) = heating voltage (V) = heating current (A) FORCED AIR FACTORS FOR THERMAL RESISTANCE Many applications with ICs have the benefit of forced air cooling by fans or other means. The junction to moving-air thermal resistance can be measured by placing the test setup inside a low velocity wind tunnel (see Fig.4). The test board and device under test are supported with minimal obstruction to the air flow. handbook, V halfpage F (V) V F1 V F2 Fig.3 V F as a function of T j. MSB473 T 1 T 2 T ( o j C) FLOW STRAIGHTENER, AIR FLOW 183 (72) 35.5 (14) 58.5 (23) 132 (52) ANEMOMETER TEST PART 43 (19) DIAMETER = 15 (6) not to scale MSB475 Fig.4 Wind tunnel - dimensions in cm (inches). FAN With the K-factor determined, can be calculated by powering up the device at ambient conditions and measuring the forward voltage drop across the TSP diode after temperature equilibrium. Manipulating the original thermal resistance equation with the K-factor, the of the package can be determined: T R j ( T j T amb ) KV ( F( amb) V Fs ( ) ) th( j a) = = = P d P d V H I H The average effect of airflow on thermal resistance for package types at a particular air flow rate can be determined using a derating curve (see Fig.5). When using derating curves, it s important to note that the variety of sizes in a package type group has been averaged. See the following section on Thermal resistance data - assumptions and precautions concerning airflow. April 2 6-4

6 THERMAL RESISTANCE ( ) DATA 12 MBK MBK Fig.6 DIP8 (3 mil). Fig.7 DIP14/16 (3 mil). 8 MBK34 9 MBK Fig.8 DIP18 (3 mil). Fig.9 DIP2 (3 mil). April 2 6-6

7 65 MBK MBK Fig.1 DIP22 (4 mil). Fig.11 DIP24 (3 mil). 7 MBK39 6 MBK Fig.12 DIP24 (4 mil). Fig.13 DIP24 (6 mil). April 2 6-7

8 MBK31 5 MBK Fig.14 DIP28 (6 mil). Fig.15 DIP4 (6 mil). 5 MBK MBK Fig.16 DIP48 (6 mil). Fig.17 HSQFP24 ( mm). April 2 6-8

9 1 MBK316 1 MBK Fig.18 LQFP32 ( mm) Fig.19 LQFP32 ( mm). 7 MBK32 9 MBK Fig.2 LQFP44 ( mm) Fig.21 LQFP48 ( mm). April 2 6-9

10 8 MBK MBK Fig.22 LQFP64 ( mm). Fig.23 LQFP64 ( mm). 6 MBK322 6 MBK Fig.24 LQFP8 ( mm). Fig.25 LQFP1 ( mm). April 2 6-1

11 6 MBK MBK Fig.26 LQFP128 ( mm). Fig.27 PLCC2 (31 mil). 8 MBK329 MBK Fig.28 PLCC28 (41 mil). Fig.29 PLCC44 (61 mil). April

12 5 MBK MBK Fig.3 PLCC52 (71 mil). Fig.31 PLCC68 (91 mil) MBK MBK Fig.32 PLCC84 (111 mil). Fig.33 QFP44 ( mm). April

13 9 8 MBK MBK Fig.34 QFP44 FeNi ( mm). Fig.35 QFP52 (1 1 2 mm). 6 MBK338 MBK Fig.36 QFP64 ( mm). Fig.37 QFP64 ( mm). April

14 MBK MBK Fig.38 QFP8 ( mm). Fig.39 QFP1 ( mm). 4 MBK34 4 MBK Fig.4 QFP12 ( mm). Fig.41 QFP128 ( mm). April

15 38 36 MBK344 8 MBK Fig.42 QFP16 ( mm). Fig.43 SDIP24 (4 mil). 75 MBK MBK Fig.44 SDIP32 (4 mil). Fig. SDIP42 (6 mil). April

16 5 MBK MBK Fig.46 SDIP52 (6 mil). Fig.47 SDIP64 (75 mil). 162 MBK MBK Fig.48 SO8 (15 mil). Fig.49 SO14 (15 mil). April

17 116 MBK MBK Fig.5 SO16 (15 mil). Fig.51 SO16 (3 mil). 94 MBK353 8 MBK Fig.52 SO2 (3 mil). Fig.53 SO24 (3 mil). April

18 74 MBK MBK Fig.54 SO28 (3 mil). Fig. SO32 (3 mil) MBK MBK Fig.56 SSOP14 (5.3 mm). Fig.57 SSOP16 (4.4 mm). April

19 1 MBK MBK Fig.58 SSOP16 (5.3 mm). Fig.59 SSOP2 (4.4 mm). 14 MBK MBK Fig.6 SSOP2 (5.3 mm). Fig.61 SSOP24 (5.3 mm). April

