PACKAGE QUALIFICATION SUMMARY REPORT

Size: px
Start display at page:

Download "PACKAGE QUALIFICATION SUMMARY REPORT"

Transcription

1 PACKAGE QUALIFICATION SUMMARY REPORT Document Control #: Purpose: Device: Mask Identification #: Process Technology: Product: To provide qualification summary report for all packages Various Various Pure Matte Tin (Sn) Plating Process (400 µin (10 µm) 1000 µin (25 µm), Pre-Plated Leadframe (), or SnAgCu based solder bump Various devices plated with Matte Tin,, or with solder spheres Updated: June 21, 2013

2 DOCUMENT CONTROL # PACKAGE QUALIFICATION SUMMARY REPORT CONTENTS 1) QUALIFICATION OVERVIEW 2) RELIABILITY TEST DESCRIPTIONS 3) QUALIFICATION RESULTS & RELEASE STATUS 4) CONCLUSION RESULTS SUMMARY The assembly using Matte Tin plating, or solder spheres complies with the reliability guidelines documented in the qualification plan. Name Department/Function Date Author S. Pokharel Quality Engineering June 21, 2013 Approved by A. Kumar Quality Engineering June 21, 2013 Manager Approved by A. Navarro FA & Reliability June 21, 2013 Manager Approved by G. Perzanowski Quality Director June 21, 2013 Approved by F. Chen Assembly Engineering June 21, 2013 Manager Approved by A. Abbott Product Environmental Compliance Manager June 21,

3 DOCUMENT CONTROL # 1 QUALIFICATION OVERVIEW The purpose of this report is to verify that the qualification testing was performed in accordance with the documented qualification plan required by Microchip specification QCI-39000, Worldwide Quality Conformance Requirements. The performance requirements was based on having passing moisture sensitivity level, package reliability, JEDEC tin whiskers growth test results per JESD22A121 & JESD201A requirements. ASSEMBLY OR PLATING SITE APTOS TECHNOLOGY ADVANCED SEMICONDUCTOR ENGINEERING GROUP, CHUNG LI ADVANCED SEMICONDUCTOR ENGINEERING GROUP, TAIWAN ADVANCED SEMICONDUCTOR ENGINEERING GROUP, SHANGHAI AMKOR TECHNOLOGY CHINA (aka ANAC) AMKOR TECHNOLOGY KOREA (aka ANAK) AMKOR TECHNOLOGY PHILIPPINES (aka ANAP) CARSEM (M) SDN BHD CARSEM SEMICONDUCTOR SDN BHD CIRCUIT ELECTRONIC INDUSTRIES CIRTEK ELECTRONICS CORP. GREATEK ELECTRONICS HANA MICROELECTRONIC KINGPAK TECHNOLOGY INC. LINGSEN PRECISION INDUSTRIES MILLENNIUM MICROTECH SHANGHAI (aka ATES) MILLENNIUM MICROTECH THAILAND (aka ALPH) MICROCHIP TECHNOLOGY THAILAND POWERTECH TECHNOLOGY INC. SILICON PRECISION INDUSTRIES UNISEM (M) BERHAD, MALAYSIA UNISEM CHINA UNISEM (M) SINGAPORE UTAC HOLDINGS (aka ASAC) UTAC THAI LIMITED (aka NSEB) VIGILANT TECHNOLOGY CO. LTD DESIGNATION APTS ASCL ASE ASSH ATC ATK ATP CARM CARS CEI CRTK GTK HANA KTI LPI MMS MMT MTAI PTI SPIL UNIB UNIC UNIS UTAC UTL VGT 3

4 DOCUMENT CONTROL # 1.1 Qualification Plan In keeping with guidelines established in QCI for new assembly packages or processes a minimum of three assembly lots would be used for package qualification testing. Representative samples of each package family and subcontractor were used to qualify the entire set of packages manufactured at each subcontractor. Each package selected would be subjected to all tests. In addition, data was collected to verify the solderability of the Matte tin lead finish in both the standard solder bath as well as a representative Pb-Free solder (note 4). Tin whisker reliability testing was performed in compliance to JESD22A121 & JESD201A requirements. A detailed qualification plan is listed below. ing Surface mount devices would be subjected to preconditioning stress before HAST, Unbiased HAST (UHAST), and Temperature Cycling. HAST Devices would be subjected to 96 hours of Highly Accelerated Stress Test (HAST). Unbiased HAST ( UHAST ) Devices would be subjected to 96 hours of Unbiased HAST testing. or Autoclave (Pressure Cooker). Temperature Cycling Devices would be subjected to 500 temperature cycles. Solderability Devices would be subjected to 8 hours of steam aging and then tested for solderability issues. Whiskers Growth Devices would be subjected to 1500 temperature cycles, 4000 hours ambient bake, and 4000 hours high temperature moisture bake. 1.2 Qualification Test Conditions Tests are performed in accordance with QCI-39000, Worldwide Quality Conformance Requirements. TEST METHOD CONDITION CRITERIA Pre-Conditioning (SMD only) JESD22-A113E 1. Electrical 25 C 2. SAM exam C Bake for 24hrs C/85% R.H. for 168hrs or 30 C/60% R.H. for 192hrs 5. Reflow C or 245 C 6. SAM exam 7. Electrical 25 C 0/all surface mount devices HAST JESD22-A110B 130 C/85%/96hrs 0/77 Unbiased HAST (UHAST) or JESD22-A C/85%/96hrs or 0/77 Unbiased Autoclave ( PCT ) 121 C/ 100%/96hrs Temperature Cycling JESD22-A104C -65 C to +150 C/500 cycles 0/77 Solderability Test Table 3.3 Solder temp. 245 C SMD & Through hole Rosin Flux 0/22 4

5 DOCUMENT CONTROL # Backward Compatibility Solderability Test Table 3.1 Forward Compatibility Solderability Test Table 3.2 Whiskers Growth (Matte tin lead finish, SnAgCu 95.5/3.9/0.6 Solder) Solder temp. 245 C Through hole 215 C SMD Rosin Flux (Matte tin lead finish, 60/40 SnPb Solder) MIL-STD 883 Method 2003 Solder temp. 265 C ± 5 C SMD & Through hole (SnPb lead finish, Sn/Ag/Cu Solder) All tin whisker reliability testing was performed per the requirements in JEDEC specifications JESD22A121 & JESD201A. 55 (+0/-10) C to +85 (+10/-0) C or -40 (+/-10) C to +85 (+10/-0) C for 1500 cycles 30±2 C/60±2% RH 4000 hrs Bake 55±3 C /85±3% RH 4000 hrs Bake 0/22 0/22 Max whisker lengths: 45um for temp cycle test and 40um for ambient/high temp & humidity tests. 2 RELIABILITY TEST DESCRIPTIONS 2.1 ing This test consists of the following tests run in a consecutive order. The tests are electrical testing at 25 C, C- SAM, Bake 150 C 24 hour, a moisture soak, 3X Reflow cycles, C-SAM and ending with electrical testing at 25 C. 2.2 Highly Accelerated Stress Test (HAST) This test is similar to autoclave, but under more severe conditions. Device pins are connected in an alternating bias of 5 volts (or the upper rated Vdd/Vcc level) and ground. 2.3 Unbiased HAST (UHAST) The unbiased HAST is performed for the purpose of evaluating the reliability on non-hermetic packaged solid-state devices in humid environments.it is a highly accelerated test with temperature and humidity that are exposed to condition 130 o C, 85 % relative humidity for a period of 96 hours. 2.4 Temperature Cycle This stress test is used to determine if any structural defects are present in a packaging design. This test is intended to reveal potential defects related to wire bonding, cracked die, substrate mounting and thermal mismatch. 2.5 Solderability Test This test is to evaluate the solderability of terminations that are normally joined by a soldering operation. The specimens subjected to this test are immersed in a flux and then dipped in a molten solder bath. 5

6 DOCUMENT CONTROL # 2.6 Autoclave (Pressure Cooker) The purpose of this test is to determine the resistance of the package to moisture under high temperature and humidity conditions. This test may cause such potential failure mechanisms as metal corrosion or ionic contamination. Unbiased devices are exposed to conditions of o C, at 15 PSI (one atmosphere), and 100% relative humidity for a period of 96 hours. 2.7 Whisker Growth This test is to determine the susceptibility of the plated matte tin finish to form a dendrite type of growth referred to as whiskers. One potential effect of excessive whisker growth includes electrical shorting between two adjacent pins. Please note that the minimum matte tin thickness is 400 µin (10 µm) and that a post plating bake or anneal process (150 C for 1 hr) is currently being utilized for all matte tin plated product to mitigate the risk of tin whiskers. This anneal process is performed within 24 hours after the matte tin deposit. 6

