CIN::APSE COMPRESSION TECHNOLOGY GET CONNECTED...

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1 CIN::APSE COMPRESSION TECHNOLOGY E N A B L I N G T E C H N O L O G Y F O R T H E M O S T D E M A N D I N G I N T E R C O N N E C T A P P L I C AT I O N S GET CONNECTED...

2 CIN::APSE It takes more than an ordinary connector to support advanced performance interconnect applications. It takes CIN::APSE, a proven solderless Z-axis connector technology that offers exceptional mechanical and electrical performance at signals well above 30 GHz. If you have an interconnect challenge, and need to overcome the restrictions of ordinary connector devices, CIN::APSE can provide the versatile and reliable interconnect solution you need. RoHS Compliant. Innovative Compression-Mount Technology CIN::APSE is a unique, Z-Axis compression interconnect which provides superior mechanical and electrical performance. The contact construction consists of randomly wound gold plated molybdenum wire, formed into a cylindrical shape (Figure 1). Standard contact diameters are 0.020" (0.50 mm) and 0.040" (1.00 mm). The basic CIN::APSE contact configuration consists of a contact installed into a customised plastic insulator with the patented Cinch hourglass hole design (Figure 2). Once in place, the contact extends on both sides of the insulator. Custom made to your specifications, CIN::APSE utilises a multi-point contact that can handle signals well above 30 GHz, while offering a superior combination of small size, low inductance and exceptional resistance to shock, vibration and thermal cycling. Figure 1. Quick, Solderless Installation CIN::APSE is a easily installed in two basic steps, without soldering. First, using alignment features, the CIN::APSE interconnect is positioned between two components with matching connection footprints. Next, the two components are compressed and fastened together (Figure 3). Low Compression Force, Low Contact Resistance The CIN::APSE contact offers one of the best force /deflection ratios in the industry. An average compression force of only 2.5 ounces (71 N) will yield a typical contact resistance of less than 20 mω. This means high I/O count applications can achieve excellent electrical performance with only minimal Z-Axis compression force (Figure 4). Figure 2. Figure 3. Figure 4. 2

3 C I N ::A P S E Contact Configurations 1. Contact only 2. Plunger - Contact 3. Plunger - Contact - Plunger 4. Contact - Spacer - Contact 1. Contact only Versatile Configurations In addition to standard configurations, CIN::APSE can be custom configured to meet your exact footprint and mated heights. Quick-turn machined prototypes Heights ranging from.020" - 1.5" ( mm) Multiple insulator materials Custom compression system design CIN::APSE can be used in almost any application where you need to connect two parallel surfaces. CIN::APSE Applications Digital devices GHz Signal Speeds Chip - PCB (LGA) PCB - PCB (Interposers) Flex Circuit - PCB / Flex Circuit (Interposers) LCD - PCB / Flex Circuit (Interconnect) D Connectors - CIN::APSE (Solutions) Hermetic sealing IP rated EMI Shielding 2. Plunger - Contact 3. Plunger - Contact - Plunger Your Need Solderless Signal Speed and Integrity CIN::APSE Solution CIN::APSE provides the advantages of a solderless connection Easy repairs and upgrades in plant or in the field No risk of damaging expensive boards or components Allows for large mismatches in CTE between substrates CIN::APSE can easily handle signal speeds over 20+ GHz Low inductance of <0.5 nh Low crosstalk and EMI Low signal loss Low circuit resistance of mω 4. Contact - Spacer - Contact High Density CIN::APSE is the leader in high I / O and miniaturization High I/O I/O counts in production exceeding 5,000 Low Profile Standard pitch as small as 1 mm Light Weight Mated height as low as.020" (0.5 mm) or up to 1.5" (38 mm) Low Mass Contacts are 75% - 85% air when fully compressed Reliability Extreme Environments 7 to 11 points of contact per contact Mechanical wiping action Extremely stable over time and temperature High contact normal force Temperature range -200º C to 200º C Low mass contact withstands extreme shock and vibration 3

4 N E W D E V E L O P M E N T S 0.8 mm CIN::APSE Solutions for Small Pitch Applications The proven performance of CIN::APSE technology in a reduced size ideal for high density applications that require pitches down to 0.8 mm. Extremely high density interconnects are needed for many components and applications. Fibre optic transceivers Medical electronics Sensors High density modules Solutions for Low Voltage Drop Applications The introduction of the Ø0.8 mm contact provides a lower line resistance whilst remaining on the standard 1.0 mm CIN::APSE pitch. CIN::APSE technology provides the ability to reduce interconnection voltage drops within a power sensitive system. Electronic control units Remote power sources Weight and Size reduction of power supplies Key CIN::APSE Features for Applications High reliability High density Low mating force Low resistance & inductance Solderless Custom configured to meet your interface pitch requirements Quick turn around machined prototypes Detail of CIN::APSE Contact Reduced Size CIN::APSE Contact on 0.8 mm pitch Standard Size CIN::APSE Contact on 1.0 mm pitch 4