20 12 MBK MBK Fig.62 SSOP28 (5.3 mm). Fig.63 SSOP56 (7.5 mm) MBK MBK Fig.64 TQFP44 (1 1 1 mm). Fig.65 TQFP64 (1 1 1 mm). April 2 6-2

21 65 MBK37 6 MBK Fig.66 TQFP8 ( mm). Fig.67 TQFP1 ( mm). 18 MBK MBK Fig.68 TSSOP14 (4.4 mm). Fig.69 TSSOP16 (4.4 mm). April

22 15 MBK MBK Fig.7 TSSOP2 (4.4 mm). Fig.71 TSSOP24 (4.4 mm). 13 MBK MBK Fig.72 TSSOP28 (4.4 mm). Fig.73 TSSOP48 (6.1 mm). April

23 98 96 MBK MBK Fig.74 TSSOP56 (6.1 mm). Fig.75 VSO4 FeNi (7.5 mm). 18 MBK Fig.76 VSO56 FeNi (11 mm). April

24 THERMAL RESISTANCE (R th(j-c) ) DATA TABLES - POWER PACKAGES (1) PACKAGE NAME PHILIPS OUTLINE CODE R th(j-c) GLUED DIE R th(j-c) SOLDERED DIE DBS9MPF SOT to 12. n.a. DBS9P SOT to 4..8 to 3. DBS13P SOT to 4..8 to 3. DBS17P SOT to 4..8 to 3. DBS23P SOT411-1 n.a..8 to 3. HSOP2 SOT to 4..8 to 3. RBS9MPF SOT to 12. n.a. RDBS13P SOT to 4..8 to 3. SIL9MPF SOT to 12. n.a. SIL9P SOT to 4..8 to 3. SIL13P SOT to 4..8 to 3. Note 1. a) Almost all of the values in the table were determined with measurements. b) Low values should be used with a large die, high values should be used with a small die. April

### Power Dissipation Considerations in High Precision Vishay Sfernice Thin Film Chips Resistors and Arrays (P, PRA etc.) (High Temperature Applications)

VISHAY SFERNICE Resistive Products Application Note ABSTRACT On our thin film chips resistors and arrays the main path for the heat, more than 90 %, is conduction through the body of the component, the

### Understanding Thermal Characteristic of SOT-223 Package

Application Note Neil Nien AN044 January 2016 Understanding Thermal Characteristic of SOT-223 Package Abstract For power ICs, the thermal parameters of different packages should be compliant with different

### DATA SHEET. TDA1510AQ 24 W BTL or 2 x 12 W stereo car radio power amplifier INTEGRATED CIRCUITS

INTEGRATED CIRCUITS DATA SHEET 24 W BTL or 2 x 12 W stereo car radio File under Integrated Circuits, IC01 January 1992 GENERAL DESCRIPTION The is a class-b integrated output amplifier encapsulated in a

### Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs

Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs SZZA017A September 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to

### INTEGRATED CIRCUITS DATA SHEET. TBA120U Sound I.F. amplifier/demodulator for TV. Product specification File under Integrated Circuits, IC02

INTEGRATED CIRCUITS DATA SHEET Sound I.F. amplifier/demodulator for TV File under Integrated Circuits, IC02 March 1986 GENERAL DESCRIPTION The is an i.f. amplifier with a symmetrical FM demodulator and

### EFFECT OF OBSTRUCTION NEAR FAN INLET ON FAN HEAT SINK PERFORMANCE

EFFECT OF OBSTRUCTION NEAR FAN INLET ON FAN HEAT SINK PERFORMANCE Vivek Khaire, Dr. Avijit Goswami Applied Thermal Technologies India 3rd Floor,C-Wing,Kapil Towers, Dr. Ambedkar Road, Pune- 411 1 Maharashtra,

### Thermal Analysis, Heat Sink Design and Performance Verification for GE Fanuc Intelligent Platform s WANic 3860 Packet Processor PCI Card

CASE STUDY Thermal Analysis, Heat Sink Design and Performance Verification for GE Fanuc Intelligent Platform s WANic 3860 Packet Processor PCI Card Challenge When GE Fanuc Intelligent Platforms, a leading

### DATA SHEET. TDA1518BQ 24 W BTL or 2 x 12 watt stereo car radio power amplifier INTEGRATED CIRCUITS

INTEGRATED CIRCUITS DATA SHEET File under Integrated Circuits, IC01 July 1994 GENERAL DESCRIPTION The is an integrated class-b output amplifier in a 13-lead single-in-line (SIL) plastic power package.