7 3.0 QUALIFICATION RESULTS 3.1 Backward Solderability Compatibility Results () Plating Site Solder Paste Composition Flux Type Lead finish Solder Temp. Package Type Result MTAI / MMT/UTL/ATP/ HANA/UNIS/CARM Sn60Pb40A Rosin Flux 100% matte Sn 215 C SMD Passed Sn60Pb40A Rosin Flux 100% matte Sn 245 C Through hole Passed MMS/ATK/ATC/CARM Sn60Pb40A Rosin Flux 100% matte Sn 215 C SMD Passed Sn60Pb40A Rosin Flux 100% matte Sn 245 C Through hole Passed 3.2 Forward Solderability Compatibility Results (MIL-STD 883 Method 2003) Plating Site Solder Paste Composition Flux Type Lead finish Solder Package Type Temperature MTAI / MMT Sn/Ag/Cu (96.5%/3.0%/0.5%) 100 R-type Sn/Pb 265 C SMD & Through hole Passed UTL Sn/Ag/Cu (95.5%/4.0%/0.5%) 145 R-type Sn/Pb 265 C SMD Passed ATP Sn/Ag/Cu (95.8%/3.5%/0.7%) Alpha 100 Sn/Pb 265 C SMD Passed MMT Sn/Ag/Cu (96.5%/3.0%/0.5%) 100 R-type Sn/Pb 265 C SMD Passed 3.3 Pb-free Solderability Results (, Note 4) Plating Site Solder Paste Composition Flux Type Lead finish Solder Temp. Package Type Result MTAI /MMT/ MMS/UTL/ATP/ ATK/ATC/CARS/UNIS Result SnAgCu (95.5/3.9/0.6) Rosin Flux 100% matte Sn 245 C SMD Passed MTAI / MMT/ATP/ /UNIS SnAgCu (95.5/3.9/0.6) Rosin Flux 100% matte Sn 245 C Through hole Passed Note 4: Pb-free refers to non-snpb based solder bath. 7

8 3.4 Package Reliability Test Results & Release Status By Pincount Package Assembly Site MSL Results To J-STD-020C Profile Solderability Results To Lead Finish HAST UHAST & PCT Temp. Cycling Package Release Status (Qualification Report Number) 3L DDPAK CARM Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q08187), Qualified By Similarity To 5L DDPAK 3L SC70 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04004,Q04059 for NCDA) 3L SC70 UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04143, Q07096) 3L SC70 CARM Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06256) 3L SOT23 MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06008,Q06009,Q08080,Q08009,Q10083) Qualified By Similarity To 5L SOT23 3L SOT23 MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07104), Qualified By Similarity To 6L SOT23 3L SOT23 UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04149,Q07004) 3L SOT23 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04140, Q04141), Qualified By Similarity To 6L SOT23 3L SOT 23A LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12062) 3L SOT23A HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06236,Q12028 ) 3L SOT89 CEI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05002,Q06255) 3L SOT89 HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06244) 3L SOT89 LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12061) 3L SOT223 HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07145, Q07169) 3L SOT223 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07170, Q08006, Q09078) 3L TO-220 CARM Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08119), Qualified by similarity to 5L TO-220 3L TO-92 GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08166) 4L SOT143 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07173) 4L SOT143 MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10100) 5L DDPAK CARM Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q08187) 8

9 Package Assembly Site MSL Results To J-STD-020C Profile Solderability Results To Lead Finish HAST UHAST & PCT Temp. Cycling Package Release Status (Qualification Report Number) 5L SC70 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04004, Q04059), Similarity To 3L SC70 5L SC70 UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04143) 5L SC70 HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05070) 5L SC70 (COL) UTL Pass Pass MSL1/260C Pass NiPdAu Pass Pass Pass Released Q10066,Q11114,Q L SOT23 MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06001,Q07021,Q08074,Q10083,Q08080) 5L SOT23 MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07104), Qualified By Similarity To 6L SOT23 5L SOT23 UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04149,Q07098) 5L SOT23 UTL Pass Pass MSL1/260C Pass NiPdAu Pass Pass Pass Released (Q11027) 5L SOT23 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04141 ), Qualified By Similarity To 6L SOT23 5L SOT23 HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06150) 5L SOT23(COL) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08020) 5L SOT223 HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07080) 5L SOT223 LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12005 ) 5L SOT223 GTBF Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q11132 ) 5L TO-220 CARM Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08119) 5L TSOT UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06214, Q06261) 6L DFN (2x2x0.9) UTL Pass Pass MSL1/260C Pass NiPdAu Pass Pass Pass Released (Q10074) 6L SC70 (COL) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09014) 6L SOT23 MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06039, Q07021,Q08074,Q10083,Q10088) 6L SOT23 MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07104) 6L SOT23 UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04149,Q05108) 9

10 Package Assembly Site MSL Results To J-STD-020C Profile Solderability Results To Lead Finish HAST UHAST & PCT Temp. Cycling Package Release Status (Qualification Report Number) 6L SOT23 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04141) 6L SOT23 (COL) MTAI Pass Pass MSL1/260C Pass NiPdAu Pass Pass Pass Released (Q12004,Q12008) 6L SOT23 (COL) UTL Pass Pass MSL1/260C Pass NiPdAu Pass Pass Pass Released (Q09004) 6L TDFN (2x2x0.8) UNIS Pass Pass MSL1/260C Pass NiPdAu Pass Pass Pass Released (Q10036) 6L TSOT UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08147) 6L UQFN (3x1.6x0.55) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QU6E) 6L XSON (1.5x1.5x0.45) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QX6E 8L DFN (2x3x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05125,Q08162,Q09098,Q10078,Q11022) 8L DFN (2x3x0.9) CARS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04106) 8L DFN (2x3x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09018) 8L DFN (3x3x0.9) ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04105,Q05047) 8L DFN (3x3x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05125) 8L DFN (4x4x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05130,Q09057,Q10070) 8L DFN (4x4x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06185,Q08002) Qualified by similarity 44L QFN(8x8) at UNIS per CCB#796 8L DFN (5x6x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05125,Q07174,Q09094) 8L DFN (5x6x0.9) ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04101,Q05003) 8L MSOP MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06007,Q06229,Q07067,Q10090) 8L MSOP MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10037) 8L MSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08065,Q09087) Qualified By Similarity To 10L MSOP 8L MSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09121) Qualified By Similarity To 10L MSOP 8L PDIP ATP Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09086), Qualified By Similarity To 14L PDIP 8L PDIP CEI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q02111) 8L PDIP MTAI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09048) 8L PDIP GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (PQF-GEI-PAE) 10

11 Package Assembly Site MSL Results To J-STD-020C Profile Solderability Results To Lead Finish HAST UHAST & PCT Temp. Cycling Package Release Status (Qualification Report Number) 8L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08081) 8L PDIP MMS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09108) 8L PDIP UTL Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q07166) 8L PDIP UNIS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q04034) 8L PDIP VGT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09049) 8L SOIC MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10089, Q09054,Q08191,Q09002,R04140), 8L SOIC ASCL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASECL-SAE) 8L SOIC ASSH Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASESH-SAE) 8L SOIC GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12042) 8L SOIC GTK Pass Pass MSL3/260C Pass NiPdAu Pass Pass Pass Released (PQF-GEI-SAF) 8L SOIC MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09068) 8L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09085, Q04097), Qualified By Similarity To 16L SOIC 8L SOIC UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04053) 8L SOIC MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04122,Q08016,Q10108) 8L SOIC ATC Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04103,Q05233) 8L SOIC UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04100,Q09036,Q09122) 8L SOIC VGT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05153,Q08079,Q10107,Q09045) 8L SOIC LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12037) 8L SOIC LPI Pass Pass MSL3/260C Pass NiPdAu Pass Pass Pass Released (PQF-LPI-SAF) 8L SOIC (COL) MTAI Pass Pass MSL1/260C Pass NiPdAu Pass Pass Pass Released (Q10116) 8L SOIC (EIAJ) MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04084,R04125,Q06029,Q10082,Q10057,Q09023,Q10094) 8L SOIC (EIAJ) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04009,Q07167,Q08085,Q09067) 8L SOIC (EIAJ) HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04089) 8L SOIC (EIAJ) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-S2AE) 11

12 Package Assembly Site MSL Results To J-STD-020C Profile Solderability Results To Lead Finish HAST UHAST & PCT Temp. Cycling Package Release Status (Qualification Report Number) 8L SOIC (EIAJ) GTK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-GEI-S2AE) 8L SOIJ-S LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (CCB1064, REL ) 8L TDFN (2x3x0.8) UNIS Pass Pass MSL1/260C Pass NiPdAu Pass Pass Pass Released (Q09012) 8L TDFN (2x3x0.8) UTL Pass Pass MSL1/260C Pass NiPdAu Pass Pass Pass Released (Q07171,Q08169,Q09038,Q L USON (2x3x0.6, COL) LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (R12023) 8L TDFN (5x6x0.8) LPI Pass Pass MSL3/260C Pass NiPdAu Pass Pass Pass Released (PQF-LPI-QAF) 8L TDFN (5x6x0.8) GTK Pass Pass MSL3/260C Pass NiPdAu Pass Pass Pass Released (PQF-GEI-QAF) 8L TDFN (5x6x0.8) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QAE) 8L TDFN (5x6x0.8) GTK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-GEI-QAE) 8L TDFN (5x6x0.8) ASCL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASECL-QAE) 8L TSSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q03024,Q07046,Q08093) 8L TSSOP UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06020,Q06237) 8L TSSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07101) 8L TSSOP VGT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08090,Q09046) 8L TSSOP MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12031) 8L UDFN (2x3x0.5) UTL Pass Pass MSL1/260C Pass NiPdAu Pass Pass Pass Released (Q08068,Q09104) 8L WSON (5x6x0.8) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QAE) 8L WSON (5x6x0.8) GTK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-GEI-QAE) 8L WSON (5x6x0.8) ASCL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASECL-QAE) 8L XSON (2x2x0.45) ASCL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASECL-QX8E) 8L XSON (2x2x0.45) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QX8E) 8L X2SON (2x2x0.40) LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (CCB ) 10L DFN (3x3x0.9) CARS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04155) 10L DFN (3x3x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05125,Q09016,Q11021,Q11082) 12

