ELECTRONICS + DESIGN FROM YOUR IDEA RIGHT TO SERIAL PRODUCTION
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1 FROM YOUR IDEA RIGHT TO SERIAL PRODUCTION
2 INDIVIDUAL PRODUCT DEVELOPMENT IS OUR CORE COMPETENCE You are well acquainted with your markets and you know: futureoriented technology is based on high-end electronics solutions. At TURCK duotec, we are not only able to reliably manufacture these components, we offer their customer-specific development as well. Which means: with us, you will get the entire know-how and the complete production technology from one source. For each of you projects, we will provide state-of-the-art service and top performance. Up to the finished product. RANGE OF S SPECIFICATION DEVELOPMENT Requirements management Concept/ feasibility study Simulation Circuit development Firm- and softwaredevelopment Layout development Mechanical design Process development Testing development Qualification/ Certification
3 Spezification Development Manufacturing Service THE APPROACH Competence is broadened by co-operation. A team of creatively-thinking experts will find innovative solutions for all kinds of challenges step by step, from the detailed specification analysis up to the successful implementation. At TURCK duotec, product and process are inseparable. Power control Interface control Sensor systems LED technology THE RANGE By now, every line of business needs innovative electronics solutions. But the requirements differ extremely. Thanks to a wide range of applications in various sectors, we have the expertise and the know-how to meet customer and product demands just as needed. Drive technology or industrial automation, LED lighting or automotive industry: we are always a competent partner for our customers. ISO 9001 ISO TS AEO-C THE RELIABILITY The only way to meet top product demands is for all areas of operation to collaborate perfectly. From the concept to the production stage, we work with defined procedures. The required standards are kept verifiably. You can talk with us about many things but when it comes to quality, we re not open to compromise. MANUFACTURING Quality and project management Prototyping COB SMT THT Thick-film/ hybrid technology Packaging Protection of electronics System assembly Product-specific test management Logistics Redesign Obsolescence management
4 AT A GLANCE DEVELOPMENT SPECIFICATION Consulting System design Requirements- and product specification document Test specification CONCEPT FEASIBILITY STUDY Research Design and simulation Technical, monetary and legal evaluation Sample production, rapid prototyping SIMULATION Circuit Thermal PCBA and system FEM, Flow CIRCUIT DESIGN Sensor system: process, multi, wireless sensor technology Power control: frequency converter for asynchronous and synchronous motor / control systems for universal and electronically commutated motor / system and PCBA power management and power distribution Interface control: embedded systems, bus and wireless systems, monitoring LED driver FIRM- AND SOFTWARE DEVELOPMENT Hardware-oriented driver Communication protocol Control algorithm GUI Application development Implementation of customised algorithm LAYOUT DEVELOPMENT MECHANICAL DEVELOPMENT Housing design System and PCBA 3D modeling PROCESS DEVELOPMENT Technological process development and qualification Conversion of products to serial process Change management TESTING DEVELOPMENT ICT, FCT, Burn-In, Boundary-Scan AOI, AXI Development of testing strategies Automation Equipment QUALIFICATION AND CERTIFICATION Electrical tests Environmental tests Consulting Documentation Initiating and supervising of accredited certification process QUALITY AND PROJECT MANAGEMENT Structure analysis, FMEA, MTBF Risk and reliability management Initiating, planning and controlling Controlling and finishing of projects Logistics Redesign & Requalification Obsolescence management Multilayer, flex, rigid-flex and rigid PCB Thick-copper, Thick-film, IMS, HD, BGA, COB Embedded components
5 AT A GLANCE PROTOTYPING COMPONENTS / BOARD Provision of material Material procurement In-house rapid prototyping of DL-PCBs Housings in 3D printing HANDLING TIME 3 workdays from request to offer (For requests received by 9 a.m) 3 weeks from incoming order to delivery after resolving all technical details (Usual time for material procurement: 5-8 workdays) (Usual time production process: 5-10 workdays/depending on vertical range of manufacture) PROCESS STRUCTURE Qualified production of A and B prototypes Transfer to C prototype production Process optimization for series production Preparation for series production COMPLETION Assembly Start-up Labeling TEST AOI X-Ray ICT / FCT BOM template Express delivery Diagnostics Rework Repair Validation SMT-PROCESS Semi-automatic pick-and-place machines or manual fine placers Fully automated pick-and-place machines SOLDERING PROCESS Manual soldering Reflow soldering Vacuum condensation soldering PROTECTION OF ELECTRONICS Potting Coating Foaming
6 AT A GLANCE PRODUCTION LAYOUT DATA TRANSFER Multilayer PCB design PCB 3D design Collision detection Thermal simulation CHIP-ON-BOARD Clean room ISO class 5 and 7 Dispensing of adhesive Chip-on-board Chip-on-flex Chip-on-chip Dam and fill Glob-top SMT-PROCESS Solder paste printing SMD pick and place SPI, AOI, AXI Component size from PROTECTION OF ELECTRONICS Dip and selective lacquering Potting Overmold with thermoplast Hot-Melt Foaming SYSTEM ASSEMBLY Housing assembly Laser marking and pad printing Labeling Junction technology and connectivity Packaging PRODUCT-SPECIFIC TEST MANAGEMENT Flying probe Board test Device adjustment System configuration, programming, parametrising FCT, ICT THT-PROCESS Component preparation Wave and selective soldering Hot bar soldering Manual soldering Depanelisation Component management Obsolescence management Redesign and Requalification Procurement and long-term storage Product traceability system Logistics THICK-FILM AND HYBRID PROCESS Wire printing Resistor printing and laser trimming Sintering process Glass passivation printing Wire printing on glass Assembly adjustment
7 AT A GLANCE ELECTRONICS PROTECTION APPLICATION Hygienic protection (autoclave safe) Protection against condensation and moisture Protection against liquids (IP68, IP69K) Protection against dust Protection against dirt Protection against chemicals and cooling lubricants Protection against fungal and bacterial contamination Mechanical protection (from vibration and shock) Protection against explosions MATERIAL PROPERTIES Temperature range for application and thermal conductivity varies as per customer requirements Increased electrical insulation Improved heat distribution ATEX-compliant protective coatings UV-resistant Abrasion-resistant Resistant to colour changes COATING Dip coating Selective coating Selective dip coating Fluorocarbon polymer coating INJECTION OVERMOULDING Hot melt injection overmoulding Thermoplastic injection overmoulding POTTING Potting with polyurethane Potting with epoxy resin Evaluation of optimum protection Combining materials to ensure tightness against leaks Customer-specific 3D shape to optimise further processing Integration of functional elements Integration of mounting elements Manufacture of housing components System assembly Testing the electronics and functionality of the packaging
8 Germany TURCK duotec GmbH Goethestraße 7 D Halver T F TURCK duotec GmbH Am Bockwald 2 D Grünhain-Beierfeld T F TURCK duotec GmbH Bottroper Str. 8 D Stuttgart T F Switzerland TURCK duotec S.A. Rue du Stand 63 CH-2800 Delémont T F contact@turck-duotec.com IMA-03_02_2015_EN. Printed in Germany
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