### Current Limiting Power Resistors for High-Power LED Module Lighting Applications

Current Limiting Power Resistors for High-Power LED Module Lighting Applications PWR263 An ongoing trend toward miniaturization of virtually all electronics is accompanied by the demand for a reduction

### The Effect of Forced Air Cooling on Heat Sink Thermal Ratings

zpero 1 The Effect of Forced Air Cooling on Heat Sink Thermal Ratings By Paul Bachman, Fellow Engineer & Ronnie Haiduk, Applications Engineer, Crydom, Inc. ABSTRACT A heat sink s ability to dissipate thermal

### INTEGRATED CIRCUITS DATA SHEET. PCF8574 Remote 8-bit I/O expander for I 2 C-bus. Product specification Supersedes data of 2002 Jul 29.

INTEGRATED CIRCUITS DATA SHEET Remote 8-bit I/O expander for I 2 C-bus Supersedes data of 2002 Jul 29 2002 Nov 22 CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION 3 ORDERING INFORMATION 4 BLOCK DIAGRAM 5 PINNING

### INTEGRATED CIRCUITS DATA SHEET. TDA7000 FM radio circuit. Product specification File under Integrated Circuits, IC01

INTEGRATED CIRCUITS DATA SHEET File under Integrated Circuits, IC01 May 1992 GENERAL DESCRIPTION The is a monolithic integrated circuit for mono FM portable radios, where a minimum on peripheral components

### Application Note, V1.0, 2008 AN2008-03. Thermal equivalent circuit models. replaces AN2001-05. Industrial Power

Application Note, V1.0, 2008 AN2008-03 Thermal equivalent circuit models replaces AN2001-05 Industrial Power Edition 2008-06-16 Published by Infineon Technologies AG 59568 Warstein, Germany Infineon Technologies

INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications The IC06 74HC/HCT/HCU/HCMOS Logic Package Information The IC06 74HC/HCT/HCU/HCMOS

### Surface Mount Technology cooling for high volumes applications by: Cesare Capriz Aavid Thermalloy via XXV Aprile 32 Cadriano (BO) ITALY

Surface Mount Technology cooling for high volumes applications by: Cesare Capriz Aavid Thermalloy via XXV Aprile 32 Cadriano (BO) ITALY Abstract: The automotive technology is fast moving in integrating

### DATA SHEET. TDA8560Q 2 40 W/2 Ω stereo BTL car radio power amplifier with diagnostic facility INTEGRATED CIRCUITS. 1996 Jan 08

INTEGRATED CIRCUITS DATA SHEET power amplifier with diagnostic facility Supersedes data of March 1994 File under Integrated Circuits, IC01 1996 Jan 08 FEATURES Requires very few external components High

### Test Methods for DC/DC Power Modules

Test Methods for DC/DC Power Modules Design Note 027 Ericsson Power Modules Precautions Abstract A user may have the desire to verify or characterize the performance of DC/DC power modules outside the

### DATA SHEET. TDA1543 Dual 16-bit DAC (economy version) (I 2 S input format) INTEGRATED CIRCUITS

INTEGRATED CIRCUITS DATA SHEET File under Integrated Circuits, IC01 February 1991 FEATURES Low distortion 16-bit dynamic range 4 oversampling possible Single 5 V power supply No external components required

### Thermal Management for Low Cost Consumer Products

Thermal Management for Low Cost Consumer Products TI Fellow Manager: Advanced Package Modeling and Characterization Texas Instruments rvin@ti.com Outline The challenges Stacked die, Package-on-Package,

### DirectFET TM - A Proprietary New Source Mounted Power Package for Board Mounted Power

TM - A Proprietary New Source Mounted Power Package for Board Mounted Power by Andrew Sawle, Martin Standing, Tim Sammon & Arthur Woodworth nternational Rectifier, Oxted, Surrey. England Abstract This

### INTEGRATED CIRCUITS DATA SHEET. TDA7052 1 W BTL mono audio amplifier. Product specification File under Integrated Circuits, IC01

INTEGRATED CIRCUITS DATA SHEET TDA7052 1 W BTL mono audio amplifier File under Integrated Circuits, IC01 July 1994 GENERAL DESCRIPTION The TDA7052 is a mono output amplifier in a 8-lead dual-in-line (DIL)

### DATA SHEET. TDA7052A/AT 1 W BTL mono audio amplifier with DC volume control INTEGRATED CIRCUITS

INTEGRATED CIRCUITS DATA SHEET 1 W BTL mono audio amplifier with DC File under Integrated circuits, IC01 July 199 FEATURES DC Few external components Mute mode Thermal protection Short-circuit proof No