13 Package Assembly Site MSL Results To J-STD-020C Profile Solderability Results To Lead Finish HAST UHAST & PCT Temp. Cycling Package Release Status (Qualification Report Number) 10L MSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08065,Q09087) 10L MSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08173,Q09121,Q11078) 10L UDFN(3.3x3.3x0.5) NSEB Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q11099 ) 12L XQFN (2x2x0.45) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QXBE) 12L X2QFN (2x2x0.40) LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (CCB , REL ) 14L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08046) 14L PDIP ATP Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09086) 14L PDIP HANA Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q05234), Qualified By Similarity To 16L PDIP 14L PDIP UNIS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q06080) 14L PDIP VGT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09095) 14L SOIC MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04165,Q06082,Q08189) 14L SOIC MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q03175,Q08038) 14L SOIC UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04074) 14L SOIC HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04060, Q04061) 14L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q03129,Q04071), Qualified by Similarity To 28L SOIC 14L SOIC GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10076) 14L TSSOP UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07006) 14L TSSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09083,Q07090,Q11072) 14L TSSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05030,Q09109,Q11104,Q11124) 14L TSSOP VGT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08070,Q09097) 14L TSSOP MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12091,Q12093) 16L PDIP HANA Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q05234) 16L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08076) 16L PDIP GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q10086) 16L PDIP ATP Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09084) 16L PDIP UNIS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q06092) 16L QFN (3x3x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08154) 16L QFN (4x4x0.9) CARS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05001) 16L QFN (4x4x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05129,Q07024,Q08171,Q11024) 13

14 Package Assembly Site MSL Results To J-STD-020C Profile Solderability Results To Lead Finish HAST UHAST & PCT Temp. Cycling Package Release Status (Qualification Report Number) 16L QSOP UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06174) 16L QSOP HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05076) 16L QSOP MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07078) 16L SOIC (150) ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09085) 16L SOIC (150) MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08072,Q10103,Q12013,Q12014) 16L SOIC (150) GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10076) 16L SOIC (150) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08064) Similarity To 20L SOIC(150) 16L SOIC (300) ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09080) 16L SOIC (300) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08064) Qualified By Similarity To 20L SOIC(300) 16L SOIC (300) GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10065), Qualified by Similarity To 20L SOIC 16L SOIC (300) ASCL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASECL-SCE) 16L TSSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10001,Q12052 ) 16L TSSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09034) 16L VQFN (3x3x0.9) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QVCE) 16L WQFN (3x3x0.75) LPI Pass Pass MSL3/260C Pass NiPdAu Pass Pass Pass Released (PQF-LPI-QCF) 18L PDIP ATP Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08155) 18L PDIP UTL Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q07159) 18L PDIP MTAI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09055) 18L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q07125) 18L PDIP MMS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q04029), Qualified By Similarity To 28L PDIP 18L SOIC UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04100) 18L SOIC MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04169,Q07102,Q08081,Q08087,Q10004,R04124) 18L SOIC MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04092Q10120), Qualified By Similarity To 28L SOIC 18L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04071),Qualified By Similarity To 28L SOIC 20L PDIP ATP Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08112) 20L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08089) 14

15 Package Assembly Site MSL Results To J-STD-020C Profile Solderability Results To Lead Finish HAST UHAST & PCT Temp. Cycling Package Release Status (Qualification Report Number) 20L UQFN 3x3x0.55) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (CCB ) 20L QFN (4x4x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05127,Q09058) 20L QFN (4x4x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06040,Q08002,) Qualified by Similarity To 44L QFN 8x8 20L QFN (5x5x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08160,Q09011) 20L SSOP MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05025,Q06246,Q08083,Q10136) 20L SSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04158), Qualified By Similarity To 28L SSOP 20L SSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05209) 20L TSSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04102,Q07119) 20L TSSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08124) 20L SOIC UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08064,Q09102) 20L SOIC UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07037) 20L SOIC GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10065) 20L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07103) 20L SOIC MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06055,Q08026,Q09101) 24L PDIP ATP Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08123) 24L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q02110), Qualified By Similarity To 40L PDIP 24L QFN (4x4x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08091) 24L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04071), Qualified By Similarity To 28L SOIC 24L SOIC MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06050) 24L SSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04158), Qualified By Similarity To 28L SSOP 24L SSOP GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10072) 24L SSOP UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09031) 24L WQFN (4x4x0.75) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QDE) 24L TFBGA (6x8x1.2) LPI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1157) 28L PDIP UTL Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q07158) 28L PDIP MTAI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q07164) 28L PLCC ATP Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q08078) 28L PLCC MMT Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (Q06053) 15

16 Package Assembly Site MSL Results To J-STD-020C Profile Solderability Results To Lead Finish HAST UHAST & PCT Temp. Cycling Package Release Status (Qualification Report Number) 28L QFN(5x5x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12002,Q11107) 28L QFN (6x6x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08002,Q09072), Qualified By Similarity To 44L QFN ( 8x8) CCB#893 28L QFN (6x6x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05129,Q08122) 28L QFN (6x6x0.9) ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10121) 28L QFN (6x6x0.9) ASAC Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10115) 28L QFN-S (6x6x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08002,Q09072), Qualified By Similarity To 44L QFN 8x8 28L QFN-S (6x6x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09060,Q09125) 28L SPDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q07124) 28L SPDIP GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q10098) 28L SPDIP MTAI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08130) 28L SPDIP UNIS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q04037) 28L SOIC MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q004092,Q10049) 28L SOIC MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04091) 28L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04071) 28L SOIC MTAI Pass Pass MSL1 or 3/260C Pass Matte Sn Pass Pass Pass Released (Q04169,Q06083,Q09111) Note 3 28L SSOP MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07007,Q09008,Q10092,Q11066) 28L SSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04158,Q08135) 28L UQFN (4x4x0.5) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09041) 32L PDIP GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (PQF-GEI-PHE) 32L PDIP LPI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (PQF-LPI-PHE) 32L PLCC GTK Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (PQF-GEI-NHE) 32L PLCC LPI Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-NHE) 32L TQFP (7x7x1) ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q05106) 32L TSOP (8x14) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-WHE) 32L TSOP (8x14) SPIL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-SPIL-WHE) 34L WFBGA (4x6x0.8) LPI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB ) 16

17 Package Assembly Site MSL Results To J-STD-020C Profile Solderability Results To Lead Finish HAST UHAST & PCT Temp. Cycling Package Release Status (Qualification Report Number) 34L WFBGA (4x6x0.8) PTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1088) 36L VTLA (5x5x0.9) ASAC Pass Pass MSL1/260C Pass NiPdAu Pass Pass Pass Released (Q11131) 40L PDIP CEI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08195) 40L PDIP UTL Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08185) 40L PDIP LPI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (PQF-LPI-PIE) 40L PDIP GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (PQF-GEI-PIE) 40L PDIP MTAI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08149) 40L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q02110) 40L QFN (5x5x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09072), Qualified by similarity to 44L QFN 8x8 40L QFN (5x5x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08159), Qualified by similarity to 44L QFN 8x8 40L QFN (6x6x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08004) 40L TSOP (10x20) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-EIE) 40L UQFN (5x5x0.5) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10050) 40L WQFN (6x6x0.8) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QIF) 44L MQFP (10x10x2) ATP Pass Pass MSL 3/260C Pass Matte Sn Pass Pass Pass Released (Q08045) Note 2 44L MQFP (10x10x2) MMT Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q08023,Q11060) Note 2 44L PLCC ATP Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q08051) 44L PLCC MMT Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q09099,Q08027,Q11093,Q11094) 44L PLCC MMS Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q05205,Q06240) 44L PLCC GTK Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (PQF-GEI-NJE) 44L QFN (8x8x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08002,Q09072) 44L QFN (8x8x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06108,Q08159,Q09033,Q11004) 44L TQFP (10x10x1) 44L TQFP (10x10x1) 44L TQFP (10x10x1) MTAI Pass Pass MSL1 /260C Pass Matte Sn Pass Pass Pass Released (Q04057,Q09029,Q10003,Q06058,Q06251,Q08174) ASAC Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06045,Q09120,Q09133) Note 2 ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q04087), Qualified By Similarity To 64L TQFP (10X10) Note 2 17

