LASER TRANSMISSION MICROJOINING TECHNOLOGY FOR PACKAGING OF MEMS
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1 MICROMANUFACTURING 2009, APRIL 1-2, MINNEAPOLIS, MN LASER TRANSMISSION MICROJOINING TECHNOLOGY FOR PACKAGING OF MEMS R. Patwa 1, H. J. Herfurth 1, S. Heinemann 1, Golam Newaz 2 1 Fraunhofer USA, Center for, Port Street, Plymouth, MI 48170, USA 2 Wayne State University, Detroit, MI 48232, USA
2 Outline Introduction - Fraunhofer CLT Laser Transmission Microjoining Applications Joining Dissimilar Materials Results Process Characterization Joining Similar Materials Conclusions
3 Key Competencies at Fraunhofer CLT Unbiased Applied R&D in: Process Development (from Chips to Ships) Consulting to Production Validation Special Optics Engineering of Advanced Lasers - Diode Lasers - Fiber Lasers Unique Turn-Key Systems
4 Outline Introduction - Fraunhofer CLT Laser Transmission Microjoining Applications Joining Dissimilar Materials Results Process Characterization Joining Similar Materials Conclusions
5 Biomedical Applications Next-generation retinal Source: California prosthesis Institute of Technology Glass MEMS Device Cochlear Implant to restore partial hearing Challenges Hermetic sealing Localized bonding Silicon base Long term stability Source: Advanced Bionics, Corp. Biocompatibility Housing of MEMS / Hermetic sealing
6 Laser Transmission Joining Principle During laser transmission microjoining process - The laser radiation is transmitted through the partially transparent top material. It is absorbed at the surface of the bottom material. The laser radiation is converted into heat energy directly at the interface. Schematic of the sample undergoing the bonding process Schematic of sample in fixture
7 Different Joining Methods Simultaneous Quasi-simultaneous Mask
8 Basic Joint Designs laser beam transparent material absorbing material transparent material laser beam absorbing material laser beam laser beam transparent material absorbing material transparent material absorbing material
9 Laser Sources Laser Transmission Joining Setup cw Yb- doped fiber laser (JDSU) Wavelength : 1110 nm Maximum Power : 25 W Fiber Size : 9 µm Laser optic cw Diode laser (Fraunhofer) Wavelength : 808 nm Maximum Power : 27 W Fiber Size : 800 µm Sample Fixture cw Nd:YAG laser (Trumpf) Wavelength : 1064 nm Maximum Power : 1000 W Fiber Size : 600 µm
10 Material Combination Matrix Transparent Absorbing Imidex Teflon PEBAX PVDF Polyurethane PEEK Borosilicate glass PA PMMA Nitinol X X Chromium coating X X Stainless steel X X X Titanium X X X Silicon X Titanium coated glass X X X ABS X PA X Metal - Polymer Ceramic Metal/Ceramic Polymer - Polymer
11 Measured Laser Power (W) Optical Properties of Materials Polymer Cover glass + Imidex Cover glass + PEEK No Cover glass & No Polymer Glass Absorption ( ), 1 0 Transmissivity of Imidex with cover glass = 79.8 % Transmissivity of PEEK with cover glass = 80.9 % Applied Laser Power (W) Transmission ( ) Silicon
12 Laser Power (W) Laser power [W] Process Optimization Process parameter window is determined to optimize bond formation process. Metal-Polymer Glass-Silicon (Log) Speed (mm/min) no effect Imidex changes color Weak Bond Bond Strong Bond Very Strong Bond Burned 35 good bond no bond 30 temporarily bonded partially melted completely melted Speed [mm/min]
13 Outline Introduction - Fraunhofer CLT Laser Transmission Microjoining Applications Joining Dissimilar Materials Results Process Characterization Joining Similar Materials Conclusions
14 Metal-Polymer Bonding Chromium - PEEK Titanium - Imidex View Nitinol - PEEK Titanium - PVDF As is bond surface top view Nitinol - Imidex Chromium - Imidex Titanium - Polyurethane