### Kit 27. 1W TDA7052 POWER AMPLIFIER

Kit 27. 1W TDA7052 POWER AMPLIFIER This is a 1 watt mono amplifier Kit module using the TDA7052 from Philips. (Note, no suffix.) It is designed to be used as a building block in other projects where a

### 4-bit binary full adder with fast carry CIN + (A1 + B1) + 2(A2 + B2) + 4(A3 + B3) + 8(A4 + B4) = = S1 + 2S2 + 4S3 + 8S4 + 16COUT

Rev. 03 11 November 2004 Product data sheet 1. General description 2. Features The is a high-speed Si-gate CMOS device and is pin compatible with low power Schottky TTL (LSTTL). The is specified in compliance

### DATA SHEET. BST50; BST51; BST52 NPN Darlington transistors DISCRETE SEMICONDUCTORS. Product specification Supersedes data of 2001 Feb 20.

DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D109 Supersedes data of 2001 Feb 20 2004 Dec 09 FEATURES High current (max. 0.5 A) Low voltage (max. 80 V) Integrated diode and resistor. APPLICATIONS

Preface xiii Introduction xv 1 Planning for surface mount design General electronic products 3 Dedicated service electronic products 3 High-reliability electronic products 4 Defining the environmental

### Effective Thermal Management of Crystal IS SMD LEDs

APPLICATION NOTE: Effective Thermal Management of Crystal IS SMD LEDs July 24, 2015 THIS APPLICATION NOTE DESCRIBES THE THERMAL MANAGEMENT CONCEPTS AND GUIDELINES FOR THE PROPER USE OF CRYSTAL IS SURFACE

### INTEGRATED CIRCUITS DATA SHEET. 74HC08; 74HCT08 Quad 2-input AND gate. Product specification Supersedes data of 1990 Dec 01.

INTEGRTED CIRCUITS DT SHEET Supersedes data of 1990 Dec 01 2003 Jul 25 FETURES Complies with JEDEC standard no. 8-1 ESD protection: HBM EI/JESD22-114- exceeds 2000 V MM EI/JESD22-115- exceeds 200 V. Specified

### N-channel enhancement mode TrenchMOS transistor

FEATURES SYMBOL QUICK REFERENCE DATA Trench technology d V DSS = V Low on-state resistance Fast switching I D = A High thermal cycling performance Low thermal resistance R DS(ON) mω (V GS = V) g s R DS(ON)

### New JEDEC thermal testing standards for high power LEDs

New JEDEC thermal testing standards for high power LEDs András Poppe, PhD Mentor Graphics Mechanical Analysis Division MicReD team also with Budapest University of Technology & Economics Department of

### 10 ma LED driver in SOT457

SOT457 in SOT457 Rev. 1 20 February 2014 Product data sheet 1. Product profile 1.1 General description LED driver consisting of resistor-equipped PNP transistor with two diodes on one chip in an SOT457

### INTEGRATED CIRCUITS DATA SHEET. SAA1064 4-digit LED-driver with I 2 C-Bus interface. Product specification File under Integrated Circuits, IC01

INTEGRATED CIRCUITS DATA SHEET 4-digit LED-driver with I 2 C-Bus interface File under Integrated Circuits, IC01 February 1991 GENERAL DESCRIPTION The LED-driver is a bipolar integrated circuit made in

### INTEGRATED CIRCUITS DATA SHEET. 74HC00; 74HCT00 Quad 2-input NAND gate. Product specification Supersedes data of 1997 Aug 26.

INTEGRTED CIRCUITS DT SHEET Quad 2-input NND gate Supersedes data of 1997 ug 26 2003 Jun 30 Quad 2-input NND gate FETURES Complies with JEDEC standard no. 8-1 ESD protection: HBM EI/JESD22-114- exceeds

### INTEGRATED CIRCUITS DATA SHEET. TDA x 6 W stereo car radio power amplifier. Product specification File under Integrated Circuits, IC01

INTEGRATED CIRCUITS DATA SHEET TDA1519 2 x 6 W stereo car radio power amplifier File under Integrated Circuits, IC01 May 1992 GENERAL DESCRIPTION The TDA1519 is an integrated class-b dual output amplifier

INTEGRTED CIRCUITS DT SEET For a complete data sheet, please also download: The IC06 74C/CT/CU/CMOS ogic Family Specifications The IC06 74C/CT/CU/CMOS ogic Package Information The IC06 74C/CT/CU/CMOS ogic

### DATA SHEET. PMEGXX10BEA; PMEGXX10BEV 1 A very low V F MEGA Schottky barrier rectifier DISCRETE SEMICONDUCTORS

DISCRETE SEMICONDUCTORS DATA SHEET Supersedes data of 24 Apr 2 24 Jun 4 FEATURES Forward current: A Reverse voltages: 2 V, 3 V, 4 V Very low forward voltage Ultra small and very small plastic SMD package