18 Package Assembly Site MSL Results To J-STD-020C Profile Solderability Results To Lead Finish HAST UHAST & PCT Temp. Cycling Package Release Status (Qualification Report Number) 44L TQFP (10x10x1) 44L TQFP (10x10x1) ATK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q ), Qualified By Similarity To 80L TQFP (12X12) Note 2 LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-TQJE) 44L VLAP (6x6x0.9) ASAC Pass Pass MSL3/260C Pass NiPdAu Pass Pass Pass Released (Q10045,Q10046,Q11084) 48L TQFP (7x7x1mm) ATK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q12036) 48L TFBGA (6x8x1.2) PTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-PTI-B3KE) 48L TFBGA (6x8x1.2) LPI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1055, REL ) 48L TQFP (7x7x1mm) ATK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q12036) 48L TFBGA (6x8x1.2) APTS Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-APTS-B3KE) 48L TFBGA (6x8x1.2) ASSH Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ASESH-B3KE) 48L TFBGA (6x8x1.2) KTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-KTI-B3KE) 48L TFBGA (6x8x1.2) PTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-PTI-B3KE) 48L TFBGA (6x8x1.2) SPIL Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-SPIL-B3KE) 48L TSOP (12x20) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-EKE) 48L TSOP (12x20) SPIL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-SPIL-EKE) 48L UQFN (6x6x0.5) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09064,Q11004) 48L WFBGA (4x6x0.8) ATK Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ATK-MAQE) 48L WFBGA (4x6x0.8) SPIL Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-SPIL-MAQE) 48L WFBGA (4x6x0.8) ASCL Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ASECL-MAQE) 48L WFBGA (5x6x0.8) ATK Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ATK-MBQE) 48L WFBGA (5x6x0.8) SPIL Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-SPIL-MBQE) 48L XFLGA (4x6x0.6) ATK Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ATK-C1QE) 48L XFLGA (5x6x0.6) ATK Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ATK-C2QE) 48L WFBGA (4x6x0.8) LPI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB ) 48L WFBGA (5x6x0.8) LPI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB , REL ) 48L WFBGA (4x6x0.8) PTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1088) 48L WFBGA (5x6x0.8) PTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1088, Rel report # ) 64L QFN (9x9x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08145,Q09106,Q10138,Q11026) 18

19 Package Assembly Site MSL Results To J-STD-020C Profile Solderability Results To Lead Finish HAST UHAST & PCT Temp. Cycling Package Release Status (Qualification Report Number) 64L TQFP CARS Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q02005) (10x10x1) 64L TQFP ASAC (UDG) Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q09118,Q09135,Q06060,Q11092) (10x10x1) 64L TQFP ATK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q08044) (10x10x1) 64L TQFP (10x10x1) ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q04087) Note 2 64L TQFP (10x10x1) MTAI Pass Pass MSL1/260 Pass Matte Sn Pass Pass Pass Released (Q04065,Q07101,Q08176,Q09075,Q10005,Q11028) 64L TQFP (14x14x1) ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q ), Qualified By Similarity To 80L TQFP (14X14) Note 2 64L TQFP UTAC Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06065), Note 2 (14x14x1) 68L PLCC ATP Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (Q08049) Note 2 68L PLCC MMT Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (Q08021) Note 2 80L TQFP (12x12x1) ATK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06096,Q10047) Note 2 80L TQFP ASAC Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06217,Q08175,Q10038,Q11049,Q11067) (12x12x1) 80L TQFP (12x12x1) CARS Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q ) 80L TQFP (12x12x1) MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06063,Q07083,Q08073,Q09079,Q11052,Q12009) 80L TQFP ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q07099) (14x14x1) 80L TQFP (14x14x1) ASAC Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06066,Q06067) Note 2 84L PLCC ATP Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (Q08050), Note 2 84L PLCC MMT Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (Q08029), Note 2 19

20 Package Assembly Site MSL Results To J-STD-020C Profile Solderability Results To Lead Finish HAST UHAST & PCT Temp. Cycling Package Release Status (Qualification Report Number) 100L TQFP (12x12x1) 100L TQFP (12x12x1) 100L TQFP (14x14x1) 100L TQFP (14x14x1) 121L TFBGA (10x10x1.1) MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06224,Q08161,Q26225,Q09079,Q11029) Note3 ASE Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06074) ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q05141,QQ06043,Q11033) Note 2 ASAC Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06207,Q08177,Q11089,Q11090) ATP Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (Q09003,Q09103,Q11038) 124L VTLA (9x9x0.9) ASAC Pass Pass MSL1/260C Pass NiPdAu Pass Pass Pass Released ( Q11083) 144L TQFP (16x16x1mm) 144L TQFP (20x20x1.4mm) ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q11073) ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q11079) Note 1: Not required for through hole packages. Note 2: Although the package qualification passed MSL1/260 C conditions, MCHP is offering the package as MSL3/260 C due to concerns with normal variability in BOM and manufacturing affecting MSL performance. This is to inform customers that the MSL level stated in the individual package qualification reports is different than the one being reported in table 3.4 of this Package Qualification Summary Report. Note 3: Dependent on the package bill of materials, i.e. leadframe paddle size, mold compound, etc. As part of Microchip s continuous improvement efforts, the MSL classification may improve to the desired MSL1 classification. MSL1 units are shipped in low-temp trays therefore these trays should not be used for baking parts. 20

21 3.5 Please see the attached document for Microchip s tin whisker reliability test status. Tin Whisker Test Package Plating Site Tin Whisker Test Lead Frame Type Package Qualified By Tin Whisker Test Lead Frame Type Pre inspection Tin Whisker Measurement Result Temperature Cycling (cycles) High Temperature & Humidity Ambient Temperature & Humidity 500 1,000 1,500 1,000 2,000 3,000 4,000 1,000 2,000 3,000 4,000 No Pass Pass Pass Pass Pass Pass Pass - Pass Pass Pass Pass 3L SOT -89 CEI Cu 8/24/40L PDIP Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass - Pass Pass Pass Pass Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass - Pass Pass Pass Pass 3L TO-92 GTK C194 5L DDPAK CARM HCL-12S 8/16/24L SOIC, 24L SSOP, 8/16/32/40L PDIP, 8L SOIJ, 28L SPDIP 3L DDPAK 3/5L TO 220 No Pass Pass Pass Pass Pass Pass - - Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass - - Pass Pass Pass Pass Pb-Free Reflow Pass Pass Pass Pass Pass Pass - - Pass Pass Pass Pass No Pass Pass Pass - Pass Pass Pass - Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass - Pass Pass Pass - Pass Pass Pass Pass Pb-Free Reflow Pass Pass Pass - Pass Pass Pass - Pass Pass Pass Pass 5L SOT 223 HANA C194 8L EIAJ UTL C194 3L SOT 223, 3/5L SOT-23, 3LSOT-89 8/14/16/18L PDIP, 14L SOIC, 8L SOIJ, 16L QSOP 3/5/6 SOT23 3/5/6 L SC70 8/18/28/40L PDIP, 28LSPDIP, 8/16/18/20L SOIC, 8L MSOP, 20L SSOP No Pass Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass 21

22 Tin Whisker Test Package Plating Site Tin Whisker Test Lead Frame Type Package Qualified By Tin Whisker Test Lead Frame Type Pre inspection Tin Whisker Measurement Result Temperature Cycling (cycles) High Temperature & Humidity Ambient Temperature & Humidity 500 1,000 1,500 1,000 2,000 3,000 4,000 1,000 2,000 3,000 4,000 No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass 8L SOIC ANAC C194 8L SOIC MMS C194 3/5/6L SOT-23, 4L SOT-143, 8L MSOP, 44L PLCC, 8/18 PDIP 16L QSOP 18/28L SOIC 8L SOIC VGT C194 8/14L PDIP 8L TSSOP UTL C L TSSOP ANAP C7025 8/10L MSOP 14/16/20L TSSOP 8/16/20L TSSOP 44L MQFP 14L TSSOP UNIS C7025 8L TSSOP, 24L SSOP 14L TSSOP VGT C7025 8L TSSOP, 8L SOIC Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass No Pass Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass No Pass Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass

23 Tin Whisker Test Package Plating Site Tin Whisker Test Lead Frame Type Package Qualified By Tin Whisker Test Lead Frame Type Pre inspection Tin Whisker Measurement Result Temperature Cycling (cycles) High Temperature & Humidity Ambient Temperature & Humidity 500 1,000 1,500 1,000 2,000 3,000 4,000 1,000 2,000 3,000 4,000 Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass L QSOP UNIS C194 28L SOIC MTAI C194 28L SOIC MMT C194 3/5/6L SOT 23 5L TSOT,5L SC70 14L PDIP, 20L SOIC 28L SPDIP, 3L SOT 223 8L MSOP, 28L SPIDP, 8/18/28/40L PDIP 8/14/18L SOIC 8L EIAJ,3/5/6 LSOT23 20/28L SSOP 8/14/16/20 L SOIC 8/14/16/18/20/24/40L PDIP 28L SPDIP, 44L TQFP No Pass Pass Pass Pass Pass Pass Pass Pass(S) Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass No Pass Pass Pass Pass Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass 28L SSOP ANAP C194 8/14/16/18/20/24L PDIP 8/10L MSOP, 8/14/16/18/20/24/28L SOIC,20/24/L SSOP 80L LQFP, 80L TQFP, 16L QSOP, 5/6L TSOT No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass 44L TQFP ANAP EFTEC64T 64L TQFP ASAC EFTEC64T 32/64/80/100/144L TQFP, Sn-Pb Reflow 128/144L LQFP Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass No Pass Pass Pass Pass Pass Pass Pass Pass 44/80/100L TQFP Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass 23

