Amphenol High Density HDB 3 and HSB 3 Connector Series SL-402 HDB 3. High Density

Transcription

1 mphenol High Density HDB 3 and HSB 3 onnector Series SL-40 HDB 3 High Density

2 Table of ontents Page No. PerformanceFeatures HDB 3 Mother Board HDB 3 Daughter Board 3 HDB 3 IO onnector 4 HDB 3 Stacker onnector HSB 3 High Speed Mother Board HSB 3 High Speed Daughter Board 7 HSB 3 High Speed Layout 8 HSB 3 High Speed Recommended Board Layout 9 Hardware for HDB 3 and HSB 3 0 Other mphenol Rectangular Products Notes Sales Office and Distributor Listing 3 ontact mphenol erospace for more information at

3 Bristle Brush dvantages The superior choice for board level interconnects The Bristle Brush contact has been proven in military avionics packages and meets the requirements of MIL-DTL-30. It provides high density in tighter spacing which is a main concern for integrated electronics in aircraft systems. Brush vs. onventional ontacts Brush ontact Innovation Multiple contact interfaces: Strands of high tensile strength wire are bundled together to form brush-like contacts. By intermeshing two multi-strand wire bundles, an electrical connection is made. Provides redundant current paths, 4-70 (point of contact) per mated contact with a gas tight junction. Very smooth (low friction) interface onventional PinSocket Machined surface finish on both parts Higher friction and wear Limited number of contact sites BRUSH ONTTS ONVNTIONL PIN ND SOKT RIMP ONTTS mphenol Brush ontact Provides: Low mating forces (70% to 90% lower than conventional pin and socket contacts asy matingunmating makes high circuit counts practical ( lbs. typical for 400 contacts) Multiple points of contact = superior electrical capability Stable, low resistance-0milliohms max. Redundant current paths Proven electrical and gas tight contact sites Severe environment protection High current rating Long contact life (00,000 cycles of mating and unmating with out performance degradation) Documented intermittency-free performance - no 0 nano second discontinuities during 0,000,000 cycles of 0.00 displacement Overall cost effectiveness (life cycle cost) Protection against micro-arcing No degradation in a frettingmicro-motion environment

4 High Density Brush (HdB 3 ) Series HDB 3 High Density Brush Series with tighter (.070 inch X.00 inch) staggered grid spacing This new connector series of brush connectors incorporates a higher density contact pattern and lower mated height than mphenol s standard low mating force rectangular connectors. HDB 3 connectors utilize the same durable and reliable B 3 brush contact in a tighter.070 X.00 staggered grid pattern. They offer the advantage of higher density in a compact-height connector utilizing less board space. Styles include mother board, daughter board, inputoutput and stacker. HDB 3 Daughter Board onnector HDB 3 Mother Board onnector HDB 3 MTRILS Insulator: Liquid crystal polymer, 30% glass filled ontact: Wire: Beryllium copper per STM B97; finish is gold per STM B488 over nickel per MS-QQ-N-90. Holder: Brass similar to UNS 3300; available finishes include gold per MIL-G-404, tin-lead per MIL-P-878 or tin per MIL-T-077 ( ompliant). Sleeve: Stainless Steel per MS-4, passivated IW QQ-P-3 (Daughter Board, IO and Stacker connector) KeysGuide Pins: Stainless Steel HDB 3 IO onnector OMPRISON HDB 3 Stacker omparison The mphenol HDB 3 onnector offers advantages over competitive connectors: Higher density contact pattern Uses less board space llows for shorter mated height Provides the durability and performance of the Brush contact Low cost HSB 3 High Speed mphenol HDB 3 Hypertronics HPH irborn RM4 ontact System Brush Hyperboloid Pin & Socket Durability, Mating ycles 00,000, ontact Mating Forces, Ounces... Mother Board.070 X X X.070 Daughter Board.070 X X X.00 onnector Width Mated Height, MB to 4th row of DB

5 HDB 3 and HSB 3 Features and Benefits PRFORMN ONNTOR PRFORMN Durability: Insertionxtraction Force: 00,000 mating cycles. ounce typical per contact Operating Temperature: - to urrent Rating: maximum (load dependent) Insulation Resistance: Voltage: amperes Hot swap ampere gigaohms minimum Dielectric Withstanding 70 volts, 0 hertz, Sea Level 0 volts, 0 hertz, 70,000 feet levation Solderability: MIL-STD-0, Method 08 FTURS FTURS Polarization: D shaped design Salt Fog: Humidity: Vibration: Shock: Data Rate (HSB 3 ): 48 Hours IW MIL-STD-344, method 00, test condition B IW MIL-STD-344, method 00, type II 4 hours in each of 3 mutually perpendicular axes IW MIL-ST 344, method 00, test condition V, letter H shock along each of three mutually perpendicular axes IW MIL-STD-344, method 004,test condition G apable of 3. Gbps (consult mphenol for arrangement) Keying: Guide Pins Radial Misalignment: ngular Misalignment: Optional keys offer 3 unique keying combinations Optional guide pins provide additional alignment apable of correcting up to a.00 initial radial misalignment apable of mating with up to a initial angular misalignment HDB 3 & HSB 3 ontact mphenol erospace for more information at