### HLMP-1600, HLMP-1601, HLMP-1620, HLMP-1621 HLMP-1640, HLMP-1641, HLMP-3600, HLMP-3601 HLMP-3650, HLMP-3651, HLMP-3680, HLMP-3681

HLMP-16, HLMP-161, HLMP-162, HLMP-1621 HLMP-16, HLMP-161, HLMP-36, HLMP-361 HLMP-365, HLMP-3651, HLMP-368, HLMP-3681 T 1 3 / (5 mm), T-1 (3 mm), 5 Volt, 12 Volt, Integrated Resistor LED Lamps Data Sheet

### JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

JEDEC STANDARD Guidelines for Reporting and Using Electronic Package Thermal Information JESD51-12 MAY 2005 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material

### Self Qualification Results

(ATO) Divisional Philips Semiconductors Philips Internal Report No.: RNR- 8 3-03/RdH/RdH- 2 0 3 6 QTS Report Database No.: 030692 Self Qualification Results NiPdAu lead- free solution of SO14/16/20 Products

### OR-ing Intelligent Switch

VI VRS VO TFL GND Rev. 03 5 November 2002 Product data 003aaa198 1. Description The is an (ORIS), a dedicated power OR-ing device, that combines the simplicity of a diode with the efficiency of a MOSFET

### Thermal analysis and measurements of spiral inductors using built-in and IR sensors

Thermal analysis and measurements of spiral inductors using built-in and IR sensors by M. Kałuża*, M. Felczak, and B. Więcek * Institute of Electronics, Lodz University of Technology, Poland, marcin.kaluza@p.lodz.pl

Advanced Monolithic Systems FEATURES Three Terminal Adjustable or Fixed oltages* 1.5, 1.8, 2.5, 2.85, 3.3 and 5. Output Current of 1A Operates Down to 1 Dropout Line Regulation:.2% Max. Load Regulation:.4%

### FLASHSOLDERING - A NEW PROCESS FOR REFLOW SOLDERING INSULATED MAGNET WIRE TO ELECTRONIC CONTACTS

FLASHSOLDERING - A NEW PROCESS FOR REFLOW SOLDERING INSULATED MAGNET WIRE TO ELECTRONIC CONTACTS David W. Steinmeier microjoining Solutions & Mike Becker Teka Interconnection Systems Abstract: Flashing

### AN1703 APPLICATION NOTE GUIDELINES FOR USING ST S MOSFET SMD PACKAGES

AN170 APPLICATION NOTE GUIELINES FO USING ST S MOSFET SM PACKAGES 1. ABSTACT.Gulino The trend from through-hole packages to low-cost SM-applications is marked by the improvement of chip technologies. "Silicon

### IP4234CZ6. 1. Product profile. Single USB 2.0 ESD protection to IEC 61000-4-2 level 4. 1.1 General description. 1.2 Features. 1.

Rev. 01 16 April 2009 Product data sheet 1. Product profile 1.1 General description The is designed to protect Input/Output (I/O) USB 2.0 ports, that are sensitive to capacitive loads, from being damaged

### DISCRETE SEMICONDUCTORS DATA SHEET. BLF244 VHF power MOS transistor

DISCRETE SEMICONDUCTORS DATA SHEET September 1992 FEATURES High power gain Low noise figure Easy power control Good thermal stability Withstands full load mismatch Gold metallization ensures excellent

### Thermal Management in Surface-Mounted Resistor Applications

VISHAY BEYSCHLAG Resistive Products 1. INTRODUCTION Thermal management is becoming more important as the density of electronic components in modern printed circuit boards (PCBs), as well as the applied

### General Information on the Assembly and Solder Pad Design of the DRAGON Family Application Note

General Information on the Assembly and Solder Pad Design of the DRAGON Family Application Note Abstract This application note gives general information on the assembly and design of the solder pad of

### WW12X, WW08X, WW06X, WW04X ±1%, ±5% Thick Film Low ohm chip resistors

WW12X, WW08X, WW06X, WW04X ±1%, ±5% Thick Film Low ohm chip resistors Size 1206, 0805, 0603, 0402 *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_WWxxX_V12 Nov.- 2011

### DATA SHEET. BAS19; BAS20; BAS21 General purpose diodes DISCRETE SEMICONDUCTORS. Product data sheet Supersedes data of 1999 May 26.

DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D088 Supersedes data of 1999 May 26 2003 Mar 20 FEATURES Small plastic SMD package Switching speed: max. 50 ns General application Continuous reverse

### Intel Atom Processor E3800 Product Family

Intel Atom Processor E3800 Product Family Thermal Design Guide October 2013 Document Number: 329645-001 Legal Lines and Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS.