24 Tin Whisker Test Package Plating Site Tin Whisker Test Lead Frame Type Package Qualified By Tin Whisker Test Lead Frame Type Pre inspection Tin Whisker Measurement Result Temperature Cycling (cycles) High Temperature & Humidity Ambient Temperature & Humidity 64L TQFP MMT C L TQFP, 44L MQFP, 8/14L TSSOP 64L TQFP MTAI C /80/100L TQFP 80L TQFP ANAK EFTEC64T 44/64L TQFP 100L TQFP ASAC EFTEC64T 44/64/80L TQFP 8L SOP LPI C194 5L SOT- 89 LPI KFCAG 3L SOT 89 48L TSOP LPI C L TQFP, 32/40L TSOP 500 1,000 1,500 1,000 2,000 3,000 4,000 1,000 2,000 3,000 4,000 No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass No Pass Pass Pass Pass Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass No Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Sn-Pb Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pb-Free Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) No Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) 32/40L PDIP, 8/16L SOIC, 8L SOIJ, 8L SOIJ-S, Sn-Pb Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) 5L SOT0223 Pb-Free Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) No Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Sn-Pb Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pb-Free Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) No Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Sn-Pb Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pb-Free Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) 24

25 Tin Whisker Test Package Plating Site Tin Whisker Test Lead Frame Type Package Qualified By Tin Whisker Test Lead Frame Type Pre inspection Tin Whisker Measurement Result Temperature Cycling (cycles) High Temperature & Humidity Ambient Temperature & Humidity 500 1,000 1,500 1,000 2,000 3,000 4,000 1,000 2,000 3,000 4,000 No Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) 3L SOT-23 LPI EFTEC64T Sn-Pb Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pb-Free Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) NOTE: All tin whisker reliability testing was performed per the requirements in JEDEC specifications JESD22A121 & JESD201A. The tin whisker acceptance criteria was based on the class 2 requirements in JESD201A, which is 45 um for the temperature cycling test and 40 um for the ambient/high temperature & humidity tests. Pass (S) is tin whisker reliability test data from Microchip's assembly subcontractor (whisker testing was performed using a different package type). Sn-Pb and Pb-free reflows have a peak reflow temperature of 215 C and 245 C respectively and both reflow profiles comply to J-STD

26 4.0 CONCLUSION The assembly using Matte Tin plating, or solder spheres complies with the reliability guidelines documented in the qualification plan. Compliance was based on passing moisture sensitivity level (JEDEC J-STD-020 compliance for SMD), package reliability, solderability ( compliance for SMD and through hole packages), and JEDEC whiskers growth test results per the JESD22A121 & JESD201A requirements. Therefore, the assembly using Matte Tin plating or for these packages is released for production using die from all of Microchip s process technologies and product fabricated at silicon foundries for the packages and assembly sites outlined in table

PACKAGE QUALIFICATION SUMMARY REPORT

PACKAGE QUALIFICATION SUMMARY REPORT PACKAGE QUALIFICATION SUMMARY REPORT Document Control #: Purpose: Device: Mask Identification #: Process Technology: Product: To provide qualification summary report for all packages Various Various Pure

More information

PACKAGE QUALIFICATION SUMMARY REPORT

PACKAGE QUALIFICATION SUMMARY REPORT PACKAGE QUALIFICATION SUMMARY REPORT Document Control #: Purpose: Device: Mask Identification #: Process Technology: Product: ML1120110066 To provide qualification summary report for all packages Various

More information

Self Qualification Results

Self Qualification Results (ATO) Divisional Philips Semiconductors Philips Internal Report No.: RNR- 8 3-03/RdH/RdH- 2 0 3 6 QTS Report Database No.: 030692 Self Qualification Results NiPdAu lead- free solution of SO14/16/20 Products

More information

RJR Polymers Reliability Qualification Report RQFN55-24-A and RQFN44-12-A

RJR Polymers Reliability Qualification Report RQFN55-24-A and RQFN44-12-A Reliability Qualification Report RQFN55-24-A and RQFN44-12-A Package Qualification September 14, 2011 RJR Polymers Reliability Qualification Report RQFN55-24-A and RQFN44-12-A Table of Contents Purpose.3

More information

Customer Service Note Lead Frame Package User Guidelines

Customer Service Note Lead Frame Package User Guidelines Customer Service Note Lead Frame Package User Guidelines CSN30: Lead Frame Package User Guidelines Introduction Introduction When size constraints allow, the larger-pitched lead-frame-based package design

More information

Reliability Stress Test Descriptions

Reliability Stress Test Descriptions 1. Solder Reflow Preconditioning (PRECON): The preconditioning stress sequence is performed for the purpose of evaluating the capability of semiconductor devices to withstand the stresses imposed by a

More information

JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

JEDEC SOLID STATE TECHNOLOGY ASSOCIATION JEDEC STANDARD Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing JESD22-A113D (Revision of JESD22-A113C) AUGUST 2003 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC

More information

Flip Chip Package Qualification of RF-IC Packages

Flip Chip Package Qualification of RF-IC Packages Flip Chip Package Qualification of RF-IC Packages Mumtaz Y. Bora Peregrine Semiconductor San Diego, Ca. 92121 mbora@psemi.com Abstract Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages

More information

REVISION HISTORY APPROVERS

REVISION HISTORY APPROVERS REVISION HISTORY Revision Description of Change Writer/Reviser Effective Date 1.0 As Issued. Renumbered from PEC-MAT-2-003-00. Lenora Bennett January 23, 2012 2.0 Updated Table 1 Nickel barrier specifications

More information

Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages

Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction This Application Note provides sample PCB land pattern

More information

White Paper. Modification of Existing NEBS Requirements for Pb-Free Electronics. By Craig Hillman, PhD

White Paper. Modification of Existing NEBS Requirements for Pb-Free Electronics. By Craig Hillman, PhD White Paper Modification of Existing NEBS Requirements for Pb-Free Electronics By Craig Hillman, PhD Executive Summary Thorough review of the relevant NEBS requirements identified several areas of concerns

More information

JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

JEDEC SOLID STATE TECHNOLOGY ASSOCIATION JEDEC STANDARD Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing JESD22-A113F (Revision of JESD22A113E, March 2006) OCTOBER 2008 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

More information

Application Note AN-0994 Maximizing the Effectiveness of your SMD Assemblies

Application Note AN-0994 Maximizing the Effectiveness of your SMD Assemblies Application Note AN-0994 Maximizing the Effectiveness of your SMD Assemblies Table of Contents Page Method...2 Thermal characteristics of SMDs...2 Adhesives...4 Solder pastes...4 Reflow profiles...4 Rework...6

More information

Technical Note Recommended Soldering Parameters

Technical Note Recommended Soldering Parameters Technical Note Recommended Soldering Parameters Introduction Introduction The semiconductor industry is moving toward the elimination of Pb from packages in accordance with new international regulations.

More information

RoHS / Lead-Free Initiative. Microsemi Analog Mixed Signal Group

RoHS / Lead-Free Initiative. Microsemi Analog Mixed Signal Group RoHS / Lead-Free Initiative Microsemi Analog Mixed Signal Group Table of Contents RoHS / Pb-Free Initiative............................................... 3 RoHS / Pb-Free Transition Strategy......................................

More information

Taping, Labeling, Storage, Packing and Marking

Taping, Labeling, Storage, Packing and Marking Taping, Labeling, Storage, Packing and Marking Vishay Semiconductor Standard Bar Code Labels Standard bar code labels for finished goods The standard bar code labels are product labels and used for identification

More information

Solder Reflow Guide for Surface Mount Devices

Solder Reflow Guide for Surface Mount Devices June 2015 Introduction Technical Note TN1076 This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is

More information

Wurth Electronics Midcom Policy Statement on RoHS Compliance And Lead-Free Products

Wurth Electronics Midcom Policy Statement on RoHS Compliance And Lead-Free Products Wurth Electronics Midcom Policy Statement on RoHS Compliance And Lead-Free Products General Environmental Policy Wurth Electronics Midcom is committed to the manufacture of environmentally-friendly products

More information

IP4234CZ6. 1. Product profile. Single USB 2.0 ESD protection to IEC 61000-4-2 level 4. 1.1 General description. 1.2 Features. 1.

IP4234CZ6. 1. Product profile. Single USB 2.0 ESD protection to IEC 61000-4-2 level 4. 1.1 General description. 1.2 Features. 1. Rev. 01 16 April 2009 Product data sheet 1. Product profile 1.1 General description The is designed to protect Input/Output (I/O) USB 2.0 ports, that are sensitive to capacitive loads, from being damaged

More information

HI-200, HI-201. Features. Dual/Quad SPST, CMOS Analog Switches. Applications. Ordering Information. Functional Diagram FN3121.9

HI-200, HI-201. Features. Dual/Quad SPST, CMOS Analog Switches. Applications. Ordering Information. Functional Diagram FN3121.9 Data Sheet FN3121.9 Dual/Quad SPST, CMOS Analog Switches HI-200/HI-201 (dual/quad) are monolithic devices comprising independently selectable SPST switches which feature fast switching speeds (HI-200 240ns,

More information

PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices

PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices Introduction There is an industry-wide trend towards using the smallest package possible for a given pin count. This is driven primarily

More information

Molded. By July. A chip scale. and Omega. Guidelines. layer on the silicon chip. of mold. aluminum or. Bottom view. Rev. 1.