5 C I N ::A P S E 360º CIN::APSE Termination CIN::APSE technology provides a method of termination from 0 and 360 degrees to solve the most complex of routing in ECU designs. The unique method of connector construction enables the designer to vary the angle of termination to aid routing direction of flexible circuits and PCBs within the system. 90º CIN::APSE The advantage of the low profile that CIN::APSE technology provides the ability to rack daughter boards closer together within a system design. Single or multiple row configuration Dual sided PCB interconnection High density Low profile saving space Compression technology Allows for tolerance and CTE mismatch Dual Technology CIN::APSE flexible termination method allows the compression technology to be incorporated within a traditional connector frame to provide a high performing Surface Mount solution. Cinch contact technology withstands extreme shock & vibration, and is extremely stable over time and temperature to provide a viable alternative to the press fit connector technology for demanding environments. 5

6 Military & Aerospace CIN::APSE provides the ability to create innovative connector solutions to meet a new generation of interconnect challenges. CIN::APSE advanced interconnect solutions include high performance Gyroscopes for in-flight control and stabilisation systems. This combined with the next generation of CPU packages connected through CIN::APSE LGA s and CIN::APSE Interposers in Digital Instrumentation & Avionics systems. CIN::APSE direct connections provide a novel yet reliable method of signal routing for Commercial in-flight entertainment visual display units, Guidance, Tracking & Seeker radars and Counter measure protection systems. Satellite & Space CIN::APSE LGAs are lightweight, high contact density and have excellent electrical & mechanical signal properties providing exceptional performance for Multipurpose Geostationary Communication Platforms. CIN::APSE PCB Interposers enable simple routing options for complex multilayer PCB and flex circuits within confined spaces within electronic control units. CIN::APSE multi-configuration custom connectors provides a new dimension for planet and deep space exploration together with the addition of environmental seals for hostile planet environments. 6

7 C I N ::A P S E Radar & Surveillance CIN::APSE multipoint compression contact technology provides ideal connector solutions for Advanced Transmitter and Receiver modules on air, land and sea radar platforms. Systems include CEMS / AESA, UAV and light-weight, compact digital surveillance systems. Telecommunications Advanced telecommunications for next generation mobile networks and internet access through the use of CIN::APSE reliability and high speed component technology. 7

8 Transport CIN::APSE provides the unique ability to make custom interconnector solutions available for electronic displays and sensors where crucial reliability is required within demanding environments. Computer CIN::APSE LGA is the connector of choice for the most demanding CPU / MCM and ASIC-to-board applications in leading: High-end servers Routers High speed switches Main frames 8

9 C I N ::A P S E Connector Performance Specifications Property Requirement Result Electrical Contact Resistance 20mV open 100 ma <15 mω typical Current-Carrying Capacity Maximum current for 30ºC temperature rise 3-6 A Inductance <0.5 nh Insulation 500 VDC >1,000 MΩ Dielectric Withstanding 500 VAC (sea level) No breakdown Mechanical Durability Room temperature >25,000 cycles Vibration 20 Gs; 10-2,000 Hz; no discontinuity greater than 2 nanoseconds No discontinuity Shock 100 Gs; 6 milliseconds; no discontinuity greater than 2 nanoseconds No discontinuity Environmental Temperature Life 1, ºC <5% resistance change 5, ºC <5% resistance change Thermal Shock 100 cycles -55ºC to +85ºC <5 mω change 2,000 cycles -20ºC to 110ºC <5 mω change Low Temperature Liquid nitrogen (-200ºC) <5 mω change Humidity 5,000 30ºC to 80ºC, 85% relative humidity <5 mω change Salt Spray 96 Hours <5 mω change Outgassing 1.0% Total Mass Loss (TML) <1.0% TML 0.1% CVCM ASTM E595 (NASA) Material Contact Material Insulator Housing Packaging Material Molybdenum with 20-30µin, gold plating Liquid Crystal Polymer / Polyetherimide Anti-static ABS 9

10 At Cinch our philosophy is that anything is possible. With over 70 years experience as a global supplier we offer simple, effective solutions to our customers interconnect and integration needs. From basic interconnect to complex integration requiring bespoke design, we focus primarily on quality, ingenuity and reliability, meeting the high performance demands of industries such as Defence, Aerospace, Space, Telecom, High Speed Data Servers and Industrial Transportation. TOGETHER WE STIMULATE, WE INNOVATE, WE CREATE. GET CONNECTED... CINCH CONNECTORS 1700 Finlay Road Lombard IL USA Tel: Fax: info@cinch.com CINCH CONNECTORS LTD. Shireoaks Road Worksop Nottinghamshire S80 3HA Tel: +44 (0) Fax: +44 (0) info@cinch.com Cinch has manufacturing and sales sites located globally approved to AS