### LM3940 1A Low Dropout Regulator for 5V to 3.3V Conversion

1A Low Dropout Regulator for 5V to 3.3V Conversion General Description The LM3940 is a 1A low dropout regulator designed to provide 3.3V from a 5V supply. The LM3940 is ideally suited for systems which

### PMD9002D. 1. Product profile. MOSFET driver. 1.1 General description. 1.2 Features. 1.3 Applications. Quick reference data

Rev. 0 20 November 2006 Product data sheet. Product profile. General description NPN Resistor-Equipped Transistor (RET), NPN general-purpose transistor and high-speed switching diode connected in totem

### TEST SOLUTIONS CONTACTING - SEMICONDUCTOR

ENGINEERED TO CONNECT CONTACTING - SEMICONDUCTOR TEST SOLUTIONS SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING - SEMICONDUCTOR 3 SEries

### # 31. Mounting Considerations for High Power Laser Diodes

# 31 Mounting Considerations for High Power Laser Diodes Mounting Considerations for High Power Laser Diodes By: Patrick Gale and Andrew Shull Introduction As the optical power of laser diodes increases

### Power chip resistor size 2512 PRC221 5%; 2% FEATURES Reduced size of final equipment Low assembly costs Higher component and equipment reliability.

FEATURES Reduced size of final equipment Low assembly costs Higher component and equipment reliability. APPLICATIONS Power supplies Printers Computers Battery chargers Automotive Converters CD-ROM. QUICK

### 74HCU04. 1. General description. 2. Features and benefits. 3. Ordering information. Hex unbuffered inverter

Rev. 7 8 December 2015 Product data sheet 1. General description The is a hex unbuffered inverter. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to

### 1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.

.Introduction If the automobile had followed the same development cycle as the computer, a Rolls- Royce would today cost \$00, get one million miles to the gallon and explode once a year Most of slides

### Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages

APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction This Application Note provides sample PCB land pattern

### VOIDLESS HERMETICALLY SEALED SWITCHING DIODES Qualified per MIL-PRF-19500/578

Available on commercial versions VOIDLESS HERMETICALLY SEALED SWITCHING DIODES Qualified per MIL-PRF-19500/578 DESCRIPTION These popular JEDEC registered switching/signal diodes are military qualified

### 74HC14; 74HCT14. Hex inverting Schmitt trigger

Rev. 7 19 November 2015 Product data sheet 1. General description The is a hex inverter with Schmitt-trigger inputs. This device features reduced input threshold levels to allow interfacing to TTL logic

### 1W High Power Purple LED Technical Data Sheet. Part No.: LL-HP60MUVA

1W High Power Purple LED Technical Data Sheet Part No.: LL-HP60MUVA Spec No.: HP60M Rev No.: V.2 Date: Aug./18/2009 Page: 1 OF 8 Features: Luckylight High power LED type. Lead frame type package (Heat

### INTERNATIONAL ATOMIC ENERGY AGENCY INSTRUMENTATION UNIT SMD (SURFACE MOUNTED DEVICES) REPAIR S. WIERZBINSKI FEBRUARY 1999

(SURFACE MOUNTED DEVICES) REPAIR S. WIERZBINSKI FEBRUARY 1999 (SURFACE MOUNTED DEVICES) REPAIR 1 TABLE OF CONTENTS PAGE 1. INTRODUCTION 3 2. ADVANTAGES 4 3. LIMITATIONS 4 4. DIALECT 5 5. SIZES AND DIMENSIONS

### Chip Diode Application Note

Chip Diode Application Note Introduction The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components.

### Data Sheet. HLMP-1600 T 1 3 / 4 (5 mm), T-1 (3 mm), 5 Volt, 12 Volt, Integrated Resistor LED Lamps. Description. Features. Package Dimensions

HLMP-16 T 1 3 / (5 mm), T-1 (3 mm), 5 Volt, 12 Volt, Integrated Resistor LED Lamps Data Sheet HLMP-16, HLMP-161, HLMP-162, HLMP-1621 HLMP-16, HLMP-161, HLMP-36, HLMP-361 HLMP-365, HLMP-3651, HLMP-368,

### Good Boards = Results

Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.