Molded. By July. A chip scale. and Omega. Guidelines. layer on the silicon chip. of mold. aluminum or. Bottom view.  Rev. 1. Application Note PAC-006 By J. Lu, Y. Ding, S. Liu, J. Gong, C. Yue July 2012 Molded Chip Scale Package Assembly Guidelines Introduction to Molded Chip Scale Package A chip scale package (CSP) has direct

More information

Product Specification

Product Specification Product Specification Model No.: DC-240-L01-00-TR Description: H=3.00mm Horizontal SMD DC Power Jacks Pin Shaft Diameter: 0.65mm Packing Method: Tape & Reel (600pcs./R) 1. General 1a. Scope The jacks should

More information

DOMINANT. Opto Technologies Innovating Illumination. 150 InGaN Warm White : NAF-BSG DATA SHEET : Primax TM. Features: Applications:

DOMINANT. Opto Technologies Innovating Illumination. 150 InGaN Warm White : NAF-BSG DATA SHEET : Primax TM. Features: Applications: DATA SHEET : Primax TM 150 InGaN Warm White : NAF-BSG Primax TM Synonymous with function and performance, enter the Primax, the new era of high intensity illumination in LED. With its high flux output

More information

MuAnalysis. Printed Circuit Board Reliability and Integrity Characterization Using MAJIC. M. Simard-Normandin MuAnalysis Inc. Ottawa, ON, Canada

MuAnalysis. Printed Circuit Board Reliability and Integrity Characterization Using MAJIC. M. Simard-Normandin MuAnalysis Inc. Ottawa, ON, Canada Printed Circuit Board Reliability and Integrity Characterization Using MAJIC M. Simard-Normandin Inc. Ottawa, ON, Canada Abstract The recent need to develop lead-free electrical and electronic products

More information

IPC/JEDEC J-STD-020C. Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices

IPC/JEDEC J-STD-020C. Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices IPC/JEDEC J-STD-020C Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices Proposed Standard for Ballot January 2004 1 PURPOSE The purpose of this standard is to

More information

RoHS-Compliant Through-Hole VI Chip Soldering Recommendations

RoHS-Compliant Through-Hole VI Chip Soldering Recommendations APPLICATION NOTE AN:017 RoHS-Compliant Through-Hole VI Chip Soldering Recommendations Ankur Patel Associate Product Line Engineer Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 4 Pin/Lead

More information

Analysis of BGA Solder Joint Reliability for Selected Solder Alloy and Surface Finish Configurations

Analysis of BGA Solder Joint Reliability for Selected Solder Alloy and Surface Finish Configurations Analysis of BGA Solder Joint Reliability for Selected Solder Alloy and Surface Finish Configurations Hugh Roberts / Atotech USA Inc Sven Lamprecht and Christian Sebald / Atotech Deutschland GmbH Mark Bachman,

More information

Cypress Semiconductor Technology Qualification Report

Cypress Semiconductor Technology Qualification Report Cypress Semiconductor Technology Qualification Report QT# 012415 VERSION 1.2 November, 2002 TSMC 0.15um Technology, Fab TSMC CY7C1371B/CY7C1373B CY7C1381B/CY7C1383B CY7C1381BV25/CY7C1383BV25 CY7C1371BV25/CY7C1373BV25

More information

Reliability Handbook

Reliability Handbook Contents Integrity and Reliability Package Integrity Tests Device Reliability Tests Appendix 1 Calculations Appendix 2 Example of Failure Rate Calculation INTEGRITY AND RELIABILITY ZETEX Semiconductors

More information

UV SMD LED PLCC-2 FEATURES APPLICATIONS. at I F (ma) (ma) MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.

UV SMD LED PLCC-2 FEATURES APPLICATIONS. at I F (ma) (ma) MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX. UV SMD LED PLCC-2 VLMU31 19225 DESCRIPTION The package of the VLMU31-series is the PLCC-2. It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled

More information

CHAPTER 6 THERMAL DESIGN CONSIDERATIONS. page. Introduction 6-2. Thermal resistance 6-2. Junction temperature 6-2. Factors affecting R th(j-a) 6-2

CHAPTER 6 THERMAL DESIGN CONSIDERATIONS. page. Introduction 6-2. Thermal resistance 6-2. Junction temperature 6-2. Factors affecting R th(j-a) 6-2 CHAPTER 6 THERMAL DESIGN CONSIDERATIONS page Introduction 6-2 Thermal resistance 6-2 Junction temperature 6-2 Factors affecting 6-2 Thermal resistance test methods 6-3 Test procedure 6-3 Forced air factors

More information

Features. Typical Applications G9. ProLight PEA2-3FVE 3W Warm White AC LED Technical Datasheet Version: 1.7 1 DS-0042

Features. Typical Applications G9. ProLight PEA2-3FVE 3W Warm White AC LED Technical Datasheet Version: 1.7 1 DS-0042 ProLight PEA2-3FVE 3W Warm White AC LED Technical Datasheet Version: 1.7 Features High Color rendering index Follow ANSI C78.788.2008 Chromaticity co-ordinates High flux per LED Good color uniformity Industry

More information

Fab Site Transfer. REASON FOR CHANGE: Closure of Santa Clara Fab and Global Foundries. EXPECTED INFLUENCE ON QUALITY/RELIABILTY/PERFORMANCE: None

Fab Site Transfer. REASON FOR CHANGE: Closure of Santa Clara Fab and Global Foundries. EXPECTED INFLUENCE ON QUALITY/RELIABILTY/PERFORMANCE: None Product Group: Vishay Siliconix/May 20, 2014/PCN- SIL-0442014 Rev1 Fab Site Transfer DESCRIPTION OF CHANGE: For the 45M cell products listed in this notification we are changing the Fab site from Santa

More information

Solutions without Boundaries. PCB Surface Finishes. Todd Henninger, C.I.D. Sr. Field Applications Engineer Midwest Region

Solutions without Boundaries. PCB Surface Finishes. Todd Henninger, C.I.D. Sr. Field Applications Engineer Midwest Region Solutions without Boundaries PCB Surface Finishes Todd Henninger, C.I.D. Sr. Field Applications Engineer Midwest Region 1 Notice Notification of Proprietary Information: This document contains proprietary

More information

Solder Joint Temperature and Package Peak Temperature Determining Thermal Limits during Soldering

Solder Joint Temperature and Package Peak Temperature Determining Thermal Limits during Soldering Freescale Semiconductor Application Note Document Number: AN3298 Rev. 0, 07/2006 Solder Joint Temperature and Package Peak Temperature Determining Thermal Limits during Soldering 1 Processability of Integrated

More information

What is surface mount?

What is surface mount? A way of attaching electronic components to a printed circuit board The solder joint forms the mechanical and electrical connection What is surface mount? Bonding of the solder joint is to the surface

More information

TN0991 Technical note

TN0991 Technical note Technical note Description of WLCSP for STMicroelectronics EEPROMs and recommendations for use Introduction This document describes the 5 and 8-bump WLCSPs (wafer level chip size package) used for STMicroelectronics

More information

High Ohmic/High Voltage Metal Glaze Leaded Resistors

High Ohmic/High Voltage Metal Glaze Leaded Resistors High Ohmic/High Voltage Metal Glaze Leaded Resistors FEATURES Technology: Metal glaze A metal glazed film is deposited on a high grade ceramic body. After a helical groove has been cut in the resistive

More information

Quad Flat Package (QFP)

Quad Flat Package (QFP) Freescale Semiconductor Application Note AN4388 Rev. 2.0, 2/2014 Quad Flat Package (QFP) 1 Introduction This document provides guidelines for handling and assembly of Freescale QFP packages during Printed

More information

Failure Analysis (FA) Introduction

Failure Analysis (FA) Introduction Failure Analysis (FA) Introduction (III - Reliability ) Tung-Bao Lu 1 of 23 Reliability Stress Stress Reliability Geberal Condition Temperature Humidity Electrical Others Precondition Baking/L3/Reflowing

More information

Mounting of Meritec SMT Products Using Lead-Free Solder

Mounting of Meritec SMT Products Using Lead-Free Solder Mounting of Meritec SMT Products Using Lead-Free Solder 10/10/08 rev B Mounting of Meritec SMT Products Using Lead-Free Solder Contents Page 2 Scope Page 3 Test Samples/Preparation Page 3 Facilities/Equipment

More information

Compliant Terminal Technology Summary Test Report

Compliant Terminal Technology Summary Test Report Engineering Report ER04100 October 5th, 2004 Revision A Copyright Autosplice Inc., September 2004 Table of Contents Summary Overview 3 Compliant Terminal Specifications 3 Test Plan 4 Test Conditions 4

More information

Power chip resistor size 2512 PRC221 5%; 2% FEATURES Reduced size of final equipment Low assembly costs Higher component and equipment reliability.