15 Metal-Polymer Bonding Bond line Titanium coated glass/ Imidex bond Stainless steel/pebax bond
16 Silicon-Glass Joining Material Silicon (Top), Borosilicate Glass (Bottom) Diode laser 30 W, 60 mm/min Nd:YAG laser 35 W, 200 mm/min Fiber laser Spot Bond
17 laser power [ W ] Laser power [ W ] Temperature Control for Plastic Welding signal processor optical fibre temperature detector laser beam L L T focussing lens filter laser power detector distance [ mm ] temperature [ C] temperature radiation L T focussing lens workpiece temperature [ C] Custom optic for temperature control distance [ mm ] Diode laser; 5 m/min
18 Load (grams) Failure Load (N) Joint Characterization Failure Load Limit Metal-Polymer Polymer-Polymer 6000 Nitinol/Imidex Chromium/Imidex Chromium/PEEK Nitinol/PEEK Titanium/Imidex Thickness - 3.1mm Thickness - 2.4mm Displacement (mm) Thickness - 1.9mm Speed (m/min)
19 Pull Strength (N/mm2) Maximum Pull Strength (N/mm2) Joint Characterization Shear Pull Strength Nitinol/PEEK Metal-Polymer Laser Power (W) 0 Nitinol/Imidex Nitinol/PEEK Chromium/PEEK Chromium/Imidex Titanium/Imidex
20 Failure Load (N/mm 2 ) Joint Characterization Degradation in Cerebrospinal fluid (CSF) Material combination: Glass: Pyrex 7740 Ti-coated Imidex: mm thick Laser: Fiber laser Weeks in CSF Solution at 37 o C Average failure load as bonded: 21.5 N/mm 2
21 Joint Characterization Pressure Testing Sample Titanium: 3 mm x 5 mm; hole diameter = 1 mm Imidex: O. D. 2 mm Pressure test setup Result Burst pressure: 80 bar Tensile strength: 8 N/mm 2
22 Joint Characterization He-Leak Testing Polyimide to Titanium Substrate: 2.6 x 10-6 Std. cc/sec/cm 2 Bond: 3.4 x 10-6 Std. cc/sec/cm 2 Leak rate slightly higher Helium Vacuum Laser Bond Helium detector/ Mass spectrometer Laser: Fiber laser Power: 4.2 W Speed: 100 mm/min
23 Joint Characterization SEM Analysis
24 Joint Characterization XPS Analysis Material combination: Imidex/Titanium Bond Lines Titanium Surface XPS Signal Collection Area C1S lines Ti2p lines
25 Competing Technologies Laser Micro-joining Advantages - Highly localized - Precise bond lines - Heat affected zone (HAZ) confined to very small volume of material - Encapsulation design flexibility Ultrasonic Welding Advantages - Lower initial equipment cost Adhesive Bonding Advantages - Good for area bonds - Non-contact process
26 Outline Introduction - Fraunhofer CLT Laser Transmission Microjoining Applications Joining Dissimilar Materials Results Process Characterization Joining Similar Materials Conclusions
27 Glass-to-Glass Welding Material: Glass wafer (Pyrex 7740) Thickness: 0.5 mm Laser: Pulsed CO 2 (Rofin SC x10) Power: Speed: 65 W >25.0 m/min Multiple scans Butt Joint (33 W, 100 mm/min) Cross-section
28 Glass-to-Glass Welding 0.25 mm T - Joint Fillet Edge Joint Fillet Edge Joint 0.25 mm Cross-section Cross-section
29 Conclusions Laser transmission microjoining of similar and dissimilar material combinations has been successfully achieved. The results demonstrate the similarities and differences between the different material systems and underscored the importance of laser microjoining technology for such applications. This study provides a database of novel joining combinations that can be commercialized for industrial applications. This technology clearly exhibits a high potential for laser joining processes to address the increasing demand for packaging applications.
30 Thank you for your attention! CONTACT- Rahul Patwa Fraunhofer Center for Port Street Plymouth, Michigan 48170
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