### Everline Module Application Note: Round LED Module Thermal Management

Everline Module Application Note: Round LED Module Thermal Management PURPOSE: Use of proper thermal management is a critical element of Light Emitting Diode (LED) system design. The LED temperature directly

### Contents. 12. Lot Number 10. 13. Reel Packing Structure 11. 14. Precaution for Use 13. 15. Hazard Substance Analysis 14. 16. Revision History 18

Rev : 00 ISSUE NO : DATE OF ISSUE : 2009. 04. 10 S P E C I F I CATION MODEL : SLHNNWW629T1S0U0S0 [Rank : (S0), (U0), (S0)] HIGH POWER LED - SUNNIX6 CUSTOMER : CUSTOMER CHECKED CHECKED APPROVED SAMSUNG

### 74HC02; 74HCT02. 1. General description. 2. Features and benefits. Ordering information. Quad 2-input NOR gate

Rev. 5 26 November 2015 Product data sheet 1. General description 2. Features and benefits The is a quad 2-input NOR gate. Inputs include clamp diodes. This enables the use of current limiting resistors

### LM56 Dual Output Low Power Thermostat

Dual Output Low Power Thermostat General Description The LM56 is a precision low power thermostat. Two stable temperature trip points (V T1 and V T2 ) are generated by dividing down the LM56 1.250V bandgap

### CS4525 Power Calculator

1. OVERVIEW CS4525 Power Calculator The CS4525 Power Calculator provides many important application-specific performance numbers for the CS4525 based on user-supplied design parameters. The Power Calculator

### 50 WATT ZENER DIODES Qualified per MIL-PRF-19500/358. 1N3305B thru 1N3350B & RB

1-0-446-1158 / (978) 620-2600 / Fax: (978) 689-03 Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 DEVICES 50 WATT ZENER DIODES Qualified per MIL-PRF-19500/358 1N3305B thru 1N3350B & RB and 1N4549B thru

### DATA SHEET. BC875; BC879 NPN Darlington transistors DISCRETE SEMICONDUCTORS. Product specification Supersedes data of 1999 May 28.

DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D186 Supersedes data of 1999 May 28 2004 Nov 05 FEATURES High DC current gain (min. 1000) High current (max. 1 A) Low voltage (max. 80 V) Integrated

### Thermal Management of Light Sources Based on SMD LEDs Application note

Thermal Management of Light Sources Based on SMD LEDs Application note Abstract This application note provides an introduction to the basic principles of heat transfer and its influence on LED applications

### DATA SHEET. BZV49 series Voltage regulator diodes DISCRETE SEMICONDUCTORS. Product data sheet Supersedes data of 1999 May 11.

DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D109 Supersedes data of 1999 May 11 2005 Feb 03 FEATURES Total power dissipation: max. 1 W Tolerance series: approx. ±5% Working voltage range: nom.

### W- Series. Features: WOB. Mechanical Data Case : Moulded plastic. Lead : Solder plated. Weight : 1.10 grams. Page <1> 15/07/08 V1.

Features: Surge overload ratings to 40 amperes peak. Ideal for printed circuit board. Reliable low cost construction. High temperature soldering guaranteed: 260 C/10 seconds/0.375inch (9.5mm) lead lengths

### PMEG6002EB; PMEG6002TV

Rev. 01 24 November 2006 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for

### Low Voltage, Resistor Programmable Thermostatic Switch AD22105

a Low Voltage, Resistor Programmable Thermostatic Switch AD22105 FEATURES User-Programmable Temperature Setpoint 2.0 C Setpoint Accuracy 4.0 C Preset Hysteresis Wide Supply Range (+2.7 V dc to +7.0 V dc)

### INTEGRATED CIRCUITS. 74LVC08A Quad 2-input AND gate. Product specification IC24 Data Handbook. 1997 Jun 30

INTEGRATED CIRCUITS IC24 Data Handbook 1997 Jun 30 FEATURES Wide supply voltage range of 1.2 V to 3.6 V In accordance with JEDEC standard no. 8-1A Inputs accept voltages up to 5.5 V CMOS low power consumption

### 74HC32; 74HCT32. 1. General description. 2. Features and benefits. Quad 2-input OR gate

Rev. 5 4 September 202 Product data sheet. General description The is a quad 2-input OR gate. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages

### Integrated Circuit Packaging and Thermal Design

Lezioni di Tecnologie e Materiali per l Elettronica Integrated Circuit Packaging and Thermal Design Danilo Manstretta microlab.unipv.it danilo.manstretta@unipv.it Introduction to IC Technologies Packaging

### HIGH VOLTAGE TEMPERATURE COMPENSATED ZENER REFERENCE DIODES

Available HIGH VOLTAGE TEMPERATURE COMPENSATED ZENER REFERENCE DIODES DESCRIPTION The 1N4057 through 1N4085A series of temperature compensated reference diodes provides a wide selection of nominal voltages

### 74HC238; 74HCT238. 3-to-8 line decoder/demultiplexer

Rev. 4 27 January 2016 Product data sheet 1. General description 2. Features and benefits 3. Ordering information The decodes three binary weighted address inputs (A0, A1 and A2) to eight mutually exclusive

