Sony IMX Mp, 1.65 µm Pixel Pitch Second Generation Back Illuminated CMOS Image Sensor

Size: px

Start display at page:

Download "Sony IMX Mp, 1.65 µm Pixel Pitch Second Generation Back Illuminated CMOS Image Sensor"

Cori Baldwin
7 years ago
Views:

1 Sony IMX Mp, 1.65 µm Pixel Pitch Second Generation Back Illuminated CMOS Image Sensor Package Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call Sales at Chipworks Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: Fax:

2 Package Analysis Some of the information in this report may be covered by patents, mask, and/or copyright protection. This report should not be taken as an inducement to infringe on these rights Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. PKG JMRF Revision 1.0 Published: August 12, 2010

3 Package Analysis Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Introduction 1.4 Device Summary 2 Device Identification 2.1 Package Overview 2.2 Die Overview 2.3 Cross-Sectional Package Analysis 2.4 Planar Package Analysis 3 SEM-EDS Analysis 3.1 Introduction 3.2 SEM-EDS Results 4 Critical Dimensions 4.1 Package Vertical Dimensions 4.2 Package Horizontal Dimensions 5 References 6 Statement of Measurement Uncertainty and Scope Variation About Chipworks

4 Overview Overview 1.1 List of Figures 2 Device Identification Casio EX-FH100 Exilim DSC Front Casio EX-FH100 Exilim DSC Back Casio EX-FH100 Exilim DSC Top Casio EX-FH100 Exilim DSC Bottom Casio EX-FH100 Main Board Front Casio EX-FH100 Main Board Back Image Sensor Assembly Front Image Sensor Assembly Back Sony IMX050 Package Front Sony IMX050 Package Planar X-Ray Sony IMX050 Package X-Ray Plane of Cross Section Sony IMX050 Package Side Sony IMX050 Package Side-View X-Ray Detailed Side-View X-Ray Sony IMX050 Package Back Sony IMX050 Package Back (Metal Slug Removed) IMX050 Die Photograph (Back of Die) IMX050 Die Markings (Back of Die) Package Cross Section Overview Substrate Thickness Ceramic Chip Carrier Thickness Ceramic Chip Carrier Interconnect Thickness Solder Joint and Land Platings PWB Thickness PWB Interconnect and IMDs Embedded Capacitor PWB Delayering Metal PWB Delayering (B) Metal PWB Delayering (C) Metal Through Hole Vias PWB Delayering Capacitor Vias Ceramic Chip Carrier Back Package X-Ray Top Level Metal Interconnect 3 SEM-EDS Analysis SEM-EDS Reference (A) SEM-EDS Reference (B) SEM-EDS Spectrum of Ceramic Chip Carrier Interconnect Metal (Location A) SEM-EDS Spectrum of Ceramic Chip Carrier Substrate (Location B) SEM-EDS Spectrum of Ceramic Chip Carrier Vias (Location C)

5 Overview SEM-EDS Spectrum of Ceramic Chip Carrier Solder Land Plating (Location D) SEM-EDS Spectrum of Solder Joint (Location E) SEM-EDS Spectrum of PWB Land Plating (Location G) SEM-EDS Spectrum of PWB Interconnect (Location H) SEM-EDS Spectrum of IMD 3 (Location L) SEM-EDS Spectrum of IMD 4-1 (Location M) SEM-EDS Spectrum of IMD 4-2 (Location N) SEM-EDS Spectrum of Ceramic Chip Carrier Underfill (Location T) 1.2 List of Tables 1 Overview Device Identification IMX050 Device Summary 2 Device Identification Package Vertical Dimensions Package Horizontal Dimensions 4 Critical Dimensions Package Vertical Dimensions Package Horizontal Dimensions

6 About Chipworks About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at: Chipworks 3685 Richmond Rd. Suite 500 Ottawa, Ontario K2H 5B7 Canada T: F: Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com

Qualcomm QCA6174 802.11ac Wi-Fi 2x2 MIMO Combo SoC

Qualcomm QCA6174 802.11ac Wi-Fi 2x2 MIMO Combo SoC Qualcomm QCA6174 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this report