Power chip resistor size 2512 PRC221 5%; 2% FEATURES Reduced size of final equipment Low assembly costs Higher component and equipment reliability. FEATURES Reduced size of final equipment Low assembly costs Higher component and equipment reliability. APPLICATIONS Power supplies Printers Computers Battery chargers Automotive Converters CD-ROM. QUICK

More information

JOINT INDUSTRY STANDARD

JOINT INDUSTRY STANDARD JOINT INDUSTRY STANDARD IPC/JEDEC J-STD-020D.1 March 2008 Supersedes IPC/JEDEC J-STD-020D August 2007 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Notice

More information

LEAD FREE HALOGENFREE. Würth Elektronik PCB Design Conference 2007. Lothar Weitzel 2007 Seite 1

LEAD FREE HALOGENFREE. Würth Elektronik PCB Design Conference 2007. Lothar Weitzel 2007 Seite 1 LEAD FREE HALOGENFREE Würth Elektronik PCB Design Conference 2007 Lothar Weitzel 2007 Seite 1 Content Solder surfaces/overview Lead free soldering process requirements/material parameters Different base

More information

Handling, soldering & mounting instructions

Handling, soldering & mounting instructions Tri-axial acceleration sensor SMB380 SMB380 Order code 0 273 141 006 Package type QFN Release version 1.0 Release date 2007-07-23 Notes Rev. 1.0 Specifications are Page subject 1 to change without notice

More information

How do you create a RoHS Compliancy-Lead-free Roadmap?

How do you create a RoHS Compliancy-Lead-free Roadmap? How do you create a RoHS Compliancy-Lead-free Roadmap? When a company begins the transition to lead-free it impacts the whole organization. The cost of transition will vary and depends on the number of

More information

Overview of Risk Assessment, Mitigation, and Management Research for Pb-free Electronics

Overview of Risk Assessment, Mitigation, and Management Research for Pb-free Electronics Overview of Risk Assessment, Mitigation, and Management Research for Pb-free Electronics Formed 1987 Electronic Products and Systems Center College Park, MD 20742 (301) 405-5323 http://www.calce.umd.edu

More information

Introduction to the Plastic Ball Grid Array (PBGA)

Introduction to the Plastic Ball Grid Array (PBGA) Introduction to the Plastic Ball Grid Array (PBGA) Q1, 2008 Terry Burnette Dec. 15, 2005 Presentation Outline PBGA Introduction and Package Description PC Board Design for PBGA PBGA Assembly PBGA Solder

More information

A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages

A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages Bernd K Appelt Director WW Business Development April 24, 2012 Table of Content Definitions Wafer Level

More information

Soldering of SMD Film Capacitors in Practical Lead Free Processes

Soldering of SMD Film Capacitors in Practical Lead Free Processes Soldering of SMD Film Capacitors in Practical Lead Free Processes Matti Niskala Product Manager, SMD products Evox Rifa Group Oyj, a Kemet Company Lars Sonckin kaari 16, 02600 Espoo, Finland Tel: + 358

More information

Automotive and Anti-Sulfuration Chip Resistor 0402

Automotive and Anti-Sulfuration Chip Resistor 0402 The resistors are constructed in a high grade ceramic body (aluminium oxide). Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the

More information

Typical Performance 1. IS-95C ACPR 21.0 - - - dbm WCDMA ACLR - 19.5 18.5 - dbm

Typical Performance 1. IS-95C ACPR 21.0 - - - dbm WCDMA ACLR - 19.5 18.5 - dbm Device Features OIP3 = 45.0 dbm @ 1900 MHz Gain = 15.0 db @ 1900 MHz Output P1 db = 27.5 dbm @ 1900 MHz 50 Ω Cascadable Patented Over Voltage Protection Circuit Lead-free/RoHS-compliant SOT-89 SMT package

More information

How To Test A Sidactor Series For A Power Supply

How To Test A Sidactor Series For A Power Supply SDP Series - SOT23-5 RoHS Pb e3 Description This new SIDACtor series is targeted for the tertiary or line driver side protection position for VDSL2+, ADSL2 applications and general I/O protection functions.

More information

ALTERNATIVE ASSEMBLY SITE FOR THE EPC CONFIGURATION FAMILY

ALTERNATIVE ASSEMBLY SITE FOR THE EPC CONFIGURATION FAMILY Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0903 ALTERNATIVE ASSEMBLY SITE FOR THE EPC CONFIGURATION FAMILY Change Description Altera is introducing Amkor, Philippines (ATP) and Amkor, Korea (ATK) as

More information

Agilent T-1 3 / 4 (5 mm), T-1 (3 mm), 5 Volt, 12 Volt, Integrated Resistor LED Lamps Data Sheet

Agilent T-1 3 / 4 (5 mm), T-1 (3 mm), 5 Volt, 12 Volt, Integrated Resistor LED Lamps Data Sheet Agilent T-1 3 / (5 mm), T-1 (3 mm), 5 Volt, 12 Volt, Integrated Resistor LED Lamps Data Sheet HLMP-16, HLMP-161, HLMP-162, HLMP-1621 HLMP-16, HLMP-161, HLMP-36, HLMP-361 HLMP-365, HLMP-3651, HLMP-36, HLMP-361

More information

Power SMD LED PLCC-2 Plus

Power SMD LED PLCC-2 Plus Power SMD LED PLCC-2 Plus 2238 DESCRIPTION The VLMW51.. white LED in PLCC-2 plus package is an advanced product in terms of high luminous flux and low thermal resistance. In combination with the small

More information

Taking the Pain Out of Pb-free Reflow

Taking the Pain Out of Pb-free Reflow Taking the Pain Out of Pb-free Reflow Paul N. Houston & Brian J. Lewis Siemens Dematic Electronics Assembly Systems (770) 797-3362 Presented at APEX 2003, Anaheim CA Daniel F. Baldwin Engent, Inc. Norcross,

More information

Advanced Technologies and Equipment for 3D-Packaging

Advanced Technologies and Equipment for 3D-Packaging Advanced Technologies and Equipment for 3D-Packaging Thomas Oppert Semicon Russia 15 th May 2014 Outline Short Company Introduction Electroless Plating on Wafer Level Ultra-SB 2 - Wafer Level Solder Balling

More information

Pb-Free Plating for Electronic Components

Pb-Free Plating for Electronic Components Pb-Free Plating for Electronic Components by Morimasa Tanimoto *, Hitoshi Tanaka *, Satoshi Suzuki * and Akira Matsuda * The authors have developed Pb-free tin alloy plating materials. Preliminary ABSTRACT

More information

QPL. Advanced Lead Frame Services From Design to Delivery

QPL. Advanced Lead Frame Services From Design to Delivery QPL Advanced Lead Frame Services From Design to Delivery CORPORATE OVERVIEW Founded in 1982, QPL Limited is a global supplier of lead frames for the semiconductor industry. With headquarters in Hong Kong

More information

Edition 2012-032 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon Technologies AG All Rights Reserved.

Edition 2012-032 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon Technologies AG All Rights Reserved. Recommendations for Printed Circuit Board Assembly of Infineon Laminate Packages Additional Information DS1 2012-03 Edition 2012-032 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon

More information

Bob Willis leadfreesoldering.com

Bob Willis leadfreesoldering.com Assembly of Flexible Circuits with Lead-Free Solder Alloy Bob Willis leadfreesoldering.com Introduction to Lead-Free Assembly Video Clips Component www.bobwillis.co.uk/lead/videos/components.rm Printed

More information

High Ohmic/High Voltage Metal Glaze Leaded Resistors

High Ohmic/High Voltage Metal Glaze Leaded Resistors VR37 High Ohmic/High Voltage FEATURES A metal glazed film is deposited on a high grade ceramic body. After a helical groove has been cut in the resistive layer, tinned electrolytic copper wires are welded

More information

WCAP-CSGP Ceramic Capacitors

WCAP-CSGP Ceramic Capacitors A Dimensions: [mm] B Recommended land pattern: [mm] D1 Electrical Properties: Properties Test conditions Value Unit Tol. Capacitance 1±0.2 Vrms, 1 khz ±10% C 15000 pf ± 10% Rated voltage Dissipation factor

More information

Assembly of LPCC Packages AN-0001

Assembly of LPCC Packages AN-0001 Assembly of LPCC Packages AN-0001 Surface Mount Assembly and Handling of ANADIGICS LPCC Packages 1.0 Overview ANADIGICS power amplifiers are typically packaged in a Leadless Plastic Chip Carrier (LPCC)

More information

Introducing Green Materials and Bill of Material change for the Cyclone II and MAX II Devices

Introducing Green Materials and Bill of Material change for the Cyclone II and MAX II Devices Revision: 1.3.0 PROCESS CHANGE NOTIFICATION PCN1105 Introducing Green Materials and Bill of Material change for the Cyclone II and MAX II Devices Change Description This is an update to PCN1105; please

More information

Specification for Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards

Specification for Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards Specification for Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards Developed by the Plating Processes Subcommittee (4-14) of the Fabrication Processes

More information

VI Chip Environmental Qualification Testing Standards

VI Chip Environmental Qualification Testing Standards VI Chip Environmental Qualification Testing Standards Revision: 0 Report Dated: June 11 th, 2014 Report Prepared By: Noel Joyce Reliability Lab Manager Page 1 of 14 Table of Contents 1. Purpose... 3 2.