### Thick Film High Power Chip Resistors. Size W, W, /2W

WF25P, WF20P, WF12P ±1%, ±5% 1Ω ~ 1MΩ Thick Film High Power Chip Resistors Size 2512 2W, 2010 1W, 1206 1/2W *Contents in this sheet are subject to change without prior notice. Page 1 of 7 ASC_WF25-20-12P_V10

### Agilent T-1 3 / 4 (5 mm), T-1 (3 mm), 5 Volt, 12 Volt, Integrated Resistor LED Lamps Data Sheet

Agilent T-1 3 / (5 mm), T-1 (3 mm), 5 Volt, 12 Volt, Integrated Resistor LED Lamps Data Sheet HLMP-16, HLMP-161, HLMP-162, HLMP-1621 HLMP-16, HLMP-161, HLMP-36, HLMP-361 HLMP-365, HLMP-3651, HLMP-36, HLMP-361

### ICS650-44 SPREAD SPECTRUM CLOCK SYNTHESIZER. Description. Features. Block Diagram DATASHEET

DATASHEET ICS650-44 Description The ICS650-44 is a spread spectrum clock synthesizer intended for video projector and digital TV applications. It generates three copies of an EMI optimized 50 MHz clock

### SDC15. TVS Diode Array for ESD Protection of 12V Data and Power Lines. PROTECTION PRODUCTS Description. Features. Mechanical Characteristics

Description The SDC15 transient voltage suppressor (TVS) is designed to protect components which are connected to data and transmission lines from voltage surges caused by electrostatic discharge (ESD),

### 74HC138; 74HCT138. 3-to-8 line decoder/demultiplexer; inverting

Rev. 6 28 December 2015 Product data sheet 1. General description 2. Features and benefits 3. Ordering information The decodes three binary weighted address inputs (A0, A1 and A2) to eight mutually exclusive

### INTEGRATED CIRCUITS DATA SHEET. TDA1517; TDA1517P 2 x 6 W stereo power amplifier. Product specification Supersedes data of 2002 Jan 17.

INTEGRATED CIRCUITS DATA SHEET TDA1517; TDA1517P 2 x 6 W stereo power amplifier Supersedes data of 2002 Jan 17 2004 Feb 18 FEATURES Requires very few external components High output power Fixed gain Good

### DISCRETE SEMICONDUCTORS DATA SHEET

DISCRETE SEMICONDUCTORS DATA SHEET ndbook, halfpage M3D49 Schottky barrier rectifiers 23 Aug 2 FEATURES Very low forward voltage High surge current Very small plastic SMD package. APPLICATIONS Low voltage

### MOSFET N-channel enhancement switching transistor IMPORTANT NOTICE. http://www.philips.semiconductors.com use http://www.nxp.com

Rev. 3 21 November 27 Product data sheet Dear customer, IMPORTANT NOTICE As from October 1st, 26 Philips Semiconductors has a new trade name - NXP Semiconductors, which will be used in future data sheets

### AC-DC Converter Application Guidelines

AC-DC Converter Application Guidelines 1. Foreword The following guidelines should be carefully read prior to converter use. Improper use may result in the risk of electric shock, damaging the converter,

### POWER FORUM, BOLOGNA 20-09-2012

POWER FORUM, BOLOGNA 20-09-2012 Convertitori DC/DC ad alta densità di potenza e bassa impedenza termica. Massimo GAVIOLI. Senior Field Application Engineer. Intersil SIMPLY SMARTER Challenges when Designing

### 1N59xxBRNG Series. 3 W DO-41 Surmetic 30 Zener Voltage Regulators

W DO-4 Surmetic 0 Zener Voltage Regulators This is a N9xxBRNG series with limits and excellent operating characteristics that reflect the superior capabilities of silicon oxide passivated junctions. All

### Thermal Load Boards Improve Product Development Process

Thermal Load Boards Improve Product Development Process Bernie Siegal Thermal Engineering Associates, Inc. 2915 Copper Road Santa Clara, CA 95051 USA P: 650-961-5900 F: 650-227-3814 E: bsiegal@thermengr.com

### Discontinued. LUXEON V Portable. power light source. Introduction

Preliminary Technical Datasheet DS40 power light source LUXEON V Portable Introduction LUXEON is a revolutionary, energy efficient and ultra compact new light source, combining the lifetime and reliability

### INTEGRATED CIRCUITS DATA SHEET. TDA8340 TDA8341 Television IF amplifier and demodulator. Product specification File under Integrated Circuits, IC02

INTEGRATED CIRCUITS DATA SHEET Television IF amplifier and demodulator File under Integrated Circuits, IC02 November 1987 DESCRIPTION The ;Q and ;Q are integrated IF amplifier and demodulator circuits