6 HDB 3 Mother Board HDB 3 MOTHR BORD HOW TO ORDR Mates with: Daughter Board IO Stacker. onnector Type HDB-M4 HDB-M4 040 M 4 X Designates HDB 3 Mother Board.33 MX.. Number of ontacts Number of ontacts Brush Wire Plating M u Min. thick over Nickel u Min. thick over Nickel Number of Brush Wire Termination ontact Termination Less Hardware ontacts Plating Finish (Purchased separately see pg 0 for hardware options) ±.00.0 ± MIN. DI. THRU HOL (US NO. SRW) PIN 4. Termination Type Stickout (Dim. ) PB, Straight,.0 Dia PB, Straight,.0 Dia PB, Straight,.0 Dia 0.80 PB, Straight,.0 Dia PB, Straight,.0 Dia ± B D F.9 MIN. HX.070 MIN DP (US 3 HX HD). ontact Termination Finish Gold plated in accordance with MIL-G-404, Type II, Min. thick Gold over Min. thick Nickel Tin plated in accordance with STM B4,.0000 Min. thick Matte Tin over.0000 Min. thick Nickel Tin-Lead plated in accordance with S-MS-P-878,.0000 Min. thick Tin-Lead over.0000 Min. thick opper u m phenol m phenol Mother Board Layout u No. of ontacts onnector s ontact Pattern 40 4 Row X Row X Row X Row X Row X ± M FINISHD HOL SIZ PR USTOMR STNDRDS FOR.0 PB TIL ontact mphenol erospace for more information at

7 hdb 3 daughter board HDB 3 DUGHTR BORD HOW TO ORDR Mates with: Mother Board Number of Brush Wire Termination ontact Termination Less Hardware ontacts Plating Finish (Purchased separately see pg 0 for hardware options). onnector Type HDB-D4 HDB-D4 040 M 0 X Designates HDB 3 Daughter Board. Number of ontacts Number of ontacts PIN MIN. DI. THRU HOL (US NO. SRW) 3. Brush Wire Plating M u Min. thick over Nickel u Min. thick over Nickel 4. Termination Type Stickout (Dim. ) 0 PB, Right ngle,.0 Dia PB, Right ngle,.0 Dia PB, Right ngle,.0 Dia PB, Right ngle,.0 Dia PB, Right ngle,.0 Dia ±.00 TYP F D B.30. ontact Termination Finish Gold plated in accordance with MIL-G-404, Type II, Min. thick Gold over Min. thick Nickel Tin plated in accordance with STM B4,.0000 Min. thick Matte Tin over.0000 Min. thick Nickel Tin-Lead plated in accordance with S-MS-P-878,.0000 Min. thick Tin-Lead over.0000 Min. thick opper u m phenol m phenol Daughter Board Layout.0 ± M.00 u ONNTOR MOUNTING SURF ±.00 TYP Mated Height s DUGHTR BORD ONNTOR DUGHTR BORD BORD DG.03 FINISHD HOL SIZ PR USTOMR STNDRDS FOR.0 PB TIL.070 ontact mphenol erospace for more information at MOTHR BORD MOTHR BORD ONNTOR

8 HDB 3 IO onnector FTURSBNFITS For cable to cable able to board applications rimp termination Uses wire well size D HDB 3 IO HOW TO ORDR Mates with: Standard Mother Board. onnector Type HDB-D4 Designates HDB 3 I0 onnector. Number of ontacts Number of ontacts IO onnector Number of ontacts Brush Wire Plating ontact Termination Finish HDB-D THRD LOKING SRW SUPPLID Mother Board 3. Brush Wire Plating M u Min. thick over Nickel u Min. thick over Nickel 4. ontact Termination Finish Gold plated in accordance with MIL-G-404, Type II, Min. thick Gold over Min. thick Nickel u m phenol 00 9 MTING MOTHR BORD ONNTOR SSMBLD INPUTOUTPUT ONNTOR MTING SURF onnector s No. of ontacts FRONT HLF INPUTOUTPUT ONNTOR RR HLF INPUTOUTPUT ONNTOR THRDD BOSS ( RQUIRD FOR MOTHR BORD ONNTOR S HRDWR ON PG 0) xploded Isometric View LOKING SRWS SUPPLID RMOVBL RIMP ONTTS FOR SIZ THRU 8 GG WIR 4 ontact mphenol erospace for more information at

