SD Memory Card Connectors

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1 SD Memory Card Connectors DM Series Withstands higher force of card insertion. Card Standard type Metal cover extends over the back of the connector. Features. Withstands higher force of card insertion Metal cover extends over the back of the connector allowing it to withstand force of up to 4 N (static load) when dropped or accidentally hit.. No damage to the card when accidentally pulled-out The connectors will release the card when a moderate pull-out force of about 4 N is applied. There will be no damage to the lock components and all connector functions will not be affected. 3. Accidental card fall-out prevention Built-in lock feature holds the card securely in place. 4. Reliable Card Insertion and Withdrawal Built-in Push-in / Push-out ejection mechanism assures simple and reliable card insertion and withdrawal. 5. Designed to accept Secure Digital I/O card (Built-in Ground Contact) The connector allows use of various expansion modules, including the Bluetooth communication modules. Applications Notebook PC's, digital cameras, PDA's, audio/video equipment and other devices utilizing SD I/O cards. Card Reverse type Metal cover extends over the back of the connector. No damage to the card when accidentally pulled-out. Accidental card fall-out prevention C39

2 Product Specifications Rating Current rating.5a DC Voltage rating 5 V AC Operating temperature range:-5ç to +85ç (Note ) Storage temperature range:-4ç to +85ç (Note ) Operating humidity range : Relative humidity 95% max. (No condensation) Item Specification Conditions. Insulation resistance Mø min. (Initial value). Withstanding voltage No flashover or insulation breakdown 3. Contact resistance mø max. (Initial value) 4. Vibration No electrical discontinuity of ns or more 5. Humidity Contact resistance: 4 mø max. from initial value Insulation resistance: Mø min. 6. Temperature cycle Contact resistance: 4 mø max. from initial value Insulation resistance: Mø min. 7. Durability (mating/un-mating) Contact resistance: 4mø max. from initial value 8. Resistance to soldering heat No deformation of components affecting performance. 5 V DC 5 V AC / one minute ma DC Frequency: to 55 Hz, single amplitude of.75 mm, hours / 3 axis 96 hours at temperature of 4ç ± ç and humidity of 9% to 95% Temperature: -55ç/ +5ç to +35ç/ +85ç/ +5ç to +35ç Duration: 3 / 5 / 3 / 5 (Minutes) 5 cycles cycles at 4 to 6 cycles per hour Reflow: At the recommended temperature profile Manual soldering: 3ç for 3 seconds Note: Includes temperature rise caused by current flow. Note: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. Materials Component Material Finish Remarks Insulator Heat resistant thermoplastic compound Color: Black UL94V- Contacts Phosphor bronze Contact area: Gold plating Termination area: Tinned copper plating - Cover Stainless steel Termination area: Tinned copper plating - Others Stainless steel Piano wire - Nickel plating - Ordering information DM AA - SF - PEJ 3 4 Series name Connector type : DM : AA : Standard receptacle : B : Reverse receptacle 3 Terminal type SF : Right angle surface mount DSF : Reverse right angle surface mount 4 Eject mechanism codes PEJ : Card Push insert/push withdraw C4

3 Standard type BPCB mounting pattern 4.5±.5.7±.5 5.4±.5.4±.5 5±.5 P=.5± ± ±.5 ±.5.±.5 Part number HRS No. DMAA-SF-PEJ() ±.5 8.5±.5 9.± ±.5 Card detection switch -Ø.3 +. Write protection switch ±.5 3.±.5 +..± t=.,w= P No. No. No.9 No.4 No.3 No.5 No.6 No.7 No (Card slot dimension).4 -Ø..55 indicates the center line of card slot. Card detection switch Write protection switch When card is ejected When card is inserted When card is ejected When card is inserted WRITE PROTECT WRITE ENABLE OPEN CLOSE OPEN OPEN CLOSE Weight:.g BCard insertion/withdrawal dimensions Card pushed-in for insertion Card fully inserted Card ejected (Card ejected dimension) C4

4 Reverse type BPCB mounting pattern -.5±.5.8± ±.5.8±.5.± ±.5 8.5±.5.5±.5 P=.5± ±.5.5±.5.8±.5.4±.5 CARD DETECT COMMON FOR CD & WP Part number HRS No. DMB-DSF-PEJ ±.5.5±.5 A A 8-.± ±.5.57±.5.3±.5 4.3±.5 4.5±.5.93±.5 C.4±.5 WP 3.48± ±.5 8.5±.5 3 Center of Card dimension B A(5:) B(5:) C(5:).7 +. (Land).3 +. (Through hole). +. (Land).8 +. (Through hole) (Land).5 +. (Through hole). +. (Land).8 +. (Through hole) (Land) +. (Through hole). +. (Land).8 +. (Through hole) (R.6) (R.6) (R.6) (R.4) (R.4) (R.4) (4.35) No.7 No.6 No.5 No.4 No.3 No. No.8 No. No :Card ejected(card ejected dimension) (6):Card fully inserted (5):Card pushed for insertion (.77) (.5) CLindicates the center line of the card slot. indicates the dimension of DIP terminals. Card detection switch When card When card is ejected is ejected OPEN CLOSE Write protection switch When card When card is ejected is ejected WRITE PROTECT WRITE ENABLE OPEN OPEN CLOSE Weight:.g C4

5 BPackaging specifications Embossed Carrier Tape Dimensions (Standard type) 45 pieces per reel.75±. Ø ±. ±.5 36±. 4.35±.3 3.4±.3 44±.3 4.4±..±. Unreeling direction Embossed Carrier Tape Dimensions(Reverse type) 45 pieces per reel.75±. Ø.5 +. ±.5 4±. 36±. 4.6±.3 3.4±.3 44±.3 4.4±..±. Unreeling direction Reel dimensions Unreeling direction D (Ø5) (Ø38) End section Mounting section(45) Lead section (4mm min.) Blank section(6mm min.) Embossed carrier tape Blank section (mm min.) Top cover tape C43

6 Recommended Temperature Profile 3ç IR Reflow Conditions Preheating: 5ç 3 to 9 sec. Soldering : 35±5ç sec. Max. Soldering : ç to sec. MAX4ç ç ç 5ç Soldering Preheating ç ç S 5S S 5S S Recommended Conditions Reflow system Solder Test board Metal mask thickness:.5 mm : IR reflow : Paste type 63 Sn/37 Pb(Flux content 9 wt%) : Glass epoxy 6mm x mm x.6 mm thick Recommended temperature profile. The temperature may be slightly changed according to the solder paste type and thickness. C44

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