More information

1W High Power Purple LED Technical Data Sheet. Part No.: LL-HP60MUVA

1W High Power Purple LED Technical Data Sheet. Part No.: LL-HP60MUVA 1W High Power Purple LED Technical Data Sheet Part No.: LL-HP60MUVA Spec No.: HP60M Rev No.: V.2 Date: Aug./18/2009 Page: 1 OF 8 Features: Luckylight High power LED type. Lead frame type package (Heat

More information

PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages

PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief 389 Authors: Mark Kwoka and Jim Benson Introduction Intersil's Quad Flat No Lead (QFN) package family offering is a

More information

Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED

Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK Typical Applications The HMC547LP3

More information

How to Avoid Conductive Anodic Filaments (CAF)

How to Avoid Conductive Anodic Filaments (CAF) How to Avoid Conductive Anodic Filaments (CAF) Ling Zou & Chris Hunt 22 January 20 1 Your Delegate Webinar Control Panel Open and close your panel Full screen view Raise hand for Q&A at the end Submit

More information

23-26GHz Reflective SP4T Switch. GaAs Monolithic Microwave IC in SMD leadless package

23-26GHz Reflective SP4T Switch. GaAs Monolithic Microwave IC in SMD leadless package CHS2411-QDG Description GaAs Monolithic Microwave IC in SMD leadless package The CHS2411-QDG (CHS2412-QDG, see Note) is a monolithic reflective SP4T switch in K-Band. Positive supply voltage only is required.

More information

1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.

1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda. .Introduction If the automobile had followed the same development cycle as the computer, a Rolls- Royce would today cost $00, get one million miles to the gallon and explode once a year Most of slides

More information

Evaluation of Soft Soldering on Aluminium Nitride (AlN) ESTEC Contract No. 19220/05/NL/PA. CTB Hybrids WG ESTEC-22nd May 2007

Evaluation of Soft Soldering on Aluminium Nitride (AlN) ESTEC Contract No. 19220/05/NL/PA. CTB Hybrids WG ESTEC-22nd May 2007 Evaluation of Soft Soldering on Aluminium Nitride (AlN) ESTEC Contract No. 19220/05/NL/PA CTB Hybrids WG ESTEC-22nd May 2007 Evaluation of Soft Soldering on AlN Schedule Project presentation Feasibility

More information

GUIDELINES FOR PRINTED CIRCUIT BOARD ASSEMBLY (PCBA) OF UTAC GROUP S GRID ARRAY PACKAGE (GQFN) AND ITS BOARD LEVEL RELIABILITY

GUIDELINES FOR PRINTED CIRCUIT BOARD ASSEMBLY (PCBA) OF UTAC GROUP S GRID ARRAY PACKAGE (GQFN) AND ITS BOARD LEVEL RELIABILITY GUIDELINES FOR PRINTED CIRCUIT BOARD ASSEMBLY (PCBA) OF UTAC GROUP S GRID ARRAY PACKAGE (GQFN) AND ITS BOARD LEVEL RELIABILITY Kyaw Ko Lwin*, Daniel Ting Lee Teh, Carolyn Epino Tubillo, Jun Dimaano, Ang

More information

Introduction. Development of the AQEC Standard

Introduction. Development of the AQEC Standard Texas Instruments Incorporated Post Office Box 84 Sherman, Texas 75090 6412 Highway 75 South Sherman, Texas 75090 (903) 868-7111 Implementation of Aerospace Qualified Electronic Component Requirements

More information

Copyright 2008 IEEE. Reprinted from ECTC2008 Proceedings.

Copyright 2008 IEEE. Reprinted from ECTC2008 Proceedings. Copyright 2008 IEEE. Reprinted from ECTC2008 Proceedings. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Amkor

More information

SDC15. TVS Diode Array for ESD Protection of 12V Data and Power Lines. PROTECTION PRODUCTS Description. Features. Mechanical Characteristics

SDC15. TVS Diode Array for ESD Protection of 12V Data and Power Lines. PROTECTION PRODUCTS Description. Features. Mechanical Characteristics Description The SDC15 transient voltage suppressor (TVS) is designed to protect components which are connected to data and transmission lines from voltage surges caused by electrostatic discharge (ESD),

More information

Precision Leaded Resistors

Precision Leaded Resistors FEATURES Approved according to CECC 40101-806 Advanced thin film technology Low TC: ± 15 to Precision tolerance of value: ± 0.1 % and ± 0.25 % Superior overall : class 0.05 Wide precision range: 10 Ω to

More information

Q&A. Contract Manufacturing Q&A. Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials

Q&A. Contract Manufacturing Q&A. Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials Q&A Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials 1. Do Nelco laminates have any discoloration effects or staining issues after multiple high temperature exposures?

More information

Processing of SMD LEDs Application note

Processing of SMD LEDs Application note Processing of SMD LEDs Application note Abstract This application note provides a basic overview of the essential aspects and influencing factors regarding the processing of SMD LEDs. Introduction In general,

More information

DOMINANT. Opto Technologies Innovating Illumination. InGaN White S-Spice : SSW-SLD DATA SHEET: SpiceLED TM. Features: Applications:

DOMINANT. Opto Technologies Innovating Illumination. InGaN White S-Spice : SSW-SLD DATA SHEET: SpiceLED TM. Features: Applications: DATA SHEET: SpiceLED TM SpiceLED TM Like spice, its diminutive size is a stark contrast to its standout performance in terms of brightness, durability and reliability. Despite being the smallest in size

More information

AND8464/D. Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages APPLICATION NOTE

AND8464/D. Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages APPLICATION NOTE Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages Prepared by: Denise Thienpont, Steve St. Germain ON Semiconductor APPLICATION NOTE Introduction ON Semiconductor has introduced an expanded

More information

Axial and Radial Leaded Multilayer Ceramic Capacitors for Automotive Applications Class 1 and Class 2, 50 V DC, 100 V DC and 200 V DC

Axial and Radial Leaded Multilayer Ceramic Capacitors for Automotive Applications Class 1 and Class 2, 50 V DC, 100 V DC and 200 V DC Axial and Radial Leaded Multilayer Ceramic Capacitors for Automotive Applications Class 1 and Class 2, 5 V DC, 1 V DC and 2 V DC DESIGNING For more than 2 years Vitramon has supported the automotive industry

More information

17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY. Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie

17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY. Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie 17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie 1. Introduction Lead is the toxic heavy metal which is

More information

Wafer Bumping & Wafer Level Packaging for 300mm Wafer

Wafer Bumping & Wafer Level Packaging for 300mm Wafer 31 st International Conference on Electronics Manufacturing and Technology - IEMT 2006 8-10 November 2006 Sunway Resort Hotel, Petaling Jaya, Malaysia Wafer Bumping & Wafer Level Packaging for 300mm Wafer

More information

New Liquid Crystal Polymer (LCP) Flex Circuits to Meet Demanding Reliability and End-Use Applications Requirements

New Liquid Crystal Polymer (LCP) Flex Circuits to Meet Demanding Reliability and End-Use Applications Requirements New Liquid Crystal Polymer (LCP) Flex Circuits to Meet Demanding Reliability and End-Use Applications Requirements Dr. Terry F. Hayden 3M Microelectronics Systems Division 6801 River Place Blvd. Austin,

More information

Lead Free Wave Soldering

Lead Free Wave Soldering China - Korea - Singapore- Malaysia - USA - Netherlands - Germany WAVE SELECTIVE REFLOW SOLDERING SOLDERING SOLDERING Lead Free Wave Soldering Ursula Marquez October 18, 23 Wave Soldering Roadmap Parameter

More information

Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection

Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection Presented in the ECWC 10 Conference at IPC Printed Circuits Expo, SMEMA Council AP EX and Designers Summit 05 Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection

More information

Failure Analysis (FA) Introduction

Failure Analysis (FA) Introduction Failure Analysis (FA) Introduction (IC ) Tung-Bao Lu 1 of 29 Structure of conventional package gold wire leadframe chip EMC die-pad Failure Classification Physical Failure (Structure) - Popcorn - Delamination

More information

Xilinx Advanced Packaging

Xilinx Advanced Packaging Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove

More information

Low Current SMD LED PLCC-2

Low Current SMD LED PLCC-2 Low Current SMD LED PLCC-2 VLMC31. 19225 DESCRIPTION These new devices have been designed to meet the increasing demand for low current SMD LEDs. The package of the VLMC31. is the PLCC-2 (equivalent to

More information

SC-1000/2000 ROTARY CODED SWITCHES FEATURES PART NUMBER DESIGNATION S C - 1 0 1 0 T B. RoHS compliant

SC-1000/2000 ROTARY CODED SWITCHES FEATURES PART NUMBER DESIGNATION S C - 1 0 1 0 T B. RoHS compliant SC-00/2000 RoHS compliant INTERNAL STRUCTURE SC-00 / 2000 series 4 2 3 6 FEATURES BC RoHS compliant Fine click with metallic spring Low profile of 3.9 mm makes perfect for high density board mounting applications

More information

High Ohmic/High Voltage Metal Glaze Leaded Resistors

High Ohmic/High Voltage Metal Glaze Leaded Resistors High Ohmic/High Voltage FEATURES A metal glazed film is deposited on a high grade ceramic body. After a helical groove has been cut in the resistive layer, tinned electrolytic copper wires are welded to

More information

APPLICATION NOTES for THROUGH-HOLE LEDs

APPLICATION NOTES for THROUGH-HOLE LEDs APPLICATION NOTES for THROUGH-HOLE s STORAGE CONDITIONS 1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature. 2. s

More information

DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS General Purpose & High Capacitance Class 2, X7R

DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS General Purpose & High Capacitance Class 2, X7R DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS General Purpose & High Capacitance Class 2, 6.3 V TO 50 V 100 pf to 22 µf RoHS compliant & Halogen Free Product Specification October 13, 11 V.8 Product

More information