9 HdB 3 Stacker onnector FTURSBNFITS For applications that need or demand parallel boards Stacker STKR ONNTOR HOW TO ORDR Mates with: Standard Mother Board HDB-D4S 0 X. onnector Type HDB-D4S Designates HDB 3 Stacker onnector.. Select the Number of ontacts Number Diff Signals Number of ontacts Number of ontacts Brush Wire Plating Termination.30 ± ontact Termination Finish MTING SURF Mother Board Less Hardware (Purchased separately see pg 0 for hardware options) 3. Select a Brush Wire Plating M u Min. thick over Nickel u Min. thick over Nickel 4. Select a Termination Type Stickout (Dim. ) PB, Straight,.0 Dia PB, Straight,.0 Dia PB, Straight,.0 Dia PB, Straight,.0 Dia PB, Straight,.0 Dia MX. ontact Termination Finish Gold plated in accordance with MIL-G-404, Type II, Min. thick Gold over Min. thick Nickel u m phenol 00 9 STIKOUT xploded Isometric View HDB3 STKR ONNTOR STNDRD HDB3 MB ONNTOR WITH OPTIONL GUID PINS STNDRD HDB3 MB SHOWN WITH OPTIONL LOKING GUID PINS ontact mphenol erospace for more information at

10 High Speed Brush (HSB 3 ) Series 3. Gbs BNFITS High speed configuration available that allows data rates up to 3. Gbs via 00 ohm matched impedance differential pairs Partially populated standard HDB 3 mother board & daughter board bodies ontact a Sales ngineer for validation results. MOTHR BORD HOW TO ORDR Mates with: High Speed Daughter Board. onnector Type ontact Number of Differential Brush Wire Less Hardware Termination Termination (Purchased separately see Differential Pairs Signal Plating Finish pg 0 for hardware options) HSB-M4 03 D M 4 X HSB-M4 Designates High Speed HSB 3 Mother Board. Number of ontacts Number Differential Pairs No. Low Speed Signals MTING INTRF ONNTOR MOUNTING SURF 3. Differential Signal D Standard PIN 4. Brush Wire Plating M u Min. thick over Nickel u Min. thick over Nickel D. Termination B Type Stickout (Dim. ) PB, Straight,.0 Dia PB, Straight,.0 Dia PB, Straight,.0 Dia 0.80 PB, Straight,.0 Dia PB, Straight,.0 Dia F.30 SHOWN WITH OPTIONL GUID PIN.33 MX. ontact Termination Finish Gold plated in accordance with MIL-G-404, Type II, Min. thick Gold over Min. thick Nickel Tin plated in accordance with STM B4,.0000 Min. thick Matte Tin over.0000 Min. thick Nickel Tin-Lead plated in accordance with S-MS-P-878,.0000 Min. thick Tin-Lead over.0000 Min. thick opper u u m phenol 00 9 m phenol 00 9 STNDRD HDB 3 onnector s No. of ontacts ontact mphenol erospace for more information at

11 High Speed Brush (HSB 3 ) Series 3. Gbs DUGHTR BORD HOW TO ORDR Mates with: High Speed Mother Board Number of Differential Pairs Differential Signals Brush Wire Plating. onnector Type HSB-D4 Designates High Speed HSB 3 Daughter Board Termination ontact Termination Finish Less Hardware (Purchased separately see pg 0 for hardware options) HSB-D4 03 D M 0 X. Select a Number of ontacts Number Diff Pairs No. Low Speed Signals PIN MIN. DI. THRU HOL (US NO. SRW) 3. Differential Signals D Standard 4. Select a Brush Wire Plating M u Min. thick over Nickel u Min. thick over Nickel. Select a Termination Type Stickout (Dim. ) 0 PB, Right ngle,.0 Dia PB, Right ngle,.0 Dia PB, Right ngle,.0 Dia PB, Right ngle,.0 Dia PB, Right ngle,.0 Dia Select a ontact Termination Finish Gold plated in accordance with MIL-G-404, Type II, Min. thick Gold over Min. thick Nickel Tin plated in accordance with STM B4,.0000 Min. thick Matte Tin over.0000 Min. thick Nickel Tin-Lead plated in accordance with S-MS-P-878,.0000 Min. thick Tin-Lead over.0000 Min. thick opper u u m phenol 00 m phenol ±.00 TYP MPTY VITIS F D B.30 ONNTOR MOUNTING SURF ±.00 TYP STNDRD HDB 3 onnector s No. of ontacts ontact mphenol erospace for more information at

12 HSB 3 Layout 40 Pin Body 80 Pin Body 0 Pin Body 0 Pin Body Differential Pairs Low Speed Signal s viewed from front of daughter board connector = 00 Ohm Differential Pair (00 ohm differential contact pairs capable of 3. Gbs data rates) = mpty ontact avity = Standard Digital, low speed signal contacts HSB 3 rrangements 4 F D 3 B 3 Differential Pair (40 Pin Body) 4 F D 3 B 7 Differential Pair (80 Pin Body) 4 F D 3 B 0 Differential Pair (0 Pin Body) 4 F D 3 B 3 Differential Pair (0 Pin body) s viewed from front of daughter board connector 8 ontact mphenol erospace for more information at

13 HSB 3 Recommended Board Layout DUGHTR BORD.07 Ø.0 ±.00 PLS NON-PLTD THRU HOL TYPIL SPING.00 Ø.00 M FINISH HOL SIZ PR USTOMR STNDRDS FOR Ø.0 PB TIL MX.0.0 PLS.0.4 BORD DG DIFFRNTIL PIR MX BORD DG.47.0 Places 7 DIFFRNTIL PIR MX BORD DG 0 DIFFRNTIL PIR.0 9 Places MX BORD DG MOTHR BORD 3 DIFFRNTIL PIR.0 Places SPING.03 Ø.0 ±.00 PLS Ø PLS FINISH HOL SIZ PR USTOMR STNDRDS FOR Ø.0 PB TIL.77 3 DIFFRNTIL PIR.0.0 places 7 DIFFRNTIL PIR PLS 0 DIFFRNTIL PIR PLS 3 DIFFRNTIL PIR ontact mphenol erospace for more information at

14 Hardware FOR hdb 3 ND HSB 3 connectors HRDWR FOR LL ONFIGURTIONS (Sold Separately) MOTHR BORD PRT NUMBR TYP STIKOUT HDB POLRIZTION KY (QTY ) 0.0 HDB POLRIZTION KY (QTY ) 0.00 HDB POLRIZTION KY (QTY ) 0.70 HDB GUID PIN (QTY ) 0.0 HDB GUID PIN (QTY ) 0.00 HDB GUID PIN (QTY ) 0.70 HDB THRDD BOSS (QTY )* 0.0 HDB THRDD BOSS (QTY )* 0.00 HDB THRDD BOSS (QTY )* 0.70 HDB LOKING GUID PIN (QTY ) 0.0 HDB LOKING GUID PIN (QTY ) 0.00 HDB LOKING GUID PIN (QTY ) 0.70 * Required with Mother Board only when mating to IO onnector Shown with Mother Board onnector on page DUGHTR BORD PRT NUMBR TYP STIKOUT HDB POLRIZTION KY (QTY ) 0.00 HDB LOW PROFIL MOUNTING NUT (QTY ) 0.4 xploded Isometric View DUGHTR BORD ONNTOR SSMBLY MOTHR BORD ONNTOR GUID PIN (OPTIONL) POLRIZTION KYS (OPTIONL) MOTHR BORD ONNTOR SSMBLY NOT INLUDD XPLODD ISOMTRI VIW SHOWN WITH OPTIONL KYING XPLODD ISOMTRI VIW SHOWN WITH OPTIONL GUID PIN LOW PROFIL MOUNTING NUT (OPTIONL) XPLODD ISOMTRI VIW SHOWN WITH OPTIONL LOW PROFIL MOUNTING NUT - SRW ND WSHR PLS (NOT SUPPLID) 0 ontact mphenol erospace for more information at

15 mphenol erospace mphenol orporation mphenol erospace 40-0 Delaware venue Sidney, New York Phone: mail: Web: MIL-DTL-30 BRUSH ONTT THNOLOGY - atalog -03 mphenol Bristle Brush ontact: Multiple Strands of High Tensile Strength Wires Bundled Together, Providing Superior lectrical onnection with Low Mating Force HIGH PRFORMN LIN RPLBL MODUL (LRM) atalog -037 mphenol LRM Surface Mount onnectors meet the high density needs of today s integrated elctronic modules. Design versatility and product reliability makes mphenol the premier choice for the system designer in solving board interconnect requirements. NW Medical able onnector 3 Utilize high performance B brush contact 0 contacts per connector Plug crimp removable contacts Receptacle printed circuit board contacts urrently available in colors, each with a unique keying combination (plug only, user is to provide key hole for receptacle) lso offered as partially populated Notches in plug connector to assist with over molding Notice: Specifications are subject to change without notice. ontact your nearest mphenol orporation Sales Office for the latest specifications. ll statements, information and data given herein are believed to be accurate and reliable but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements or suggestions concerning possible use of our products are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should assume that all safety measures are indicated or that other measures may not be required. Specifications are typical and may not apply to all connectors. MPHNOL is a registered trademark of mphenol orporation. ontact mphenol erospace for more information at

16 Notes ontact mphenol erospace for more information at